JP2006013312A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To carry out cutting without contaminating switches even if an operator's hand is contaminated due to unloading of a plate-like object after cutting in a manual type cutting device wherein detaching/attaching and cutting of the plate-like object are started by the operator by switch operation. <P>SOLUTION: In the cutting device 1 having an attach/detach region cover 200 wherein a chuck table 2 moves between an attach/detach region 20 and a cutting region 10 and which can cover and open/close the region 20, the cutting mode is turned off when cutting of the plate-like object W is finished and the chuck table 2 is positioned at the region 20; the suction state in the chuck table 2 is turned off when the chuck table 2 is positioned in the region 20, and the cover 200 is in its open state from its close state; and suction operation in the chuck table 2 is turned on and the cutting mode is turned on, when the chuck table 2 is located in the region 20 and the cover 200 is in its close state from its open state. Consequently, an operator has not to touch the device except in opening and closing of the cover 200. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cutting apparatus for cutting a wafer and dividing it into individual chips.

  In a semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a number of regions arranged in a lattice pattern on the surface of a semiconductor wafer that is a substantially circular plate-like object. Then, an area called a street partitioning each circuit is cut along dicing lines and diced to be divided into individual semiconductor chips. For the semiconductor wafer division performed in this way, a cutting device is mainly used (see, for example, Patent Document 1).

  There are two types of cutting devices, a fully automatic type and a manual type. In a fully automatic type cutting machine, a semiconductor wafer previously stored in a cassette is taken out and transported to a chuck table, the semiconductor wafer is sucked and held on the chuck table, a street to be cut is detected, and the detected street is detected. A series of operations of cutting, cleaning the semiconductor wafer after cutting, and storing the semiconductor wafer after cleaning in a cassette are performed automatically. On the other hand, as a manual type cutting device, for example, there is a cutting device 300 shown in FIG.

  The cutting apparatus 300 includes a chuck table 303 that holds a workpiece and can move between an attachment / detachment region 301 and a cutting region 302, and an alignment unit that detects a cutting position of the workpiece held on the chuck table 303. 304 and a cutting means 305 for cutting the detected cutting position. For example, when cutting a semiconductor wafer, the operator opens the attachment / detachment area cover 306, the operator places the semiconductor wafer W integrated with the frame F via the adhesive tape T on the chuck table 303, and the suction on switch by the operator By the operation of 307, the suction of the semiconductor wafer W on the chuck table 303 is turned on, then the cutting of the semiconductor wafer W is started by the operation of the cutting start switch 308 by the operator, and after the end of the cutting, the operation of the suction off switch 309 by the operator The chuck table 303 is turned off, the operator attaches the attachment / detachment area cover 306 by hand, and takes out the semiconductor wafer W from the cutting apparatus 300. In other words, operations other than the detection of the cutting position and the cutting process are not automated, and an operator's hand must be interposed. Note that the switch 307 may be configured by a touch panel.

JP-A-10-116802

  In the manual type cutting apparatus, since the operator needs to hold the semiconductor wafer W after cutting from the chuck table 303, the cutting waste and the cutting fluid adhere to the operator's hand. Since the operator turns on / off the suction and starts cutting by operating the switches 307, 308, and 309, if these switches are operated with a hand to which cutting waste or cutting fluid has adhered, Cutting waste and cutting fluid will adhere. Therefore, there is a problem that the switches become dirty.

  In addition, when the switch is constituted by a touch panel, the screen display becomes invisible due to the attachment of cutting waste or the like, and the subsequent operation is hindered. In particular, when all operations are performed using the touch panel, the apparatus cannot be operated.

  On the other hand, it is inefficient for the operator to wash his hands each time the semiconductor wafer W after cutting is taken out of the apparatus. In addition, if a device for cleaning the semiconductor wafer W after cutting is mounted in the cutting device, the device becomes larger and the cost becomes higher. The problem as described above is a problem that occurs in common in cutting all plate-like objects including a semiconductor wafer.

  Therefore, the problem to be solved by the present invention is that, in a manual type cutting device, even if the operator's hand is soiled by taking out a plate-like object after cutting, the size of the device is not increased, and the switch, touch panel, etc. It is to prevent the operation site from getting dirty.

