JP2014075488A - Heat radiation device - Google Patents
Heat radiation device Download PDFInfo
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- JP2014075488A JP2014075488A JP2012222321A JP2012222321A JP2014075488A JP 2014075488 A JP2014075488 A JP 2014075488A JP 2012222321 A JP2012222321 A JP 2012222321A JP 2012222321 A JP2012222321 A JP 2012222321A JP 2014075488 A JP2014075488 A JP 2014075488A
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- main body
- path forming
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- heat
- forming portion
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2220/00—Closure means, e.g. end caps on header boxes or plugs on conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/14—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes molded
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
- F28F2275/143—Fastening; Joining by using form fitting connection, e.g. with tongue and groove with pin and hole connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
- F28F2280/04—Means for preventing wrong assembling of parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本発明は、発熱体が熱的に結合され、発熱体の熱を放熱する冷媒が流れる冷媒通路が内部に形成された本体部を備え、冷媒通路に冷媒を流入させる流入路を有するとともに冷媒通路から冷媒を流出させる流出路を有する放熱装置に関する。 The present invention includes a main body portion in which a heat generating body is thermally coupled and a refrigerant passage through which a refrigerant for radiating heat of the heat generating body flows is formed, and has an inflow passage through which the refrigerant flows into the refrigerant passage and the refrigerant passage The present invention relates to a heat radiating device having an outflow path for allowing a refrigerant to flow out of the apparatus.
半導体素子など、駆動に伴い発熱する電子部品を冷却する熱交換器としては、例えば、特許文献１に記載の熱交換器が挙げられる。
特許文献１に記載の熱交換器は、一対のプレートを有している。一対のプレートには、それぞれ、周縁部を残して全体に凹部が形成されている。一対のプレートの周縁部の一部には、それぞれ、凹部とプレートの縁とを連通する断面半円状の溝部が形成されている。一対のプレートは、溝部が対向するように重ね合わされるとともに、溝部には出入口パイプが嵌着されている。そして、溝部と出入口パイプの間をロウ付けすることで熱交換器が構成されている。
An example of a heat exchanger that cools electronic components that generate heat upon driving, such as a semiconductor element, is the heat exchanger described in Patent Document 1.
The heat exchanger described in Patent Document 1 has a pair of plates. Each of the pair of plates has a concave portion formed on the whole, leaving a peripheral edge portion. A part of the peripheral edge portion of the pair of plates is formed with a semicircular cross-sectional groove portion that communicates the recess and the edge of the plate. The pair of plates are overlapped so that the groove portions face each other, and an inlet / outlet pipe is fitted in the groove portions. And the heat exchanger is comprised by brazing between a groove part and an entrance / exit pipe.
ところで、熱交換器においては、部品点数の削減が望まれている。
本発明の目的は、部品点数を削減することができる放熱装置を提供することにある。
By the way, in a heat exchanger, reduction of a number of parts is desired.
An object of the present invention is to provide a heat dissipation device that can reduce the number of parts.
上記課題を解決するため、請求項１に記載の発明は、発熱体が熱的に結合され、前記発熱体の熱を放熱する冷媒が流れる冷媒通路が内部に形成された本体部を備え、前記冷媒通路に冷媒を流入させる流入路を有するとともに前記冷媒通路から冷媒を流出させる流出路を有する放熱装置であって、前記本体部には、前記流入路及び前記流出路の少なくとも一方を形成する流路形成部が一体成形されることを要旨とする。 In order to solve the above-mentioned problem, the invention according to claim 1 includes a main body portion in which a heat generating body is thermally coupled, and a refrigerant passage through which a refrigerant for radiating heat of the heat generating body flows is formed, A heat dissipation device having an inflow path through which a refrigerant flows into the refrigerant path and an outflow path through which the refrigerant flows out from the refrigerant path, wherein the main body portion includes at least one of the inflow path and the outflow path. The gist is that the path forming portion is integrally formed.
これによれば、流入路及び流出路の少なくとも一方については、本体部の形成と同時に流路形成部を作ることによって設けられているため、流入路及び流出路の少なくとも一方のためにその形成用の部材を別に用意する必要がない。このため、放熱装置の部品点数が削減される。 According to this, since at least one of the inflow path and the outflow path is provided by forming the flow path forming portion at the same time as the formation of the main body portion, it is formed for at least one of the inflow path and the outflow path. There is no need to prepare a separate member. For this reason, the number of parts of the heat dissipation device is reduced.
