JP2014063892A - Multiple patterning wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board which hardly generates burrs or the like on wiring boards when divided into the wiring boards.SOLUTION: The multiple patterning wiring board of the present invention includes: an insulating base 1 having a plurality of wiring board region groups 1b and interposed dummy regions 1c arranged between the wiring board region groups 1b, wherein each of the wiring board region groups 1b has a plurality of wiring board regions 1a; and a wiring conductor 2 provided in each of the wiring board regions 1a. The insulating base 1 has notches 3, and the notches 3 are arranged so that the distance D1 to the interposed dummy regions 1c is shorter than the distance D2 to the wiring board regions 1a.

Description

  The present invention relates to a multi-piece wiring board for manufacturing a wiring board on which electronic components such as a semiconductor element or a light emitting element are mounted.

  2. Description of the Related Art Conventionally, a wiring board for mounting an electronic component such as a semiconductor element such as an imaging element or a crystal resonator is made of tungsten or molybdenum on the surface of an insulating board made of an electrically insulating material such as an aluminum oxide sintered body. A wiring conductor made of metal powder metallization is provided.

  The wiring board has been downsized in response to the recent demand for downsizing of electronic devices, and is manufactured by dividing a multi-piece wiring board in order to efficiently manufacture a plurality of wiring boards. . The multi-cavity wiring board is formed by arranging a plurality of wiring board regions serving as a wiring board in the central portion of the insulating base in the vertical and horizontal directions.

  The multi-cavity wiring board may be provided with a notch on the outer periphery of the surrounding dummy area provided around the plurality of wiring board areas of the insulating base. The notch has a groove shape extending in the thickness direction of the insulating base (see, for example, Patent Document 1). The notch is used, for example, as an alignment groove of a multi-piece wiring board or an arrangement location of a plating terminal.

JP2009-010103A

  In recent years, due to the increase in the area of the upper surface of the wiring board region with respect to the area of the upper surface of the multi-cavity wiring board, the width of the peripheral dummy area between the outer edge of the multi-cavity wiring board and the wiring board area has been reduced. When such a multi-piece wiring board is bent and divided along the dividing groove, burrs may occur on the side surface of the wiring board obtained by dividing the wiring board region in the vicinity of the notch. This is because the width of the surrounding dummy area between the notch and the wiring board area is getting smaller, so that the surrounding dummy area is removed by bending the multi-piece wiring board along the dividing groove. Then, sufficient force is not applied to the surrounding dummy area between the notch and the wiring board area, and part of the surrounding dummy area between the notch and the wiring board area cannot be removed. Met.

  A multi-piece wiring board according to one aspect of the present invention includes a plurality of wiring board area groups and an interposing dummy area disposed between the plurality of wiring board area groups. Each includes an insulating base having a plurality of wiring board regions and a wiring conductor provided in each of the plurality of wiring board regions. The insulating base has a notch, and the notch is arranged so that the distance to the intervening dummy region is closer than the distance to the wiring board region.

In the multi-piece wiring board according to one aspect of the present invention, the insulating base has a notch, and the notch is closer to the intervening dummy area than the distance to the wiring board area. Therefore, even if burrs are generated when the dividing groove in the vicinity of the notch is divided, the burrs are generated in the intervening dummy area near the notch and are relatively separated from the notch. It can be reduced that it occurs on the side surface of the wiring board obtained by dividing the wiring board area.

(A) is a top view which shows the multi-piece wiring board in the 1st Embodiment of this invention, (b) is an enlarged view in the A section of (a). (A) is sectional drawing in the AA line of the multi-piece wiring board shown by Fig.1 (a), (b) is B of the multi-piece wiring board shown by Fig.1 (a). It is sectional drawing in the -B line. (A) is a top view which shows the multi-piece wiring board in the 2nd Embodiment of this invention, (b) is an enlarged view in the A section of (a). (A) is a top view which shows the multi-piece wiring board in the 3rd Embodiment of this invention, (b) is sectional drawing in the AA of (a).

  Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
The multi-cavity wiring board according to the first embodiment of the present invention includes an insulating substrate 1 having a plurality of wiring board areas 1a and a plurality of wiring board areas as in the example shown in FIGS. 1a, and a wiring conductor 2 provided in each of 1a.

  The insulating base 1 is provided around the plurality of wiring board region groups 1b, the interposed dummy regions 1c disposed between the plurality of wiring substrate region groups 1b, and the plurality of wiring substrate region groups 1b and the interposed dummy regions 1c. And a surrounding dummy area 1d. Each of the plurality of wiring board region groups 1b has one to a plurality of wiring substrate regions 1a.

  Each of the plurality of wiring board regions 1a is a region that is used as a package that is mounted and sealed on an external circuit board, for example, on which electronic components are mounted and sealed. The surrounding dummy area 1d is an area used when the insulating base 1 is manufactured or transported, and the surrounding dummy area 1d is used for positioning and fixing when forming the insulating base 1 or the insulating base 1 during processing or transporting. Etc. can be performed. In the present embodiment, the plurality of wiring board regions 1a are provided side by side vertically and horizontally, but the plurality of wiring board regions 1a may be provided side by side vertically or horizontally.

  The material of the insulating substrate 1 is an insulator such as ceramic or resin. When the material of the insulating substrate 1 is ceramic, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body, or the like may be used as the material. it can. Further, when the material of the insulating substrate 1 is a resin, examples of the material include fluorine resin such as epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin, and tetrafluoroethylene resin, or glass epoxy resin. Can be used.

When the material of the insulating substrate 1 is an aluminum oxide sintered body, for example, organic materials suitable for raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), and magnesia (MgO). A ceramic green sheet is obtained by adding a solvent and a solvent to form a slurry, and forming this into a sheet by employing a conventionally known doctor blade method or calendar roll method. The insulating substrate 1 is manufactured by performing an appropriate punching process on the sheet and stacking a plurality of sheets as necessary to form a generated shape, and firing the generated shape at a high temperature (about 1300 to 1500 ° C.).

  When the material of the insulating substrate 1 is a resin, the insulating substrate 1 is manufactured by a transfer molding method, an injection molding method, or the like using a mold that can be molded into a predetermined wiring board shape, for example. For example, when the insulating base 1 is a glass epoxy resin, the base made of glass fiber is impregnated with an epoxy resin precursor, and the epoxy resin precursor is thermally cured at a predetermined temperature to thereby insulate the insulating base 1. Is produced.

  The wiring conductor 2 is provided on the surface and inside of the insulating base 1, and the wiring conductor 2 mounts an electronic component on the divided wiring board, or electrically connects the mounted electronic component and the external circuit board. It is for connection. When the insulating substrate 1 is made of ceramics, the wiring conductor 2 is made of metal powder metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu). The wiring conductor 2 includes a metal conductor provided on the surface or inside of the insulating base 1 and a penetrating conductor that penetrates through the insulating layer constituting the insulating base 1 and electrically connects the metal conductors positioned above and below. It is out.

  The wiring conductor 2 disposed inside the insulating base 1 is formed by, for example, applying a metallized paste for the wiring conductor 2 on a ceramic green sheet for the insulating base 1 by a printing means such as a screen printing method, and then applying a ceramic for the insulating base 11. It is formed by firing together with a green sheet. Further, the through conductor is formed, for example, in a ceramic green sheet for the insulating base 11 by a die or punching process by punching or laser processing or the like, and through metal for the through conductor is formed in the through hole. It is formed by filling the paste with the printing means and firing it together with the ceramic green sheet for the insulating substrate 1.

  When the material of the insulating substrate 1 is a resin, the wiring conductor 2 can be made of a metal material such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, and alloys thereof. The wiring conductor 2 is formed, for example, by transferring a copper foil processed into a predetermined shape onto a resin sheet made of glass epoxy resin, and laminating the resin sheet to which the copper foil is transferred and bonding with an adhesive. . In such a case, the wiring conductor 2 is formed by transferring a metal foil onto a resin sheet. Further, among the wiring conductors 2, the through conductors that penetrate the resin sheet in the thickness direction are deposited on the inner surfaces of the through holes formed in the resin sheet by printing or plating a conductor paste, or filled with the through holes. What is necessary is just to form. Such a through conductor is formed, for example, by integrating a metal foil or a metal column by resin molding, or by depositing the insulating substrate 1 on the insulating substrate 1 using a sputtering method, a vapor deposition method, or the like.

