JP2014056990A - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of suppressing an occurrence of an exposure failure.SOLUTION: The exposure apparatus exposes a substrate to exposure light through a liquid, and includes: an optical member having an emitting surface from which the exposure light emits; a stage movable under the optical member, and having a member disposed with an object that can face the emitting surface through a gap; a first liquid supply device that supplies the gap between the object and the optical member with a liquid; and a second liquid supply device at least part of which is disposed on the stage, and that supplies the gap with a liquid.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used. The exposure apparatus includes a substrate stage that is movable while holding a substrate, and exposes the substrate held on the substrate stage.

US Patent Application Publication No. 2008/0043211 US Patent Application Publication No. 2008/0100812

  In the immersion exposure apparatus, when the substrate is held with a gap around the substrate stage, the amount of liquid flowing into the gap may vary depending on the surface characteristics of the substrate. When the liquid flowing into the gap is collected on the substrate stage side, the temperature around the substrate in the substrate stage fluctuates due to fluctuations in the heat of vaporization of the liquid due to the fluctuations in the amount of liquid described above, resulting in poor exposure. there is a possibility. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, an optical member having an exit surface from which the exposure light is emitted, and an object that can face the exit surface; A stage having a member arranged through a gap and movable under the optical member, a first liquid supply device for supplying a liquid between the object and the optical member, and at least a part of the stage being arranged And a second liquid supply device that supplies liquid to the gap.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect of the present invention and developing the exposed substrate. .

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, comprising: an optical member having an exit surface from which exposure light is emitted; and a substrate facing the optical member. The liquid is supplied by the first liquid supply device, the member is disposed through the object and the gap that can be opposed to the emission surface, the member and the substrate are moved, and between the moving substrate and the optical member There is provided an exposure method including exposing a substrate through the liquid and supplying a liquid to the gap by a second liquid supply device at least partially disposed on a stage.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure method of the third aspect of the present invention; and developing the exposed substrate. .

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

1 is a schematic block diagram that shows an example of an exposure apparatus EX according to a first embodiment. The figure which shows an example of the liquid immersion member and substrate stage which concern on 1st Embodiment. The figure which expanded a part of FIG. FIG. 4 is a diagram illustrating an example of a substrate P held by a first holding unit 31. The figure which shows the relationship between time and temperature in the substrate stage. FIG. 6 is a diagram illustrating an operation of the liquid supply apparatus 50. The top view which shows an example of exposure apparatus. The figure which shows an example of a substrate stage. The flowchart which shows an example of the manufacturing process of a device.

  Hereinafter, embodiments of the exposure apparatus, the exposure method, and the device manufacturing method of the present invention will be described with reference to FIGS. 1 to 9, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that can be moved by mounting a measurement member C and a measuring instrument, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, and a drive system 6 that moves the measurement stage 3 And an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of the optical path of the exposure light EL The immersion member 7 capable of forming the immersion space LS so as to be filled with the liquid LQ, the control device 8 for controlling the overall operation of the exposure apparatus EX, and the control device 8 for storing various information relating to exposure. And a storage device 8R that. The storage device 8R includes, for example, a memory such as a RAM, a recording medium such as a hard disk and a CD-ROM. In the storage device 8R, an operating system (OS) for controlling the computer system is installed, and a program for controlling the exposure apparatus EX is stored.

  Further, the exposure apparatus EX includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. The detection system 300 includes an alignment system 302 that detects an alignment mark on the substrate P, and a surface position detection system 303 that detects the position of the upper surface (surface) Pa of the substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  Further, the exposure apparatus EX includes a chamber apparatus 103 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space 102 in which the exposure light EL travels. The chamber apparatus 103 includes a chamber member 104 that forms the space 102, and an air conditioning system 105 that adjusts the environment of the space 102.

  The space 102 includes a space 102A and a space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 includes an air supply unit 105S that supplies gas to the spaces 102A and 102B, and supplies the gas from the air supply unit 105S to the spaces 102A and 102B to adjust the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are arranged in the space 102A.

  The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 can be moved to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C. The substrate stage 2 and the measurement stage 3 can move independently on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion (substrate holding portion) 31 that holds the lower surface Pb of the substrate P so as to be releasable, and an opening Th in which the substrate P can be disposed. And an upper surface disposed around the upper surface Pa of the substrate P in a state of being held by the holding unit 31.

  In the present embodiment, the substrate stage 2 is arranged around the first holding unit 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. And a second holding part 32 that holds the lower surface Tb of the cover member (defining member) T in a releasable manner. The cover member T is disposed around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding portion 31 is disposed. In the present embodiment, the cover member T has an upper surface 2U.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the upper surface Pa of the substrate P and the XY plane are substantially parallel. The second holding part 32 holds the cover member T so that the upper surface 2U of the cover member T and the XY plane are substantially parallel. In the present embodiment, the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U of the cover member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is).