また、前記本体部は、凹部が形成された筐体と、前記凹部を覆う状態で前記筐体に取り付けられることで前記筐体とともに前記冷媒通路を形成する蓋部材とから構成され、前記筐体には、前記蓋部材の位置決めを行う位置決め用のピンが一体成形されていてもよい。 In addition, the main body portion includes a housing in which a recess is formed, and a lid member that forms the refrigerant passage together with the housing by being attached to the housing so as to cover the recess. The positioning pin for positioning the lid member may be integrally formed.
これによれば、位置決め用のピンを筐体とは別に用意する必要がなく、放熱装置の部品点数が削減される。
また、前記本体部には、前記冷媒通路の内部に突出するフィンが一体成形されていてもよい。
According to this, it is not necessary to prepare positioning pins separately from the housing, and the number of parts of the heat dissipation device is reduced.
The main body may be integrally formed with a fin that protrudes into the refrigerant passage.
これによれば、フィンを本体部とは別に用意する必要がなく、放熱装置の部品点数が削減される。
また、前記本体部及び前記流路形成部は、鋳造により製造されていてもよい。
According to this, it is not necessary to prepare the fin separately from the main body, and the number of parts of the heat dissipation device is reduced.
Further, the main body portion and the flow path forming portion may be manufactured by casting.
これによれば、鋳造は、鋳型に溶融した金属材料を流し込んで形成する方法であるため、放熱装置の量産性に優れる。
また、前記本体部及び前記流路形成部は、切削により製造されていてもよい。
According to this, since casting is a method in which a molten metal material is poured into a mold and formed, it is excellent in mass productivity of the heat dissipation device.
Further, the main body part and the flow path forming part may be manufactured by cutting.
これによれば、複雑な形状の放熱装置であっても成形することができる。
また、前記本体部及び前記流路形成部は、鍛造により製造されていてもよい。
According to this, even a heat dissipation device having a complicated shape can be molded.
Further, the main body portion and the flow path forming portion may be manufactured by forging.
本発明によれば、部品点数を削減することができる。 According to the present invention, the number of parts can be reduced.
本発明をインバータ装置に設けられる放熱装置に具体化した一実施形態について図１〜図６にしたがって説明する。
図１に示すように、インバータ装置１０は、インバータケース１１内に、インバータを構成する半導体素子（スイッチング素子やダイオード）などの電子部品１２が収容されて構成されている。
An embodiment in which the present invention is embodied in a heat dissipation device provided in an inverter device will be described with reference to FIGS.
As shown in FIG. 1, the inverter device 10 is configured such that an electronic case 12 such as a semiconductor element (switching element or diode) constituting the inverter is accommodated in an inverter case 11.
図１及び図２に示すように、インバータケース１１のケース本体１３は、矩形状をなす底板１４と、底板１４の対向する一対の短辺から立設された側壁１５ａ，１５ｂと、底板１４の対向する一対の長辺から立設された側壁１６ａ，１６ｂとから構成されている。各側壁１５ａ，１５ｂ，１６ａ，１６ｂの先端には、フランジ１７が形成されており、このフランジ１７に天板１８が取り付けられることで、インバータケース１１が形成されている。フランジ１７には、天板１８をケース本体１３に固定するための図示しないボルトが螺合される螺合部１７ａが形成されている。天板１８の周縁部には、ボルトが挿通される挿通孔１８ａが形成されている。底板１４には、底板１４から垂直に延びる柱状の支持部１９が複数箇所に形成されており、支持部１９の先端面には、先端面から垂直に延びる円柱状のピン２０が形成されている。このピン２０は、天板１８の内面に形成された図示しない凹部に挿入されている。ピン２０が天板１８の凹部に挿入されて天板１８が位置決めされるとともに、挿通孔１８ａに挿通されたボルトが螺合部１７ａに螺合されて天板１８がケース本体１３に固定されている。 As shown in FIGS. 1 and 2, the case main body 13 of the inverter case 11 includes a rectangular bottom plate 14, side walls 15 a and 15 b erected from a pair of opposing short sides of the bottom plate 14, and the bottom plate 14. It is comprised from the side wall 16a, 16b standingly arranged from a pair of opposing long side. A flange 17 is formed at the tip of each side wall 15a, 15b, 16a, 16b, and an inverter case 11 is formed by attaching a top plate 18 to the flange 17. The flange 17 is formed with a screwing portion 17a into which a bolt (not shown) for fixing the top plate 18 to the case body 13 is screwed. An insertion hole 18 a into which a bolt is inserted is formed in the peripheral portion of the top plate 18. The bottom plate 14 is formed with a plurality of columnar support portions 19 extending vertically from the bottom plate 14, and a columnar pin 20 extending vertically from the front end surface is formed on the front end surface of the support portion 19. . The pin 20 is inserted into a recess (not shown) formed on the inner surface of the top plate 18. The pins 20 are inserted into the recesses of the top plate 18 to position the top plate 18, and the bolts inserted through the insertion holes 18 a are screwed into the screwing portions 17 a to fix the top plate 18 to the case body 13. Yes.
