US20140096938A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20140096938A1 US20140096938A1 US14/043,209 US201314043209A US2014096938A1 US 20140096938 A1 US20140096938 A1 US 20140096938A1 US 201314043209 A US201314043209 A US 201314043209A US 2014096938 A1 US2014096938 A1 US 2014096938A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- dissipation device
- case
- coolant
- forming portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2220/00—Closure means, e.g. end caps on header boxes or plugs on conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/14—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes molded
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
- F28F2275/143—Fastening; Joining by using form fitting connection, e.g. with tongue and groove with pin and hole connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
- F28F2280/04—Means for preventing wrong assembling of parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The heat dissipation device is provided with a body portion, to which a heating element is thermally coupled. A coolant passage through which the coolant, which dissipates heat of the heating element, flows is provided in the body portion. A passage forming portion, which forms at least one of an inflow passage and an outflow passage, is molded integrally with the body portion.
Description
- The art of the present disclosure relates to a heat dissipation device with a coolant passage through which coolant, which dissipates heat of a heating element, flows.
- A heat exchanger disclosed in Japanese Laid-Open Patent Publication No. 2008-211147 is an example of the heat exchanger, which cools electronic parts such as a semiconductor device that generates heat when driven.
- The heat exchanger disclosed in Japanese Laid-Open Patent Publication No. 2008-211147 has a pair of plates. A recessed portion is formed in the entire portion of each plate except for peripheral edge portions thereof. A groove portion with a semicircular cross section, which communicates the recessed portion with the edge of each plate, is formed in a part of the peripheral portion of each of the pair of plates. The pair of plates is stacked such that the groove portions face each other, and an inlet-outlet pipe, through which the coolant flows, fits into the groove portions therebetween. The groove portions and the inlet-outlet pipe are brazed to each other.
- Reduction of the number of components of the heat exchanger is desired.
- An object of the present disclosure is to provide a heat dissipation device that reduces the number of components.
- To achieve the foregoing object, a heat dissipation device including a body portion thermally coupled with a heating element, an inflow passage, an outflow passage, and a flow passage forming portion formed integrally with the body portion is provided. The body portion includes therein a coolant passage through which coolant, which dissipates heat of the heating element, flows. The inflow passage admits the coolant into the coolant passage. The outflow passage allows the coolant to flow out of the coolant passage. The flow passage forming portion forms at least one of the inflow passage and the outflow passage.
- Other aspects and advantages of the present invention will become apparent from the following description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
- The invention, together with objects and advantages thereof, may best be understood by reference to the following description of the presently preferred embodiments together with the accompanying drawings in which:
-
FIG. 1 is a perspective view illustrating an inverter device according to an embodiment; -
FIG. 2 is an exploded perspective view illustrating a heat dissipation device according to an embodiment provided in the inverter device ofFIG. 1 ; -
FIG. 3A is a plan view illustrating the inverter device ofFIG. 1 ; -
FIG. 3B is a lateral view illustrating the inverter device ofFIG. 1 ; -
FIG. 4 is a cross-sectional view illustrating the inverter case ofFIG. 1 ; -
FIG. 5A is an enlarged view illustrating a position determining pin in the heat dissipation device ofFIG. 2 ; -
FIG. 5B is a cross-sectional view taken alongline 5B-5B ofFIG. 5A , illustrating the position determining pin; and -
FIG. 6 is a cross-sectional view taken along line 6-6 ofFIG. 2 , illustrating the inverter case ofFIG. 2 . - A heat dissipation device provided in an inverter device according to an embodiment of the present disclosure will be described with reference to
FIGS. 1 to 6 . - As shown in
FIG. 1 , aninverter device 10 is configured such thatelectronic parts 12 such as a semiconductor device (a switching element and a diode) as a component of an inverter are accommodated in aninverter case 11. - As shown in
