JP2014067940A - Substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce foot printing, the damage of a substrate, and the adhesion of particles.SOLUTION: A substrate processing system includes a carrier carrying in/out block 2; a processing block 4 made by laminating a first processing block 4a and a second processing block 4b; a substrate carrying in/out block 3 provided between the carrier carrying in/out block and the processing block; a substrate carrying portion 7a placing the carrier C at a position communicating to the first processing block; a substrate carrying out portion 7b placing the carrier at a position communicating to the second processing block; a first main arm A1 for carrying a wafer in the carrier placed at a carrier carrying portion to the first processing block; a second main arm A5 for carrying a wafer processed by the second processing block to the carrier on a carrier carrying out portion; and a carrier carrying device 8 carrying the carrier between the carrier carrying in/out block, the substrate carrying in portion, and the substrate carrying out portion, and carrying the carrier on the substrate carrying in portion to the substrate carrying out portion.

Description

  The present invention relates to a substrate processing system.

  For example, a photolithography process in a semiconductor device manufacturing process is performed using, for example, a coating and developing processing system. The coating / development processing system is adjacent to, for example, a loading / unloading block for loading / unloading wafers in a cassette unit, and a processing block in which a plurality of processing apparatuses for performing various processes such as resist coating processing, development processing, and heat treatment are arranged. An interface block is provided for transferring the wafer between the exposure apparatus and the processing block.

  In the coating and developing system, the wafer is continuously processed in a single wafer manner. For example, a plurality of wafers housed in a cassette of the loading / unloading block are sequentially transferred to the processing block, and predetermined processing such as resist coating processing and heat treatment is performed on each wafer in each processing apparatus of the processing block. Thereafter, each wafer is transferred to an exposure apparatus via an interface block and subjected to exposure processing. Thereafter, the wafer is returned to the processing block again, and predetermined processing such as development processing is performed in each processing apparatus. Thereafter, each wafer is sequentially returned from the processing block to the loading / unloading block and returned to the cassette.

  In the above-described coating and developing processing system, processing corresponding to a small lot is required due to diversification of device products in recent years. In this case, since the number of wafers accommodated in one cassette decreases, it is necessary to make more cassettes stand by in the system. It is necessary to transfer the wafers of a plurality of cassettes to the processing block so that there is no space between them. Thus, for example, it has been proposed to provide a cassette stocker in the processing system.

  In such a process, generally, a substrate unloaded from a carrier (FOUP) containing a substrate is transported to a processing unit and subjected to a predetermined process, and then a processed substrate is accommodated in the carrier and processed. A substrate transfer processing apparatus is known (see, for example, Patent Document 1).

  In such a processing apparatus, in order to increase the processing efficiency, a plurality of, for example, 4, 5 carriers are placed in parallel on the carrier station, the substrate is unloaded from a predetermined carrier, and is accommodated in an empty carrier. Continuous processing.

  In addition, in order to cope with the demand for high-throughput and small lot handling due to diversification of devices in recent years, an apparatus capable of storing a large number of carriers in the apparatus has been proposed (for example, see Patent Document 2).

  In addition, in substrate processing other than photolithography processing, for example, cleaning processing having a liquid processing unit for applying a chemical solution for performing single wafer processing on a substrate, substrate processing using a carrier is applied in the same manner as described above. Yes.

Japanese Patent Laid-Open No. 2003-218018 JP 2009-10287 A

  In the case of such an apparatus, after the carrier transferred to the carrier standby unit is transferred to the carrier transfer unit, the wafer is taken out by the substrate transfer device provided between the carrier transfer unit and the processing block, and processed. It is transported to the block. Further, the processed wafer is taken out from the processing block by the substrate transfer device and transferred into the carrier. Therefore, in the case of such an apparatus, at least a carrier transport mechanism for transporting the carrier, a carrier delivery unit, and a space for arranging a substrate transport device that takes out the wafer from the carrier and transports it to the processing block is necessary. Further reduction of the footprint has become difficult.

  In addition, there are concerns such as damage to the wafer and adhesion of particles due to the number of times the substrate transfer device contacts the wafer until the substrate is transferred from the carrier to the processing block and until the processing is completed and transferred from the processing block to the carrier.

  Further, when the size of the wafer W is increased from, for example, 300 mm to 450 mm, when the above method is simply scaled up, the dimension value is 1.5 times or more than the current method, which is different from the conventional methods. A substrate processing system having a mechanism for carrying in a new processing block is desired.

  The present invention has been made in view of such a point, and an object of the present invention is to provide a substrate processing system capable of reducing a footprint and reducing damage to a substrate and adhesion of particles.

  In order to achieve the above object, the invention described in claim 1 includes a carrier loading / unloading block for loading a carrier capable of accommodating a plurality of substrates, and at least one processing unit for performing single wafer processing on the substrates. A processing block formed by stacking a first processing block and a second processing block having at least one processing unit for performing single wafer processing on a substrate processed in the first processing block; A substrate processing system comprising a substrate loading / unloading block provided between a loading block and the processing block and loading / unloading a substrate between the carrier loading / unloading block and the processing block. A substrate carry-in section placed at a position communicating with one processing block; and a substrate placed at a position communicating a carrier with the second processing block A first substrate transport device that is provided in the first processing block and takes out the substrate from the carrier placed in the carrier loading unit and transports the substrate to the processing unit in the first processing block; A second substrate transport apparatus that is provided in the second processing block and transports a substrate processed by a processing unit in the second processing block to a carrier on the carrier unloading unit; and the carrier loading / unloading block And the substrate carrying-in unit and the substrate carrying-out unit, and after the substrate is taken out from the carrier on the substrate carrying-in unit by the first substrate carrying device, the carrier is transferred to the substrate carrying-out unit. And a carrier conveying device for conveying.

  In the first aspect of the present invention, it is preferable that the substrate carry-in portion and the substrate carry-out portion are provided with a lid opening / closing mechanism for opening and closing the lid of the carrier (invention 2).

  The processing block includes a third processing block having a processing unit for processing a substrate processed in the first processing block before being processed in the second processing block, and the third processing block. And a third substrate transfer device that carries the substrate in and out of the processing unit in the block.