図２に示すように、底板１４には、インバータケース１１内に収容された電子部品１２を冷却するための放熱装置３１が設けられている。本実施形態において、放熱装置３１は、ケース本体１３と一体に設けられている。以下、詳細に説明を行う。 As shown in FIG. 2, the bottom plate 14 is provided with a heat dissipation device 31 for cooling the electronic component 12 housed in the inverter case 11. In the present embodiment, the heat dissipation device 31 is provided integrally with the case main body 13. Details will be described below.
底板１４には、平面視Ｕ字状をなす筐体３３が立設されている。そして、筐体３３の内側には、Ｕ字状の凹部３２が形成されている。放熱装置３１の筐体３３は、ケース本体１３の一部（底板１４）に形成されており、ケース本体１３が放熱装置３１の筐体３３を兼ねている。 A casing 33 having a U-shape in plan view is erected on the bottom plate 14. A U-shaped recess 32 is formed inside the housing 33. The housing 33 of the heat radiating device 31 is formed on a part (the bottom plate 14) of the case main body 13, and the case main body 13 also serves as the housing 33 of the heat radiating device 31.
凹部３２は、対向する一対の側壁１５ａ，１５ｂのうち、一方の側壁１５ａから他方の側壁１５ｂに向けて延びるとともに、他方の側壁１５ｂに至る前に一方の側壁１５ａに向けて折り返すように形成されている。凹部３２には、底板１４から垂直に延びる板状のフィン３４が複数形成されている。フィン３４は、対向する一対の側壁１５ａ，１５ｂの対向方向に延びている。 The recess 32 is formed so as to extend from one side wall 15a to the other side wall 15b of the pair of opposing side walls 15a and 15b, and to be folded back toward the one side wall 15a before reaching the other side wall 15b. ing. A plurality of plate-like fins 34 extending vertically from the bottom plate 14 are formed in the recess 32. The fin 34 extends in the opposing direction of the pair of opposing side walls 15a and 15b.
図６に示すように、フィン３４は、放熱装置３１の筐体３３に一体成形されている。
図２に示すように、底板１４において、凹部３２の周囲には、ボルトＢ１が螺合される螺合部３５が形成されている。また、底板１４において、凹部３２の周囲には、底板１４の外面から垂直に延びるピン３６が２箇所に形成されている。
As shown in FIG. 6, the fin 34 is integrally formed with the housing 33 of the heat dissipation device 31.
As shown in FIG. 2, in the bottom plate 14, a screwing portion 35 into which the bolt B <b> 1 is screwed is formed around the recess 32. In the bottom plate 14, pins 36 extending vertically from the outer surface of the bottom plate 14 are formed at two locations around the recess 32.
底板１４には、凹部３２を覆う平板状の蓋部材３７が取り付けられている。そして、筐体３３と蓋部材３７によって冷媒が流れる冷媒通路３８が形成されている。本実施形態では、放熱装置３１の筐体３３と、蓋部材３７とで、放熱装置３１の本体部３９が構成されている。 A flat lid member 37 that covers the recess 32 is attached to the bottom plate 14. The casing 33 and the lid member 37 form a refrigerant passage 38 through which the refrigerant flows. In the present embodiment, the casing 33 of the heat dissipation device 31 and the lid member 37 constitute a main body 39 of the heat dissipation device 31.
蓋部材３７の周縁部には、蓋部材３７を底板１４に固定するためのボルトＢ１が挿通される挿通孔４０が形成されている。また、蓋部材３７の周縁部には、ピン３６が挿通される挿通孔４１が形成されている。そして、蓋部材３７は、蓋部材３７に形成された挿通孔４１にピン３６が挿通されるとともに、ボルトＢ１が螺合部３５に螺合されることで、底板１４に取り付けられている。したがって、ピン３６は蓋部材３７の位置決めを行う位置決め用のピンとして機能している。 An insertion hole 40 through which a bolt B <b> 1 for fixing the lid member 37 to the bottom plate 14 is inserted is formed in the peripheral portion of the lid member 37. Further, an insertion hole 41 through which the pin 36 is inserted is formed in the peripheral portion of the lid member 37. The lid member 37 is attached to the bottom plate 14 by inserting the pin 36 into the insertion hole 41 formed in the lid member 37 and screwing the bolt B1 into the screwing portion 35. Therefore, the pin 36 functions as a positioning pin for positioning the lid member 37.