  The cover member T may be formed integrally with the substrate stage 2. For example, at least a part of the substrate stage 2 may have the upper surface 2U.

  In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the cover member Q so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck mechanism. The cover member Q is disposed around the measurement member C held by the third holding unit 33. The holding mechanism used at least one of the third holding part 33 and the fourth holding part 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the cover member Q may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding portion 34 holds the cover member Q so that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the cover member Q held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measuring member C held by the third holding unit 33. In addition, the upper surface of the cover member Q held by the fourth holding portion 34 is appropriately referred to as the upper surface 3U of the measurement stage 3.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11 </ b> A can measure the position of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R arranged on the substrate stage 2 and the measurement mirror 3R arranged on the measurement stage 3.

  The alignment system 302 detects the alignment mark of the substrate P and detects the position of the shot region (exposure region) S of the substrate P. The alignment system 302 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the alignment system 302 facing the −Z direction.

  The surface position detection system 303 is also called, for example, an autofocus / leveling system, and detects the position of the upper surface Pa of the substrate P by irradiating the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 with detection light. To do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing the −Z direction.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 drives the drive systems 4, 5, 5 based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to perform position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is formed on the emission surface 13 side. The immersion space LS is formed so that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The exit surface 13 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. The emission surface 13 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 7 has a lower surface 14 at least partially facing the −Z direction. In the present embodiment, the emission surface 13 and the lower surface 14 can hold the liquid LQ with an object arranged at a position (projection region PR) where the exposure light EL emitted from the emission surface 13 can be irradiated. . The immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and the object arranged in the projection region PR. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 13 and the object arranged in the projection region PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ with the object so that the optical path K of the exposure light EL between the terminal optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, the objects that can be arranged in the projection region PR include objects that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12). The object is movable with respect to the last optical element 12 and the liquid immersion member 7. The object has an upper surface (surface) that can face at least one of the emission surface 13 and the lower surface 14. An immersion space LS can be formed between the upper surface of the object and the emission surface 13. The object is movable in a plane (XY plane) perpendicular to the optical axis (Z axis) of the last optical element 12. In the present embodiment, an immersion space LS can be formed between the upper surface of the object and at least a part of the emission surface 13 and the lower surface 14. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the upper surface (front surface) of the object on the other side, the optical path K of the exposure light EL between the last optical element 12 and the object is changed. An immersion space LS is formed so as to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held on the substrate stage 2 are the exit surface 13 of the last optical element 12 facing the −Z direction and the liquid immersion facing the −Z direction. The lower surface 14 of the member 7 can be opposed. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. Further, these objects can face at least a part of the detection system 300.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ with the substrate P so that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. FIG. 3 is an enlarged view of a part of FIG. In FIG. 2, the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7), but as described above, the substrate stage 2 (cover member T), and The measurement stage 3 (cover member Q, measurement member C) can also be arranged.

  As shown in FIG. 2, the liquid immersion member 7 includes at least a part 71 facing the exit surface 13 of the last optical element 12 and a main body 72 at least partly disposed around the last optical element 12. Including. The facing portion 71 has a hole (opening) 7 </ b> K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least partially facing the emission surface 13 via a gap, and a lower surface 7H on which the substrate P (object) can face. The hole 7K is formed so as to connect the upper surface 7U and the lower surface 7H. The upper surface 7U is disposed around the upper end of the hole 7K, and the lower surface 7H is disposed around the lower end of the hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and irradiate the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is disposed around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

  Further, the liquid immersion member 7 includes a supply port 15 that can supply the liquid LQ and a recovery port 16 that can recover the liquid LQ. The supply port 15 supplies the liquid LQ when the substrate P is exposed, for example. The recovery port 16 recovers the liquid LQ, for example, when the substrate P is exposed. The supply port 15 can supply the liquid LQ during one or both of the exposure and non-exposure of the substrate P. Note that the recovery port 16 can recover the liquid LQ during one or both of exposure and non-exposure of the substrate P.

  The supply port 15 is disposed so as to face the optical path K in the vicinity of the optical path K of the exposure light EL emitted from the emission surface 13. The supply port 15 only needs to face one or both of the space between the exit surface 13 and the opening 7K and the side surface of the last optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to the space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and then is supplied onto the substrate P (object) through the opening 7K.

  The supply port 15 is connected to a liquid supply device (first liquid supply device) 18 via a flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The liquid supply device 18 may be provided in the exposure apparatus EX, or may be provided, for example, in a clean room outside the exposure apparatus EX. The channel 17 includes a supply channel 17 </ b> R formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel 17 </ b> R and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The collection port 16 is disposed at least at a part around the opening 7K through which the exposure light EL passes. In the present embodiment, the collection port 16 is disposed at least at a part around the holding surface 7H. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 72 has an opening 7P that faces the substrate P (object). The opening 7P is disposed at least at a part around the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 disposed in the opening 7P. In the present embodiment, the porous member 19 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H on which the substrate P (object) can face, an upper surface 19U facing in the opposite direction of the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is disposed on at least a part of the periphery of the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes a holding surface 7H and a lower surface 19H.