  The present invention moves a chuck table for holding a plate-like object and a chuck table between an attachment / detachment area where a plate-like object is attached / detached and a cutting area where a plate-like object is cut. A cutting table including at least a chuck table drive unit for recognizing the position of the chuck table, and an attachment / detachment region cover that covers the attachment / detachment region and can be opened / closed, and a change in the opening / closing state of the attachment / detachment region cover is detected. A suction control unit for turning on / off the suction action of the chuck table based on the change, a cutting means for cutting the plate-like object held on the chuck table, and a cutting of the plate-like object held on the chuck table by the cutting means. Cutting mode control unit for turning on / off the cutting mode to be performed, and at least holding of the plate-like object on the chuck table and the cutting mode are operable. Or a main switch that disables the operation, and when the cutting of the plate-like object is finished and the chuck table is positioned in the attachment / detachment region, the cutting mode control unit turns the cutting mode off and the chuck table is attached / detached. When the attachment / detachment area cover is changed from the closed state to the open state, the suction control unit turns off the suction action on the chuck table based on the fact that the attachment / detachment area cover is opened, and the chuck table is positioned in the attachment / detachment area. The suction control unit turns on the suction action in the chuck table and the cutting mode control unit turns on the cutting mode based on the fact that the detachable region cover is changed from the open state to the closed state. An example of the plate-like material is a semiconductor wafer, but is not limited thereto.

  In the above cutting apparatus, the chuck table is connected to a suction source via a suction path including a pressure gauge, a suction action is applied to the chuck table by the suction control unit, and the pressure value measured by the pressure gauge is a predetermined value. It is preferable that the cutting mode control unit turns on the cutting mode when the pressure decreases or lower.

  According to the present invention, when the chuck table is located in the attachment / detachment area and the attachment / detachment area cover is changed from the closed state to the open state, the suction action of the plate-like object on the chuck table is turned off, and the chuck table is in the attachment / detachment area. When the attachment / detachment area cover is changed from the open state to the closed state, the suction action of the plate-like object on the chuck table is turned on, and a series of cutting operations are automatically performed. / There is no need to instruct the start of turning off and cutting by a switch operation. Therefore, the plate-like object can be attached to and detached from the chuck table without operating the switches, so that the switches are not soiled and the apparatus is instructed to start / stop suction and to start cutting. This eliminates the need for a dedicated switch. When the switch is configured by a touch panel, it is possible to prevent the screen display from being invisible due to attached cutting waste or the like.

  In addition, when a pressure gauge is provided in the suction path connecting the chuck table and the suction source, the suction of the plate-like object can be performed by measuring the pressure in the suction path while the chuck table is sucked. Since it can be judged whether it is enough, it can avoid that cutting is performed in the state where suction is insufficient.

  A cutting apparatus 1 shown in FIG. 1 shows an example of the present invention, and a plate-like object to be cut is held on a chuck table 2. The chuck table 2 has a function of holding a plate-like object by suction, and in the X-axis direction between a cutting area 10 that is an area where actual cutting is performed and an attachment / detachment area 20 where the plate-like object is attached / detached. It is configured to be movable. The detachable area 20 is covered with a detachable area cover 200 that is transparent or translucent and can be opened and closed. When the detachable area cover 200 is opened, an operator can place a plate-like object on the chuck table 2 or the chuck table. The plate-like object mounted on 2 can be taken out. When opening / closing the detachable area cover 200, the handle 200a can be gripped.

  Above the movement path of the chuck table 2, an alignment means 3 for detecting a position where the plate-like object is to be cut is disposed. The alignment means 3 is located between the cutting area 10 and the attachment / detachment area 20 and includes an imaging means 30 for imaging the surface of the plate-like object.

  A cutting means 4 having a cutting blade 40 capable of rotating at high speed is disposed in the cutting region 10. The cutting means 4 is movable in the Y-axis direction and the Z-axis direction. The plate-like object held on the chuck table 2 moves in the X-axis direction, and a cutting blade 40 that rotates at high speed acts on the plate-like object. By doing so, cutting is performed. When cutting, a cutting fluid is supplied to the plate-like object. The cutting area is covered with an openable / closable cutting area cover 100, and the cutting blade 40 can be replaced by opening the cutting area cover 100.