図５（ａ）及び（ｂ）に示すように、放熱装置３１の筐体３３に蓋部材３７を取り付けるときに蓋部材３７の位置決めを行う位置決め用のピン３６は、放熱装置３１の筐体３３に一体成形されている。同様に、ケース本体１３に天板１８を取り付けるときに天板１８の位置決めを行う位置決め用のピン２０はケース本体１３に一体成形されている。 As shown in FIGS. 5A and 5B, the positioning pins 36 for positioning the lid member 37 when the lid member 37 is attached to the housing 33 of the heat dissipation device 31 are provided on the housing 33 of the heat dissipation device 31. Are integrally molded. Similarly, positioning pins 20 for positioning the top plate 18 when the top plate 18 is attached to the case body 13 are formed integrally with the case body 13.
図２に示すように、側壁１５ａには、流路形成部としての筒状の流入路形成部４２が一体成形されている。流入路形成部４２内には、流入路５１が形成され、流入路５１は冷媒通路３８の入口に連通している。同様に、側壁１５ａには、流路形成部としての筒状の流出路形成部４３が一体成形されている。流出路形成部４３内には、流出路５２が形成され、流出路５２は冷媒通路３８の出口に連通している。 As shown in FIG. 2, a cylindrical inflow passage forming portion 42 as a flow passage forming portion is integrally formed on the side wall 15a. An inflow path 51 is formed in the inflow path forming portion 42, and the inflow path 51 communicates with the inlet of the refrigerant passage 38. Similarly, a cylindrical outflow passage forming portion 43 as a flow passage forming portion is integrally formed on the side wall 15a. An outflow path 52 is formed in the outflow path forming portion 43, and the outflow path 52 communicates with the outlet of the refrigerant passage 38.
図３（ａ）及び（ｂ）に示すように、流入路形成部４２及び流出路形成部４３には、ホースなどの管状の部材４４を介して冷媒供給源が接続され、冷媒供給源から供給される冷媒を、流入路５１を介して冷媒通路３８に流入させるとともに、流出路５２を介して冷媒通路３８から流出させる。 As shown in FIGS. 3A and 3B, a refrigerant supply source is connected to the inflow path forming portion 42 and the outflow path forming portion 43 via a tubular member 44 such as a hose, and supplied from the refrigerant supply source. The refrigerant is caused to flow into the refrigerant passage 38 via the inflow passage 51 and out of the refrigerant passage 38 via the outflow passage 52.
図４に示すように、流入路形成部４２は、放熱装置３１の筐体３３と一体成形されている。同様に、流出路形成部４３は、放熱装置３１の筐体３３（ケース本体１３）と一体成形されている。 As shown in FIG. 4, the inflow path forming portion 42 is integrally formed with the housing 33 of the heat dissipation device 31. Similarly, the outflow path forming portion 43 is integrally formed with the housing 33 (case body 13) of the heat dissipation device 31.
上記したように、ケース本体１３には、放熱装置３１の筐体３３、流入路形成部４２、流出路形成部４３、ピン２０，３６、フィン３４が一体成形されている。
ケース本体１３は、鋳造により一体成形されており、ケース本体１３の形状に合わせて製造された鋳型に溶融した金属材料（例えば、アルミニウム）を流し込み、凝固させることでケース本体１３が製造される。そして、ケース本体１３を鋳型から引き抜くことで、放熱装置３１の筐体３３、流入路形成部４２、流出路形成部４３、ピン２０，３６及びフィン３４が一体形成されたケース本体１３が得られる。なお、「一体成形」とは、放熱装置３１の本体部３９、流入路形成部４２及び流出路形成部４３が同一の部材であることを示し、例えば、複数の部材をロウ材などで接合して一体化したものを含まない。
As described above, the casing 33 of the heat radiating device 31, the inflow path forming portion 42, the outflow path forming portion 43, the pins 20 and 36, and the fins 34 are integrally formed in the case body 13.
