TW201707904A - Cutting device for enabling an operator to notice the difference between the cutting blade configured in the device and the cutting blade installed on the device early and easily - Google Patents
Cutting device for enabling an operator to notice the difference between the cutting blade configured in the device and the cutting blade installed on the device early and easily Download PDFInfo
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- TW201707904A TW201707904A TW105117409A TW105117409A TW201707904A TW 201707904 A TW201707904 A TW 201707904A TW 105117409 A TW105117409 A TW 105117409A TW 105117409 A TW105117409 A TW 105117409A TW 201707904 A TW201707904 A TW 201707904A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02054—Cleaning before device manufacture, i.e. Begin-Of-Line process combining dry and wet cleaning steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
Abstract
Description
本發涉及一種用切割刀片對被加工物進行切割加工的切割裝置。 The present invention relates to a cutting device for cutting a workpiece with a cutting blade.
如果對切割裝置安裝和被加工物不相對應的規格(特性)的切割刀片，在切割加工時切割刀片就有破損之虞。另外，錯將僅有些微規格差異的切割刀片安裝到切割裝置的情形中，切割刀片在加工中不會破損，一看去顯得像是能夠正常地進行切割加工。但是，如果用顯微鏡對被加工物的切割痕進行確認，崩缺就顯大，對晶片特性有產生不良影響的情形。因此，通常，要在切割裝置裝設對應於被加工物的規格的切割刀片以對被加工物進行切割加工。 If the cutting blade is mounted on the cutting device with a specification (characteristic) that does not correspond to the workpiece, the cutting blade may be damaged during the cutting process. In addition, in the case where the cutting blade having only a slight difference in micro-size is attached to the cutting device, the cutting blade is not damaged during processing, and it seems to be able to perform the cutting process normally. However, if the cut marks of the workpiece are confirmed by a microscope, the chipping is large and the wafer characteristics are adversely affected. Therefore, in general, a cutting blade corresponding to the specification of the workpiece is attached to the cutting device to perform cutting processing on the workpiece.
以往，為了讓操作員注意到切割裝置上安裝了錯誤規格的切割刀片，已有提議針對每種規格的切割刀片將刀片匣或匣夾持具著色的管理方法(例如，參照專利文獻1)。在專利文獻1中記載的管理方法是，將收容切割刀片的刀片匣和保持刀片匣的匣夾持具，用對應於切割刀片的規 格的色彩進行著色。藉此，因為操作員不是根據顯示規格的文字列(ID)，而是根據對應於規格的色彩來選擇切割刀片，所以能夠容易地選擇對應於被加工物的規格的切割刀片。 In the past, in order to allow the operator to notice that the cutting blade of the wrong size is mounted on the cutting device, a management method of coloring the blade or the cymbal holder for each type of cutting blade has been proposed (for example, refer to Patent Document 1). The management method described in Patent Document 1 is to use a blade that accommodates a cutting blade and a jaw holder that holds the blade, with a gauge corresponding to the cutting blade. The color of the grid is colored. Thereby, since the operator selects the cutting blade according to the character string (ID) according to the display specification and the color corresponding to the specification, the cutting blade corresponding to the specification of the workpiece can be easily selected.
此外，也有將和切割刀片的規格相關聯的二維條碼附在刀片匣上的管理方法被提出(例如，參照專利文獻2)。在專利文獻2中記載的管理方法是，在將切割刀片安裝到切割裝置時，要從刀片匣取出切割刀片，並且用條碼讀取機從附在刀片匣上的二維條碼讀取切割刀片的規格。藉此，既無從二維條碼讀進錯誤的規格的情事，且防止了對切割裝置進行之切割刀片規格的設定失誤。 Further, a management method of attaching a two-dimensional bar code associated with the specification of the dicing blade to the blade raft is also proposed (for example, refer to Patent Document 2). The management method described in Patent Document 2 is that, when the cutting blade is attached to the cutting device, the cutting blade is taken out from the blade, and the cutting blade is read from the two-dimensional bar code attached to the blade bar by the bar code reader. specification. Thereby, neither the error specification is read from the two-dimensional barcode, and the setting of the cutting blade specification for the cutting device is prevented.
【專利文獻1】特許第5506557號公報 [Patent Document 1] Patent No. 5506557
【專利文獻2】特開2009-083016號公報 [Patent Document 2] JP-A-2009-083016
可是，在切割裝置中，是藉輸入表示切割刀片的規格(特性)的ID來設定規格。在專利文獻1的管理方法中，雖然可以減少切割刀片安裝錯誤的情事，但是由於切割刀片的ID是手動輸入切割裝置的，所以有發生輸入錯誤之虞。這點，在專利文獻2的管理方法中，由於是以讀取二維條碼的方式輸入ID，因此可以防止ID的輸入疏失。然而， 當忘記讀取二維條碼，或者取到別的切割刀片的二維條碼時，被安裝到切割裝置的切割刀片和切割裝置中所設定的切割刀片就會不一致。 However, in the cutting device, the specification is set by inputting an ID indicating the specification (characteristic) of the cutting blade. In the management method of Patent Document 1, although the erroneous blade mounting error can be reduced, since the ID of the dicing blade is manually input to the cutting device, an input error occurs. In this regard, in the management method of Patent Document 2, since the ID is input by reading the two-dimensional barcode, it is possible to prevent the input of the ID from being lost. however, When the two-dimensional bar code is forgotten to be read, or the two-dimensional bar code of another cutting blade is taken, the cutting blade set to the cutting device and the cutting blade set in the cutting device are inconsistent.
本發明即是有鑑於相關問題點而完成的，目的在於提供一種能夠讓操作者早期且容易地注易到裝置中所設定之切割刀片和被安裝到裝置的切割刀片的差異之切割裝置。 The present invention has been made in view of the related problems, and an object thereof is to provide a cutting device which allows an operator to easily and easily inject a difference between a cutting blade set in a device and a cutting blade mounted to the device.
本發明的切割裝置是具備：保持被加工物的保持機構、將對該保持機構所保持之被加工物進行切割的切割刀片安裝成可旋轉的切割機構、輸入資訊的輸入機構、將從該輸入機構被輸入的資訊顯示出來的顯示機構，和控制機構的切割裝置；該切割刀片的特性係以色彩設定，且該控制機構具備，記憶該切割刀片的特性所被設定之色彩和ID的特性記憶部，和將在該輸入機構被輸入的輸入ID與該特性記憶部中所記憶的ID進行對照查核，再用對應於該被輸入之該輸入ID的該特性記憶部所記憶之該色彩將該顯示機構的指定區域進行顯示之顯示控制部。 The cutting device according to the present invention includes: a holding mechanism for holding a workpiece; a cutting blade that cuts a cutting blade that cuts the workpiece held by the holding mechanism into a rotatable cutting mechanism; and an input means for inputting information; a display mechanism displayed by the information input by the mechanism, and a cutting device of the control mechanism; the characteristics of the cutting blade are set by color, and the control mechanism has a characteristic memory for storing the color and ID set by the characteristics of the cutting blade And checking an input ID input in the input means with an ID stored in the characteristic storage unit, and using the color stored in the characteristic storage unit corresponding to the input input ID A display control unit that displays a designated area of the display unit.