  As shown in FIG. 2, an opening / closing sensor 6 having an advancing / retreating portion 60 that moves forward / backward by opening / closing the placement area cover 200 is disposed at a position protruding from the base 5 of the cutting apparatus 1. The advancing / retreating portion 60 is immersed when the detachable area cover 200 is closed, and protrudes when the detachable area cover 200 is open. The open / close sensor 6 determines that the attachment / detachment region cover 200 is in the closed state when the advance / retreat portion 60 is immersed, and determines that the attachment / detachment region cover 200 is in the open state when the advance / retreat portion 60 protrudes. To do. The configuration of the open / close sensor 6 is not limited to the illustrated example. For example, a magnetic sensor or an optical sensor can be used.

  As shown in FIG. 2, the open / close sensor 6 is electrically connected to a suction control unit 7 that controls on / off of suction of the plate-like object in the chuck table 2, and the suction control unit 7 includes an attachment / detachment region. Information indicating whether the cover 200 is open or closed is notified from the open / close sensor 6. The suction control unit 7 determines that the detachable area cover 200 has changed from the open state to the closed state, has changed from the closed state to the open state, and has no change, according to information notified from the open / close sensor 6. It can also be grasped.

  The suction control unit 7 communicates with the chuck table 2 through the suction path 8. The suction control unit 7 includes, for example, an electromagnetic valve, and connects and disconnects the suction source 9 and the chuck table 2 by opening and closing thereof. Further, a pressure gauge 80 is disposed in the middle of the suction path 8. The suction control unit 7 can open and close the electromagnetic valve based on the change in the state of the attachment / detachment region cover 200 to turn on / off the suction on the chuck table 2.

  The pressure gauge 80 is connected to a cutting mode control unit 10 that controls on / off of the cutting mode, and the cutting mode control unit 10 turns on / off the cutting mode based on a pressure measurement value by the pressure gauge 80. be able to. Here, the cutting mode refers to the movement (start movement function) of the chuck table 2 from the attachment / detachment area 20 (see FIG. 1) to the cutting area 10 (see FIG. 1), and the detection of the cutting position by the alignment means 3 (alignment function). The reciprocating movement (cutting movement function) of the chuck table 2 in the cutting region 20 in the X-axis direction, the rotation of the cutting blade 40 and the movement of the cutting means 4 in the Y-axis direction and the Z-axis direction (cutting processing function), In this mode, the plate-like object held on the chuck table 2 is cut by automatically moving the chuck table 2 to the attachment / detachment region 20 (return function).

  A main switch 11 is provided on the front side of the cutting apparatus 1. The main switch 11 is connected to the suction control unit 7 and the cutting mode control unit 10, and is capable of holding the plate-like object on the chuck table 2 and executing the cutting mode by turning on / off the main switch 11 ( An operable state) or an inoperable state (inoperable state).

  The chuck table 2 is driven in the X-axis direction by the chuck table driving unit 12, and positional information of the chuck table 12 in the X-axis direction is grasped by the chuck table driving unit 12. The position information is recognized by the cutting mode control unit 10 and the suction control unit 7.

  As an example, the case of cutting a semiconductor wafer will be described along the flowchart of FIG. 3 with reference to other drawings as appropriate. The flowchart shown in FIG. 3 shows processing when the main switch 11 shown in FIGS. 1 and 2 is on. When the main switch 11 is off, the operation is disabled, so the processing shown in the flowchart in the drawing is not performed.

  When the main switch 11 is on, the chuck table driving unit 12 determines whether or not the chuck table 2 is positioned in the attachment / detachment region 20 based on the X coordinate of the chuck table 2 (step S1). This process is for determining whether or not the cutting mode has been completed when cutting in the cutting mode has already been performed, and the chuck table 2 is normally operated immediately after the main switch 11 is turned on. This is for determining whether or not it is located in the detachable area 20. When the chuck table 2 is positioned in the attachment / detachment region 20, since the cutting has been completed or the cutting has not yet been performed, this information is notified to the cutting mode control unit 10, and the cutting mode control unit 10 The cutting mode is turned off (step S2). On the other hand, when the chuck table 2 is not located in the attachment / detachment area, the process waits for the chuck table 2 to return to the attachment / detachment area.