FIGS. 1 and 2 , acase body 13 of theinverter case 11 is provided with arectangular bottom plate 14,lateral walls lateral walls lateral walls bottom plate 14. Thelateral walls bottom plate 14. Aflange 17 is formed on the distal ends of thelateral walls inverter case 11 is formed by attaching atop plate 18 to theflange 17. A plurality of threadedportions 17 a, into which bolts that are not illustrated are threaded for fixing thetop plate 18 to acase body 13, are formed in theflange 17. A plurality of through-holes 18 a, into which the bolts are inserted, is formed in a peripheral portion of thetop plate 18. Pillar-like support portions 19, which extend vertically from thebottom plate 14, are formed at a plurality of positions of thebottom plate 14. Acolumnar pin 20, which extends vertically from a distal end surface of eachsupport portion 19, is formed on the distal end surface of eachsupport portion 19. Eachpin 20 is inserted into a corresponding recessed portion formed in the internal surface of thetop plate 18, which is not illustrated. Thepins 20 are inserted into the corresponding recessed portions of thetop plate 18 so that the position of thetop plate 18 is determined, and the bolts inserted into the through-holes 18 a are threaded into the threadedportions 17 a so that thetop plate 18 is fixed to thecase body 13. - As shown in
FIG. 2 , aheat dissipation device 31 for cooling theelectronic parts 12 accommodated in theinverter case 11 is formed on thebottom plate 14. In the present embodiment, theheat dissipation device 31 is formed integrally with thecase body 13. Hereinafter, explanation will be made in detail. - A
case 33, which is U-shaped in the plan view, is set up on thebottom plate 14. A U-shaped recessedportion 32 is formed in the inside of thecase 33. Thecase 33 of theheat dissipation device 31 is formed on a part of the case body 13 (bottom plate 14), and thecase body 13 serves as thecase 33 of theheat dissipation device 31. - The
recessed portion 32 is formed such that it extends from one of the pair oflateral walls lateral wall 15 a to the other one of the pair oflateral walls lateral wall 15 b, and turns toward thelateral wall 15 a before reaching thelateral wall 15 b. A plurality ofplate fins 34, which extend vertically from thebottom plate 14, are formed in therecessed portion 32. Thefins 34 extend in a direction in which thelateral walls - As shown in
FIG. 6 , thefins 34 are molded integrally with thecase 33 of theheat dissipation device 31. - As shown in
FIG. 2 , threadedportions 35, into which bolts B1 are threaded, are formed at a plurality of positions of a peripheral portion of the recessedportion 32 in thebottom plate 14. Further,pins 36, which extend vertically from an outer surface of thebottom plate 14, are formed at two positions of the peripheral portion of therecessed portion 32 in thebottom plate 14. - A
plate lid member 37, which covers therecessed portion 32, is attached to thebottom plate 14. Acoolant passage 38, through which coolant flows, is formed by thecase 33 and thelid member 37. Abody portion 39 of theheat dissipation device 31 in the present embodiment is provided with thecase 33 and thelid member 37. - Through-
holes 40, into which the bolts B1 for fixing thelid member 37 to thebottom plate 14 are inserted, are formed at a plurality of positions of a peripheral portion of thelid member 37. Further, through-holes 41, into which thepins 36 are inserted, are formed at two positions of the peripheral portion of thelid member 37. Thelid member 37 is attached to thebottom plate 14 by inserting thepins 36 into the through-holes 41 formed in thelid member 37 and threading the bolts B1 into the threadedportions 35. Accordingly, thepins 36 serve as position determining pins for determining the position of thelid member 37 for thebottom plate 14, namely thecase 33. - As shown in
FIGS. 5A and 5B , thepins 36, which determine the position of thelid member 37 when thelid member 37 is attached to thecase 33 of theheat dissipation device 31, are molded integrally with thecase 33 of theheat dissipation device 31. Similarly, the position determining pins 20, which determine the position of thetop plate 18 when thetop plate 18 is attached to thecase body 13, are molded integrally with thecase body 13. - As shown in
FIG. 2 , a cylindrical inflowpassage forming portion 42 as a flow passage forming portion is molded integrally with thelateral wall 15 a. Aninflow passage 51 is formed in the inflowpassage forming portion 42. Theinflow passage 51 is in communication with an inlet of thecoolant passage 38. Similarly, an outflowpassage forming portion 43 as a flow passage forming portion is molded integrally with thelateral wall 15 a. Anoutflow passage 52 is formed in the outflowpassage forming portion 43. Theoutflow passage 52 is in communication with an outlet of thecoolant passage 38. - As shown in
FIGS. 3A and 3B , a coolant supply source is connected through atubular member 44 such as a hose to the inflowpassage forming portion 42 and the outflowpassage forming portion 43. The coolant supplied from the coolant supply source flows through theinflow passage 51 to thecoolant passage 38, and discharged through theoutflow passage 52 from thecoolant passage 38. - As shown in
