JP2014073562A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device improving productivity as compared with a conventional cutting device.SOLUTION: A cutting device comprises: holding means for sucking and holding a package substrate; cutting means having a cutting blade for cutting the package substrate held by the holding means; a cassette placing base on which a cassette capable of storing a plurality of package substrates is placed; a temporarily placing portion for temporarily placing and positioning the package substrates stored in the cassette placed on the casette placing base; carrying-out means for carrying out the package substrates stored in the cassette placed on the cassette placing base to the temporarily placing portion; and conveying means for conveying the package substrates positioned by the temporarily placing portion to the holding means. The temporarily placing portion has positioning means for positioning the package substrates, and a suction/adsorption checking table for checking the suction/adsorption of the package substrates.

Description

  The present invention relates to a cutting apparatus for cutting a package substrate.

  The package substrate is formed by laminating a plurality of materials, and furthermore, the influence of heat when sealing a semiconductor chip with resin, the influence of heat due to reflow heating when mounting a semiconductor chip on a lead frame or printed circuit board, etc. Therefore, the package substrate is likely to warp.

  Even if an attempt is made to suck and hold a warped package substrate with the holding table of the cutting apparatus, negative pressure leaks from a portion where the package substrate and the holding table are not in close contact, and the package substrate cannot be sucked and held.

  The cutting apparatus is controlled to perform suction holding again even if the negative pressure leaks once at the holding table and the package substrate cannot be sucked and held. If suction holding is attempted a plurality of times and suction holding cannot be performed, the cutting device transmits an error message. In response to the error message, the operator removes the package substrate from the holding table and resumes cutting of the remaining package substrate.

JP 2012-051081 A

  However, the warped package substrate is transported to the holding table, tried to suck and hold multiple times, and finally the suction device cannot be held and the cutting device sends an error message, and the operator removes the package substrate on the holding table. Therefore, there is a problem that efficiency is very low and productivity is low.

  An object of the present invention has been made in view of the above, and is to provide a cutting device with improved productivity as compared with a conventional cutting device.

  According to the present invention, there is provided a cutting apparatus for cutting a package substrate, the holding means for sucking and holding the package substrate, the cutting means having a cutting blade for cutting the package substrate held by the holding means, and the package substrate. A cassette mounting table on which a plurality of cassettes that can be stored are mounted, a temporary mounting unit that temporarily positions and positions a package substrate stored in the cassette mounted on the cassette mounting table, and a cassette mounting table mounted on the cassette mounting table An unloading means for unloading the package substrate contained in the placed cassette to the temporary placement section; and a transport means for transporting the package substrate positioned by the temporary placement section to the holding means. The placing portion includes positioning means for positioning the package substrate, and a suction suction confirmation table for confirming suction suction of the package substrate. Cutting device is provided.

  Preferably, the package substrate that has not been sucked and sucked by the sucking and sucking confirmation table is carried into the cassette by the carry-out means without being carried by the carrying means to the holding means.

According to the present invention, before the package substrate is transported onto the holding table (holding means), whether or not the package substrate can be sucked and sucked is confirmed by the suction and suction confirmation table, and the warp so that suction and suction cannot be performed by the suction and suction confirmation table. It is possible to prevent the package substrate having the above from being conveyed to the holding table in advance.
In addition, since the package suction check table actually confirms whether the package substrate can be sucked and sucked, the detection accuracy of the package substrate that cannot be sucked and sucked is higher than the method of measuring the warpage of the package substrate, and compared to the conventional cutting device. Thus, a cutting device that improves productivity is provided.

It is a perspective view of a cutting device concerning an embodiment of the present invention. It is a front view of the cassette in which a plurality of package substrates are stored. It is sectional drawing explaining the process of positioning a package board | substrate with a centering guide. It is sectional drawing of the state which mounted the package board | substrate positioned in order to confirm the possibility of attraction | suction adsorption | suction of a package board | substrate with the suction suction confirmation table. It is sectional drawing of the state which attracted and held the package board | substrate with the suction suction confirmation table. FIG. 5 is a cross-sectional view illustrating a step of confirming whether or not a package substrate different from the package substrate shown in FIG.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a cutting device 2 according to an embodiment of the present invention is shown. A cassette mounting table 6 for mounting the cassette 5 is provided on the base 4 of the cutting device 2.

  A cassette elevator 8 for moving the cassette 5 in the Z-axis direction (vertical direction) is attached to the cassette mounting table 6. A plurality of package substrates 11 are stored in the cassette 5. A tape 13 having the same dimensions as the back surface of the package substrate 11 is attached to the back surface of the package substrate 11.