On the surface of the exposed portion of the wiring conductor 2, a metal plating layer having excellent corrosion resistance such as nickel and gold is applied. Corrosion of the wiring conductor 2 can be reduced, and the electronic component, bonding wire or external circuit board and the wiring conductor 2 can be firmly bonded. For example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the surface of the exposed portion.

  Moreover, when a light emitting element is used as the electronic component, the multi-cavity wiring board may be coated with a silver plating layer having a thickness of about 1 to 10 μm on the surface of the wiring conductor 2. When a silver plating layer is deposited on the surface of the wiring conductor 2 on which the electronic components are mounted, when the light emitting element is mounted on the wiring board obtained by dividing the multi-piece wiring board, the wiring conductor Thus, a light emitting device capable of efficiently reflecting the light emitted toward the direction 2 can be obtained.

Further, the surface of the wiring conductor 2 on which the electronic component is mounted may be coated with a Cu plating layer. For example, by applying a Cu plating layer of about 10 to 80 μm between the nickel plating layer and the gold plating layer or on the underlying layer of the nickel plating layer and the gold plating layer, the heat generated by the electronic component is efficiently applied to the wiring conductor 2. It is possible to obtain a highly reliable electronic device that can conduct heat well.

  The dividing grooves 4 are formed at the boundary between the wiring substrate regions 1a of the insulating base 1, the boundary between the wiring substrate region 1a and the interposing dummy region 1c or the surrounding dummy region 1d, and the boundary between the interposing dummy region 1c and the surrounding dummy region 1d. Is provided. These dividing grooves 4 are formed by a method in which a cutter blade or a mold is pressed against a generated shape to be the insulating substrate 1, or a method in which laser processing or dicing is performed on the generated shape to be the insulating substrate 1 or the insulating substrate 1 after firing. Can be formed. The vertical cross-sectional shape of the dividing groove 4 may be a shape with a gradually narrowing width toward the bottom or a concave shape. However, as in the example shown in FIGS. When the shape is narrowed, when the insulating substrate 1 is bent and broken along the dividing groove 4, stress is easily concentrated on the bottom of the dividing groove 4, so that it is accurately divided with a small force compared to the concave shape. it can. Further, the dividing grooves 4 may be provided on both main surfaces of the insulating base 1 as in the example shown in FIG.

  The depth of the dividing groove 4 is appropriately set depending on the material of the insulating substrate and is preferably formed to be about 50% to 70% of the thickness of the insulating substrate 1. If the depth of the dividing groove 4 is 50% or less of the thickness of the insulating substrate 1, the mechanical strength becomes higher with respect to the thickness of the insulating substrate 1, and the dividing groove 4 tends to be difficult to be divided. If it is 70% or more, the mechanical strength of the insulating substrate 1 tends to be low, and the wiring board tends to be easily broken during transportation. By setting the depth of the dividing groove 4 in the above range, the insulating substrate 1 is divided with high accuracy, and a multi-piece wiring board in which the occurrence of inadvertent cracking during transportation is reduced is obtained. When the dividing grooves 4 are formed on both main surfaces of the insulating substrate 1, the total depth of the dividing grooves 4 formed on both main surfaces may be set within the above range.