根據這個構成，指定區域會對應輸入ID而以表示切割刀片之特性的色彩被顯示出來。由於可以從指定區域的色彩來掌握切割裝置中所設定之切割刀片的特性，所以能夠早期且容易地發現切割刀片的安裝錯誤和輸入ID的輸入疏失。因此，能夠使操作員注意到與切割裝置之設定不同的切割刀片被安裝到切割裝置的情形，並且能夠抑制因 切割刀片的破損和崩缺所造成之晶片特性的劣化。 According to this configuration, the designated area is displayed corresponding to the input ID and the color indicating the characteristics of the cutting blade. Since the characteristics of the cutting blade set in the cutting device can be grasped from the color of the designated area, the mounting error of the cutting blade and the input loss of the input ID can be found early and easily. Therefore, it is possible to make the operator notice that the cutting blade different from the setting of the cutting device is mounted to the cutting device, and it is possible to suppress the cause Deterioration of wafer characteristics caused by breakage and chipping of the cutting blade.
依據本發明，透過用對應於輸入ID而表示切割刀片的特性的色彩來顯示指定區域的方式，可以讓操作員早期且容易地注意到與切割裝置之設定不同的切割刀片被安裝到切割裝置的情形。 According to the present invention, the manner in which the designated area is displayed by the color indicating the characteristic of the cutting blade corresponding to the input ID allows the operator to notice early and easily that the cutting blade different from the setting of the cutting device is attached to the cutting device. situation.
1‧‧‧切割裝置 1‧‧‧ cutting device
11‧‧‧框體 11‧‧‧ frame
12‧‧‧支持台 12‧‧‧Support desk
13‧‧‧前面 13‧‧‧ front
14‧‧‧顯示器；輸入機構；顯示機構 14‧‧‧ display; input mechanism; display mechanism
15‧‧‧基台 15‧‧‧Abutment
16‧‧‧立壁部 16‧‧‧立立部
21‧‧‧保持機構 21‧‧‧ Keeping institutions
22‧‧‧保持面 22‧‧‧ Keep face
23‧‧‧夾具部 23‧‧‧Clamping Department
25‧‧‧移動板 25‧‧‧Mobile board
26‧‧‧防水蓋 26‧‧‧Waterproof cover
31‧‧‧昇降機構 31‧‧‧ Lifting mechanism
34‧‧‧洗淨機構 34‧‧‧ Washing agency
35‧‧‧旋轉工作台 35‧‧‧Rotating table
36‧‧‧切割刀片 36‧‧‧Cutting Blade
37‧‧‧向上對切割機構；切割機構 37‧‧‧Upward cutting mechanism; cutting mechanism
38‧‧‧外殼 38‧‧‧Shell
39‧‧‧攝像機構 39‧‧‧ camera organization
41‧‧‧切割進給機；切割進給機構 41‧‧‧ cutting feeder; cutting feed mechanism
42‧‧‧一對導軌 42‧‧‧A pair of guide rails
43‧‧‧X軸工作台 43‧‧‧X-axis workbench
44‧‧‧滾珠螺桿 44‧‧‧Ball screw
45‧‧‧驅動馬達 45‧‧‧Drive motor
51‧‧‧分度進給機構 51‧‧‧Dividing feed mechanism
52‧‧‧一對導軌 52‧‧‧A pair of guide rails
53‧‧‧Y軸工作台 53‧‧‧Y-axis table
54、64‧‧‧滾珠螺桿 54, 64‧‧‧ Ball screw
55、65‧‧‧驅動馬達 55, 65‧‧‧ drive motor
61‧‧‧切入進給機構 61‧‧‧ cut into the feeding institution
62‧‧‧一對導軌 62‧‧‧A pair of guide rails
63‧‧‧Z軸工作台 63‧‧‧Z-axis workbench
71‧‧‧刀片匣 71‧‧‧blade
72‧‧‧匣夾持具 72‧‧‧匣 clamp
81‧‧‧控制機構 81‧‧‧Control agency
82‧‧‧特性記憶部 82‧‧‧ Characteristic Memory Department
83‧‧‧特性設定部 83‧‧‧ Characteristic setting department
84‧‧‧顯示控制部 84‧‧‧Display Control Department
85‧‧‧輸入畫面 85‧‧‧ Input screen
86‧‧‧顯示畫面 86‧‧‧Display screen
87‧‧‧指定區域 87‧‧‧Specified area
88‧‧‧設定畫面 88‧‧‧Setting screen
F‧‧‧環狀框架 F‧‧‧Ring frame
T‧‧‧切割膠帶 T‧‧‧ cutting tape
W‧‧‧被加工物 W‧‧‧Processed objects
Z1、Z2‧‧‧切割刀片36的顯示區域 Display area of Z1, Z2‧‧ cutting blade 36
【圖1】本實施態樣之切割裝置的外觀斜視圖。 Fig. 1 is a perspective view showing the appearance of a cutting device of the present embodiment.
【圖2】本實施態樣之切割裝置的內部的斜視圖。 Fig. 2 is a perspective view showing the inside of the cutting device of the embodiment.
【圖3】本實施態樣的特性數據之顯示控制的控制構成示意模式圖。 Fig. 3 is a schematic diagram showing the control of the display control of the characteristic data of the present embodiment.
【圖4】本實施態樣之特性記憶部的設定畫面之一例的示意圖。 Fig. 4 is a view showing an example of a setting screen of the characteristic memory unit of the present embodiment.
【圖5】本實施態樣的特性數據顯示畫面之一例的示意圖。 Fig. 5 is a view showing an example of a characteristic data display screen of the present embodiment.
【圖6】本實施態樣之切割刀片的更換作業流程之示意流程圖。 Fig. 6 is a schematic flow chart showing the flow of replacement of the cutting blade of the embodiment.
【圖7】變形例的特性數據顯示畫面之一例的示意圖。 Fig. 7 is a schematic view showing an example of a characteristic data display screen of a modification.
以下將參照所附圖式就本實施態樣進行說明。圖1是本實施態樣之切割裝置的外觀斜視圖。圖2是本實施態樣之切割裝置的內部的斜視圖。此外，切割裝置並不限於圖1及圖2所示的構成。切割裝置只要是利用切割刀片對 被加工物進行切割的裝置，什麼樣的構成都可以。 The present embodiment will be described below with reference to the drawings. Fig. 1 is a perspective view showing the appearance of a cutting device of the present embodiment. Fig. 2 is a perspective view showing the inside of the cutting device of the embodiment. Further, the cutting device is not limited to the configuration shown in FIGS. 1 and 2 . The cutting device is only required to use a pair of cutting blades What kind of structure can be used for the device to be cut by the workpiece.