  An arm 9 that can move in the Y-axis direction and the Z-axis direction is provided on the base 4, and an unloading means 10 is provided at the tip of the arm 9. By moving the arm 9 in the Y-axis direction, the unloading means 10 can pull out and transport the package substrate 11 in the Y-axis direction. By moving the arm 9 in the Z-axis direction, the unloading means 10 moves the package substrate 11. It can be moved in the Z-axis direction.

  A suction suction confirmation table 17 for confirming suction suction of the package substrate 11 is provided between the cassette mounting table 6 and the carry-out means 10. A pair of centering guides 16 for positioning the package substrate 11 is provided above the suction suction confirmation table 17. The suction placement confirmation table 17 and the pair of centering guides 16 constitute a temporary placement unit 19.

  A transport unit 18 that is movable and rotatable in the Z-axis direction is provided adjacent to the temporary placement unit 19, and a holding table 20 that holds the package substrate 11 transported by the transport unit 18 is provided on the base 4. . The holding table 20 is provided with a rotation mechanism and a machining feed means (not shown), and the holding table 20 is moved in the X-axis direction between the home position A and the machining area B shown by the machining feed means.

  A housing 34 is integrally connected to the base 4, and a first cutting blade (not shown) for cutting the package substrate 11 protruding from the housing 34 and held on the holding table 20 is mounted. The cutting unit 22 and the second cutting unit 24 to which the second cutting blade 23 is attached are arranged so as to be independently movable in the Y-axis direction.

  Further, the base 4 is provided with a spinner cleaning unit 28 that cleans the package substrate 11 that has been cut, and the housing 34 is a transport unit that transports the cut package substrate 11 from the holding table 20 to the spinner cleaning unit 28. 26 is provided. An operation panel 32 for inputting cutting conditions is provided adjacent to the holding table 20, and a display monitor 36 is provided on the housing 34.

  Referring to FIG. 2, a front view of the cassette 5 in which a plurality of package substrates are stored is shown. The cassette 5 is provided with 10 cassette stages (accommodating sections) for accommodating package substrates from the cassette stage 15 to the cassette stage 15I. From the cassette stage 15, the package substrate 11 to the package substrate 11I are stored one by one. As described above, the tape 13 is attached to the back surface of each package substrate.

  Hereinafter, an operation of the cutting device 2 of the embodiment of the present invention configured as described above will be described. Referring to FIG. 3, a partial cross-sectional side view illustrating the process of positioning the package substrate 11 with the centering guide 16 is shown. When the cassette mounting table 6 on which the cassette 5 is mounted by the cassette elevator 8 rises to a height at which the unloading means 10 can take out the package substrate 11 accommodated in the cassette 5, the arm 9 moves in the Y-axis direction to carry out. The means 10 carries the package substrate 11 accommodated in the cassette 5 to a pair of centering guides 16 provided above the suction suction confirmation table 17.

  Thereafter, the pair of centering guides 16 are moved toward each other, and the center positioning of the package substrate 11 is performed. The suction suction confirmation table 17 has a suction portion 17 a provided with a plurality of suction holes 17 b, and the suction portion 17 a is selectively communicated with the suction source 38 via the electromagnetic switching valve 40.

  Referring to FIG. 4, there is shown a cross-sectional view for explaining a process of confirming whether or not the package substrate 11 can be sucked and sucked by the suction suction confirmation table 17. The pair of centering guides 16 move away from each other, and the arm 9 moves in the Z-axis direction (downward), whereby the package substrate 11 on which the unloading means 10 is positioned is transferred from the pair of centering guides 16 to the suction suction confirmation table 17. Transport.

  Next, as shown in FIG. 5, by switching the electromagnetic switching valve 40 to the connection position, the suction portion 17 a of the suction suction confirmation table 17 is communicated with the suction source 38 to check whether the suction suction of the package substrate 11 is possible. To implement. In the case shown in FIG. 5, the package substrate 11 is transported to the holding table 20 by the transport means 18 and sucked and held by the holding table 20 because the suction suction confirmation table 17 can suck and suck the package substrate 11 with little warpage of the package substrate 11. Is done.

  The package substrate 11 sucked and held by the holding table 20 is moved in the X-axis direction by the processing feeding means, and cutting is performed by the first cutting unit 22 and the second cutting unit 24.

  The holding table 20 that sucks and holds the package substrate 11 that has been cut is returned to the home position A shown in FIG. 1 by the processing feed means, and the package substrate 11 is transported to the spinner cleaning unit 28 by the transport unit 26, and the spinner cleaning is performed. Washed by unit 28.

