JPH0888317A - Semiconductor device and its mounting method - Google Patents

Abstract

PURPOSE: To obtain a mounting method in which a package is held easily in a positioning operation or a mounting operation when an SVP-type (vertical mounting-type) semiconductor is mounted, in which a mounting operation is simplified and in which a high-density mounting operation can be performed. CONSTITUTION: A semiconductor device is provided with leads 12 on the rear surface of packages 11A, 11B, and it is mounted in such a way that the leads 12 are connected to a mounting board 1 so as to be directed in the vertical state. In the semiconductor device, one side face of the package which is set to be vertical in a mounted state is provided with female protrusions 14 and a side face on the opposite side of the side face is provided with male protrusions 15 which can be fitted to the female protrusions 14, and the packages in a plurality are mounted on the mounting board 1 in a state that they are arranged. At this time, the female protrusions 14 on the package 11A on one side are fitted to the male protrusions 15 on the adjacent package 11B so as to integrate both packages. Thereby, it is not required to hold and position the respective packaged individually, and their mounting operation can be simplied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an SVP (Surface) which is surface-mounted in a direction perpendicular to a mounting board.
Vertical Package) type semiconductor device,
The present invention relates to a mounting method for mounting the SVP type semiconductor device on a mounting board.

[0002]

2. Description of the Related Art In order to meet the recent demand for high-density mounting of semiconductor devices, a technique of stacking semiconductor device packages has been conventionally proposed. For example, Japanese Patent Laid-Open No. 3-3
The one disclosed in Japanese Patent No. 2050 has a structure in which a protrusion is provided on the upper surface of a package of a semiconductor device and a recess is provided on the lower surface, a plurality of packages are stacked one above the other, and each protrusion and the recess are fitted together. Then, the relative positioning of each package is performed, and then the leads of each package are connected to each other or to the mounting substrate. Further, as a similar technique, there is one described in JP-A-2-239651.

Such a high-density mounting technique is applied because a plurality of stacked packages are brought into close contact with each other, and in the case of a package having a high heat generating property, the heat radiation effect of the lower package is deteriorated. Difficult to do. Further, in the case of selectively replacing the package after stacking, it is necessary to remove at least the package above the package to be replaced, which is disadvantageous in terms of maintenance.

In this respect, the SVP type semiconductor device is advantageous in solving the above-mentioned problems and performing high-density mounting. This S
As shown in an example in FIG. 8, the VP type semiconductor device has a plurality of leads 22 projecting from one side surface of a package 21 having a shape close to a flat shape. A book lead is formed as a post lead 23 by bending at right angles in mutually opposite directions, and the other leads 22 are formed by slightly bending the ends into an L shape. In mounting the package, the package 21 is placed on the mounting substrate 1 so as to stand in the vertical direction, and the leads 22 and the post leads 23 are connected to the circuit pattern formed on the mounting substrate 1 by soldering or the like. Has been taken. In this SVP type semiconductor device, the plane area occupied by the semiconductor device with respect to the mounting substrate 1 can be made small, which is effective for high-density mounting. Moreover, since each package is mounted independently, it is advantageous in terms of heat dissipation and maintenance.

[0005]

However, this S
In the VP type semiconductor device, it is necessary to connect the leads 22 and the post leads 23 with the package held vertically on the mounting substrate 1. At that time, the plurality of leads are respectively positioned on a fine circuit pattern. Since it is necessary, there is a problem that mounting work is difficult and skill is required. In particular, when a plurality of SVP semiconductor devices are mounted adjacent to each other, the work of holding the packages vertically and the work of positioning the leads of each package are extremely difficult due to the small dimension between the adjacent packages. It will be difficult. In particular, when positioning the leads, it is necessary to perform a position recognition operation for recognizing the circuit pattern and the leads so as to match the positions of the two.
Mounting time becomes long.

In order to solve such a problem, for example, as a technique for positioning the package with respect to the mounting board, a protrusion is provided on the bottom surface of the package as described in, for example, Japanese Patent Application Laid-Open No. 60-263448. A method of positioning by inserting it into a hole formed in the mounting board can be considered. However, in the package of the SVP type semiconductor device, since a plurality of leads are formed on the surface facing the mounting substrate, such a protrusion cannot be formed. Is reduced, and it becomes difficult to construct a multi-lead semiconductor device.

Further, in the SVP type semiconductor device, in order to stably hold the package on the mounting substrate in a vertical state, it is necessary to form the post leads in a length equal to or larger than a predetermined dimension. Therefore, as shown in FIG.
In order to prevent the post leads 23 of the adjacent packages 21 from interfering with each other when arranging, the arrangement pitch dimension is influenced by the length of the post leads 23. Incidentally, a pair of post leads 2 is conventionally used.
The width dimension of 3 is 3.7 mm, and the adjacent package 2
It is difficult to set the arrangement pitch of 1 to 2.54 mm or less, which is an obstacle to high-density mounting.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device which can easily perform positioning when mounting an SVP type semiconductor device and hold a package during mounting. Another object of the present invention is to provide a mounting method capable of mounting a plurality of SVP type semiconductor devices on a mounting substrate with high density.