  Further, an interface block is further provided between the processing block and the exposure apparatus, a substrate transported by the first substrate transport apparatus can be placed in the interface block, and the second substrate transport is possible. A buffer unit having a plurality of mounting shelves that can be carried out by the apparatus, an interface arm that transfers the substrate between the buffer unit and the exposure apparatus, and a substrate delivery that transfers the substrate between the mounting shelves of the buffer unit And an arm (claim 4). In this case, it is preferable that the first processing block has a resist coating processing unit and the second processing block has a development processing unit.

  Further, an interface block is further provided between the processing block and the exposure apparatus, a substrate to be transported by the first substrate transport apparatus is placed in the interface block, and the second substrate transport apparatus is used. Between the substrate carrying out and the substrate carried by the third substrate carrying device, a buffer unit having a plurality of mounting shelves from which the substrate can be carried out, and between the buffer unit and the exposure device You may make it provide the interface arm which delivers a board | substrate, and the board | substrate delivery arm which delivers a board | substrate between the mounting shelves of the said buffer part (Claim 6). In this case, it is preferable that the first processing block has an antireflection film coating processing unit, the second processing block has a development processing unit, and the third processing block has a resist coating processing unit. (Claim 7).

  Furthermore, the apparatus further includes a control unit that controls driving of at least the first substrate transfer device and the lid opening / closing mechanism, and the substrate is removed from the carrier in the first processing block based on a control signal from the control unit. When the time until the transfer to the first processing block is a predetermined time or more, the lid opening / closing mechanism may close the carrier lid (Claim 8). Further, the apparatus further includes a control unit that controls driving of at least the second substrate transfer device and the lid opening / closing mechanism, and the substrate is second in the second processing block based on a control signal from the control unit. When the time from the processing block to the carrier is a predetermined time or more, the lid opening / closing mechanism may close the carrier lid.

  The invention according to claim 10 is a carrier loading / unloading block for loading a carrier capable of accommodating a plurality of substrates, a processing block having at least one processing unit for performing single wafer processing on the substrate, and the carrier loading / unloading. A substrate processing system provided with a substrate loading / unloading block provided between a block and the processing block for loading / unloading a substrate between the carrier and the processing block, wherein the carrier communicates with the processing block A substrate carry-in / out unit configured to be capable of being mounted on the substrate, a carrier provided in the processing block, placed on the substrate carry-in / out unit, a substrate transfer device for transferring the substrate to the processing unit, and the carrier And a carrier transport device that transports the carrier between the carry-in / out block and the substrate carry-in / out section.

  In a tenth aspect of the present invention, it is preferable that a lid opening / closing mechanism for opening / closing a lid of the carrier is provided in the substrate carry-in / out section (invention 11).

  The apparatus further includes at least a control unit that controls driving of the substrate transfer device and the lid opening / closing mechanism, and based on a control signal from the control unit, a time until the substrate is transferred from the processing block to the carrier. In the case of a predetermined time or more, the lid opening / closing mechanism may close the lid (claim 12).

  In addition, in the present invention, the substrate carry-in / out block may be provided with a carrier standby section on which a carrier can be placed (claim 13).

  According to the first aspect of the present invention, the carrier can be directly communicated with the processing block by the carrier transport device, and the carrier can be accessed by the substrate transport device in the processing block, and before the carrier is carried into the processing block from the carrier. It is possible to reduce the number of times the transfer device contacts the wafer W and the number of times until the wafer W is transferred from the processing block after the processing is completed. Therefore, the footprint can be reduced, and the substrate damage and particle adhesion can be reduced. In addition, in a substrate processing system having a mechanism for loading / unloading a substrate into / from a new processing block corresponding to the scale-up of the substrate, the footprint can be reduced, and damage to the substrate and adhesion of particles can be reduced.

  According to the second aspect of the present invention, by providing the lid opening / closing mechanism for opening and closing the lid of the carrier in the substrate carry-in portion and the substrate carry-out portion, the carrier is loaded and unloaded before the carrier communicates with the processing block. Since the wafer in the carrier is not exposed to this atmosphere, the cleanliness of the atmosphere in the carrier loading / unloading block can be lowered to some extent, and the supply amount of clean gas in the carrier loading / unloading block can be reduced.

  According to the third aspect of the present invention, the third processing block is provided between the first processing block and the second processing block, and the processing in the third processing block is included in the third processing block. Since the substrate transport apparatus for loading / unloading the substrate to / from the unit is provided, it is possible to flexibly cope with various layouts and diversify the substrate processing.

  According to the fourth and fifth aspects of the present invention, the substrate transported by the first substrate transport apparatus can be placed in the interface block provided between the processing block and the exposure apparatus, and the second A buffer unit having a plurality of mounting shelves that can be carried out by the substrate transport apparatus, an interface arm that transfers the substrate between the buffer unit and the exposure device, and a substrate delivery that transfers the substrate between the mounting shelves of the buffer unit Since the arm is provided, a plurality of substrates can be continuously processed (resist application and development processing), and throughput can be improved.

  According to the sixth and seventh aspects of the present invention, the substrate transported by the first substrate transport device is placed in the interface block provided between the processing block and the exposure apparatus, and the second substrate is mounted. A substrate having a plurality of mounting shelves capable of carrying out a substrate by the transport device and a substrate transported by the third substrate transport device, and between the buffer portion and the exposure device Since it includes an interface arm for transferring and receiving a substrate and a substrate transfer arm for transferring and receiving the substrate between the mounting shelves of the buffer unit, a plurality of substrates are continuously processed (antireflection coating, resist coating, and development processing). Therefore, the processing can be diversified and the throughput can be improved.

  According to the eighth aspect of the present invention, when the carrier communicates with the first processing block and the time until the substrate is transported from the carrier to the first processing unit is longer than a predetermined time, Since the cover is configured to be closed, the time during which the inside of the carrier and the substrate in the carrier are exposed to the atmosphere in the first processing block can be reduced. In addition, the number of particles diffusing from the carrier to the first processing block can be reduced.

  According to the ninth aspect of the present invention, in a state where the carrier communicates with the second processing block and the time until the substrate is transported from the second processing block to the carrier is equal to or longer than a predetermined time, the carrier Therefore, the time during which the inside of the carrier and the substrate in the carrier are exposed to the atmosphere in the second processing block can be reduced. In addition, the number of particles diffusing from the carrier to the first processing block can be reduced.