FIG. 4 , the inflowpassage forming portion 42 is molded integrally with thecase 33 of theheat dissipation device 31. Similarly, the outflowpassage forming portion 43 is molded integrally with the case 33 (case body 13) of theheat dissipation device 31. - As described above, the
case 33 of theheat dissipation device 31, the inflowpassage forming portion 42, the outflowpassage forming portion 43, thepins fins 34 are integrally molded in thecase body 13. - The
case body 13 is an integrally molded cast. That is, thecase body 13 is manufactured by flowing melted metal materials (such as aluminum) into a mold formed in accordance with the shape of thecase body 13, and solidifying the metal materials. Thecase body 13, in which thecase 33, the inflowpassage forming portion 42, the outflowpassage forming portion 43, thepins fins 34 of theheat dissipation device 31 are integrally formed, is obtained by drawing out thecase body 13 from the mold. The phrase “integrally molded” refers to a fact that thebody portion 39, the inflowpassage forming portion 42, and the outflowpassage forming portion 43 of theheat dissipation device 31 are the same member. The phrase does not include a plurality of members integrally joined by a brazing material, for example. - As shown in
FIG. 3A , the top of thecoolant passage 38 corresponds to a mounting region for theelectronic parts 12 as heat generators in thecase 33. Theelectronic parts 12 are mounted on the region. Eachelectronic part 12 is signally connected to acontrol board 45 accommodated in thecase body 13. Theelectronic parts 12 are controlled by thecontrol board 45, in which a control device is formed, which is not illustrated. - Next, an operation of the
heat dissipation device 31 according to the present embodiment will be described. - When the
electronic parts 12 generate heat and the coolant flows from theinflow passage 51 to thecoolant passage 38, theelectronic parts 12 transfer heat to the coolant via thebody portion 39. Theelectronic parts 12 are cooled by the coolant. The coolant that has passed through thecoolant passage 38 is discharged from thecoolant passage 38 through theoutflow passage 52. - The above described embodiment has the following advantages.
- (1) The
case 33 of theheat dissipation device 31 is molded integrally with the inflowpassage forming portion 42 and the outflowpassage forming portion 43. Accordingly, since the inflowpassage forming portion 42 and the outflowpassage forming portion 43 are formed simultaneously with the body portion 39 (case 33), it is not necessary to separately prepare a member for forming theinflow passage 51 and theoutflow passage 52. Therefore, the number of components of theheat dissipation device 31 is reduced. - (2) The
pins 36, which determine the position of thelid member 37 attached to thecase 33 of theheat dissipation device 31, are molded integrally with thecase 33 of theheat dissipation device 31. Accordingly, it is not necessary to prepare the position determining pins 36 separately from thecase 33. Therefore, the number of components of theheat dissipation device 31 is reduced. - (3) The
fins 34, which protrude in the inside of thecoolant passage 38, are molded integrally with thecase 33 of theheat dissipation device 31. Accordingly, it is not necessary to prepare thefins 34 separately from thecase 33. Therefore, the number of components of theheat dissipation device 31 is reduced. - (4) The
case body 13 is manufactured by casting. Since the casting is a method in which the melted metal materials are flowed into the mold, it excels in mass production of thecase body 13. - (5) The
pins 20, which determine the position of thetop plate 18 attached to thecase body 13, are molded integrally with thecase body 13. Accordingly, it is not necessary to prepare thepins 20 separately from thecase body 13 so that the number of components is reduced. - (6) For example, as in the heat exchanger disclosed in Japanese Laid-Open Patent Publication No. 2008-211147, when the heat dissipation device is configured by brazing the inlet-outlet pipe on between the pair of plates, a sealing member is intervened at an interface between the inlet-outlet pipe and the pair of plates to ensure the sealing property between the inlet-outlet pipe and the pair of plates. In the