  In the present embodiment, the recovery port 16 includes a hole of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 16) of the porous member 19. Note that the porous member 19 may not be disposed.

  The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to, for example, a vacuum system provided outside the exposure apparatus EX, and can suck the liquid LQ through the recovery port 16. The liquid recovery apparatus 21 may be provided in the exposure apparatus EX, or may be provided, for example, in a clean room outside the exposure apparatus EX. The channel 20 includes a recovery channel 20R formed inside the liquid immersion member 7 and a channel formed by a recovery pipe that connects the recovery channel 20R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  As shown in FIGS. 2 and 3, in the present embodiment, the substrate stage 2 is a space portion that communicates with a gap (gap) Ga between the substrate (object) P and the cover member (member) T (substrate stage 2). 23. The space 23 is located below the gap Ga. The gap Ga is formed between the side surface Pc of the substrate P held by the first holding unit 31 and the inner surface Tc of the cover member T held by the second holding unit 32 that face each other.

  A porous member 80 is disposed in the space 23. In the present embodiment, the porous member 80 has an upper surface 80A that can face at least one of the injection surface 13 and the lower surface 14. The upper surface 80A is disposed below the substrate P and the cover member T (−Z side). In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed by, for example, a sintering method. In the present embodiment, at least a part of the liquid LQ flowing into the gap Ga is recovered through the porous member 80.

  In the present embodiment, the porous member 80 is supported by the case 81. The case 81 is disposed in the space part 23. In the present embodiment, the case 81 is made of, for example, ceramic, but may be made of metal. The porous member 80 may be disposed directly in the space portion 23 without using the case 81.

  In the present embodiment, a support member 82 is disposed between the porous member 80 and the case 81 and the cover member T. The support member 82 is supported by at least a part of the porous member 80 and the case 81. The support member 82 can face at least a part of the lower surface Tb of the cover member T. The support member 82 supports at least a part of the lower surface Tb of the cover member T. Note that this may be omitted without using the support member 82.

  In the present embodiment, the substrate stage 2 has a suction port 24 disposed in the space 23. In the present embodiment, the suction port 24 is formed on at least a part of the inner surface of the substrate stage 2 that forms the space 23. The suction port 24 sucks at least a part of the fluid in the space portion 23 so that the space portion 23 has a negative pressure. The suction port 24 can suck one or both of the liquid and gas in the space 23.

  The suction port 24 is connected to the fluid suction device 26 via the flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suck one or both of liquid and gas through the suction port 24. The fluid suction device 26 may include a flow meter (not shown), and the amount of fluid (liquid) sucked may be measured by this flow meter. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of liquid and gas) sucked from the suction port 24 is sucked into the fluid suction device 26 via the flow path 25. The fluid suction device 26 may be provided in the exposure apparatus EX, or may be provided, for example, in a clean room outside the exposure apparatus EX.

  In the present embodiment, the case 81 has a hole (opening) 81 </ b> H that connects the outer surface and the inner surface of the case 81. The opening 83 at the upper end of the hole 81 </ b> H faces the lower surface of the porous member 80. The opening at the lower end of the hole 81H is connected to the suction port 24. The suction port 24 can suck the fluid in the space inside the case 81 through the hole 81H so that the space inside the case 81 has a negative pressure.

  In the present embodiment, the substrate stage 2 is provided with a flow path 51 of a liquid supply device (second liquid supply device) 50 that supplies a liquid into the gap Ga. One end of the flow channel 51 opens as a supply port 51a facing the space 23, and is connected to the liquid supply device 50 at the other end side. The liquid supply device 50 supplies the liquid to the space portion 23 through the flow path 51 under the control of the control device 8. In the present embodiment, the liquid supplied from the liquid supply device 50 uses the same water (pure water) as the liquid LQ described above.

  In the present embodiment, the first holding unit 31 has, for example, a pin chuck mechanism. The first holding portion 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall portion 35 that can be opposed to the lower surface Pb of the substrate P, and the support surface 31S on the inner side of the peripheral wall portion 35, and includes a plurality of pin members. The support portion 36 includes a suction port 37 that is disposed on the support surface 31S and sucks fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space in at least a part between the lower surface Pb of the substrate P. Note that, in the support surface 31, the peripheral wall portion 35 is substantially circular, and the center of the first holding portion 31 is the center of the peripheral wall portion 35 in the above description and the following description. In the present embodiment, the peripheral wall portion 35 is substantially circular (annular) in the XY plane. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall portion 35 are in contact with each other, whereby the peripheral wall portion 35, the lower surface Pb of the substrate P, the support surface 31S, and the like. The space 31H formed by can be set to a negative pressure. As a result, the substrate P is held by the first holding unit 31. In addition, the substrate P is released from the first holding unit 31 by releasing the suction operation of the suction port 37.