  After the cutting mode is turned off, the open / close sensor 6 detects the open / close state of the placement area cover 2 and performs a process corresponding to the change in the state (step S3). Immediately after turning off the cutting mode, the placement area cover 20 is in a closed state, and the operator holds the handle 200a to place the semiconductor wafer W to be cut on the chuck table 2 and places the placement area cover 20 on the chuck table 2. Open the cover 20. Then, as shown in FIG. 4A, the advancing / retreating portion 60 constituting the open / close sensor 6 is in a protruding state. Then, the open / close sensor 6 detects that the placement area cover 20 has been opened, and this information is notified to the suction control unit 7, whereby the placement area cover 20 is changed from the closed state to the open state. The suction control unit 7 recognizes that it has become, and turns off the suction action in the chuck table 2 (step S4).

  In a state where the chuck table 2 is not sucked, if there is a semiconductor wafer that has been cut, the operator can take out the cut semiconductor wafer W from the chuck table 2. Then, the operator places the semiconductor wafer W to be newly cut on the chuck table 2 in a state integrated with the frame F via the adhesive tape T as shown in FIG. . If there is no cut semiconductor wafer, the semiconductor wafer to be cut first is placed on the chuck table (step S5). In addition, since the cutting waste and cutting fluid adhere to the cut semiconductor wafer W, the cutting waste and cutting fluid adhere to the operator's hand when removing from the chuck table 2.

  After placing the semiconductor wafer W to be cut on the chuck table 2, the operator closes the placement area cover 20. Then, as shown in FIG. 4B, the open / close sensor 6 detects that the advancing / retreating portion 60 is immersed and the placement area cover 20 is closed, and notifies the suction switch 7 of the detection. The suction switch 7 recognizes that the placement area cover 20 has changed from the open state to the closed state, and operates the electromagnetic valve to cause the chuck table 2 and the suction source 9 to communicate with each other, thereby causing the chuck table 2 to perform a suction action. To adsorb the semiconductor wafer W (step S6).

  After applying the suction action to the chuck table 2, it is determined based on the measured value of the pressure gauge 80 whether or not the suction is normally performed (step S7). When the measured value by the pressure gauge 80 is equal to or smaller than the predetermined reduced pressure value, it is assumed that the semiconductor wafer W is normally adsorbed, and the cutting mode control unit 10 turns on the cutting mode and starts cutting in the cutting mode (step S8). ). On the other hand, if the measured value by the pressure gauge 80 is not less than or equal to the predetermined reduced pressure value, it is determined that the semiconductor wafer W is not normally sucked and an error is generated, and the shift to the cutting mode is not performed. In this case, it can be displayed on the display screen (not shown) of the cutting apparatus 1.

  After the cutting mode is turned on, the above-described start movement function, alignment function, cutting movement function, cutting processing function, and return function are automatically executed one after another without intervention of the operator. Specifically, in the start movement function, the chuck table 2 is moved in the + X direction from the attachment / detachment region 20 to be positioned immediately below the alignment unit 3, and in the alignment function, the surface of the semiconductor wafer W is imaged by the imaging unit 30 and cut. Detect the street to be.

  Next, as shown in FIG. 5, the chuck table 2 is reciprocated in the cutting region 10 by the cutting movement function, and the cutting blade 40 is rotated at a high speed by the cutting processing function and the cutting means 4 is lowered to cut the street. . In the cutting processing function, after cutting all streets in the same direction while indexing the cutting means 4 in the Y-axis direction, the chuck table 2 is rotated 90 degrees, and cutting is performed while indexing the cutting means 4 in the Y-axis direction. Cut all streets that are orthogonal to the completed streets. When cutting, a cutting fluid is supplied from the nozzle 41. The semiconductor wafer W is diced by cutting vertically and horizontally in this way, and is divided into individual semiconductor chips. After the cutting, the chuck table 2 is returned to the attachment / detachment region 20 by the return function.