  According to the tenth aspect of the present invention, the carrier can be directly communicated with the processing block by the carrier transport device, and the carrier can be accessed by the substrate transport device in the processing block. It is possible to reduce the number of times that the substrate transfer device contacts the substrate before the transfer to the processing block and the number of times that the processing is completed and the substrate is transferred from the processing block to the carrier. Therefore, the footprint can be reduced, and the substrate damage and particle adhesion can be reduced. In addition, in a substrate processing system having a mechanism for loading / unloading a substrate into / from a new processing block corresponding to the scale-up of the substrate, the footprint can be reduced, and damage to the substrate and adhesion of particles can be reduced.

  According to the eleventh aspect of the present invention, the atmosphere in the carrier loading / unloading block is provided before the carrier communicates with the processing block by providing the lid loading mechanism for opening / closing the carrier lid in the substrate loading / unloading portion. Further, since the wafer in the carrier is not exposed, the cleanliness of the atmosphere in the carrier loading / unloading block can be lowered to some extent, and the supply amount of clean gas in the carrier loading / unloading block can be reduced.

  According to the twelfth aspect of the present invention, when the time until the substrate is transported from the processing block to the carrier is longer than a predetermined time, the lid is closed. Can reduce the time of exposure to the atmosphere in the processing block. In addition, the number of particles that diffuse from the carrier into the processing block can be reduced.

  According to the thirteenth aspect of the present invention, since the carrier standby unit for placing the carrier is provided in the substrate carry-in / out block, the carrier cannot be placed on the substrate carry-in unit, the substrate carry-out unit, or the substrate carry-in / out unit. In addition, since the carrier can be temporarily placed, the processing system can be operated efficiently and the throughput can be improved.

  According to the present invention, the footprint can be reduced, and the damage to the substrate and the adhesion of particles can be reduced. In addition, in a substrate processing system having a mechanism for loading / unloading a substrate into / from a new processing block corresponding to the scale-up of the substrate, the footprint can be reduced, and damage to the substrate and adhesion of particles can be reduced.

1 is a schematic perspective view showing an example of a first embodiment of a substrate processing system according to the present invention. It is a top view which shows the substrate processing system of the said 1st Embodiment. It is a side view which shows the substrate processing system of the said 1st Embodiment. It is a schematic sectional drawing which shows operation | movement of the carrier of the board | substrate carrying-in part in the substrate processing system of the said 1st Embodiment. It is a schematic sectional drawing which shows the movement operation | movement of the carrier of the board | substrate carrying-in part in the substrate processing system of the said 1st Embodiment. It is a schematic sectional drawing which shows opening operation | movement of the cover body of the carrier of the board | substrate carrying-in part in the substrate processing system of the said 1st Embodiment. It is a top view which shows the substrate processing system which concerns on this invention provided with the carrier waiting part. It is a front view which shows the said carrier standby part. It is a top view which shows an example of 2nd Embodiment of the substrate processing system which concerns on this invention. It is a schematic sectional drawing which shows an example of the substrate processing system of the said 2nd Embodiment.

  Hereinafter, embodiments of a substrate processing system of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>
In the first embodiment, the substrate processing system according to the present invention is applied to a coating and developing processing system. As shown in FIGS. 1 to 3, the coating and developing treatment system 1 includes a carrier loading / unloading block 2 for loading and unloading a carrier C in which, for example, 25 wafers W, which are substrates, are hermetically stored, and a plurality of, for example, 6 The processing block 4 configured by vertically arranging the first to sixth unit blocks B1 to B6 and the wafer W in the carrier C loaded into the carrier loading / unloading block 2 are loaded into and unloaded from the processing block 4 A substrate loading / unloading block 3, an interface block 5, and an exposure device 6 are provided.

  The carrier loading / unloading block 2 is provided with a carrier stage 20 on which a plurality of carriers C can be mounted. For example, the carrier C is loaded into and unloaded from the carrier stage 20 by an OHT (Over Head Transfer) device (not shown). .

  The processing block 4 includes at least one or more processing units. In this example, the first and second anti-reflection films are formed from the lower side to the lower side of the resist film. Unit blocks (BCT layers) B1 and B2, third and fourth unit blocks (COT layers) B3 and B4 for performing resist solution coating processing, and fifth and sixth unit blocks (for performing development processing) DEV layers) B5 and B6. The first and second unit blocks B1 and B2 constitute a first processing block 4a, and the fifth and sixth unit blocks B5 and B6 constitute a second processing block 4b. The third and fourth unit blocks B3 and B4 positioned between 4a and the second processing block 4b constitute a third processing block 4c (see FIGS. 1 and 3).

   Next, the configuration of the first to sixth unit blocks B (B1 to B6) will be described. Each of these unit blocks B1 to B6 is performed by a coating processing unit (denoted by reference numeral 12 in FIG. 2) for applying a chemical solution to the wafer W and a coating processing unit 12 (hereinafter referred to as a coating unit 12). Various types of heating / cooling heat treatment units 13 for performing pre-processing and post-processing, and dedicated transfer for transferring the wafer W between the coating unit 12 and the heating / cooling heat treatment units 13. Main arms A1 to A6, which are means A, are provided.

  The substrate loading / unloading block 2 and an interface extending linearly in the length direction (Y-axis direction in the drawing) of each of the unit blocks B1 to B6 are provided at substantially the center of the first to sixth unit blocks B1 to B6. A transfer area 21 for the wafer W for connecting to the block 5 is formed, and a coating unit 12 having a plurality of coating portions for performing a resist coating process on both sides of the transfer area 21. A heating / cooling heat treatment unit 13 is provided.