  In this embodiment, the lower surface of the board | substrate P is hold | maintained at the upper end of the support part 36 (a some pin member) by making the space 31H into a negative pressure. That is, at least a part of the holding surface 36S that holds the substrate P is defined by the upper end of the support portion 36 (a plurality of pin members).

  In the present embodiment, the second holding unit 32 has, for example, a pin chuck mechanism. The second holding part 32 is arranged so as to surround the peripheral wall part 35 on the support surface 32S of the substrate stage 2, and surrounds the peripheral wall part 38 on the support surface 32S so that the lower surface Tb of the cover member T can be opposed. And a support surface 40 that includes a plurality of pin members, and a support surface that is disposed on the support surface 32S between the peripheral wall portion 39 and the peripheral wall portion 39. And a suction port 41 for sucking fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space in at least a portion between the lower surface Tb of the cover member T. The control device 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other, whereby the peripheral wall portion 38, the peripheral wall portion 39, and the cover member T The space 32H formed by the lower surface Tb and the support surface 32S can be set to a negative pressure. Thereby, the cover member T is held by the second holding portion 32. Further, the cover member T is released from the second holding portion 32 by releasing the suction operation of the suction port 41.

  The space portion 23 includes a space around the peripheral wall portion 35. In the present embodiment, the space portion 23 includes a space between the peripheral wall portion 35 and the peripheral wall portion 38.

  As shown in FIG. 4, the substrate stage 2 includes heaters HT1 and HT2 and temperature sensors TS1 and TS2. The heater HT1 mainly heats the first holding unit 31, and a plurality (six in FIG. 4) are arranged at intervals in the circumferential direction at positions near the outer peripheral portion of the substrate P with respect to the XY plane. ing. The operation (heating / heating release) of each heater HT1 is controlled by the control device 8.

  The heater HT2 mainly heats the second holding unit 32 and is arranged in a rectangular shape along the edge of the cover member T with respect to the XY plane. The operation (heating / heating release) of each heater HT2 is controlled by the control device 8.

  The temperature sensor TS1 measures the temperature of the first holding unit 31 and outputs the measurement result to the control device 8. The temperature sensor TS1 is arranged near the central portion in the circumferential direction of each heater HT1 with respect to the XY plane. The temperature sensor TS2 measures the temperature of the second holding unit 32 and outputs the measurement result to the control device 8, and is arranged at the corner portion of the rectangular heater HT2 and the central portion of the side with respect to the XY plane. Has been.

  Next, an example of the operation of the exposure apparatus EX will be described with reference to FIGS. FIG. 5 is a diagram showing the relationship between time and temperature in the substrate stage 2.

  In order to expose the substrate P held by the first holding unit 31, the control device 8 controls the operation of the heaters HT1 and HT2 in advance based on the temperature measurement results by the temperature sensors TS1 and TS2, and performs the first holding. The temperature of the unit 31 and the second holding unit 32 is controlled to a predetermined temperature T1 (see FIG. 5). Then, the control device 8 moves the substrate stage 2 to the exposure position, and an immersion space LS is formed with the liquid LQ between the last optical element 12 and the immersion member 7 and the substrate stage 2 (substrate P). Thereafter, the control device 8 starts an exposure process for the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. As a result, the substrate P is exposed with the exposure light EL through the liquid LQ, and the pattern image of the mask M is projected onto the substrate P through the projection optical system PL and the liquid LQ.

  As shown in FIG. 4, in the present embodiment, a plurality of shot regions S that are exposure target regions are arranged on the substrate P in a matrix. The control device 8 sequentially exposes a plurality of shot areas S determined on the substrate P.

  When exposing the shot region S of the substrate P, the terminal optical element 12 and the liquid immersion member 7 and the substrate P are opposed to each other, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. When sequentially exposing the plurality of shot regions S of the substrate P, the immersion space LS is filled with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Is formed, the substrate stage 2 is moved in the XY plane by the drive system 5. In the state where the immersion space LS is formed with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2, the control device 8 While moving the stage 2, the substrate P is exposed.

  For example, in order to expose the first shot area S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to the exposure start position. The control device 8 moves the first shot region S (substrate P) in the Y-axis direction with respect to the projection region PR of the projection optical system PL while the immersion space LS is formed. The exposure light EL is irradiated to the shot area S.

  After the exposure of the first shot area S is completed, in order to expose the next second shot area S, the control device 8 moves the substrate P in the X-axis direction (with the immersion space LS formed) Alternatively, the second shot region S is moved to the exposure start position by moving in the direction inclining with respect to the X-axis direction in the XY plane. The control device 8 exposes the second shot area S in the same manner as the first shot area S.