  The cleaned package substrate 11 is transported to the temporary placement unit 19 by the transport unit 18 and stored in the cassette 5 by the unloading unit 10. Thereafter, the cassette stage is sequentially raised one by one, and the unloading means 10 unloads the package substrates accommodated in the cassette 5 one by one to the temporary placement unit 19 to perform the above-described alignment and suction suction confirmation steps. When the suction and adsorption can be performed, processes such as cutting and cleaning are further performed.

  Referring to FIG. 6, there is shown a cross-sectional view for explaining a step of confirming whether or not the package substrate 11B different from the package substrate 11 shown in FIGS. The package substrate 11B has a large warp, and the suction suction confirmation table 17 cannot suck and suck the package substrate 11B.

  Since the suction suction confirmation table 17 and the holding table 20 are designed to perform the same suction action, the package substrate 11B to which the suction suction confirmation table 17 cannot be sucked and sucked cannot also suck and suck the holding table 20. Such a package substrate 11 </ b> B is carried into the cassette 5 from the temporary placement unit 19 by the carry-out means 10 without being carried to the holding table 20 by the carrying means 18.

  Accordingly, the package substrate 11B having a warp that cannot be sucked and held by the holding table 20 can be prevented from being conveyed to the holding table 20, so that the productivity of the cutting device 2 is improved.

  In this way, the suction suction confirmation table 17 is subjected to the suction suction confirmation table 17 for all the package substrates 11 to 11I, and the package substrates that have not been sucked and sucked are returned to the cassette 5 by the unloading means 10, and the package substrates are The stored cassette stage is stored in the memory. The package substrate that has been sucked and sucked is transferred to the holding table 20 by the transfer means 18, and the first and second cutting units 22 and 24 perform the cutting process.

  Of the package substrates stored in the cassette 5, when all of the package substrates that have been suctioned and sucked by the suction suction confirmation table 17 are completed, the display monitor 36 displays that the cutting has been completed, and further cutting is performed. The cassette stage in which the package substrate that has not been stored is displayed. In the present embodiment, the cassette stage 15B and the cassette stage 15E are displayed.

  As described above, the cutting device 2 according to the present embodiment confirms whether or not the package substrate 11 can be sucked and sucked by the suction suction confirmation table 17 before the package substrate is transported onto the holding table 20. Since the package substrate having a warp that cannot be sucked and sucked by the check table 17 can be prevented from being conveyed to the holding table 20 in advance, productivity is improved as compared with the conventional cutting apparatus.

  In the following, alternative embodiments will be described. In this alternative embodiment, the tape 13 is attached to the package substrate 11 and supported by the annular frame, the clamp is provided on the holding table 20, and the annular frame is fixed by the clamp, thereby cutting the package substrate 11.

  In another alternative embodiment, the tape 13 is not adhered to the package substrate 11, and the cut package substrate 11 is sucked on the entire surface and conveyed to the canister for storage. Alternatively, a pickup unit may be provided in the base 4 and the package substrate 11 cut by the pickup unit may be stored in the chip tray.

  The present invention is not limited by the contents described in the above embodiments. The constituent elements described above include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described above can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

2 Cutting device 5 Cassette 6 Cassette mounting table 10 Unloading means 11 Package substrate 16 Centering guide (positioning means)
17 Suction Adsorption Confirmation Table 18 Transport Unit 19 Temporary Place 20 Holding Table (Holding Unit)
22 1st cutting unit (cutting means)
23 Second cutting blade 24 Second cutting unit (cutting means)

Claims (2)

A cutting device for cutting a package substrate,
Holding means for sucking and holding the package substrate;
Cutting means having a cutting blade for cutting the package substrate held by the holding means;
A cassette mounting table on which a cassette capable of accommodating a plurality of package substrates is mounted;
A temporary placement unit for temporarily placing and positioning a package substrate housed in the cassette placed on the cassette placement table;
Unloading means for unloading the package substrate accommodated in the cassette placed on the cassette placing table to the temporary placing portion;
Transport means for transporting the package substrate positioned by the temporary placement portion to the holding means,
The temporary storage section is
Positioning means for positioning the package substrate;
A suction suction confirmation table for confirming suction suction of the package substrate;
A cutting apparatus comprising:   2. The cutting apparatus according to claim 1, wherein the package substrate that has not been sucked and sucked by the suction suction confirmation table is carried into the cassette by the carry-out means without being carried by the carrying means to the holding means.

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