  The first and second unit blocks B1 and B2 are provided with a BCT coating device 12A as an antireflection film coating unit as a processing unit on one side of the main arms A1 and A2 across the transport area 21. On the other hand, a heat treatment unit 13 is provided. In the first and second unit blocks B 1 and B 2, after the antireflection film is applied to the wafer W in the BCT coating apparatus 12, the heat treatment unit 13 performs heat treatment. The third and fourth unit blocks B3 and B4 are provided with a resist coating apparatus 12C as a processing unit on one side of the main arms A3 and A4 with the transfer area 21 therebetween, and the other is a heat treatment unit 13 on the other side. Is provided. In the third and fourth unit blocks B3 and B4, after the resist is applied by the resist coating device 12, heat treatment is performed in the heat treatment unit 13. Further, the fifth and sixth unit blocks B5 and B6 are provided with a developing processing device 12B as a processing unit on one side of the main arms A5 and A6 across the conveyance area 21, and on the other side. A heat treatment unit 13 is provided. In the fifth and sixth unit blocks B5 and B6, after the resist is applied and the wafer W exposed by the exposure apparatus 6 is developed, the heat treatment unit 13 performs the heat treatment. .

  For example, as shown in FIG. 2, the heat treatment unit 13 includes a hot plate 13a for placing and heating the wafer W and a cooling plate 13b for placing and cooling the wafer W, and performs both heating and cooling. Can do. In addition, you may arrange | position various apparatuses to each unit block B1-B6 according to a process, such as an apparatus which performs the adhesion process which improves the adhesiveness of a resist.

  Hereinafter, the BCT coating device 12A, the resist coating device 12C, and the development processing device 12B will be collectively referred to as the coating unit 12, and when simply expressed as the coating unit 12, all the coating units of the unit blocks B1 to B6 are all described. In the first and second unit blocks B1 and B2, the coating unit (BCT) 12 is used. In the third and fourth unit blocks B3 and B4, the coating unit (COT) 12 is used, and the fifth and sixth units are used. In blocks B5 and B6, they are respectively expressed as coating units (DEV) 12, which respectively mean an antireflection film coating unit, a resist coating unit, and a development processing unit.

  The main arms A1 to A6 are configured to be movable back and forth with respect to the coating unit 12 and the heat treatment unit 13, movable up and down, rotatable about the vertical axis, and movable in the Y-axis direction. In addition to each processing unit, the substrate can be transferred to a delivery unit described later. In particular, in the present embodiment, the main arms A1 and A2 (first substrate transfer device) of the first and second unit blocks B1 and B2 (first processing block 4a) are provided with a substrate carry-in unit 7a described later. Can access the carrier C placed on the main arms A5 and A6 (second substrate transfer device) of the fifth and sixth unit blocks B5 and B6 (second processing block 4b). Access to the substrate carry-out section 7b is possible.

  In the substrate loading / unloading block 2, a substrate loading on which a carrier C can be placed at a position where it can communicate with the first and second unit blocks B1 and B2 on the side of the first and second unit blocks B1 and B2. The carrier C is placed at a position where the carrier C can be placed at a position where it can communicate with the part 7a and the fifth and sixth unit blocks B5 and B6 on the side of the fifth and sixth unit blocks B5 and B6. A possible substrate carry-out unit 7b and a carrier carrying device 8 for carrying the carrier C between the carrier carry-in / out block 2, the substrate carry-out unit 7a, and the substrate carry-out unit 7b are provided.

  For example, as shown in FIG. 1, the carrier transport device 8 includes a movable body 8 b slidably mounted on a rail 8 a extending in the X direction of the ceiling portion of the coating and developing apparatus 1, and suspended from the movable body 8 b. For example, the suspension member 8c that can be telescopically stretched, the carrier gripping body 8d that is telescopically expandable in the horizontal Y direction, and the carrier gripping body 8d are opposed to the lower end portion of the suspension member 8c. A pair of carrier gripping pieces 8e are provided on both sides, one end projecting so as to be rotatable and the other end being movable toward and away from each other.

  The carrier transport device 8 configured as described above can transport the carrier C between the carrier carry-in / out block 2 and the substrate carry-in portion 7a and the substrate carry-out portion 7b, and the carrier C on the substrate carry-in portion 7a. After the wafer W is taken out from the main arms A1 and A2, the carrier C can be transferred to the substrate carry-out portion 7b.

  In the above description, the structure in which the carrier transport device 8 is suspended from the ceiling of the coating and developing apparatus 1 has been described. However, the carrier transporting apparatus 8 is on a movable base that slides on the rails laid on the floor of the coating and developing apparatus 1. You may comprise the self-supporting carrier conveyance apparatus 8 provided with the raising / lowering mechanism, the horizontal expansion-contraction mechanism, the rotation mechanism, etc.

  Here, the configuration of the substrate carry-in / out block 3 will be described using the first and second unit blocks B1 and B2 of the substrate carry-in portion 7a as an example with reference to FIGS. The substrate carry-in part 7a is provided with a substrate carry-in stage 17a and a carrier mounting table 14 provided on the substrate carry-in stage 17a. , Are configured to slide toward the second unit block B1, B2. The wafer transfer areas 21 of the first and second unit blocks B1 and B2 are covered with a casing 15 for performing atmosphere control. A wafer transfer port 18 is formed at a position corresponding to the cassette mounting table 14 in the casing 15, and the wafer transfer port 18 is closed by a lid opening / closing mechanism 16 that opens and closes a lid C1 of the carrier C described later (FIG. 4). reference).

  The substrate carry-out section 7b provided at a position where the fifth and sixth unit blocks B5 and B6 can communicate with each other is provided on the substrate carry-out stage 17b on which the carrier C can be placed and the substrate carry-out stage 17b. A carrier mounting table 14 is provided, and is configured to slide toward the fifth and sixth unit blocks B5 and B6 by a driving mechanism (not shown) in a state where the carrier C is mounted on the carrier mounting table 14 ( (See FIG. 3). Further, the fifth and sixth unit blocks B5 and B6 also correspond to the cassette mounting table 14 in the casing (not shown) covering the wafer transfer area 21 as in the first and second unit blocks B1 and B2. A wafer transfer port (not shown) is formed at the position to be closed, and the wafer transfer port is closed by a lid opening / closing mechanism 16 that opens and closes a lid C1 of the carrier C described later.

  The lid opening / closing mechanism 16 includes a lock release mechanism (not shown) that detaches the lid C1 from the carrier C, and moves the lid C1 downward from the wafer transfer port 18 while holding the lid C1, or the wafer transfer port from below. And a moving mechanism (not shown) that moves to the 18th side.