  The control device 8 finishes the operation (scan exposure operation) of irradiating the shot region S with the exposure light EL while moving the shot region S in the Y-axis direction with respect to the projection region PR, and the exposure of the shot region S. Thereafter, while repeating the operation (stepping operation) for moving the next shot region S to the exposure start position, the plurality of shot regions S on the substrate P are transferred to the projection optical system PL and the liquid LQ in the immersion space LS. Are sequentially exposed. The exposure light EL is sequentially irradiated onto the plurality of shot regions S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P relatively move along the movement locus indicated by the arrow R1 in FIG. While exposing the projection area PR to the exposure light EL, the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL through the liquid LQ. In at least part of the movement of the substrate stage 2 in the exposure of the substrate P, the immersion space LS is formed on the gap Ga.

  At this time, the liquid LQ supplied from the liquid supply device 18 flows into the gap Ga as shown in FIG. The liquid LQ flowing into the gap Ga is sucked through the hole of the porous member 80 by the negative pressure suction force by the operation of the fluid suction device 26, and sucked and collected through the suction port 24, the hole 81H and the flow path 25. . Here, the amount of the liquid LQ flowing into the gap Ga may vary depending on, for example, the liquid repellency characteristics on the surface Pa and the side surface Pc of the substrate P.

  For example, as shown in FIG. 6, when the amount of the liquid LQ flowing into the gap Ga is smaller than the amount of the liquid LQ shown in FIG. 3, the heat of vaporization of the liquid LQ is also reduced. As shown by the graph G1, the temperature of the substrate stage 2 may become higher than the predetermined temperature T1 with the passage of time due to heat generation of the drive system 5 or the like. On the contrary, when the amount of the liquid LQ flowing into the gap Ga is large, the heat of vaporization of the liquid LQ also increases, and as shown by the graph G2 in FIG. Even if there is, there is a possibility that the temperature of the substrate stage 2 becomes lower than the predetermined temperature T1. As described above, when the temperature variation occurs in the substrate stage 2, an error occurs in the position and size of the shot region S in the substrate P due to the thermal deformation of the substrate P, or a measurement device is provided in the substrate stage 2. If it is provided, there is a possibility that the measurement accuracy is reduced and exposure failure occurs.

Therefore, in the present embodiment, the control device 8 controls the liquid supply device 50 to follow the change in the amount of the liquid flowing in through the gap Ga and the gap through the flow channel 51 as shown in FIG. A liquid is supplied to Ga (space part 23). In other words, the control device 8 supplies the liquid from the liquid supply device 50 to the gap Ga (space portion 23) via the flow path 51 so as to cancel the fluctuation in the amount of liquid flowing into the gap Ga from the immersion space LS. Supply.
Specifically, the control device 8 reduces the variation in the amount of liquid in the gap Ga by the method as described below.

(Liquid supply according to liquid recovery amount)
By the operation of the fluid suction device 26, the liquid in the gap Ga is sucked and collected, the amount of the collected liquid is detected by the first sensor, and the amount of the liquid detected by the first sensor is out of the preset range. In this case, the liquid supply device 50 supplies an amount in which the amount of the liquid detected by the first sensor falls within the set range. As a 1st sensor, the flow meter provided in the fluid suction apparatus 26 mentioned above can be illustrated, for example. In this case, the control device 8 controls the operation of the fluid suction device 26 and the operation of the liquid supply device 50 synchronously, and the amount of the liquid from the liquid supply device 50 among the liquids in the gap Ga is, for example, the immersion space. By making the amount relatively larger than the amount of liquid flowing into the gap Ga from LS, adverse effects such as foreign matters contained in the liquid from the liquid supply device 18 flowing into the gap Ga through the surface Pa of the substrate P can be suppressed.

(Liquid supply according to the temperature of the recovered liquid)
By the operation of the fluid suction device 26, the liquid in the gap Ga is sucked and collected, and the temperature of the collected liquid is detected by the second sensor, and the temperature of the liquid detected by the second sensor is out of the preset range. In such a case, the amount of liquid in the gap Ga may fluctuate and the temperature of the substrate stage 2 may fluctuate. To supply. Also in this case, the control device 8 synchronously controls the operation of the fluid suction device 26 and the operation of the liquid supply device 50 so that the amount of liquid from the liquid supply device 50 out of the liquid in the gap Ga By making the amount relatively larger than the amount of liquid flowing into the gap Ga from the space LS, adverse effects such as foreign matters contained in the liquid from the liquid supply device 18 flowing into the gap Ga through the surface Pa of the substrate P can be suppressed. . In each of the above examples, if the amount of liquid recovery (suction) by the fluid suction device 26 is constant, the amount of liquid from the liquid supply device 50 is not necessarily equal to the amount of liquid flowing into the gap Ga from the immersion space LS. It does not have to be relatively greater than the amount.

  Further, in the liquid supply by the liquid supply device 50, the heat of vaporization accompanying the evaporation of the liquid is adjusted. For example, a temperature adjusting device for adjusting the temperature of the liquid supplied by the liquid supply device 50 is provided, and the gap Ga is provided. The liquid temperature can be adjusted in a short time by adopting a configuration in which the liquid whose temperature has been adjusted to be within the set range is supplied from the liquid supply device 50. It goes without saying that the liquid supply by the liquid supply device 50 according to the temperature of the recovered liquid and the liquid supply by the liquid supply device 50 according to the liquid recovery amount described above may be used in combination.