如圖1所示，在切割裝置1中，裝設著對應被加工物W之特性(規格)的切割刀片36(參見圖2)，同時設定了此切割刀片36的刀片外徑、刀片刃厚、刀尖露出量等的特性數據(規格數據)。切割裝置1係建構成，使切割刀片36與保持機構21上所保持的被加工物W相對地移動，並沿著分割預定線切割保持機構21上的被加工物W。被加工物W的表面以格子狀的分割預定線區劃成複數個區域，各區域上則形成有各種器件。 As shown in Fig. 1, in the cutting device 1, a cutting blade 36 (see Fig. 2) corresponding to the characteristics (specification) of the workpiece W is attached, and the outer diameter of the blade and the blade edge thickness of the cutting blade 36 are set. Characteristic data (specification data) such as the amount of exposure of the tool tip. The cutting device 1 is constructed such that the cutting blade 36 moves relative to the workpiece W held by the holding mechanism 21, and cuts the workpiece W on the holding mechanism 21 along the dividing line. The surface of the workpiece W is divided into a plurality of regions in a lattice-shaped dividing line, and various devices are formed in each region.
被加工物W的背面黏貼著切割膠帶T，切割膠帶T的外周上則貼附著環狀框架F。被加工物W在以切割膠帶T做中介而為環狀框架F所支持的狀態下被搬入切割裝置1。此外，被加工物W只要是可以做為加工對象者即可，什麼樣的構成皆可。例如，被加工物W可以是在矽、砷化鎵等的半導體基板上形成有半導體器件的半導體晶圓，也可以是在陶瓷、玻璃、藍寶石系的無機材料基板上形成有光器件的光器件晶圓。 The dicing tape T is adhered to the back surface of the workpiece W, and the annular frame F is attached to the outer periphery of the dicing tape T. The workpiece W is carried into the cutting device 1 in a state supported by the annular frame F by the dicing tape T. In addition, the workpiece W can be used as a processing object, and any configuration can be used. For example, the workpiece W may be a semiconductor wafer in which a semiconductor device is formed on a semiconductor substrate such as tantalum or gallium arsenide, or an optical device in which an optical device is formed on a ceramic, glass, or sapphire-based inorganic material substrate. Wafer.
切割裝置1具有包覆切割加工的加工空間之長方體狀的框體11，和鄰接於框體11並形成待機空間和洗淨空間的支持台12。支持台12的上面中央開口成往框體11內延伸狀。此開口被能夠與保持機構21一起移動的移動板25及波紋狀的防水蓋26覆蓋。圖1中示出的是，使保持機構21往框體11的外部移動而在支持台12上待機的狀態。在支持台12上設有載置晶圓儲存盒(未圖示出)的昇降機構31、對 加工完了的被加工物W進行洗淨的洗淨機構34，二者之間夾著保持機構21。 The cutting device 1 has a rectangular parallelepiped frame 11 that covers a processing space for cutting, and a support table 12 that is adjacent to the frame 11 to form a standby space and a cleaning space. The upper central opening of the support base 12 extends into the frame body 11. This opening is covered by the moving plate 25 and the corrugated waterproof cover 26 which are movable together with the holding mechanism 21. FIG. 1 shows a state in which the holding mechanism 21 is moved to the outside of the casing 11 and stands by on the support table 12. A lifting mechanism 31 on which a wafer storage case (not shown) is placed is provided on the support table 12, The cleaning mechanism 34 that has finished the processed workpiece W is washed, and the holding mechanism 21 is interposed therebetween.
昇降機構31使載置著晶圓儲存盒的工件台32昇降，在高度方向上調整晶圓儲存盒內之被加工物W的出入位置。洗淨機構34使保持著被加工物W的旋轉工作台35下降到支持台12內，並朝著旋轉中的旋轉工作台35噴射洗淨水以洗淨被加工物W。而且，洗淨機構34接著噴出乾燥空氣取代洗淨水以使被加工物W乾燥。支持台12的上方設有，在晶圓儲存盒、保持機構21、洗淨機構34相互之間搬送被加工物W的1個或複數個搬送機構(未圖示)。 The elevating mechanism 31 raises and lowers the workpiece stage 32 on which the wafer storage cassette is placed, and adjusts the position of the workpiece W in the wafer storage cassette in the height direction. The cleaning mechanism 34 lowers the rotary table 35 holding the workpiece W into the support table 12, and ejects the washing water toward the rotating rotary table 35 to wash the workpiece W. Further, the cleaning mechanism 34 then discharges dry air instead of the washing water to dry the workpiece W. One or a plurality of transport mechanisms (not shown) for transporting the workpiece W between the wafer storage cassette, the holding mechanism 21, and the cleaning mechanism 34 are provided above the support table 12.
如圖2所示，在框體11及支持台12(參見圖1)內的基台15上，設有使保持機構21在X軸方向上進行切割進給的切割進給機構41。切割進給機41具有配置在基台15上之平平行於X軸方向的一對導軌42，和可滑動地設置於一對導軌42上之馬達驅動的X軸工作台43。在X軸工作台43的背面側形成有未圖示出的螺帽部，並於此螺帽部螺合著滾珠螺桿44。藉由連結於滾珠螺桿44之驅動馬達45的旋轉驅動，保持機構21即沿著一對導軌42在X軸方向上受到切割進給。 As shown in Fig. 2, a cutting feed mechanism 41 for cutting and feeding the holding mechanism 21 in the X-axis direction is provided on the base 15 in the frame 11 and the support table 12 (see Fig. 1). The cutting feeder 41 has a pair of guide rails 42 disposed on the base 15 in parallel with the X-axis direction, and a motor-driven X-axis table 43 slidably disposed on the pair of guide rails 42. A nut portion (not shown) is formed on the back side of the X-axis table 43, and the ball screw 44 is screwed to the nut portion. The holding mechanism 21 is subjected to cutting feed in the X-axis direction along the pair of guide rails 42 by the rotational driving of the drive motor 45 coupled to the ball screw 44.
在X軸工作台43的上部，保持被加工物W的保持機構21被設置成能夠繞著Z軸旋轉。在保持機構21上以多孔陶瓷材料形成保持面22(參見圖1)，被加工物W由在此保持面22上產生的負壓吸引保持住。在保持機構21的周圍設有空氣驅動式的4個夾具部23，利用各夾具部23從四方 將被加工物W周圍的環狀框架F夾持固定住。在基台15的上面，直立設置的門型立壁部16被設置成橫跨保持機構21的移動路徑。 On the upper portion of the X-axis table 43, the holding mechanism 21 that holds the workpiece W is provided to be rotatable about the Z axis. The holding surface 22 is formed of a porous ceramic material on the holding mechanism 21 (see Fig. 1), and the workpiece W is held by the suction generated on the holding surface 22 by the negative pressure. Four air-driving type clamp portions 23 are provided around the holding mechanism 21, and the respective clamp portions 23 are used from the square. The annular frame F around the workpiece W is clamped and fixed. On the upper surface of the base 15, an upright-shaped door-shaped standing wall portion 16 is provided to straddle the moving path of the holding mechanism 21.