  With the carrier C mounted on the carrier mounting table 14, the cover C 1 and the cover C 1 of the carrier C are opened and closed by sliding to the first and second unit blocks B 1 and B 2 side through the wafer transfer port 18. The mechanism 16 comes into contact. In this state, the unlocking mechanism provided in the lid opening / closing mechanism 16 is driven to detach the lid C1 from the carrier (see FIG. 5). Thereafter, the lid opening / closing mechanism 16 is retracted downward by the moving mechanism while holding the lid C1, thereby opening the lid C1 and communicating the carrier C with the first and second unit blocks B1 and B2. (See FIG. 6). The lid opening / closing mechanism 16 can return the retracted lid C1 to the front of the cassette C and close the lid 1 of the cassette C. In this state, the main arms A1 and A2 of the first and second unit blocks B1 and B2 take out the wafer W from the carrier C and transfer it to the processing units in the first and second unit blocks B1 and B2. .

  The substrate carry-in section 7a is the first and second unit blocks B1 and B2 where the coating unit 12 (BCT coating apparatus 12A) to be processed first is present, and the substrate carry-out section 7b is the development unit (DEV) 12 to be processed last. It is preferable from the viewpoint of throughput that the (development processing device 12B) is provided in the fifth and sixth unit blocks B5 and B6. In the case of the present embodiment, the first processing, that is, the substrate carrying-in portion 7a is provided in the first and second unit blocks B1 and B2 having the antireflection film coating apparatus 12A, and the last processing, that is, the development processing is performed. It is preferable to provide the fifth and sixth unit blocks B5 and B6 to be performed. With this configuration, the number of times the wafer W is transferred can be reduced, and the throughput can be improved.

  The lid opening / closing mechanism 16 is driven (opened / closed) based on a control signal from the control unit 40 described later until the wafer W is transferred from the carrier to the first processing block 4. Is longer than a predetermined time (for example, 60 seconds), the cover body opening / closing mechanism 16 closes the cover body C1 of the carrier C and the next wafer W is transferred for a predetermined time (for example, 15 seconds). The lid C1 is opened. By doing so, it is possible to reduce the contamination of the carrier C and the wafer W in the carrier C with the atmosphere in the processing block 4, and also diffuse from the carrier C into the first processing block 4a. The number of particles can be reduced.

  Further, the lid opening / closing mechanism 16 transfers the wafer W from the fifth and sixth unit blocks B5 and B6 to the carrier C in the fifth and sixth unit blocks B5 and B6 constituting the second processing block 4b. When the time until it is done is a predetermined time (for example, 60 seconds) or more, the lid opening / closing mechanism 16 closes the lid C1 of the carrier C. By doing so, the contamination of the carrier C and the wafer W in the carrier C with the atmosphere in the processing block 4 can be reduced, and the carrier C is diffused from the carrier C into the second processing block 4b. The number of particles can be reduced.

  Further, as shown in FIGS. 7 and 8, a carrier standby unit 30 configured so that the carrier C can be placed on the substrate carry-in / out block 2 may be provided. The carrier standby unit 30 is provided with a mounting table 31 on the side wall of the processing block 4 so that the carrier C can be mounted on the mounting table 31. For example, a plurality of carrier standby units 30 can be arranged in the vertical direction at the left and right positions of the substrate carry-in unit 7a and the substrate carry-out unit 7b. When the carrier C loaded into the carrier loading / unloading block 2 is loaded with another carrier C in the substrate loading / unloading section 7a, or when the wafer W is loaded from the carrier C of the substrate loading / unloading section 7a into the first processing block 4a. After that, the carrier C can be temporarily placed when it cannot be placed on the substrate carry-out portion 7b. Therefore, the coating and developing apparatus 1 can be operated efficiently and the throughput can be increased. The carrier standby unit 30 is provided with the lid opening / closing mechanism 16 of the lid C1 of the carrier C as described above with reference to FIGS. 4 to 6, and the carrier C whose lid C1 has been opened by the carrier transport device 8 is processed into the processing block 4. The carrier opening / closing mechanism 16 may not be provided in the substrate carry-in portion 7a and the substrate carry-out portion 7b.

  The area adjacent to the interface block 5 in the transfer area 21 of the first to sixth unit blocks B1 to B6 is a wafer transfer area, and as shown in FIGS. 2 and 7, the main arm A (A1) A buffer unit 10 having a plurality of stages, for example, six stages of buffer units BU1 to BU6 capable of holding a plurality of wafers W is provided at a position accessible by A6), and between the buffer units BU1 to BU6 of the buffer unit 10. A substrate transfer arm 9 that transfers (transfers) the wafer W is provided. The substrate delivery arm 9 is configured to be movable up and down in the Z direction and to advance and retreat in the X direction, thereby making it possible to access the buffer units BU1 to BU6.

  The interface block 5 is provided with an interface arm 19. The interface arm 19 is for transferring the wafer W placed on the buffer units BU1 to BU6 to the exposure apparatus 5, and can be moved up and down in the Z direction, can be advanced and retracted in the Y direction, and swivels to expose the exposure apparatus. 5 is configured to be accessible.

  In the above, the coating and developing apparatus 1 described above manages the recipe of each processing unit, manages the recipe of the transfer flow (transport path) of the wafer W, processes in each processing unit, the main arms A1 to A6, and the carrier transport. A control unit 40 including a computer that controls the drive of the apparatus 8, the substrate transfer arm 9, the interface arm 19, and the lid opening / closing mechanism 19 is provided. In this control unit 40, the wafer W is transferred using the first to sixth unit blocks B1 to B6 and processed.

  The transfer flow recipe designates the transfer path (transfer order) of the wafers W in the unit block, and is created for each of the unit blocks B1 to B6 according to the type of coating film to be formed. A plurality of transfer flow recipes are stored in the control unit 40 for each of the first to sixth unit blocks B1 to B6.

  Hereinafter, the flow of the wafer W in the coating and developing apparatus 1 will be described by taking as an example the case where an antireflection film is formed below the resist film. First, the carrier C is carried into the carrier carry-in / out block 2 from the outside. Next, the carrier loading unit 7a provided at the position where the carrier C placed on the carrier loading / unloading block 2 communicates with the first unit block B1 which is the first processing block 4a is loaded by the carrier transfer device 8. It is conveyed to the placement unit 14.