The case main body 13 is integrally formed by casting, and the case main body 13 is manufactured by pouring a molten metal material (for example, aluminum) into a mold manufactured according to the shape of the case main body 13 and solidifying it. Then, by pulling out the case main body 13 from the mold, the case main body 13 in which the housing 33 of the heat radiating device 31, the inflow path forming portion 42, the outflow path forming portion 43, the pins 20, 36 and the fins 34 are integrally formed is obtained. . Note that “integral molding” indicates that the main body 39, the inflow path forming section 42, and the outflow path forming section 43 of the heat dissipation device 31 are the same member. For example, a plurality of members are joined with a brazing material or the like. Not integrated.
図３（ａ）に示すように、筐体３３において、冷媒通路３８上は、発熱体としての電子部品１２の搭載領域とされており、この領域に電子部品１２が搭載されている。それぞれの電子部品１２は、ケース本体１３に収容された制御基板４５に信号接続される。そして、電子部品１２は図示しない制御機器が設けられた制御基板４５によって制御される。 As shown in FIG. 3A, in the housing 33, the refrigerant passage 38 has a mounting area for the electronic component 12 as a heating element, and the electronic component 12 is mounted in this area. Each electronic component 12 is signal-connected to a control board 45 accommodated in the case body 13. The electronic component 12 is controlled by a control board 45 provided with a control device (not shown).
次に、本実施形態における放熱装置３１の作用について説明する。
電子部品１２が発熱し、流入路５１から冷媒通路３８に冷媒が流入すると、電子部品１２が発した熱は、本体部３９を介して冷媒と熱交換を行う。そして、冷媒と熱交換を行うことで、電子部品１２は冷却される。冷媒通路３８を流通した冷媒は、流出路５２を介して冷媒通路３８から流出する。
Next, the effect | action of the thermal radiation apparatus 31 in this embodiment is demonstrated.
When the electronic component 12 generates heat and the refrigerant flows into the refrigerant passage 38 from the inflow passage 51, the heat generated by the electronic component 12 exchanges heat with the refrigerant via the main body 39. And the electronic component 12 is cooled by heat-exchanging with a refrigerant | coolant. The refrigerant flowing through the refrigerant passage 38 flows out from the refrigerant passage 38 via the outflow passage 52.
したがって、上記実施形態によれば、以下のような効果を得ることができる。
（１）放熱装置３１の筐体３３と、流入路形成部４２及び流出路形成部４３とは一体成形されている。したがって、流入路形成部４２及び流出路形成部４３は、本体部３９（筐体３３）と同時に作られているため、流入路５１及び流出路５２のためにその形成用の部材を別に用意する必要がない。このため、放熱装置３１の部品点数が削減される。
Therefore, according to the above embodiment, the following effects can be obtained.
(1) The housing 33 of the heat radiating device 31, the inflow path forming portion 42, and the outflow path forming portion 43 are integrally formed. Therefore, since the inflow path forming portion 42 and the outflow path forming portion 43 are made at the same time as the main body 39 (housing 33), separate members for forming the inflow path 51 and the outflow path 52 are prepared. There is no need. For this reason, the number of parts of the heat dissipation device 31 is reduced.
（２）放熱装置３１の筐体３３に取り付けられる蓋部材３７の位置決めを行うピン３６と、放熱装置３１の筐体３３とは一体成形されている。したがって、位置決め用のピン３６を筐体３３とは別に用意する必要がなく、放熱装置３１の部品点数が削減される。 (2) The pin 36 for positioning the lid member 37 attached to the housing 33 of the heat radiating device 31 and the housing 33 of the heat radiating device 31 are integrally formed. Therefore, there is no need to prepare positioning pins 36 separately from the housing 33, and the number of parts of the heat dissipation device 31 is reduced.
（３）冷媒通路３８の内部に突出するフィン３４と、放熱装置３１の筐体３３とは一体成形されている。したがって、フィン３４を筐体３３とは別に用意する必要がなく、放熱装置３１の部品点数が削減される。 (3) The fins 34 protruding into the refrigerant passage 38 and the housing 33 of the heat dissipation device 31 are integrally formed. Therefore, it is not necessary to prepare the fins 34 separately from the housing 33, and the number of parts of the heat dissipation device 31 is reduced.
（４）ケース本体１３は、鋳造によって製造されている。鋳造は、鋳型に溶融した金属材料を流し込んで形成する方法であるため、ケース本体１３の量産性に優れる。
（５）ケース本体１３に取り付けられる天板１８の位置決めを行うピン２０は、ケース本体１３に一体成形されている。このため、ピン２０をケース本体１３とは別に用意する必要がなく、部品点数が削減される。
(4) The case body 13 is manufactured by casting. Casting is a method in which a molten metal material is poured into a mold and formed, so that the mass productivity of the case body 13 is excellent.