[0009]

The semiconductor device of the present invention comprises:
A semiconductor device in which a lead is provided on one surface of a package and the lead is connected to a mounting substrate to mount the package in a vertical state with respect to the mounting substrate. Has a female projection on its side surface and a male projection capable of being fitted to the female projection on the side surface opposite to this surface.

Here, when a plurality of packages are mounted on the mounting substrate in an arrayed state, the female projection of one package and the male projection of another package adjacent to this package are fitted together.

In the mounting method of the present invention, a plurality of semiconductor devices having a female protrusion on one side surface of a package which is vertical in the mounted state and a male protrusion on the opposite side surface are arranged. In mounting in this state, after mounting the first package on the mounting substrate, the protrusions of the second package are fitted to the protrusions of the first package, and the second package is mounted on the mounting substrate. The third and subsequent packages are characterized in that the protrusions are fitted to the protrusions of the package immediately before and the packages are sequentially mounted.

In another mounting method of the present invention, a plurality of semiconductor devices each having a female protrusion on one side surface of a package which is vertical in a mounted state and a male protrusion on a side surface opposite to the one side are provided. When mounting the individual packages, fit the protrusions of the first package to the protrusions of the first package,
The protrusions of the third and subsequent packages are fitted to the protrusions of the immediately preceding package to integrate the first to third packages into a connected state, and then the plurality of integrated packages are mounted on the mounting substrate. The feature is that they are implemented at the same time.

[0013]

[Operation] By fitting the female projection and the male projection of the adjacent packages, the adjacent packages are integrally connected,
In addition, it is possible to position them relative to each other, and when mounting on the mounting board, it is not necessary to individually position each package while individually holding it and mounting it on the mounting board. Simplification is possible.

If one package is mounted first, the other package can be positioned and held on the mounting board only by fitting the protrusion to the one package, and the mounting work of the other package can be easily performed. It will be something. Further, by fitting the protrusions of the plurality of packages to each other and integrating these packages in advance, the plurality of packages can be mounted at the same time by one mounting work, which simplifies the mounting and shortens the mounting time. It will be possible.

[0015]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of one embodiment of the SVP type semiconductor device according to the present invention. This semiconductor device has a resin package 11 in the shape of a rectangle that is flat in the vertical direction. Although detailed description and illustration are omitted in this package, a semiconductor element is incorporated and an inner lead of a lead frame is provided. Electrical connection to the department. A plurality of leads 12 as outer lead portions of the lead frame are provided on one side surface (lower surface) of the lower side of the package 11.
Are projected in a line in series. Of these leads 12, each two leads 13 at both ends are formed longer than the other leads, and are formed as post leads bent at right angles in mutually opposite directions in the thickness direction of the package 11. Further, the other lead 12 has its tip bent and formed in an L shape. The tip surfaces of the post leads 13 and the other leads 12 are located on the same plane.

Of the pair of side surfaces having the largest area of the package 11, one female side surface (the right side surface in the drawing) is integrally formed with two female protrusions 14 arranged side by side in the lateral direction. Similarly, two male projections 15 are formed integrally side by side in the lateral direction on the side surface (the left side surface in the figure). The female projection 14 has a rectangular fitting recess 14a having a smaller size than the upper side of the rectangular projection, and is formed in a concave shape when viewed from the front. h is set to a dimension equal to the array pitch of adjacent packages, here 2.43 mm. On the other hand, the male projection 15 is formed as the same rectangular projection as the fitting recess 14a of the female projection 14,
The projecting dimension h projecting in the front direction is the female projection 14
Is formed to have the same size as the protruding size h. The projections 14 and 15 are integrally resin-molded when the package 11 is resin-molded.

According to this SVP type semiconductor device, as shown in FIG.
As shown in the partially cutaway perspective view and the side view of FIGS. 1A and 1B, the two packages 11A and 11B are connected to the circuit board 1.
When mounted in a state where they are arranged adjacent to each other, the leads 12 and the post leads 13 of each package are connected to the circuit of the mounting substrate 1 by soldering or the like, and the post leads 13 maintain the standing state. The male projection 15 provided on the package 11A is inserted into the fitting recess 14a of the female projection 14 provided on the other package 11A. It can be integrated in parallel. In this integrated state, the male protrusion 15
Since the female protrusion 14 is interposed between both packages 11A and 11B, both packages 11A and 11B are kept at an interval equal to the protrusion dimension h of these protrusions 14 and 15.