heat dissipation device 31 of the present embodiment, since thecase 33 of theheat dissipation device 31 is molded integrally with the inflowpassage forming portion 42 and the outflowpassage forming portion 43, the interface between thecase 33, and the inflowpassage forming portion 42 and the outflowpassage forming portion 43 is absent. Accordingly, it is not necessary to provide a sealing member. Therefore, it is not necessary to provide a sealing member between thecase 33 of theheat dissipation device 31, and the inflowpassage forming portion 42 and the outflowpassage forming portion 43 to ensure the sealing property therebetween so that the number of components is reduced. - (7) As in the heat exchanger disclosed in Japanese Laid-Open Patent Publication No. 2008-211147, when the inlet-outlet pipe is brazed to the pair of plates, positional shifting of the inlet-outlet pipe may be caused in the steps of arranging the inlet-outlet pipe on the recessed portion of the pair of plates, and melting the brazing material after the inlet-outlet pipe is arranged on the recessed portion of the pair of plates. When the brazing is performed in the state where the positional shifting of the inlet-outlet pipe is caused, inferior joint is likely to be caused so that the joint reliability of the heat exchanger is reduced. In the
heat dissipation device 31 of the present embodiment, because the inflowpassage forming portion 42 and the outflowpassage forming portion 43 are molded integrally with thecase 33, the positional shifting of the inflowpassage forming portion 42 and the outflowpassage forming portion 43 is not caused. - (8) Since it is not necessary to braze the inlet-outlet pipe to the plates unlike the heat exchanger disclosed in Japanese Laid-Open Patent Publication No. 2008-211147, the step of brazing the inflow
passage forming portion 42 and the outflowpassage forming portion 43 is omitted. - (9) When the
pins 20 are not integrally molded, the pins are press fit into the holes formed in thesupport portions 19 to be provided in thecase body 13. In theheat dissipation device 31 of the present embodiment, since thepins 20 are molded integrally with thecase body 13, the step of press fitting the pins becomes unnecessary. - The embodiment may be modified as follows.
- In the embodiment, the
heat dissipation device 31 molded integrally with thecase body 13 of theinverter case 11 is used as theheat dissipation device 31. Theheat dissipation device 31 is not limited to this. Thebody portion 39 of theheat dissipation device 31, the inflowpassage forming portion 42, and the outflowpassage forming portion 43 may be integrally molded. It is not necessary to mold these elements integrally with other members such as thecase body 13. - The case body 13 (the
case 33 of theheat dissipation device 31, the inflowpassage forming portion 42, and the outflow passage forming portion 43) may be articles manufactured by cutting. In this case, unlike the case of casting, it is not necessary to draw out thecase body 13 from the mold. Accordingly, thecase body 13 is manufactured even if thecase body 13 includes a complicated shape. For example, the inflowpassage forming portion 42 and the outflowpassage forming portion 43 may be of a flexed shape. - The case body 13 (the
case 33 of theheat dissipation device 31, the inflowpassage forming portion 42, and the outflow passage forming portion 43) may be a forging manufactured by forging. - Only one of the inflow
passage forming portion 42 and the outflowpassage forming portion 43 may be molded integrally with thecase 33 of theheat dissipation device 31. - It is not necessary to mold the position determining pins 36 integrally with the
case body 13. - It is not necessary to mold the
fins 34 integrally with thecase body 13. - The
fins 34 may be molded integrally with thelid member 37. - Therefore, the present examples and embodiments are to be considered as illustrative and not restrictive and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalence of the appended claims.
Claims (6)
1. A heat dissipation device comprising:
a body portion thermally coupled with a heating element, wherein the body portion includes therein a coolant passage through which coolant, which dissipates heat of the heating element, flows;
an inflow passage, which admits the coolant into the coolant passage;
an outflow passage, which allows the coolant to flow out of the coolant passage; and
a flow passage forming portion formed integrally with the body portion, wherein the flow passage forming portion forms at least one of the inflow passage and the outflow passage.
2. The heat dissipation device according to claim 1 , wherein
the body portion includes a case, including a recessed portion, and a lid member, which is attached to the case in a state in which it covers the recessed portion to form the coolant passage with the case, and
the heat dissipation device further includes a position determining pin formed integrally with the case to determine a position of the lid member with respect to the case.
3. The heat dissipation device according to claim 1 , further comprising a fin molded integrally with the body portion and arranged inside the coolant passage.
4. The heat dissipation device according to claim 1 , wherein the body portion and the flow passage forming portion are casts.
5. The heat dissipation device according to claim 1 , wherein the body portion and the flow passage forming portion are articles formed by cutting.