  Next, the carrier placing portion 14 slides and contacts the lid opening / closing mechanism 16, and the lid opening / closing mechanism 16 holds the lid C 1 of the carrier C. Then, the carrier C and the first unit block B1 communicate with each other when the lid opening / closing mechanism 16 moves downward while holding the lid C. In this state, the main arm A1 (first substrate transfer device) takes out the wafer W in the carrier C, and the main arm A1 transfers the wafer W to the coating unit (BCT) 12 (antireflection film coating device 12A). After the antireflection film coating apparatus 12A supplies the antireflection film to the wafer W, the antireflection film is formed by heat treatment by the heat treatment unit 13. Thereafter, the main arm A1 takes out the wafer W from the heat treatment unit 13 and transfers it to the buffer unit BU1.

  Thereafter, the wafer W is transferred from the buffer unit BU1 to the buffer unit BU3 by the substrate transfer arm 9, and the coating unit (COT) 12 (3) of the third processing block 4c by the main arm A3 (third substrate transfer device). Then, the resist film solution is supplied to the wafer W to form a resist film, which is heat-treated in the heat treatment unit 13. Thereafter, the main arm A3 takes out the wafer W from the heat treatment unit 13 and transfers it to the buffer unit BU3.

  Subsequently, the wafer W of the buffer unit BU3 is transferred to the exposure apparatus 6 by the interface arm 19, where a predetermined exposure process is performed. The wafer W after the exposure processing is transferred to the buffer unit BU5 and transferred to the main arm A5 (second substrate) in order to deliver the wafer W to the interface unit 19 to the fifth unit block B5 which is the second processing block 4b. The wafer W is first subjected to the heat treatment in the heat treatment unit 13 and the cooling treatment after the heat treatment, and then transferred to the coating unit (DEV) 12 (development processing device 12B), where it is developed by the development processing device 12B. The developed wafer W is subjected to a heat treatment by the heat treatment unit 13 and a predetermined development process is performed.

  Further, after all the wafers W to be processed in the carrier C communicating with the first unit block B1, that is, the wafers W to be transferred to the first unit block B1, are transferred to the first unit block B1, The carrier C is transported to the substrate carry-out portion 7b of the fifth unit block B5 by the carrier transport device 8, and is communicated by the lid opening / closing mechanism 16 in the fifth unit block B5 as described above. Then, the wafer W that has been processed in the fifth unit block B5 is transferred by the main arm A5 into the carrier C placed on the substrate carry-out portion 7b.

  In such a coating and developing apparatus 1, since the carrier C is directly communicated with the unit blocks B1 to B6 and accessed by the main arms A1 to A6 in the unit blocks B1 to B6, the footprint is reduced. At the same time, the number of times the transfer device contacts the wafer W before the transfer from the carrier C to the first processing block 4a, and the time from the end of processing to the transfer of the wafer W from the second processing block 4b to the carrier C. Since the number of times can be reduced, it is possible to reduce the risk that the substrate transfer apparatus rubs and damages the back surface of the wafer, and the risk of adhesion of particles on the back surface.

Second Embodiment
Next, a second embodiment of the substrate processing system according to the present invention will be described. FIG. 9 and FIG. 10 are a plan view and a schematic sectional view showing the configuration of a cleaning processing system 101 as a substrate processing system in which the substrate processing method according to the second embodiment is realized.

  As shown in FIGS. 9 and 10, the cleaning processing system 101 includes a carrier loading / unloading block 102 as a loading / unloading unit for loading and unloading a plurality of wafers W from / to the cleaning processing system 101 in cassette units, for example. The processing block 104 having a plurality of liquid processing units 109 for performing predetermined liquid processing on the wafer W in a single wafer manner, and the wafer W in the carrier C transferred to the carrier loading / unloading block 102 are transferred to the processing block 104. The substrate loading / unloading block 103 for loading / unloading the wafers W one by one and the processing block 104 are integrally connected.

  In the substrate carry-in / out block 103, a carrier transport device 108 having a carrier gripping piece 108e configured similarly to the carrier transport device 8 of the first embodiment is disposed. With this carrier transport device 108, the carrier C can be transported between the carrier carry-in / out block 102 and the substrate carry-in / out unit 107 that can communicate with the processing block 104.

  As shown in FIG. 10, the processing blocks 104 are stacked in the order of the first processing block 104a and the second processing block 104b. The first and second processing blocks 104 a and 104 b include a plurality of processing units 109 for applying a chemical solution to the wafer W, and a transfer area for transferring the wafer W to these processing units 109. 121 and main arms A11 and A12 which are conveying means A are provided.

  The first and second processing blocks 104a and 104b are provided with a linear transfer area 121 in which the main arms A11 and A12 are arranged, and processing units 109 are provided on both sides of the transfer area 121. ing. In each processing unit 109, resist stripping treatment by SPM (mixed solution of sulfuric acid and hydrogen peroxide solution), particle removal by SC1 (ammonia hydrogen peroxide), metal removal by SC2 (mixed solution of hydrochloric acid and hydrogen peroxide solution), etc. Various processes can be performed independently or a plurality of processes can be performed continuously, and a plurality of processing units 109 can be used to perform a plurality of liquid processes continuously. Absent.

  The main arms A11, A12 are configured to be movable back and forth with respect to the processing unit 109, movable up and down, rotatable about a vertical axis, and movable in the Y direction. The first and second processing blocks 104a, In addition to each processing unit 109 in 104b, it is possible to access a carrier C placed on a substrate loading / unloading unit 107 as described later.

  Next, the substrate loading / unloading unit 107 of the substrate loading / unloading block 103 will be described using the substrate loading / unloading unit 107 for the first processing block 104a. A substrate carry-in / out unit 107 capable of mounting a carrier is provided at a position where it can communicate with the first processing block 104a on the side of the first processing block 104a. The substrate loading / unloading unit 107 is provided with a substrate loading / unloading stage 113 provided on the side wall of the first processing block 104a and a carrier loading table 114 provided on the substrate loading / unloading stage 113. 114 is configured to slide toward the first processing block 104a by a slide mechanism (not shown).