Therefore, as a first method of mounting the SVP type semiconductor device on the mounting substrate 1, as shown in FIG. 3, one first package 11A is first mounted on the mounting substrate 1.
To be mounted on. In this case, as in the conventional case, the post lead 13 is brought into contact with the surface of the mounting substrate 1 to hold the first package 11A in a vertical state with respect to the mounting substrate 1, and each lead 12 and the post lead After positioning 13 with respect to the circuit pattern provided on the mounting board, each lead 12 and the post lead 13 are soldered to the circuit pattern. Then, the male projection 15 of the second package 11B adjacent to the female projection 14 of the first package 11A is fitted. As a result, the second package 11B is held and positioned relatively to the already mounted first package 11A, and as a result, the second package 11B is also held in the vertical state with respect to the mounting board 1 and mounted. The circuit pattern on the substrate 1 is positioned.

When three or more packages are mounted adjacent to each other, the male protrusion is fitted to the female protrusion of the second package so that the third package is vertically mounted on the mounting substrate. It can be held in place and positioned. In this way, the protrusions are sequentially fitted to the mounted first package to position the plurality of second and subsequent packages, and then the leads of the positioned packages are soldered to the circuit pattern. Thus, mounting of all SVP type semiconductor devices is realized.

Therefore, in this mounting method, if the first package 11A is mounted first, the second and subsequent packages are fitted in the protrusions with respect to the immediately preceding packages, respectively, so that they are placed in a state perpendicular to the mounting substrate 1. Holding and positioning are performed. Therefore, by holding the subsequent packages in a vertical state, it becomes less necessary for each package to maintain its vertical state by the post leads 13, so that the bending length of the post leads 13 can be shortened. As a result, the distance between the adjacent packages, which is restricted by the length of the post leads, can be reduced, and the packaging density can be improved. Incidentally, in this embodiment, the interval is 2.43 mm, which is the projection size h of the projections 14 and 15 described above. Also, the second
Subsequent packages are sequentially positioned with respect to the immediately preceding package, and as a result, are positioned with respect to the mounting board, so that it is not necessary to identify leads and circuit patterns for individually positioning each package with respect to the mounting board. Therefore, reduction of mounting time is achieved.

As the second mounting method of the present invention, as shown in FIG. 4, the female protrusions 14 and the male protrusions 15 of the adjacent packages of the plurality of packages 11A, 11B ,. By fitting and before mounting, the plurality of packages are integrated into a connected state by the protrusions. Then, if this integrated package group is placed on the mounting substrate 1 while being gripped by the clamper 2, each package 11A, 11B, ... Each package 11A, 11B, ...
It is naturally held upright above. Then, if one of the packages, or the leads 12 of the packages at both ends and the circuit pattern of the mounting board 1 are recognized and positioned, other packages are necessarily positioned with respect to the mounting board at the same time. Will be done. Then, the leads 12 and the post leads 13 of each integrated package are brought into contact with the circuit pattern and soldered to each other, whereby a plurality of packages can be simultaneously mounted by one mounting operation. It is possible to shorten the time.

Here, in the above-described embodiment, an example in which the female protrusion and the male protrusion are integrally formed at the time of resin molding of the package has been described, but as shown in FIG. 5, each protrusion 14 and 15 is different from the package 11. It may be formed in a body and integrated with the package 11 with an adhesive or the like. By doing so, it is possible to provide the protrusion later even on the package of the existing SVP type semiconductor device in which the protrusion is not formed, and the present invention can be applied. Further, when the package is formed of resin or ceramic, if each protrusion is formed of metal or the like, the protrusion portion can be configured as a heat sink for heat dissipation, and the heat dissipation effect of the semiconductor device can be enhanced.

FIG. 6 is a perspective view of another embodiment of the semiconductor device of the present invention. In this embodiment, the male projection 15A has a wedge-shaped front end surface 15Aa, and the female projection 14A has a wedge-shaped recess 14Aa on the surface (right side surface) of the package. In this way, by making the fitting surface of the female projection 14A and the male projection 15A have a wedge structure, the male projection 15A is guided by the wedge action to the female projection 14A when they are fitted together. Since they are fitted together, the relative positions of both protrusions can be accurately positioned, and even if the paired packages are misaligned, the misalignment can be corrected by fitting both protrusions. Will be.