(5) The pins 20 for positioning the top plate 18 attached to the case body 13 are integrally formed with the case body 13. For this reason, it is not necessary to prepare the pin 20 separately from the case main body 13, and the number of parts is reduced.
（６）例えば、特許文献１に記載の熱交換器のように、出入口パイプを一対のプレートにロウ付けすることで放熱装置を構成する場合、出入口パイプと、一対のプレートとのシール性を確保するために、出入口パイプと一対のプレートとの境界にシール材を介在させる場合がある。本実施形態の放熱装置３１においては、放熱装置３１の筐体３３と流入路形成部４２及び流出路形成部４３とが一体成形されているため、流入路形成部４２及び流出路形成部４３と筐体３３との境界部がなく、シール材を設ける必要がない。このため、流入路形成部４２及び流出路形成部４３と、放熱装置３１の筐体３３とのシール性を確保するためにシール材を設ける必要がなく、部品点数が削減される。 (6) For example, when a heat radiating device is configured by brazing an inlet / outlet pipe to a pair of plates as in the heat exchanger described in Patent Document 1, a sealing property between the inlet / outlet pipe and the pair of plates is ensured. In order to do so, a sealing material may be interposed at the boundary between the inlet / outlet pipe and the pair of plates. In the heat radiating device 31 of the present embodiment, the housing 33 of the heat radiating device 31 and the inflow path forming portion 42 and the outflow path forming portion 43 are integrally formed. There is no boundary with the housing 33, and there is no need to provide a sealing material. For this reason, it is not necessary to provide a sealing material in order to ensure the sealing performance between the inflow path forming portion 42 and the outflow path forming portion 43 and the housing 33 of the heat dissipation device 31, and the number of parts is reduced.
（７）特許文献１に記載の熱交換器のように、出入口パイプを一対のプレートにロウ付けする場合には、一対のプレートの凹部に出入口パイプを配置する段階や、一対のプレートの凹部に出入口パイプを配置した後、ロウ材を溶融させる段階などで、出入口パイプに位置ずれが生じる場合がある。そして、出入口パイプに位置ずれが生じた状態でロウ付けが行われると、接合不良が生じるおそれがあり、熱交換器の接合信頼性が低下する。本実施形態の放熱装置３１においては、流入路形成部４２及び流出路形成部４３が筐体３３に一体成形されることで、流入路形成部４２及び流出路形成部４３に位置ずれが生じることがない。 (7) Like the heat exchanger described in Patent Document 1, when brazing the inlet / outlet pipes to the pair of plates, the stage of arranging the inlet / outlet pipes in the recesses of the pair of plates, or the recesses of the pair of plates After the entrance / exit pipe is arranged, the entrance / exit pipe may be misaligned, for example, at the stage of melting the brazing material. If brazing is performed in a state where the position of the inlet / outlet pipe is displaced, there is a possibility that a bonding failure may occur, and the bonding reliability of the heat exchanger decreases. In the heat radiating device 31 of the present embodiment, the inflow path forming portion 42 and the outflow path forming portion 43 are integrally formed with the housing 33, so that the inflow path forming portion 42 and the outflow path forming portion 43 are displaced. There is no.
（８）特許文献１に記載の熱交換器とは異なり、出入口パイプをプレートにロウ付けする必要がないため、流入路形成部４２及び流出路形成部４３をロウ付けする工程が不要となる。 (8) Unlike the heat exchanger described in Patent Document 1, since it is not necessary to braze the inlet / outlet pipe to the plate, the step of brazing the inflow path forming section 42 and the outflow path forming section 43 is not required.
（９）ピン２０を一体成形しない場合には、支持部１９に形成された穴にピンを圧入することで、ケース本体１３にピンを設ける。本実施形態の放熱装置３１においては、ピン２０がケース本体１３に一体成形されているため、ピンを圧入する工程が不要となる。 (9) When the pin 20 is not integrally formed, the pin is provided in the case body 13 by press-fitting the pin into the hole formed in the support portion 19. In the heat dissipation device 31 of the present embodiment, since the pin 20 is integrally formed with the case main body 13, the step of press-fitting the pin becomes unnecessary.
なお、実施形態は以下のように変更してもよい。
○ 実施形態において、放熱装置３１として、インバータケース１１のケース本体１３に一体成形された放熱装置３１を用いたが、これに限られない。放熱装置３１の本体部３９、流入路形成部４２及び流出路形成部４３が一体成形されていればよく、ケース本体１３など、他の部材と一体化されていなくてもよい。
In addition, you may change embodiment as follows.