  Further, the wafer transfer area 121 of the first processing block 104a is covered with a casing (not shown) as in the first embodiment in order to control the atmosphere, and a position corresponding to the cassette mounting table 114 in the casing. A wafer transfer port (not shown) is formed, and the wafer transfer port is closed by a lid opening / closing mechanism 116 that opens and closes the lid C1 of the carrier C. The lid opening / closing mechanism 116 can be the same as the lid opening / closing mechanism 16 of the first embodiment, and is driven and controlled based on a control signal from the control unit 40.

  With the above-described configuration, the carrier C placed on the carrier placing table 114 of the substrate loading / unloading unit 107 comes into contact with the lid opening / closing mechanism 116 when the carrier placing table 114 slides, and the lid opening / closing mechanism 116. Thus, the cover C1 of the carrier C is held. In this state, the lid opening / closing mechanism 116 holds the lid C1 and moves downward, so that the carrier C is placed at a position communicating with the first processing block 104.

  Here, the flow of the wafer W in the cleaning processing apparatus 101 will be described. First, the carrier C is loaded into the carrier loading / unloading block 102 from the outside and placed on the carrier stage 120. Next, the carrier loading table 114 on the substrate loading / unloading stage 113 of the substrate loading / unloading unit 107 provided at a position where the carrier C mounted on the carrier stage 120 is communicated with the first processing block 104a by the carrier transfer device 108. Transport to.

  Next, the carrier mounting table 114 slides on the first processing block 104a side until it contacts the lid opening / closing mechanism 116, and the lid opening / closing mechanism 116 moves downward while holding the lid C1. It communicates with the transfer area 121 of one processing block 104a. Thereafter, the main arm A11 conveys the solution to one liquid processing unit 109 in the first processing block 104a. In the liquid processing unit 109, processing of a predetermined chemical solution, for example, resist removal processing by SPM is executed. Thereafter, the main arm A11 transports it to another liquid processing unit 109 of the first processing block 104a. In this liquid processing unit 109, for example, particle removal processing by SC1 is performed, and it is transferred to the carrier C on the carrier mounting table 114 by the main arm A11. In this case, a plurality of liquid processing such as SPM processing and SC1 processing may be performed by the same liquid processing unit 109.

  After that, the above processing is repeated until there is no wafer to be processed in the carrier C. When there is no wafer W to be processed in the carrier C to be processed and all the processed wafers W are collected in the carrier C, After the lid C1 is closed by the lid opening / closing mechanism 116 and the holding of the lid C1 is released, the carrier mounting table 114 slides away from the first processing block 104a. Thereafter, the carrier is transferred from the carrier mounting table 114 to the carrier loading / unloading block 102 by the carrier transfer device 108, thereby completing the processing.

  In such a cleaning processing apparatus 101, the carrier C is directly communicated with the processing block 104, and the carrier is accessed by the main arms A11 and A12 of the processing block 104, so that the footprint is reduced and the processing from the carrier C is performed. Since the number of times the transfer device comes into contact with the wafer W before the transfer to the block 104 and the number of times from the processing block 104 to the transfer of the wafer W to the carrier C can be reduced, the transfer device can reduce the wafer. It is possible to reduce the risk of causing damage by rubbing the back surface and the risk of adhesion of particles on the back surface.

  Further, when the time until the wafer W is transferred from the processing block 104 to the carrier C is equal to or longer than a predetermined time (for example, 60 seconds), the lid opening / closing mechanism 116 is operated by the lid opening / closing mechanism 116. C1 is closed. By doing so, it is possible to reduce the contamination of the carrier C and the wafer W in the carrier C with the atmosphere in the processing block 104, and the number of particles that diffuse from the carrier C into the processing block 104. Can be reduced.

<Other embodiments>
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples.

  (1) For example, in the first embodiment, the case where the first, second, and third processing blocks 4a and 4b4c are stacked has been described. However, the first and second processing blocks 4a and 4b are arranged in two stages. The resist coating apparatus 12C may be disposed in the first processing block 4a, and the heat treatment unit 13 may be disposed.

  In the embodiment configured as described above, the carrier C placed on the carrier loading / unloading block 2 is provided at a position communicating with the first unit block B1 which is the first processing block 4a by the carrier conveying device 8. Then, the substrate is transferred to the carrier placing portion 14 of the substrate carrying-in portion 7a.

  The carrier mounting portion 14 slides and comes into contact with the lid opening / closing mechanism 16, and the lid opening / closing mechanism 16 moves downward while holding the lid C1 of the carrier C, whereby the carrier C and the first unit block B1. And communicate. In this state, the main arm A1 (first substrate transfer device) takes out the wafer W in the carrier C, and the main arm A1 transfers the wafer W to the coating unit (COT) 12 (resist coating device 12C) for resist coating. In the apparatus 12 </ b> C, a resist film solution is supplied to the wafer W to form a resist film, which is heat-treated in the heat treatment unit 13. Thereafter, the main arm A1 takes out the wafer W from the heat treatment unit 13 and transfers it to the buffer unit BU1.

  Subsequently, the wafer W of the buffer unit BU1 is transferred to the exposure apparatus 6 by the interface arm 19, where a predetermined exposure process is performed. The wafer W after the exposure processing is transferred to the buffer unit BU5 and transferred to the main arm A5 (second substrate) in order to deliver the wafer W to the interface unit 19 to the fifth unit block B5 which is the second processing block 4b. The wafer W is first subjected to the heat treatment in the heat treatment unit 13 and the cooling treatment after the heat treatment, and then transferred to the coating unit (DEV) 12 (development processing device 12B), where it is developed by the development processing device 12B. The developed wafer W is subjected to a heat treatment by the heat treatment unit 13 and a predetermined development process is performed.

  Further, after all the wafers W to be processed in the carrier C communicating with the first unit block B1, that is, the wafers W to be transferred to the first unit block B1, are transferred to the first unit block B1, The carrier C is transported to the substrate carry-out portion 7b of the fifth unit block B5 by the carrier transport device 8, and is communicated by the lid opening / closing mechanism 16 in the fifth unit block B5 as described above. Then, the wafer W that has been processed in the fifth unit block B5 is transferred by the main arm A5 into the carrier C placed on the substrate carry-out portion 7b.

  (2) Carrier loading / unloading block 2,102, carrier standby unit 30, substrate loading / unloading unit 7a, substrate unloading unit 7b, substrate loading / unloading unit 107, coating unit 12, heat treatment unit 13, unit block described in the above embodiment The number and arrangement of the above are not limited to this, and can be arbitrarily changed according to the processing purpose.