Further, as described above, when the projection is formed separately from the package, or when a slider is provided in the resin molding die of the package so that the projection having a somewhat complicated shape can be resin-molded. 7, the female projection 14B may be formed in a dovetail groove, and the male projection 15B may be formed in a shape in which the tip end is enlarged and fitted into the dovetail groove. In this case, one package fits the female protrusion 14B and the male protrusion 15B while sliding vertically in the adjacent package. With this dovetail groove shape, adjacent packages can be regulated in opposite directions, both packages can be firmly connected, and the relative positional relationship between them can be set with high accuracy. However, in the structure of this embodiment, the post lead 13 is required to be formed in such a size that it does not project from both side surfaces of the package so that the package and the post lead do not interfere with each other when the protrusions are fitted together.

It should be noted that each of the above-mentioned embodiments shows a few examples of the present invention, and the shape of the package and the shapes of the female protrusion and the male protrusion may be arbitrarily designed in addition to the embodiments described above. It is possible. Further, in each of the above-described embodiments, the female protrusion and the male protrusion are arranged in the lateral direction with respect to one package.
Although an example in which individual packages are arranged is shown, a configuration in which only one relatively large protrusion is provided in the package may be used as long as each package can be positioned in parallel.

[0026]

As described above, in the semiconductor device of the present invention, the female protrusion is fitted to one side surface of the package which is vertical in the mounted state, and the female protrusion is fitted to the side surface opposite to this side surface. Since each has a possible male-type protrusion, by mating the female-type protrusion and the male-type protrusion of the adjacent packages, the adjacent packages are integrally connected and both packages are relatively positioned. When mounting on a mounting board, it is not necessary to individually position and individually package each package while mounting on the mounting board, and the mounting work can be simplified. In addition, since it is possible to mount while securely holding each package, the post lead for holding the package can be shortened, the pitch dimension of the adjacent package can be reduced, and high-density mounting can be performed. .

According to the mounting method of the present invention, after mounting the first package on the mounting substrate, the protrusion of the second package is fitted to the protrusion of the first package to mount the second package on the mounting substrate. Mounted on the
If the first package is mounted accurately by fitting the protrusions to the protrusions of the package immediately before and mounting them sequentially, the second and subsequent packages can be mounted on the first package only by fitting the protrusions. It is possible to position the mounting substrate while holding it, and it is possible to simplify the mounting of the second and subsequent packages.

Further, according to another mounting method of the present invention, the protrusion of the first package is fitted to the protrusion of the first package,
The protrusions of the third and subsequent packages are fitted to the protrusions of the immediately preceding package to integrate the first to third packages into a connected state, and then the plurality of integrated packages are mounted on the mounting substrate. By mounting at the same time, a plurality of packages can be mounted at the same time by one mounting work, and the mounting work time can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a semiconductor device of the present invention viewed from the right side and the left side.

FIG. 2 is a partially cutaway perspective view and a side view showing a state in which a semiconductor device is mounted according to the present invention.

FIG. 3 is a front view showing a first mounting method of the present invention.

FIG. 4 is a front view showing a second mounting method of the present invention.

FIG. 5 is a perspective view of another embodiment of the present invention.

FIG. 6 is a perspective view of still another embodiment of the present invention.

FIG. 7 is a perspective view of a modified example of the present invention.

FIG. 8 is a perspective view of a conventional SVP type semiconductor device to which the present invention is applied.

FIG. 9 is a diagram showing a relationship between post lead lengths and package arrangement pitches.

[Explanation of symbols]

 1 Mounting Substrate 2 Clamper 11 Package 12 Lead 13 Post Lead 14 Female Protrusion 14a Fitting Recess 15 Male Protrusion

Claims (4)

[Claims] 1. A semiconductor device in which a lead is provided on one surface of a package and the lead is connected to a mounting substrate to mount the package in a vertical state with respect to the mounting substrate. A semiconductor device having a female projection on one side surface of the package and a male projection that can be fitted to the female projection on a side surface opposite to this surface. 2. A plurality of packages are mounted in an array on a mounting board, and a female protrusion of one package is mounted,
2. The semiconductor device according to claim 1, wherein a male projection of another package adjacent to this package is fitted. 3. When mounting a plurality of semiconductor devices having a female protrusion on one side surface of a package which is vertical in a mounted state and a male protrusion on the opposite side surface, After mounting the first package on the mounting substrate, the protrusions of the second package are fitted to the protrusions of the first package to mount the second package on the mounting substrate. A method of mounting a semiconductor device, characterized in that the protrusion is fitted to the protrusion of the package immediately before and the components are sequentially mounted. 4. When mounting a plurality of semiconductor devices having a female protrusion on one side surface of a package which is vertical in a mounted state and a male protrusion on a side surface opposite to the one side, The projections of the second package are fitted to the projections of the first package, the projections of the third and subsequent packages are fitted to the projections of the package immediately before, and the first to third
A method of mounting a semiconductor device, characterized in that the subsequent packages are integrated into a connected state, and then the integrated packages are simultaneously mounted on a mounting substrate.