(Liquid supply according to the temperature of the substrate stage 2)
When the measurement result of at least one of the temperature sensors TS1 and TS2 deviates from the preset range, it is estimated that the amount of liquid flowing from the immersion space LS into the gap Ga varies and the temperature variation of the substrate stage 2 occurs. it can. Therefore, the control device 8 controls the liquid supply device 50 to supply the liquid from the supply port 51a to the space portion 23 so that the temperature measured by the temperature sensors TS1 and TS2 falls within the set range.

(Liquid supply according to exposure conditions)
Depending on the exposure conditions of the substrate P, for example, even when the various sensors described above are not used, it is possible to estimate the amount of liquid flowing into the gap Ga from the immersion space LS. Therefore, it is possible to adjust the amount of liquid supplied from the liquid supply device 50 according to the exposure conditions. Examples of this type of exposure condition include the shape of the substrate P, the liquid repellency of the substrate P with respect to the liquid, and the moving condition of the substrate stage 2.

  As the shape of the substrate P, for example, when it is known that the width of the gap Ga varies depending on the roundness of the circular substrate P, the gap due to the variation in the amount of liquid flowing into the gap Ga estimated in advance is used. The liquid is supplied from the liquid supply apparatus 50 by the method described above so as to reduce the fluctuation of the liquid amount in Ga. Similarly, with respect to the liquid repellency of the substrate P with respect to the liquid, if the liquid repellency varies, the amount of liquid flowing into the gap Ga varies. For this reason, when the variation degree of the liquid repellency of the substrate P is known, the above-described change is made so as to reduce the fluctuation in the liquid amount in the gap Ga due to the fluctuation in the amount of liquid flowing into the gap Ga that is estimated in advance. The liquid may be supplied from the liquid supply device 50 by a method.

  As for the movement conditions of the substrate stage 2, as described above, the substrate stage 2 moves so that the immersion space LS straddles the gap Ga, and the substrate stage 2 moves without straddling the gap Ga. In this case, the amount of liquid flowing into the gap Ga may vary. In this case, the control device 8 reduces the fluctuation in the liquid amount in the gap Ga due to the fluctuation in the amount of liquid flowing into the gap Ga that is estimated in advance based on the distribution of the shot areas S and the exposure order that are set in advance. In addition, the liquid may be supplied from the liquid supply device 50 by the method described above. For example, when the exposure process is performed in a state where the immersion space LS straddles the gap Ga, the amount of liquid supplied from the liquid supply device 50 is reduced (or the liquid supply is stopped), and the immersion space LS is not in the gap. When the exposure process is performed without straddling Ga, the supply amount may be adjusted so as to increase the amount of liquid supplied from the liquid supply device 50.

  The timing for supplying the liquid from the liquid supply apparatus 50 described above can be performed for each substrate P, for example. In this case, by supplying the liquid before or after the exposure processing for the substrate P, it is possible to eliminate adverse effects such as vibrations when it is performed during the exposure processing. Further, every time a predetermined number of substrates P are exposed, the amount of liquid flowing from the liquid supply device 18 into the gap Ga varies by adjusting the amount of liquid supplied from the liquid supply device 50. The fluctuation of the amount of liquid in the gap Ga can be managed with higher accuracy. Alternatively, the liquid supply amount from the liquid supply apparatus 50 may be changed so as to suppress the fluctuation when the above-described fluctuation occurs while always supplying a constant amount of liquid from the liquid supply apparatus 50.

  As described above, in this embodiment, by supplying the liquid from the liquid supply device 50 to the gap Ga, the roller that suppresses the temperature fluctuation generated in the substrate stage 2 due to the fluctuation of the amount of the liquid in the gap Ga. it can. Therefore, in the present embodiment, it is possible to suppress the occurrence of exposure failure accompanying the temperature variation of the substrate stage 2.

Second Embodiment
Next, a second embodiment of the exposure apparatus EX will be described.
In the second embodiment, the liquid supply amount from the liquid supply device 50 is adjusted based on the liquid recovery amount of the liquid recovery device 21.

  The liquid recovery device 21 includes a flow meter that measures the amount of liquid recovered from the immersion space LS by the liquid immersion member 7. The value of the flow meter of the liquid recovery device 21 varies depending on the amount of liquid flowing into the gap Ga from the immersion space LS. That is, when the liquid recovery amount measured by the flow meter of the liquid recovery device 21 increases, it can be estimated that the amount of liquid flowing into the gap Ga from the immersion space LS has decreased.