  After turning on the cutting mode, the process returns to step S1 to wait for the chuck table 2 to return to the attachment / detachment region. When the cutting is finished and the chuck table 2 returns to the attachment / detachment region 20, the same processing as described above is performed from step S2.

  Thus, since the semiconductor wafer suction and cutting mode on the chuck table 2 can be started based on whether or not the detachable region cover 200 has been changed from the open state to the closed state, there is no instruction from the operator through the switch operation. Even cutting is done automatically. Accordingly, it is not necessary for the operator to operate the switch in order to cause the semiconductor wafer to be attracted or cut, and since only the handle 200a is touched, a hand is required when taking the cut semiconductor wafer W from the chuck table 2. Even if it gets dirty, the switches will not get dirty. Further, such a switch is not necessary.

  After all the semiconductor wafers are cut and the last semiconductor wafer is taken out from the chuck table 2, the detachable area cover 200 is closed without placing the next semiconductor wafer on the chuck table 2. If the operator turns off the main switch before closing 200, the operation becomes impossible and the processing shown in the flowchart of FIG. 3 is not performed, so that suction or cutting processing on the chuck table 2 is not performed.

  On the other hand, when resuming the cutting of the semiconductor wafer, if the main switch 11 is turned on, the semiconductor wafer is placed on the chuck table 2 and the placement area cover 200 is closed as described above. The semiconductor wafer is automatically adsorbed and cut at. Since the main switch 11 is not frequently operated, even if cutting chips or the like are attached to the operator's hand, the main switch 11 is turned off after the work is finished and, for example, the hand is washed before returning home. If you do, you will not be adversely affected by dirt on your hands.

It is a perspective view which shows an example of the cutting device which concerns on this invention. It is a side view of the cutting device. It is a flowchart which shows the outline | summary of the process in the cutting device. It is a side view which shows an open / close sensor, (A) shows the case where an attachment / detachment area | region cover will be in an open state, (B) shows the case where an attachment / detachment area cover will be in a closed state. It is a perspective view which shows a mode that a semiconductor wafer is cut. It is a perspective view which shows the conventional cutting device.

Explanation of symbols

1: Cutting device 10: Cutting area 100: Cutting area cover 2: Chuck table 20: Removable area 200: Removable area cover 200a: Handle 3: Alignment means 30: Imaging means 4: Cutting means 40: Cutting blade 41: Nozzle 5: Base 6: Open / close sensor 60: Advance / retreat unit 7: Suction control unit 8: Suction path 80: Pressure gauge 9: Suction source 10: Cutting mode control unit 11: Main switch 12: Chuck table drive unit W: Semiconductor wafer T: Adhesion Tape F: Frame

Claims (2)

A chuck table for holding a plate-like object;
The chuck table that moves the chuck table between an attaching / detaching area where a plate-like object is attached and detached and a cutting area where a plate-like object is cut, and recognizes the position of the chuck table A cutting device including at least a drive unit,
A detachable area cover that can be opened and closed to cover the detachable area;
A suction controller that detects a change in the open / closed state of the detachable region cover and turns on / off a suction action in the chuck table based on the change; and a cutting means that cuts a plate-like object held by the chuck table;
A cutting mode control unit for turning on / off a cutting mode for cutting the plate-like object held on the chuck table by the cutting means;
A main switch for holding at least the plate-like object in the chuck table and making the cutting mode operable or inoperable,
When the cutting of the plate-like object is finished and the chuck table is positioned in the attachment / detachment region, the cutting mode control unit turns off the cutting mode,
When the chuck table is positioned in the attachment / detachment region, the suction control unit turns off the suction action in the chuck table based on the fact that the attachment / detachment region cover is changed from the closed state to the open state,
When the chuck table is positioned in the attachment / detachment region, the suction control unit turns on the suction action in the chuck table based on the attachment / detachment region cover being changed from the open state to the closed state, and the cutting mode A cutting device in which the control unit turns on the cutting mode. The chuck table is connected to a suction source via a suction path including a pressure gauge, and the suction control unit applies a suction action to the chuck table, and the pressure value measured by the pressure gauge is a predetermined reduced pressure value. The cutting apparatus according to claim 1, wherein the cutting mode control unit turns on the cutting mode when:

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