  (3) The heat treatment unit 13 performs heat treatment and cooling treatment after the heat treatment, but the degree of roughness of the resist after the other treatment, for example, the adhesion treatment performed at the initial stage of the photolithography treatment or the development. Smoothing processing may be used to reduce the noise. Further, the configurations of the carrier transport devices 8 and 108 and the main arms A1 to A6, A11, and A12 are not limited to this.

1 Coating and developing equipment (substrate processing system)
101 Cleaning processing equipment (substrate processing system)
2,102 Carrier loading / unloading block 3,103 Substrate loading / unloading block 4,104 Processing blocks 4a, 104a First processing block 4b, 104b Second processing block 4c Third processing block 5 Interface block 6 Exposure unit 7a Substrate loading Unit 7b Substrate unloading unit 107 Substrate loading / unloading unit 8, 108 Carrier transfer device 9 Substrate delivery arm 10 Buffer unit 12 Coating unit 12A Antireflection coating device 12B Development processing unit 12C Resist coating unit 13 Heat treatment unit 16, 116 Lid opening / closing mechanism 19 Interface arm 30 Carrier standby part W Wafer (substrate)
C carrier C1 carrier lid B1-B6 1st-6th unit block BU1-BU6 buffer unit

Claims (13)

A carrier loading / unloading block for loading a carrier capable of accommodating a plurality of substrates, a first processing block having at least one processing unit for performing single wafer processing on the substrate, and a substrate processed in the first processing block A processing block formed by laminating a second processing block having at least one processing unit for performing single wafer processing on
A substrate processing system provided with a substrate loading / unloading block for loading / unloading a substrate between the carrier loading / unloading block and the processing block, provided between the carrier loading / unloading block and the processing block;
A substrate carry-in unit for placing the carrier at a position communicating with the first processing block;
A substrate carry-out unit for placing the carrier at a position communicating with the second processing block;
A first substrate transport apparatus that is provided in the first processing block and takes out a substrate from a carrier placed in the carrier carry-in section and transports the substrate to a processing unit in the first processing block;
A second substrate transport device that is provided in the second processing block and transports a substrate processed by a processing unit in the second processing block to a carrier on the carrier unloading unit;
The carrier is transported between the carrier carry-in / out block and the substrate carry-in unit and the substrate carry-out unit, and after the substrate is taken out by the first substrate carrying device from the carrier on the substrate carry-in unit, the carrier is removed. A carrier transfer device for transferring to the substrate unloading unit;
A substrate processing system comprising:   The substrate processing system according to claim 1, wherein the substrate carry-in unit and the substrate carry-out unit include a lid opening / closing mechanism that opens and closes a lid of a carrier.   The processing block includes a third processing block having a processing unit for processing a substrate processed in the first processing block before being processed in the second processing block, and in the third processing block. The substrate processing system according to claim 1, further comprising a third substrate transfer device that carries the substrate in and out of the processing unit.   An interface block is further provided between the processing block and the exposure apparatus, and a substrate transported by the first substrate transport apparatus can be placed in the interface block, and the second substrate transport apparatus A buffer unit having a plurality of stackable shelves; an interface arm for transferring a substrate between the buffer unit and the exposure apparatus; and a substrate transfer arm for transferring a substrate between the buffer unit mounting shelves; The substrate processing system according to claim 1, further comprising:   The substrate processing system according to claim 4, wherein the first processing block has a resist coating processing unit, and the second processing block has a development processing unit.     An interface block is further provided between the processing block and the exposure apparatus, a substrate to be transported by the first substrate transport apparatus is placed in the interface block, and a substrate by the second substrate transport apparatus is placed. Unloading and placing the substrate transported by the third substrate transporting device, and a buffer unit having a plurality of mounting shelves from which the substrate can be unloaded, and the substrate between the buffer unit and the exposure device The substrate processing system according to claim 3, further comprising an interface arm for transferring and receiving and a substrate transfer arm for transferring and receiving a substrate between the mounting shelves of the buffer unit.   The first processing block includes an antireflection film coating processing unit, the second processing block includes a development processing unit, and the third processing block includes a resist coating processing unit. The substrate processing system according to claim 6.   The apparatus further includes a control unit that controls driving of at least the first substrate transfer device and the lid opening / closing mechanism, and the substrate is first removed from the carrier in the first processing block based on a control signal from the control unit. 3. The substrate processing system according to claim 2, wherein the lid opening / closing mechanism closes the lid of the carrier when the time until the transfer to the processing block is a predetermined time or more.   The apparatus further includes a control unit that controls driving of at least the second substrate transfer device and the lid opening / closing mechanism, and the substrate is a second processing block in the second processing block based on a control signal from the control unit. 3. The substrate processing system according to claim 2, wherein the lid opening / closing mechanism closes the lid of the carrier when the time from the transfer to the carrier is equal to or longer than a predetermined time. A carrier loading / unloading block for loading a carrier capable of accommodating a plurality of substrates, a processing block having at least one processing unit for performing single wafer processing on the substrate, and between the carrier loading / unloading block and the processing block A substrate processing system provided with a substrate loading / unloading block for loading / unloading a substrate between a carrier and the processing block;
A substrate carry-in / out unit configured to be capable of being placed at a position where the carrier communicates with the processing block;
A substrate transfer device that is provided in the processing block and that transfers the substrate to and from the carrier placed on the substrate carry-in / out unit and the processing unit;
A carrier transport device for transporting a carrier between the carrier carry-in / out block and the substrate carry-in / out unit;
A substrate processing system comprising:   The substrate processing system according to claim 10, further comprising a lid opening / closing mechanism for opening / closing a lid of a carrier in the substrate carry-in / out section.   The apparatus further includes a control unit that controls driving of at least the substrate transfer device and the lid opening / closing mechanism, and a time until the substrate is transferred from the processing block to the carrier based on a control signal from the control unit is a predetermined time. 12. The substrate processing system according to claim 11, wherein the lid opening / closing mechanism closes the lid in the above case.   The substrate processing system according to claim 1, further comprising a carrier standby unit capable of placing a carrier on the substrate carry-in / out block.

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