Therefore, in the present embodiment, for example, when the value of the flow meter of the liquid recovery device 21 increases, control is performed so that the supply of the liquid from the liquid supply device 50 to the space portion 23 is started. Note that when a constant amount of liquid is constantly supplied from the liquid supply device 50, the supply amount may be increased.
Thereby, the quantity of the fluid (liquid) attracted | sucked to the fluid suction apparatus 26 from the space part 23 can be adjusted, and the fluctuation | variation of the vaporization heat mentioned above can be suppressed.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the configuration in which the temperature of the substrate stage 2 is adjusted by adjusting the amount of the liquid in the gap Ga is described, but the present invention is not limited to this, and the above-described liquid supply process, It is good also as a structure which adjusts the temperature of the substrate stage 2 combining the heat processing by the heaters HT1 and HT2.

  Further, when the substrate is not exposed, the cleaning liquid may be supplied from the supply port 51a of the liquid supply device 50. As a result, the porous member 80 and the space 23 can be cleaned. The cleaning liquid may include at least one of ethanol, isopropyl alcohol (IPA), and pentanol, for example. Alternatively, the cleaning liquid may include an alkaline liquid such as tetramethyl ammonium hydroxide (TMAH). An acidic liquid may be used as the cleaning liquid. For example, the liquid LC may contain hydrogen peroxide. For example, an aqueous hydrogen peroxide solution (hydrogen peroxide solution) may be used as the liquid LC.

Moreover, in the said embodiment, although the structure formed between the board | substrate P and the cover member T as gap Ga was illustrated, it is not limited to this, For example, as shown in FIG. A scale member (measurement member) GT is provided as a member with a gap Gm around the cover member T as an object, and an encoder system is used that measures the position of the substrate stage 2 using the scale member GT. In addition, the amount of the liquid LQ remaining in the gap Gm can be adjusted in the same manner as in the above embodiment. In this case, the gap Gm is formed between the edge portion Egg of the scale member GT and the edge portion Eg of the cover member T.
Such an encoder system is disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  In addition to the substrate stage 2, as shown in FIG. 7, in the measurement stage 3, a gap Gn formed between the measurement member (measuring instrument) C for measuring the exposure light EL and the cover member Q. It is also possible to adjust the amount of the liquid LQ remaining in the same manner as in the above embodiment. In this case, the gap Gn is formed between the edge portion Egq of the cover member Q and the edge portion Egc of the measurement member C. Further, when the transition from the exposure process to the measurement process or the transition from the measurement process to the exposure process, the immersion space LS is on the substrate stage 2 while maintaining the state in which the substrate stage 2 and the measurement stage 3 are close to each other. When moving relative to the measurement stage 3, the liquid LQ remaining in the gap between the substrate stage 2 and the measurement stage 3 can be adjusted in the same manner as in the above embodiment.

  In each of the above-described embodiments, the optical path K on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the 2004/019128 pamphlet, the optical path on the incident side (object plane side) of the last optical element 12 may also be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the exposure liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices. For example, as shown in FIG. 8, the exposure apparatus EX may include two substrate stages 2001 and 2002. In that case, the object that can be arranged so as to face the emission surface 13 is one of the substrate stages, the substrate held on the one substrate stage, the other substrate stage, and the substrate held on the other substrate stage. Including at least one.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage (stage), 8 ... Control apparatus, 12 ... Terminal optical element (optical member), 13 ... Ejection surface, 18 ... Liquid supply apparatus (1st liquid supply apparatus), 31 ... 1st holding part, 32 ... Second holding unit 50 ... Liquid supply device (second liquid supply device), 51a ... Supply port, 80 ... Porous member, DP ... Dummy substrate (second object, second liquid supply device), EL ... Exposure light, EX: exposure apparatus, Ga, Gm, Gn: gap (gap), GT: scale member (member, measuring member), LQ: liquid, LS: immersion space, P: substrate (object), S: shot area (exposure) Area), T ... cover member (member, defining member)