If the opening width of the dividing groove 4 of the insulating substrate 1 is about 0.01 mm to 1.0 mm, the insulating substrate 1 can be divided well, and by forming the dividing groove 4, the area of each wiring board region 1a is reduced. Can be reduced. That is, when the dividing groove 4 is formed, it can be reduced that the area of the wiring board region 1a is greatly reduced. If the opening width of the dividing groove 4 is smaller than 0.01 mm, the force applied to the bottom of the dividing groove 4 becomes weak when the insulating substrate 1 is bent and divided along the dividing groove 4. When the opening width of 4 is larger than 1.0 mm, the wiring board 1c
This is because the area of the main surface is reduced. Further, when the opening width is smaller than 0.01 mm, when forming the dividing groove 4 by pressing a cutter blade or a mold against the generated shape to be the insulating base 1, and firing the generated shape to be the insulating base 1, The inner wall surfaces of the dividing grooves 4 may stick together and the dividing grooves 4 may close, or the inner wall surfaces on the bottom side of the dividing grooves 4 may stick together and the dividing grooves 4 may become shallow.

  As shown in FIGS. 1 and 2, the notch 3 is provided in the peripheral dummy region 1 d around the outer periphery of the insulating base 1 in a groove shape on the side surface of the insulating base 1. Is penetrated in the thickness direction. Such a notch 3 is used to align the multi-cavity wiring board when mounting electronic components on the multi-cavity wiring board or joining a lid or lead pins to the multi-cavity wiring board. For example, it is a portion where a rod-shaped jig is disposed. Moreover, the notch part 3 may be used as an arrangement | positioning location of the terminal for electrolytic plating. In such a case, an electrode electrically connected to the wiring conductor 2 is provided on the inner surface of the notch 3. A jig that is electrically connected to the plating power supply is brought into contact with the electrode on the inner surface of the notch 3 and a current is passed from the electrode on the inner surface of the notch 3, so that the surface of the multi-piece wiring substrate is obtained. A plating layer formed by electrolytic plating can be applied to the provided wiring conductor.

The cut-out portion 3 is formed in a semicircular shape, a semi-elliptical shape, a circular shape, a fan shape, a polygonal shape such as a triangular shape or a quadrangular shape in a plan view. Here, when the distance between the notch 3 and the intervening dummy region 1c is D1, and the distance between the notch 3 and the wiring board region 1a is D2, D1
The notch 3 is arranged so as to satisfy the relationship <D2. With such a configuration, even when burrs are generated when the dividing groove 4 in the vicinity of the notch 3 is divided, most of the burrs are generated in the intervening dummy region 1c near the notch 3, Compared with the intervening dummy region 1c, it can be reduced that it occurs on the side surface of the wiring board away from the notch 3.

  The multi-cavity wiring board in this embodiment is bent along the boundary between the wiring board regions 1a of the insulating base 1 and the dividing grooves 4 provided at the boundary between the wiring board region 1a and the interposing dummy region 1c. As a result, a plurality of wiring boards are obtained. Electronic components are bonded and mounted on the wiring board obtained by dividing the multi-cavity wiring board. The electronic component is, for example, a semiconductor element or a light emitting element. In addition, a small electronic component such as a capacitor or a diode may be mounted together with a semiconductor element or a light emitting element. The electronic component is bonded to the upper surface of the wiring board by a conductive bonding material such as a brazing material made of a gold (Au) -silicon (Si) alloy or an epoxy resin containing silver (Ag). The electrode of the electronic component and the wiring conductor 2 are electrically connected via a connecting member such as a bonding wire mainly composed of Au. The electronic component is sealed with a sealing material such as a resin as necessary.

  The multi-piece wiring board of this embodiment has a plurality of wiring board region groups 1b and intervening dummy regions 1c arranged between the plurality of wiring substrate region groups. Each has an insulating base 1 having a plurality of wiring board regions 1a and a wiring conductor 2 provided in each of the plurality of wiring board regions 1a. And the notch 3 is arranged so that the distance to the intervening dummy region 1c is closer than the distance to the wiring substrate region 1a. Because of this structure, even if burrs are generated when the dividing groove 4 in the vicinity of the notch 3 is divided, the burrs are generated in the intervening dummy region 1c near the notch 3 and are cut. It is possible to reduce the occurrence of occurrence on the side surface of the wiring board obtained by dividing the wiring board region 1 a that is relatively far from the notch 3.

  Since the notch 3 is arranged on an extension line of the intervening dummy region 1c, the distance between the notch 3 and the interposing dummy region 1c can be reduced, so that the wiring obtained by dividing the wiring board region 1a can be obtained. Generation of burrs on the side surface of the substrate can be more effectively reduced.

