JP2014056885A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which enables easy control of a viscous member having heat conductivity.SOLUTION: An electronic component 1 according to one embodiment of this invention includes: a semiconductor module 2; a heat radiation member 3 which transmits heat of the semiconductor module 2; an insulation member 4 disposed between the semiconductor module 2 and the heat radiation member 3; a viscous member 5 which is disposed between the semiconductor module 2 and the insulation member 4 or between the insulation member 4 and the heat radiation member 3 and has heat conductivity; and a recessed part 6 in which the viscous member 5 is housed.

Description

  The present invention relates to an electronic component, for example, an electronic component that dissipates heat by transmitting heat of a semiconductor module to a heat dissipation member via a viscous member.

  An electronic component having a semiconductor module is configured to be able to dissipate heat from the semiconductor module in order to prevent performance degradation of the semiconductor module.

  For example, in the power conversion device of Patent Document 1, as shown in FIG. 4, a gel grease 104 having thermal conductivity is disposed between an insulating plate 102 and a heat radiating plate 103 joined to a semiconductor module 101, and the semiconductor module The heat of 101 is transmitted to the heat radiating plate 103 via the gel grease 104 to radiate heat.

  Here, if the thickness of the gel grease 104 is large, it becomes a thermal resistance and hinders the cooling performance. Therefore, after the gel grease 104 is disposed between the insulating plate 102 and the heat radiating plate 103, the insulating plate 102 and the heat radiating plate 103 are pressed so as to sandwich the gel grease 104, thereby thinning the gel grease 104 and The grease 104 is spread between the insulating plate 102 and the heat radiating plate 103.

JP 2007-236120 A

  However, it is difficult to control the spreading characteristics of the gel grease 104. For example, as shown in the areas A1 and A2 in FIG. 4, the gel grease 104 protrudes to cause a short circuit between the terminals 105, or in the area A3 in FIG. As described above, the gel grease 104 does not reach the corners of the insulating plate 102, so that good heat radiation characteristics cannot be ensured.

  The present invention has been made to solve such problems, and an object of the present invention is to provide an electronic component in which a viscous member having thermal conductivity can be easily controlled.

  An electronic component according to an aspect of the present invention includes a semiconductor module, a heat radiating member to which heat of the semiconductor module is transmitted, an insulating member disposed between the semiconductor module and the heat radiating member, and the semiconductor module. A viscous member having thermal conductivity and disposed between the insulating member or between the insulating member and the heat radiating member, and a recess in which the viscous member is accommodated.

  In the above-described electronic component, the concave portion is a surface of the semiconductor module facing the insulating member, a surface of the insulating member facing the semiconductor module, a surface of the insulating member facing the heat dissipation member, or the heat dissipation member. Preferably, the insulating member is formed on a surface facing the insulating member, the viscous member is sandwiched between the facing members, and the facing member is pressed to be assembled.

  In the above-described electronic component, it is preferable that the depth of the concave portion is deeper at least at the center or substantially at the center than at the outside.

  In the above-described electronic component, it is preferable that the concave portion has a planar area substantially equal to the main surface of the semiconductor module.

  In the above-described electronic component, the depth of the deepest portion of the concave portion is approximately 1/3 or more of the total thickness of the viscous member, excluding the thickness in the concave portion, The thickness is preferably equal to or less than the total thickness excluding the thickness in the recess.

  In the electronic component described above, it is preferable that the viscous member is a heat dissipating grease.

  As described above, according to the present invention, it is possible to provide an electronic component in which a viscous member having thermal conductivity can be easily controlled.

1 is a perspective view schematically showing an electronic component according to an embodiment of the present invention. It is a figure for demonstrating the shape of the recessed part in the electronic component which concerns on embodiment of this invention. It is a figure for demonstrating the formation procedure of a recessed part. It is a perspective view which shows the conventional power converter device schematically.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. However, the present invention is not limited to the following embodiment. In addition, for clarity of explanation, the following description and drawings are simplified as appropriate.

  First, a basic configuration of the electronic component 1 according to the present embodiment will be described. FIG. 1 schematically shows an electronic component 1 according to the present embodiment. As shown in FIG. 1, the electronic component 1 of the present embodiment includes a semiconductor module 2, a heat radiating member 3, an insulating member 4, and a viscous member 5. The semiconductor module 2 is a so-called power card including, for example, a MOS FET element, an IGBT element, and the like, and includes a main electrode terminal 21 and a signal terminal 22.

  The heat radiating member 3 radiates heat transmitted from the semiconductor module 2. The heat dissipating member 3 is disposed so as to face at least one main surface of the semiconductor module 2 (a surface disposed in a direction orthogonal to the paper surface). The heat radiating member 3 is, for example, a heat exchanger that can circulate a cooling medium inside a heat sink, and includes a planar region that covers the entire main surface of the semiconductor module 2. However, the heat dissipation member 3 is not particularly limited as long as the semiconductor module 2 can be cooled satisfactorily.