立壁部16上設有，在Y軸方向上對切割機構37進行分度進給的分度進給機構51，和在Z軸方向上對切割機構37進行切入進給的切入進給機構61。分度進給機構51具有，配設在立壁部16的前面之平行於Y軸方向的一對導軌52，和可滑動地設置在一對導軌52上之Y軸工作台53。切入進給機構61具有，配置在Y軸工作台53上之平行於Z軸方向的一對導軌62，和可滑動地設置在一對導軌62上之Z軸工作台63。 The standing wall portion 16 is provided with an index feeding mechanism 51 that indexes the cutting mechanism 37 in the Y-axis direction, and a cutting feed mechanism 61 that cuts and feeds the cutting mechanism 37 in the Z-axis direction. The index feeding mechanism 51 has a pair of guide rails 52 disposed in the front surface of the standing wall portion 16 in the Y-axis direction, and a Y-axis table 53 slidably provided on the pair of guide rails 52. The cutting feed mechanism 61 has a pair of guide rails 62 disposed on the Y-axis table 53 in parallel with the Z-axis direction, and a Z-axis table 63 slidably disposed on the pair of guide rails 62.
在Z軸工作台63的下部設有切割被加工物W的切機構37。Y軸工作台53及Z軸工作台63的背面側上分別形成有螺帽部，滾珠螺桿54、64則螺合於這些螺帽部。於Y軸工作台53用的滾珠螺桿54、Z軸工作台63用的滾珠螺桿64之一端部，分別連結著驅動馬達55、65。透過驅動馬達55、65，各別的滾珠螺桿54、64受到旋轉驅動，藉而使得切割機構37沿著導軌52在Y軸方向上移動，且切割機構37沿著導軌62在Z軸方向上進行切入進給。 A cutting mechanism 37 for cutting the workpiece W is provided at a lower portion of the Z-axis table 63. Nut portions are formed on the back sides of the Y-axis table 53 and the Z-axis table 63, and the ball screws 54, 64 are screwed to the nut portions. The drive screws 55 and 65 are connected to one end of the ball screw 54 for the Y-axis table 53 and the ball screw 64 for the Z-axis table 63, respectively. The respective ball screws 54, 64 are rotationally driven by the drive motors 55, 65, whereby the cutting mechanism 37 is moved along the guide rail 52 in the Y-axis direction, and the cutting mechanism 37 is carried along the guide rail 62 in the Z-axis direction. Cut into the feed.
切割機構37被建構成將切割刀片36可旋轉地安裝在從外殼38突出之轉軸(未圖示)的前端。切割刀片36是例如，用樹脂結合劑固定鑽石磨粒而形成圓板狀。另外，在切割機構37的外殼38上設有對被加工物W的上面進行攝像之攝像機構39，且切割刀片36係依據攝像機構39所拍攝 的影像對被加工物W進行對準定位。切割機構37一邊從切割噴嘴(未圖示)將切割水噴射到被加工物W，一邊以切割刀片36切割被加工物W。 The cutting mechanism 37 is constructed to rotatably mount the cutting blade 36 to the front end of a rotating shaft (not shown) that protrudes from the outer casing 38. The cutting blade 36 is formed, for example, by fixing diamond abrasive grains with a resin bond to form a disk shape. Further, an image pickup mechanism 39 that images the upper surface of the workpiece W is provided on the outer casing 38 of the cutting mechanism 37, and the cutter blade 36 is photographed according to the image pickup mechanism 39. The image is aligned and positioned on the workpiece W. The cutting mechanism 37 cuts the workpiece W by the cutting blade 36 while ejecting the cut water from the cutting nozzle (not shown) to the workpiece W.
回到圖1，在框體11的前面13上設置著觸控面板式的顯示器14。輸入畫面及顯示畫面被顯示在顯示器14，加工條件等的各種資訊由顯示畫面顯示出來，並由輸入畫面來設定加工條件等的各種資訊。亦即，顯示器14既起到作為用來輸入資訊的輸入機構的功能，同時也起到作為顯示所輸入之資訊的顯示機構的功能。此外，代之以在顯示器14顯示出顯示畫面及輸入畫面，也可以在切割裝置1個別地設置顯示機構和輸入機構。 Returning to Fig. 1, a touch panel type display 14 is disposed on the front surface 13 of the casing 11. The input screen and the display screen are displayed on the display 14, and various kinds of information such as processing conditions are displayed on the display screen, and various information such as processing conditions are set by the input screen. That is, the display 14 functions both as an input means for inputting information and as a display means for displaying the input information. Further, instead of displaying the display screen and the input screen on the display 14, the display means and the input means may be separately provided in the cutting device 1.
另外，在框體11的前面13，利用磁力安裝著保持切割刀片36用之刀片匣71的匣夾持具72。刀片匣71及匣夾持具72係配合切割刀片36的特性，用不同的色彩加以著色。如此，切割刀片36不是只用文字列來管理，而是用對應於特性的色彩來管理。因此，在安裝切割刀片36時，操作者可以根據刀片匣71的色彩容易地就切割刀片36進行選擇，可以防止對切割裝置1之切割刀片36的安裝錯誤。 Further, a cymbal holder 72 for holding the blade 匣 71 for the dicing blade 36 is attached to the front surface 13 of the casing 11 by magnetic force. The blade 匣 71 and the jaw holder 72 are matched to the characteristics of the cutting blade 36 and are colored with different colors. As such, the cutting blade 36 is not managed solely by the character string, but is managed with a color corresponding to the characteristic. Therefore, when the cutting blade 36 is mounted, the operator can easily select the cutting blade 36 in accordance with the color of the blade set 71, and the mounting error of the cutting blade 36 of the cutting device 1 can be prevented.
此外，在安裝切割刀片36時，是由操作者將切割刀片36的ID輸入切割裝置1，並設定切割刀片36的刀片外徑、刀片刃厚、刀尖伸出量等的特性。由於ID是用手動輸入的，所以實際安裝在切割裝置1之切割刀片36的特性，和切割裝置1中所設定之切割刀片36的特性有時會不一致。這種情況下，顯示器14雖然會顯示出對應於所輸入 之ID的切割刀片36的特性數據，但是要讓操作員確認這是否是安裝在切割裝置1的切割刀片36之特性數據時，會變成是在確認顯示器14所顯示之特性數據的數值，因此難以發現差異。 Further, when the cutting blade 36 is mounted, the operator inputs the ID of the cutting blade 36 into the cutting device 1, and sets the characteristics of the blade outer diameter, the blade edge thickness, the blade tip extension amount, and the like of the cutting blade 36. Since the ID is manually input, the characteristics of the cutting blade 36 actually mounted on the cutting device 1 and the characteristics of the cutting blade 36 set in the cutting device 1 sometimes do not coincide. In this case, the display 14 will display corresponding to the input. The characteristic data of the cutting blade 36 of the ID, but it is difficult for the operator to confirm whether this is the characteristic data of the cutting blade 36 mounted on the cutting device 1, and it becomes a value for confirming the characteristic data displayed on the display 14. Find the difference.