In the embodiment, the heat dissipating device 31 integrally formed with the case main body 13 of the inverter case 11 is used as the heat dissipating device 31, but is not limited thereto. The main body 39, the inflow passage formation portion 42, and the outflow passage formation portion 43 of the heat radiating device 31 may be integrally formed, and may not be integrated with other members such as the case main body 13.
○ 実施形態において、ケース本体１３（放熱装置３１の筐体３３、流入路形成部４２及び流出路形成部４３）は、切削によって製造されていてもよい。この場合、鋳造の場合とは異なり、鋳型からケース本体１３を引き抜く必要がなく、ケース本体１３が複雑な形状であっても、製造することができる。例えば、流入路形成部４２及び流出路形成部４３を屈曲させた形状とすることができる。 In the embodiment, the case main body 13 (the housing 33 of the heat dissipation device 31, the inflow path forming portion 42, and the outflow path forming portion 43) may be manufactured by cutting. In this case, unlike the case of casting, it is not necessary to pull out the case body 13 from the mold, and the case body 13 can be manufactured even if it has a complicated shape. For example, the inflow path forming portion 42 and the outflow path forming portion 43 can be bent.
○ 実施形態において、ケース本体１３（放熱装置３１の筐体３３、流入路形成部４２及び流出路形成部４３）は、鍛造によって製造されていてもよい。
○ 実施形態において、流入路形成部４２及び流出路形成部４３のいずれか一方のみを放熱装置３１の筐体３３に一体成形してもよい。
In the embodiment, the case main body 13 (the casing 33 of the heat radiating device 31, the inflow path forming portion 42, and the outflow path forming portion 43) may be manufactured by forging.
In the embodiment, only one of the inflow path forming portion 42 and the outflow path forming portion 43 may be integrally formed with the housing 33 of the heat dissipation device 31.
○ 実施形態において、位置決め用のピン３６は、ケース本体１３に一体成形されていなくてもよい。
○ 実施形態において、フィン３４は、ケース本体１３に一体成形されていなくてもよい。
In the embodiment, the positioning pin 36 may not be integrally formed with the case body 13.
In the embodiment, the fins 34 may not be integrally formed with the case body 13.
○ 実施形態において、フィン３４は、蓋部材３７に一体成形されていてもよい。 In the embodiment, the fin 34 may be integrally formed with the lid member 37.
３１…放熱装置、３２…凹部、３３…筐体、３４…フィン、３６…ピン、３７…蓋部材、３８…冷媒通路、３９…本体部、４２…流路形成部としての流入路形成部、４３…流路形成部としての流出路形成部、５１…流入路、５２…流出路。 DESCRIPTION OF SYMBOLS 31 ... Radiating device, 32 ... Recessed part, 33 ... Housing, 34 ... Fin, 36 ... Pin, 37 ... Lid member, 38 ... Refrigerant passage, 39 ... Main body part, 42 ... Inflow path formation part as flow path formation part, 43 ... Outflow path forming part as flow path forming part, 51 ... Inflow path, 52 ... Outflow path.