6. The heat dissipation device according to claim 1 , the body portion and the flow passage forming portion are forgings.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-222321 | 2012-10-04 | ||
JP2012222321A JP2014075488A (en) | 2012-10-04 | 2012-10-04 | Heat radiation device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140096938A1 true US20140096938A1 (en) | 2014-04-10 |
Family
ID=50337168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/043,209 Abandoned US20140096938A1 (en) | 2012-10-04 | 2013-10-01 | Heat dissipation device |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140096938A1 (en) |
JP (1) | JP2014075488A (en) |
CN (1) | CN103715157A (en) |
DE (1) | DE102013219852A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160126160A1 (en) * | 2014-11-03 | 2016-05-05 | Hyundai Mobis Co., Ltd. | System for cooling dual sides of power semiconductor device |
WO2018174484A1 (en) * | 2017-03-21 | 2018-09-27 | 엘지이노텍 주식회사 | Converter |
EP3514811A1 (en) * | 2017-12-18 | 2019-07-24 | Deere & Company | An electrical assembly having cavities for coolant |
US10405466B1 (en) | 2018-06-14 | 2019-09-03 | Ford Global Technologies, Llc | Power-module assembly with endcap |
EP3544396A4 (en) * | 2016-11-17 | 2020-08-05 | LG Innotek Co., Ltd. | Dc-dc converter |
US10888035B2 (en) * | 2016-09-20 | 2021-01-05 | Mitsubishi Electric Corporation | Power conversion device |
WO2022043617A1 (en) * | 2020-08-31 | 2022-03-03 | Epec Oy | Electrical device and method for cooling electrical device |
US11391523B2 (en) * | 2018-03-23 | 2022-07-19 | Raytheon Technologies Corporation | Asymmetric application of cooling features for a cast plate heat exchanger |
US20220407413A1 (en) * | 2019-11-25 | 2022-12-22 | Lg Innotek Co., Ltd. | Converter |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102417581B1 (en) * | 2016-11-17 | 2022-07-07 | 엘지이노텍 주식회사 | Dc-dc converter |
JP2022108688A (en) * | 2021-01-13 | 2022-07-26 | 本田技研工業株式会社 | Vehicle temperature control system |
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2013
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- 2013-10-01 US US14/043,209 patent/US20140096938A1/en not_active Abandoned
- 2013-10-01 DE DE102013219852.3A patent/DE102013219852A1/en not_active Ceased
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Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160126160A1 (en) * | 2014-11-03 | 2016-05-05 | Hyundai Mobis Co., Ltd. | System for cooling dual sides of power semiconductor device |
US10888035B2 (en) * | 2016-09-20 | 2021-01-05 | Mitsubishi Electric Corporation | Power conversion device |
US11575313B2 (en) * | 2016-11-17 | 2023-02-07 | Lg Innotek Co., Ltd. | DC-DC converter |
US20220247305A1 (en) * | 2016-11-17 | 2022-08-04 | Lg Innotek Co., Ltd. | Dc-dc converter |
EP3544396A4 (en) * | 2016-11-17 | 2020-08-05 | LG Innotek Co., Ltd. | Dc-dc converter |
CN113645776A (en) * | 2016-11-17 | 2021-11-12 | Lg伊诺特有限公司 | DC-DC converter |
US11251694B2 (en) * | 2016-11-17 | 2022-02-15 | Lg Innotek Co., Ltd. | DC-DC converter |
US11304336B2 (en) | 2017-03-21 | 2022-04-12 | Lg Innotek Co., Ltd. | Converter |
WO2018174484A1 (en) * | 2017-03-21 | 2018-09-27 | 엘지이노텍 주식회사 | Converter |
US10925181B2 (en) | 2017-03-21 | 2021-02-16 | Lg Innotek Co., Ltd. | Converter |
US10483028B2 (en) | 2017-12-18 | 2019-11-19 | Deere & Company | Electrical assembly having cavities for coolant |
EP3514811A1 (en) * | 2017-12-18 | 2019-07-24 | Deere & Company | An electrical assembly having cavities for coolant |
US11391523B2 (en) * | 2018-03-23 | 2022-07-19 | Raytheon Technologies Corporation | Asymmetric application of cooling features for a cast plate heat exchanger |
US10405466B1 (en) | 2018-06-14 | 2019-09-03 | Ford Global Technologies, Llc | Power-module assembly with endcap |
US20220407413A1 (en) * | 2019-11-25 | 2022-12-22 | Lg Innotek Co., Ltd. | Converter |
WO2022043617A1 (en) * | 2020-08-31 | 2022-03-03 | Epec Oy | Electrical device and method for cooling electrical device |
Also Published As
Publication number | Publication date |
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JP2014075488A (en) | 2014-04-24 |
DE102013219852A1 (en) | 2014-04-10 |
CN103715157A (en) | 2014-04-09 |
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