在這種情況下，藉由對每個被加工物W確認所製作成之器件數據的方式，也可以讓操作員注意到切割刀片36未對應於被加工物W的情形。然而，由於器件數據是在裝配作業後之即將加工前的最後階段才會被要求確認，所以即使在確認器件數據時注意到切割刀片36的設定錯誤等，還是有加工開始大幅度延遲的問題。於是，在本實施態樣的切割裝置1，就將表示切割刀片36之特性的色彩與特性數據一起顯示出來，讓操作員早期且容易地注意到切割刀片36的安裝錯誤和設定失誤。 In this case, the operator can be made aware that the cutting blade 36 does not correspond to the workpiece W by confirming the fabricated device data for each workpiece W. However, since the device data is required to be confirmed at the final stage immediately before the assembly operation, even if the setting error of the cutting blade 36 is noted when the device data is confirmed, there is a problem that the processing starts to be largely delayed. Thus, in the cutting apparatus 1 of the present embodiment, the color indicating the characteristics of the cutting blade 36 is displayed together with the characteristic data, allowing the operator to notice the mounting error and the setting error of the cutting blade 36 early and easily.
以下，將參照圖3至圖5，說明特性數據的顯示控制。圖3是本實施態樣之特性數據的顯示控制之控制構成的模式示意圖。圖4是本實施態樣之特性記憶部的設定畫面之一例的示意圖。圖5是本實施態樣之特性數據的顯畫面之一例的示意圖。另外，在圖3中，為方便說明，係省略和特性數據之顯示控制無關的構成進行載。 Hereinafter, display control of the characteristic data will be described with reference to FIGS. 3 to 5. Fig. 3 is a schematic view showing the control structure of the display control of the characteristic data of the present embodiment. Fig. 4 is a view showing an example of a setting screen of the characteristic memory unit of the embodiment. Fig. 5 is a view showing an example of a display screen of characteristic data of the present embodiment. In addition, in FIG. 3, for convenience of explanation, the configuration which is not related to the display control of the characteristic data is omitted.
如圖3所示，在切割裝置1(參見圖1)的顯示器14上，顯示出接受資訊的輸入之輸入畫面85，和顯示在輸入畫面85所輸入之資訊的顯示畫面86。輸入畫面85顯示出，例如，顯示於顯示器14之選擇按鈕、輸入欄、鍵盤影像等之輸入工具，形成操作員的指尖能夠操作的作區域。顯示 畫面86顯示出，例如，顯示於顯示器14之特性數據和器件數據等，形成只能夠顯示數據的非操作區域。顯示器14上顯示出將這個輸入畫面85和顯示畫面86加以組合的各種畫面。亦即，顯示畫面86內也可以具有輸入畫面85(輸入單元)。此情況下，如果輸入ID，顯示畫面86之指定區域87(參見圖5)的色彩就會立即變成對應於ID的色彩。 As shown in FIG. 3, on the display 14 of the cutting device 1 (see FIG. 1), an input screen 85 for accepting input of information and a display screen 86 for displaying information input on the input screen 85 are displayed. The input screen 85 displays, for example, an input tool displayed on the display button 14, input field, keyboard image, and the like of the display 14, forming an area in which the operator's fingertip can be operated. display The screen 86 displays, for example, characteristic data and device data displayed on the display 14, forming a non-operation area in which only data can be displayed. Various screens that combine this input screen 85 and display screen 86 are displayed on the display 14. That is, the input screen 85 (input unit) may be provided in the display screen 86. In this case, if the ID is input, the color of the designated area 87 (see Fig. 5) of the display screen 86 immediately becomes the color corresponding to the ID.
顯示器14受到對切割裝置1的各部分進行整合控制之控制機構81所控制。控制機構81具有，記憶切割刀片36(參見圖2)的特性所設定之色彩與ID的特性記憶部82、對應在輸入畫面85被輸入之輸入ID而設定切割刀片36之特性數據的特性設定部83，和以對應於在輸入畫面85被輸入之輸入ID的色彩來表示顯示畫面86之指定區域87的顯示控制部84。切割刀片36的ID與切割刀片36的特性數據和顯示特性數據的色彩，在特性記憶部82被賦予關聯性。另外，表示切割刀片36之特性數據的色彩，和刀片匣71等(參見圖1)的色彩是一致的。 The display 14 is controlled by a control mechanism 81 that performs integrated control of the various portions of the cutting device 1. The control unit 81 has a characteristic storage unit 82 for color and ID set by the characteristics of the memory cutting blade 36 (see FIG. 2), and a characteristic setting unit for setting characteristic data of the cutting blade 36 corresponding to the input ID input to the input screen 85. 83, and a display control unit 84 that indicates the designated area 87 of the display screen 86 in accordance with the color corresponding to the input ID input on the input screen 85. The ID of the dicing blade 36 and the characteristic data of the dicing blade 36 and the color of the display characteristic data are assigned to the characteristic memory unit 82. Further, the color indicating the characteristic data of the cutting blade 36 is identical to the color of the blade 匣 71 or the like (see Fig. 1).
在輸入畫面85被輸入的輸入ID和在特性記憶部82被記憶起來的ID，在特性設定部83中受到對照核查，和輸入ID相關聯之切割刀36的特性數據從特性記憶部82被讀出來並設定至切割裝置1。在輸入畫面85被輸入之輸入ID和在特性記憶部82被記憶起來的ID，在顯示控制部84受到對照核查，與輸入ID相關聯的色彩從特性記憶部82被讀出來且顯示畫面86的指定區域87被著色。對應於此指定區域87的色彩與刀片匣71的色彩是否相同，就能夠讓操作員確 認安裝在切割裝置1上之切割刀片36的特性數據是不是適切地設定了。 The input ID input to the input screen 85 and the ID stored in the characteristic storage unit 82 are checked by the characteristic setting unit 83, and the characteristic data of the dicing blade 36 associated with the input ID is read from the characteristic memory unit 82. Come out and set to the cutting device 1. The input ID input to the input screen 85 and the ID stored in the characteristic storage unit 82 are checked by the display control unit 84, and the color associated with the input ID is read from the characteristic storage unit 82 and the screen 86 is displayed. The designated area 87 is colored. Whether the color corresponding to the designated area 87 is the same as the color of the blade 71, the operator can be sure It is recognized whether the characteristic data of the cutting blade 36 mounted on the cutting device 1 is appropriately set.
因為輸入ID剛輸入之後，顯示畫面86之指定區域87的色彩就會改變，所以能夠讓操作員在早期階段就注意到不同於切割裝置1之設定的切割刀片36被安裝到切割裝置1的情形。此外，控制機構81的各部分是由執行各種處理的處理器和記憶體等構成。記憶體依據用途是以ROM(Read Only Memory)、RAM(Random Access Memory)等之一個或複數個記憶媒體構成。記憶體中記憶著，例如，切割刀片36的特性數據、器件數據、表示切割刀片36之特性的色彩、顯示控制用的程式等。 Since the color of the designated area 87 of the display screen 86 is changed immediately after the input ID is input, it is possible for the operator to notice that the cutting blade 36 different from the setting of the cutting device 1 is attached to the cutting device 1 at an early stage. . Further, each part of the control unit 81 is constituted by a processor, a memory, or the like that performs various processes. The memory is composed of one or a plurality of memory media such as a ROM (Read Only Memory) or a RAM (Random Access Memory). The memory stores, for example, characteristic data of the dicing blade 36, device data, a color indicating characteristics of the dicing blade 36, a program for display control, and the like.