Claims (6)
前記本体部には、前記流入路及び前記流出路の少なくとも一方を形成する流路形成部が一体成形されることを特徴とする放熱装置。 A heat generating body is thermally coupled, a refrigerant passage through which a refrigerant that radiates heat from the heat generating body flows is provided, and a main body portion is formed therein. A heat dissipating device having an outflow path through which refrigerant flows out,
The heat radiating device according to claim 1, wherein a flow path forming part that forms at least one of the inflow path and the outflow path is formed integrally with the main body.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012222321A JP2014075488A (en) | 2012-10-04 | 2012-10-04 | Heat radiation device |
| CN201310456301.0A CN103715157A (en) | 2012-10-04 | 2013-09-29 | Heat dissipation device |
| US14/043,209 US20140096938A1 (en) | 2012-10-04 | 2013-10-01 | Heat dissipation device |
| DE102013219852.3A DE102013219852A1 (en) | 2012-10-04 | 2013-10-01 | Heat dissipation device |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2012222321A JP2014075488A (en) | 2012-10-04 | 2012-10-04 | Heat radiation device |
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| JP2014075488A true JP2014075488A (en) | 2014-04-24 |
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| JP2012222321A Withdrawn JP2014075488A (en) | 2012-10-04 | 2012-10-04 | Heat radiation device |
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| Country | Link |
|---|---|
| US (1) | US20140096938A1 (en) |
| JP (1) | JP2014075488A (en) |
| CN (1) | CN103715157A (en) |
| DE (1) | DE102013219852A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20220098116A (en) * | 2016-11-17 | 2022-07-11 | 엘지이노텍 주식회사 | Dc-dc converter |
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| KR101653453B1 (en) * | 2014-11-03 | 2016-09-09 | 현대모비스 주식회사 | Cooling system for cooling both sides of power semiconductor |
| JP6710283B2 (en) * | 2016-09-20 | 2020-06-17 | 三菱電機株式会社 | Power converter |
| CN109964548B (en) * | 2016-11-17 | 2021-08-27 | Lg伊诺特有限公司 | DC-DC converter |
| CN113015405B (en) | 2017-03-21 | 2023-11-07 | Lg伊诺特有限公司 | Inverter |
| US10483028B2 (en) | 2017-12-18 | 2019-11-19 | Deere & Company | Electrical assembly having cavities for coolant |
| US11391523B2 (en) * | 2018-03-23 | 2022-07-19 | Raytheon Technologies Corporation | Asymmetric application of cooling features for a cast plate heat exchanger |
| US10405466B1 (en) | 2018-06-14 | 2019-09-03 | Ford Global Technologies, Llc | Power-module assembly with endcap |
| KR20210063708A (en) * | 2019-11-25 | 2021-06-02 | 엘지이노텍 주식회사 | Converter |
| FI20205844A (en) * | 2020-08-31 | 2022-03-01 | Epec Oy | Electrical device and method for cooling an electrical device |
| JP2022108688A (en) * | 2021-01-13 | 2022-07-26 | 本田技研工業株式会社 | Vehicle temperature control system |
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| JPH0211147A (en) | 1988-06-29 | 1990-01-16 | Yasuro Kuratomi | Far infrared radiation heating drying deodorizer |
| US6882533B2 (en) * | 2001-02-22 | 2005-04-19 | Hewlett-Packard Development Company, L.P. | Thermal connector for cooling electronics |
| US7177153B2 (en) * | 2002-01-16 | 2007-02-13 | Rockwell Automation Technologies, Inc. | Vehicle drive module having improved cooling configuration |
| JP2004296673A (en) * | 2003-03-26 | 2004-10-21 | Tdk Corp | Power-supply unit having watertight plate |
| US20050128710A1 (en) * | 2003-12-15 | 2005-06-16 | Beiteimal Abdlmonem H. | Cooling system for electronic components |
| WO2005088714A1 (en) * | 2004-03-08 | 2005-09-22 | Remmele Engineering, Inc. | Cold plate and method of making the same |
| JP2008027370A (en) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | Electronic device |
| JP4996284B2 (en) | 2007-02-28 | 2012-08-08 | 株式会社ティラド | Pipe structure for heat exchanger |
| TWI423403B (en) * | 2007-09-17 | 2014-01-11 | Ibm | Integrated circuit stack |
| EP2247172B1 (en) * | 2009-04-27 | 2013-01-30 | Siemens Aktiengesellschaft | Cooling system, cooling board and assembly with cooling system |
| JP5702988B2 (en) * | 2010-01-29 | 2015-04-15 | 株式会社 日立パワーデバイス | SEMICONDUCTOR POWER MODULE, POWER CONVERSION DEVICE MOUNTED WITH THE SEMICONDUCTOR POWER MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR POWER MODULE WATER CHANNEL FORMING BODY |
| US8931546B2 (en) * | 2010-03-29 | 2015-01-13 | Hamilton Sundstrand Space Sytems International, Inc. | Compact two sided cold plate with threaded inserts |
-
2012
- 2012-10-04 JP JP2012222321A patent/JP2014075488A/en not_active Withdrawn
-
2013
- 2013-09-29 CN CN201310456301.0A patent/CN103715157A/en active Pending
- 2013-10-01 US US14/043,209 patent/US20140096938A1/en not_active Abandoned
- 2013-10-01 DE DE102013219852.3A patent/DE102013219852A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220098116A (en) * | 2016-11-17 | 2022-07-11 | 엘지이노텍 주식회사 | Dc-dc converter |
| KR102512381B1 (en) | 2016-11-17 | 2023-03-22 | 엘지이노텍 주식회사 | Dc-dc converter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103715157A (en) | 2014-04-09 |
| DE102013219852A1 (en) | 2014-04-10 |
| US20140096938A1 (en) | 2014-04-10 |
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