(Second Embodiment)
Next, a multi-piece wiring board according to a second embodiment of the present invention will be described with reference to FIG.

  The multi-cavity wiring board according to the present embodiment differs from the multi-cavity wiring board of the first embodiment in that the width W1 of the notch 3 is narrower than the width W2 of the intervening dummy region 1c and the plane. In view, the shape of the notch 3 is a wide bell shape on the outer peripheral side of the insulating base 1, and the outer end of the dividing groove 4 is more peripheral than the inner end of the notch 3. It is a point located on the side. Since there is no notch 3 in a region symmetrical to the plurality of wiring board regions 1a across the dividing groove 4, a force is easily applied when force is applied to the dividing groove. The occurrence of burrs can be reduced.

  Further, when the dividing groove 4 in the vicinity of the notch 3 is divided, even if burrs are generated in the intervening dummy region 1c located between the wiring substrate regions 1a, the burrs are formed between the intervening dummy region 1c and the wiring substrate region 1a. Therefore, the generation of burrs on the side surfaces of the wiring board obtained by dividing the wiring board region 1a can be reduced.

In plan view, the notch 3 has a wide bell shape on the outer peripheral side of the insulating base 1, so a rod-shaped jig for aligning the multi-piece wiring board is provided on the outer peripheral side of the insulating base 1. It is easy to place the jig in the notch portion 3 when placing from the top. Notch 3 in plan view
Since the angle formed by the inner surface is a wide angle, it is possible to reduce the damage of the insulating substrate 1 due to contact with the jig.

(Third embodiment)
Next, a multi-piece wiring board according to a third embodiment of the present invention will be described with reference to FIG.

  The multi-cavity wiring board in the present embodiment is different from the multi-cavity wiring board of the first embodiment in that the dividing groove 4 closest to the notch 3 is sandwiched between the plurality of wiring board region groups 1b. Thus, the intervening dummy region 1c is provided only in a region symmetrical to the notch 3 and the notch 3 is a through hole. The intervening dummy area 1c has the same size as the wiring board area 1a. With such a structure, more wiring board regions 1a can be arranged.

  In addition, this invention is not limited to the example of said embodiment, A various change is possible. For example, at the boundary of the wiring board region 1a, when a multi-cavity wiring board is divided, a hole that becomes a groove is formed, and a conductor is formed on the inner surface of the hole so that the multi-cavity wiring board is divided, so-called A castellation conductor may be formed.

  Further, the wiring board region 1a may be provided with a cavity for storing electronic components or the like on the upper surface or the lower surface of the insulating substrate 1.

  Moreover, the notch 3 does not need to penetrate the insulating substrate 1 in the thickness direction. Further, in order to prevent the burr generated around the notch 3 from spreading toward the wiring board region 1a, it is preferable to set D2 to be 1.5 times or more of D1.

  Further, dummy conductors arranged in the same manner as the wiring board region 1a may be provided in the intervening dummy region 1c. If the insulating substrate 1 is made of ceramics, local deformation of the multi-piece wiring board during firing can be reduced.

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ... Wiring board area | region 1b ... Wiring board area | region group 1c ... Interposition dummy area | region 1d ... Surrounding dummy area | region ...... Wiring conductor 3 ...... Notch Part 4 ... Dividing groove

Claims (3)

A plurality of wiring board region groups and an intervening dummy region disposed between the plurality of wiring board region groups, and each of the plurality of wiring board region groups has a plurality of wiring substrate regions; An insulating substrate;
A wiring conductor provided in each of the plurality of wiring board regions,
The insulating base has a notch, and the notch is arranged so that the distance to the intervening dummy region is closer than the distance to the wiring board region. Multi-cavity wiring board.   The multi-piece wiring board according to claim 1, wherein the notch is disposed on an extension line of the intervening dummy region.   3. The multi-piece wiring board according to claim 1, wherein a width of the notch portion is narrower than a width of the intervening dummy region.

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