此外，切割刀片36的ID包含切割刀片36之品種資訊的文字列，係將例如、品種資訊、磨粒資訊、黏結劑資訊、刀片的形狀資訊等之一部分或全部加以組合而構成的。另外，切割刀片36的ID可以在特性記憶部82中對切割刀片36的特性形成關聯，也可以採用和品種資訊等沒有關係的文字列構成。即使切割刀片36的ID是和品種資訊等沒有關係的文字列，依然能夠藉著輸入切割刀片36的ID來顯示和輸入ID相關聯之切割刀片36的特性數據。 Further, the ID of the cutting blade 36 includes a character string of the type information of the cutting blade 36, and is formed by combining, for example, part or all of the information of the variety, the information of the abrasive grain, the information of the adhesive, and the shape information of the blade. Further, the ID of the dicing blade 36 may be associated with the characteristic of the dicing blade 36 in the characteristic memory unit 82, or may be constituted by a character string not related to the genre information or the like. Even if the ID of the cutting blade 36 is a character string which is not related to the item information or the like, the characteristic data of the cutting blade 36 associated with the input ID can be displayed by inputting the ID of the cutting blade 36.
接著，將就具體的設定例進行說明。如圖4所示，顯示器14(參見圖3)上顯示出表示特性記憶部82的記憶內容的設定畫面88。設定畫面88中，切割刀片36(參見圖2)的ID、色彩，和切割刀片36的特性數據形成關聯顯示出來。此外，也可以在設定畫面88中變更色彩設定。參照 此設定畫面88，就可以由操作員針對一對切割刀片36分別地選擇ID。例如，針對一邊的切割刀片36選擇設定畫面88的第1列的ID，針對另一邊的切割刀片36則選擇設定畫面88的第2列的ID。 Next, a specific setting example will be described. As shown in FIG. 4, a display screen 88 indicating the memory content of the characteristic storage unit 82 is displayed on the display 14 (see FIG. 3). In the setting screen 88, the ID and color of the cutting blade 36 (see Fig. 2) are displayed in association with the characteristic data of the cutting blade 36. Further, the color setting may be changed on the setting screen 88. Reference With this setting screen 88, the ID can be individually selected by the operator for the pair of cutting blades 36. For example, the ID of the first column of the setting screen 88 is selected for one cutting blade 36, and the ID of the second column of the setting screen 88 is selected for the other cutting blade 36.
如圖5所示，在刀片數據的顯示畫面86設有一對(Z1、Z2)切割刀片36的顯示區域，並在各顯示區域設有輸入單元作為輸入畫面85。在各輸入單元輸入參照設定畫面88(參見圖4)而擇定的ID。針對一邊(Z1)的切割刀片36，在輸入單元輸入第1列的ID。據此，由顯示控制部84從特性記憶部82讀出和第1列的ID相關聯的色彩，並由特性設定部83從特性記憶部82讀出和第1列的ID相關聯之特性數據。 As shown in FIG. 5, a display area of the blade data display screen 86 is provided with a pair of (Z1, Z2) cutting blades 36, and an input unit is provided as an input screen 85 in each display area. The ID selected by referring to the setting screen 88 (see FIG. 4) is input to each input unit. The ID of the first column is input to the input unit for the cutting blade 36 of one side (Z1). As a result, the display control unit 84 reads the color associated with the ID of the first column from the characteristic storage unit 82, and the characteristic setting unit 83 reads the characteristic data associated with the ID of the first column from the characteristic storage unit 82. .
結果，在顯示畫面86一邊的切割刀片36之特性數據被顯示出來，同時特性數據的外周邊框，即指定區域87，以對應於一邊的切割刀片36的色彩顯示出來。由於針對一邊的切刀片36，對應於刀片匣71(參見圖1)的色彩被顯示出來，因此能夠讓操作員適切地設定特性數據。 As a result, the characteristic data of the cutting blade 36 on the side of the display screen 86 is displayed, while the outer peripheral frame of the characteristic data, that is, the designated area 87, is displayed in the color of the cutting blade 36 corresponding to one side. Since the color corresponding to the blade 匣 71 (see Fig. 1) is displayed for the cutting blade 36 for one side, the operator can appropriately set the characteristic data.
雖然針對另一邊(Z2)的切割刀片36在設定畫面88選擇了第2列的ID，但是卻在輸入單元錯誤地輸入第3列的ID。因此，由顯示控制部84從特性記憶部82讀出和第3列的ID相關聯的色彩，並由特性設定部83從特性記憶部82讀出和第3列ID相關聯的特性數據。結果，在顯示畫面86上，顯示出與另一邊的切割刀片36不同的特性數據，同時特性數據的外周邊框，即指定區域87，被以未對應於另一 邊的切割刀片36的色彩顯示出來。由於針對另一邊的切刀片36，顯示出來的是未對應於刀片匣71(參見圖1)的色彩，因此能夠讓操作員注意到所設定的是錯誤的特性數據。 Although the cutting blade 36 on the other side (Z2) selects the ID of the second column on the setting screen 88, the ID of the third column is erroneously input to the input unit. Therefore, the display control unit 84 reads the color associated with the ID of the third column from the characteristic storage unit 82, and the characteristic setting unit 83 reads the characteristic data associated with the third column ID from the characteristic storage unit 82. As a result, on the display screen 86, characteristic data different from the other side of the cutting blade 36 is displayed, while the outer peripheral frame of the characteristic data, that is, the designated area 87, is not corresponding to the other The color of the edge cutting blade 36 is displayed. Since the cutting blade 36 for the other side is displayed with a color that does not correspond to the blade 匣 71 (see Fig. 1), the operator can be made aware of the erroneous characteristic data set.
這種情況，在對切割裝置1設定切割刀片36之特性數據的階段，顯示畫面86中顯示的是對應於特性數據的色彩。在此，於設定切割刀片36的特性數據後，在確認器件數據時，也有機會對特性數據的設定失誤進行確認。這種情況也可以變換器件數據的邊框的色彩，以便操作員進行確認。再者，在加工的畫面也可以變換為對應於被輸入設定的刀片的色彩。然而，因為器件數據的確認是在裝配作業後，所以加工作業的開始會因為重新設定而延遲。如果採用本實施態樣的切割裝置1，就能夠讓操作員在比器件數據的確認更早的階段就注意到特性數據的設定失誤，並重新設定。 In this case, at the stage where the characteristic data of the cutting blade 36 is set to the cutting device 1, the color corresponding to the characteristic data is displayed on the display screen 86. Here, after setting the characteristic data of the dicing blade 36, when the device data is confirmed, the setting error of the characteristic data is also confirmed. This situation can also change the color of the border of the device data for the operator to confirm. Furthermore, the processed screen can also be converted to a color corresponding to the blade to which the setting is input. However, since the confirmation of the device data is after the assembly operation, the start of the machining operation is delayed due to the reset. According to the cutting apparatus 1 of the present embodiment, the operator can notice the setting error of the characteristic data at an earlier stage than the confirmation of the device data, and reset it.