Claims (36)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
A stage having an object that can be opposed to the exit surface and a member that is disposed through a gap and is movable under the optical member;
A first liquid supply device for supplying a liquid between the object and the optical member;
An exposure apparatus comprising: a second liquid supply device that is at least partially disposed on the stage and supplies a liquid to the gap. The liquid supply device supplies the liquid to the gap so as to reduce fluctuations in the amount of liquid in the gap including the liquid supplied from the first liquid supply device and flowing into the gap. The exposure apparatus described. 3. The exposure apparatus according to claim 1, wherein the second liquid supply apparatus supplies the liquid so as to cancel the fluctuation of the amount of the liquid flowing into the gap among the liquids supplied from the first liquid supply apparatus. . 3. The exposure according to claim 1, wherein the second liquid supply device supplies the liquid to the gap such that the amount of liquid from the second liquid supply device among the liquid in the gap is relatively large. apparatus. A liquid recovery device for recovering the liquid in the gap;
The exposure apparatus according to claim 1, wherein the second liquid supply apparatus adjusts an amount of liquid supplied to the gap based on the liquid recovered by the liquid recovery apparatus. A first sensor for detecting the amount of liquid recovered by the liquid recovery device;
The exposure apparatus according to claim 5, wherein the second liquid supply apparatus adjusts an amount of liquid supplied to the gap according to a detection result of the first sensor. The exposure apparatus according to claim 6, wherein the second liquid supply device adjusts the amount of liquid supplied to the gap when the amount of liquid detected by the first sensor is out of a preset range. A second sensor for detecting the temperature of the liquid recovered by the liquid recovery device;
The exposure apparatus according to claim 5, wherein the second liquid supply apparatus adjusts an amount of liquid supplied to the gap according to a detection result of the second sensor. The exposure apparatus according to claim 8, wherein the second liquid supply apparatus adjusts the amount of liquid supplied to the gap when the temperature of the liquid detected by the second sensor is out of a preset range. The exposure apparatus according to any one of claims 1 to 9, wherein the second liquid supply apparatus adjusts an amount of liquid supplied to the gap every time a predetermined number of the substrates are exposed. The exposure apparatus according to claim 1, further comprising: a control device that controls an amount of liquid supplied to the gap by the second liquid supply device. The exposure apparatus according to claim 11, wherein the control device controls the second liquid supply device based on the liquid collected from the gap. The exposure apparatus according to claim 11, wherein the control device controls the second liquid supply device based on a result of detecting the temperature of the stage. The control device controls the second liquid supply device based on an estimation result obtained by estimating an amount of liquid supplied from the first liquid supply device and flowing into the gap. The exposure apparatus according to item. The exposure apparatus according to claim 11, wherein the control apparatus controls the second liquid supply apparatus based on an exposure condition of the substrate. The exposure apparatus according to claim 15, wherein the exposure conditions for the substrate include at least one of a shape of the substrate and liquid repellency with respect to the liquid. The exposure apparatus according to claim 15, wherein the exposure condition of the substrate includes a movement condition of the stage. The exposure apparatus according to claim 17, wherein the moving condition of the stage is set according to a distribution of an exposure area on the substrate. The exposure apparatus according to any one of claims 1 to 18, wherein the second liquid supply apparatus supplies a liquid to the gap in at least a part of the exposure of the substrate. The exposure apparatus according to claim 1, wherein the second liquid supply apparatus supplies a liquid to the gap at least one of before and after exposure of the substrate. The stage moves at least partially while holding the substrate so that the liquid supplied from the first liquid supply device straddles the gap. Exposure equipment. The stage includes a first holding unit that holds the object, and a second holding unit that holds the member.
The exposure apparatus according to any one of claims 1 to 21, wherein the gap includes at least a part of a space between the first holding unit and the second holding unit. The stage includes a porous member disposed in the gap,
The exposure apparatus according to claim 22, wherein the liquid supplied by the second liquid supply apparatus is in contact with the porous member. The exposure apparatus according to any one of claims 1 to 23, wherein the second liquid supply apparatus supplies the liquid to the gap through a supply port provided in the stage so as to face the gap. The object includes the substrate;
The second liquid supply device adjusts an amount of liquid flowing into the gap among liquids supplied from the first liquid supply device by arranging a second object on the stage instead of the substrate. The exposure apparatus according to any one of claims 1 to 23. The exposure apparatus according to claim 25, wherein an interval between the second object arranged on the stage and the member is different from an interval between the substrate held on the stage and the member. The liquid repellency between the liquid and the portion adjacent to the gap in the second object disposed on the stage is determined between the portion of the substrate held on the stage and the liquid adjacent to the gap. 27. The exposure apparatus according to claim 25 or 26, which is different from liquid repellency. The shape of the portion adjacent to the gap in the second object arranged on the stage is different from the shape of the portion adjacent to the gap in the substrate held on the stage. An exposure apparatus according to claim 1. The object includes the substrate;
The exposure apparatus according to any one of claims 1 to 28, wherein the member includes a defining member that defines a position where the stage holds the substrate. The exposure apparatus according to any one of claims 1 to 28, wherein the object includes a defining member that defines a position where the stage holds the substrate. The exposure apparatus according to claim 30, wherein the member includes a measurement member for measuring the stage. 32. The exposure apparatus according to claim 30 or 31, wherein the member includes a measurement member for measuring the exposure light. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 32;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Supplying a liquid by a first liquid supply device between an optical member having an emission surface from which the exposure light is emitted and a substrate facing the optical member;
Disposing a member through an object and a gap that can face the emission surface, and moving the member and the substrate;
Exposing the substrate through a liquid between the moving substrate and the optical member;
Supplying a liquid to the gap by a second liquid supply device at least partially disposed on the stage;
An exposure method comprising:   The second liquid supply device supplies the liquid to the gap so as to reduce fluctuations in the amount of liquid in the gap including the liquid that is supplied between the optical member and the substrate and flows into the gap. The exposure method according to claim 34. Exposing the substrate using the exposure method of claim 34 or 35;
Developing the exposed substrate. A device manufacturing method.

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