參照圖6，對切割刀片的更換作業流程做說明。圖6為本實施態樣之切割刀片的更換作業流程之示意流程圖。另外，圖6中將適當地使用圖2及圖3的符號進行說明。 Referring to Fig. 6, the replacement work flow of the cutting blade will be described. Fig. 6 is a schematic flow chart showing the flow of replacing the cutting blade of the embodiment. In addition, in FIG. 6, description will be made using the symbols of FIG. 2 and FIG. 3 as appropriate.
如圖6所示，由操作員從刀片匣71取出切割刀片36再將切割刀片36安裝到切割裝置1(步驟S01)。這種情況，因為刀片匣71是以表示切割刀片36的特性的色彩加以著色，所以能夠防對切割裝置1之切割刀片36的安裝錯誤。接著，對切割裝置1輸入輸入ID，顯示器14之指定區 域87被以對應於輸入ID的色彩顯示出來(步驟S02)。這種情況，因為顯示器14之指定區域87係以表示切割刀片36的特性的色彩加以著色，所以能夠藉由和刀片匣71的色彩進行比較的方式，防止輸入ID的設定失誤。 As shown in Fig. 6, the cutter blade 36 is taken out by the operator and the cutting blade 36 is attached to the cutting device 1 (step S01). In this case, since the blade set 71 is colored in a color indicating the characteristics of the cutting blade 36, it is possible to prevent the mounting of the cutting blade 36 of the cutting device 1 from being erroneous. Next, an input ID is input to the cutting device 1, and a designated area of the display 14 The field 87 is displayed in a color corresponding to the input ID (step S02). In this case, since the designated area 87 of the display 14 is colored by the color indicating the characteristics of the cutting blade 36, the setting error of the input ID can be prevented by comparison with the color of the blade 71.
接著，實施切割刀片36的裝配作業，且切割刀片36的前端位置受到檢測(步驟S03)。藉此，切割刀片36已經更換的情形在切割裝置1中被識別出來。接著，配合被加工物W選擇器件數據，並顯示出器件數據的確認畫面(步驟S04)。這種情況，進給速度等作為器件數據被顯示出來，並對是否是與切割刀片36的特性數據不一致的進給速度進行確認。藉此，可以讓操作員對安裝在切割裝置1之切割刀片36的特性數據是否已經設定進行最後的確認。 Next, the assembly work of the cutting blade 36 is performed, and the front end position of the cutting blade 36 is detected (step S03). Thereby, the situation in which the cutting blade 36 has been replaced is recognized in the cutting device 1. Next, the device data is selected in cooperation with the workpiece W, and a confirmation screen of the device data is displayed (step S04). In this case, the feed speed or the like is displayed as the device data, and it is confirmed whether or not the feed speed is inconsistent with the characteristic data of the cutting blade 36. Thereby, the operator can make a final confirmation as to whether or not the characteristic data of the cutting blade 36 mounted on the cutting device 1 has been set.
如上所述，如果採用本實施態樣的切割裝置1，就能夠配合輸入ID而以表示切割刀片36之特性的色彩來顯示指定區域87。因為可以從指定區域87的色彩來掌握切割裝置1中所設定之切割刀片36，所以能夠早期且容易地發現切割刀片36的安裝錯誤和輸入ID的設定失誤。因此，可以讓操作員注意到與切割裝置1的設定不同的切割刀片36被安裝到切割裝置1的情形，抑制切割刀片36的破損和因崩缺而造成之晶片特性的劣化。 As described above, according to the cutting apparatus 1 of the present embodiment, the designated area 87 can be displayed in a color indicating the characteristics of the cutting blade 36 in accordance with the input ID. Since the cutting blade 36 set in the cutting device 1 can be grasped from the color of the designated area 87, the mounting error of the cutting blade 36 and the setting error of the input ID can be found early and easily. Therefore, the operator can be made aware of the case where the cutting blade 36 different from the setting of the cutting device 1 is attached to the cutting device 1, suppressing the breakage of the cutting blade 36 and the deterioration of the wafer characteristics due to the collapse.
此外，本發明並不限於上述實施態樣，可以做各種變更再實施。在上述實施態樣中，關於所附圖式中圖示的尺寸和形狀等，並不限定於此，可以在發揮本發明的效果的範圍內做適當變更。其他，只要不脫離本發明之目 的的範圍，可以適當做變更再實施。 Further, the present invention is not limited to the above-described embodiments, and various modifications can be made. In the above-described embodiments, the size, shape, and the like shown in the drawings are not limited thereto, and may be appropriately changed within the range in which the effects of the present invention are exerted. Other, as long as it does not deviate from the purpose of the present invention The scope of the changes can be implemented as appropriate.
例如，在上述實施態樣中，特性數據的外周邊框雖然是做成會變更成和輸入ID相關聯的色彩的構成，但是並不限定於此構成。如圖7所示，在顯示畫面86中，於特性數據的顯示區域設有作為輸入畫面85的輸入單元，並且也可以根據輸入單元中所輸入的ID，將顯示區域全體變更成和輸入ID相關聯的色彩。利用這樣的構成，也可以讓操作員早期且容易地注意到裝置中所設定之切割刀片36的特性，和安裝到裝置上之切割刀片36的特性並不相同。 For example, in the above-described embodiment, the outer peripheral frame of the characteristic data is configured to be changed to the color associated with the input ID, but the configuration is not limited thereto. As shown in FIG. 7, in the display screen 86, an input unit as the input screen 85 is provided in the display area of the characteristic data, and the entire display area may be changed to be associated with the input ID based on the ID input in the input unit. The color of the joint. With such a configuration, it is also possible for the operator to notice early and easily the characteristics of the cutting blade 36 set in the apparatus, and the characteristics of the cutting blade 36 mounted on the apparatus are not the same.
另外，在上述實施態樣中，雖然是針對在顯示畫面86中納入輸入畫面85的構成做說明，但是並不限定於此構成。也可以分別準備輸入畫面85和顯示畫面86，形成輸入畫面85輸入ID，並將對應於輸入ID的特性數據和色彩顯示在顯示畫面86的狀態。 Further, in the above-described embodiment, the configuration in which the input screen 85 is included in the display screen 86 has been described, but the configuration is not limited thereto. The input screen 85 and the display screen 86 may be prepared separately, and an input screen 85 is input with an ID, and characteristic data and color corresponding to the input ID are displayed on the display screen 86.
此外，在上述的實施態樣中，雖然是用顯示器14來構成輸入機構及顯示機構，但是並不限定於此構成。輸入機構只要能夠輸入資訊即可，例如，也可以用鍵盤和滑鼠等的裝置來構成。顯示機構只要能夠顯示從輸入機構輸入的資訊即可，以顯示專用的顯示器來構成亦可。 Further, in the above-described embodiment, the input unit and the display unit are configured by the display 14, but the configuration is not limited thereto. The input mechanism can be configured as long as it can input information, for example, a device such as a keyboard or a mouse. The display means may be configured to display a dedicated display, as long as it can display information input from the input means.
另外，在上述實施態樣中，刀片匣71及匣夾持具72雖然做成以表示切割刀片36之特性的色彩加以著色的構成，但是並不限定於此構成。刀片匣71及匣夾持具72形成透明的，收容於刀片匣71及匣夾持具72的切割刀片36則以表示特性的色彩加以著色亦可。此外，如果由操作員對 切割刀片36的特性和色彩賦予關聯性以進行識別，那麼刀片匣71、匣夾持具72、切割刀片36亦可不著色。 Further, in the above-described embodiment, the blade 匣 71 and the 匣 holder 72 are formed by coloring the color indicating the characteristics of the dicing blade 36, but the configuration is not limited thereto. The blade 匣 71 and the 匣 holder 72 are formed transparent, and the dicing blade 36 accommodated in the blade 匣 71 and the 匣 holder 72 is colored by a color indicating characteristics. In addition, if it is operated by the operator The characteristics and color of the cutting blade 36 are correlated to be recognized, and the blade 匣 71, the 匣 holder 72, and the cutting blade 36 may not be colored.
此外，在上述實施態樣中，雖然是做成用手動輸入來輸入切割刀片36之ID的構成，但是並不限定於此構成。對刀片匣71附加二維條碼，再藉讀取二維條碼的方式將切割刀片36的ID輸入切割裝置1亦可。 Further, in the above-described embodiment, the ID of the cutting blade 36 is input by manual input, but the configuration is not limited thereto. A two-dimensional barcode is attached to the blade 匣 71, and the ID of the cutting blade 36 is input to the cutting device 1 by reading the two-dimensional barcode.
另外，在上述實施態樣中，雖然是做成特性記憶部82中所記憶的色彩和刀片匣71的色彩形成一致的構成，但是並不限定於此。特性記憶部82中所記憶的色彩沒有必要和刀片匣71的色彩完全一致，只要能夠從特性記憶部82中所記憶的色彩來辨識刀片匣71的色彩台可。 Further, in the above-described embodiment, the color stored in the characteristic storage unit 82 and the color of the blade 71 are formed to be identical, but the configuration is not limited thereto. The color stored in the characteristic memory unit 82 does not have to be exactly the same as the color of the blade 71, as long as the color table of the blade 71 can be recognized from the color memorized in the characteristic memory unit 82.
如以上所說明的，本發明具有所謂，能夠讓操作員早期且容易地注意到裝置中所設定的切割刀片和安裝到裝置上的切割刀片不同相的效果，尤其，對於能夠用顯示器來確認切割刀片之規格的切割裝置是有用的。 As explained above, the present invention has a so-called effect that allows the operator to notice early and easily notice that the cutting blade set in the device and the cutting blade mounted on the device are out of phase, in particular, it is possible to confirm the cutting with the display. A cutting device of the size of the blade is useful.
14‧‧‧顯示器；輸入機構；顯示機構 14‧‧‧ display; input mechanism; display mechanism
81‧‧‧控制機構 81‧‧‧Control agency
82‧‧‧特性記憶部 82‧‧‧ Characteristic Memory Department
83‧‧‧特性設定部 83‧‧‧ Characteristic setting department
84‧‧‧顯示控制部 84‧‧‧Display Control Department
85‧‧‧輸入畫面 85‧‧‧ Input screen
86‧‧‧顯示畫面 86‧‧‧Display screen
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-134192 | 2015-07-03 | ||
| JP2015134192A JP2017013199A (en) | 2015-07-03 | 2015-07-03 | Cutting device |
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| Publication Number | Publication Date |
|---|---|
| TW201707904A true TW201707904A (en) | 2017-03-01 |
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| KR (1) | KR20170004880A (en) |
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| TWI768112B (en) * | 2017-08-31 | 2022-06-21 | 日商迪思科股份有限公司 | Processing device |
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| JP6815882B2 (en) * | 2017-02-06 | 2021-01-20 | 株式会社ディスコ | Cutting equipment |
| JP6998158B2 (en) * | 2017-09-07 | 2022-01-18 | 株式会社ディスコ | Cutting blade feeder |
| JP6989396B2 (en) * | 2018-01-11 | 2022-01-05 | 株式会社ディスコ | How to install processing equipment and processing means |
| JP7017949B2 (en) * | 2018-03-02 | 2022-02-09 | 株式会社ディスコ | Processing equipment |
| CN109514302A (en) * | 2018-12-11 | 2019-03-26 | 浙江英洛华装备制造有限公司 | The cutting auxiliary device of cameron core |
| JP7198119B2 (en) * | 2019-03-04 | 2022-12-28 | 株式会社ディスコ | processing equipment |
| JP7229640B2 (en) * | 2019-04-12 | 2023-02-28 | 株式会社ディスコ | cutting equipment |
| CN110450287B (en) * | 2019-06-26 | 2020-03-10 | 云浮市科特机械有限公司 | Automatic stone production method |
| JP6944103B2 (en) * | 2019-10-22 | 2021-10-06 | エヌティーエンジニアリング株式会社 | Machining status monitoring method and system for work machines |
| JP6851525B1 (en) * | 2020-03-25 | 2021-03-31 | Dmg森精機株式会社 | Tool magazine device |
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| GB9012044D0 (en) | 1990-05-30 | 1990-07-18 | British Telecomm | Cellular radio |
| JP2004272837A (en) * | 2003-03-12 | 2004-09-30 | Toyota Motor Corp | Intermediate body shape data generating device, tool locus generating device, and data generating system for producing final body |
| JP5055732B2 (en) * | 2005-09-15 | 2012-10-24 | 村田機械株式会社 | Setup tool information display device |
| JP2009083016A (en) * | 2007-09-28 | 2009-04-23 | Disco Abrasive Syst Ltd | Cutting device |
| JP5506557B2 (en) * | 2010-06-16 | 2014-05-28 | 株式会社ディスコ | Cutting blade management method |
| JP5523212B2 (en) * | 2010-06-16 | 2014-06-18 | 株式会社ディスコ | Cutting blade management method |
| WO2014168152A1 (en) * | 2013-04-11 | 2014-10-16 | シチズンホールディングス株式会社 | Offset number setting device |
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|---|---|---|---|---|
| TWI768112B (en) * | 2017-08-31 | 2022-06-21 | 日商迪思科股份有限公司 | Processing device |
Also Published As
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| CN106313347A (en) | 2017-01-11 |
| TWI714593B (en) | 2021-01-01 |
| JP2017013199A (en) | 2017-01-19 |
| CN106313347B (en) | 2020-10-09 |
| KR20170004880A (en) | 2017-01-11 |
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