  The insulating member 4 is disposed between the semiconductor module 2 and the heat radiating member 3. The insulating member 4 is a ceramic plate, for example, and includes a planar region that covers the entire main surface of the semiconductor module 2. However, the insulating member 4 is not particularly limited as long as it is a member that can satisfactorily insulate between the semiconductor module 2 and the heat dissipation member 3.

  The viscous member 5 transmits the heat of the semiconductor module 2 to the insulating member 4 and the heat radiating member 3. The viscous member 5 is a member having thermal conductivity such as a heat radiation grease. The viscous member 5 of the present embodiment is disposed between the semiconductor module 2 and the insulating member 4 and between the insulating member 4 and the heat dissipation member 3. However, when the semiconductor module 2 and the insulating member 4 are integrated, the viscous member 5 between the semiconductor module 2 and the insulating member 4 is omitted, and the insulating member 4 and the heat dissipation member 3 are integrated. If it is, the viscous member 5 between the insulating member 4 and the heat radiating member 3 is omitted.

  In the electronic component 1 having such a configuration, for example, the viscous member 5 is disposed between the semiconductor module 2 and the insulating member 4 and between the insulating member 4 and the heat radiating member 3. The viscous member 5 is spread between the semiconductor module 2 and the insulating member 4 and between the insulating member 4 and the heat radiating member 3 by pressing and expanding the viscous member 5. However, as described above, the viscous member 5 may protrude from the periphery of the electronic component 1 when the semiconductor module 2 and the heat dissipation member 3 are pressed.

  Therefore, the electronic component 1 according to the present embodiment includes a recess 6 that accommodates the viscous member 5 as shown in FIG.

  Next, the recess 6 will be described in detail. A viscous member 5 is accommodated in the recess 6. The recess 6 is a surface facing the insulating member 4 in the semiconductor module 2 (one main surface in the present embodiment), a surface facing the semiconductor module 2 in the insulating member 4, a surface facing the heat radiation member 3 in the insulating member 4, or The heat radiating member 3 is formed on the surface facing the insulating member 4.

  In the present embodiment, a concave portion (not shown) that accommodates a viscous member disposed between the semiconductor module 2 and the insulating member 4, and a viscous member 5 disposed between the insulating member 4 and the heat radiating member 3. And the recess 6 shown in FIG. 1 is formed on the surface of the heat dissipating member 3 facing the insulating member 4.

  Thereby, when the semiconductor module 2 and the heat radiating member 3 are pressed, it is unlikely that the viscous member 5 in the recess 6 protrudes from the periphery of the electronic component 1, and the viscous member does not protrude from the periphery of the electronic component 1. The viscous member 5 does not need to be expanded by delicate pressure control, and the viscous member 5 can be easily controlled. Moreover, since the sticking out of the periphery of the electronic component 1 in the viscous member 5 can be prevented, a short circuit between the main electrode terminals 21 can be prevented.

  FIG. 2 is a diagram for explaining the shape of the recess 6 and shows the positional relationship with the semiconductor module 2. As shown in FIG. 2, it is preferable that the depth D of the recess 6 is deeper at least at the center or substantially at the center than at the outside. In other words, it is preferable that the depth D of the recess 6 is formed so as to become shallower from the approximate center toward the outside. The recessed part 6 of this Embodiment is made into the shape where the cross sectional view curved. When the semiconductor module 2 and the heat radiating member 3 are pressed, the viscous member 5 becomes a small amount as it is expanded outward. However, since the depth D of the concave portion 6 becomes shallower outward, the viscous member 5 is Thus, the viscous member 5 can be spread to the corners of the recess 6. The depth D of the concave portion 6 does not necessarily need to be intermittently shallow toward the outside, and may be formed so as to become shallow toward the outside on average.

  Moreover, it is preferable that the recess 6 has a planar area substantially equal to the main surface of the semiconductor module 2. As shown in FIGS. 1 and 2, the recess 6 of the present embodiment includes a rectangular planar region substantially equal to the main surface of the semiconductor module 2. Thereby, the heat of the semiconductor module 2 can be efficiently transmitted to the insulating member 4 and the heat radiating member 3.

  Further, the depth D of the deepest portion of the recess 6 is approximately 1/3 or more of the thickness of the entire viscous member 5 excluding the thickness in the recess 6, and the entire thickness of the viscous member 5. It is preferable that it is below the thickness except the thickness in the recessed part 6 from. Thereby, the thickness of the viscous member 5 is not increased more than necessary, and the thermal resistance can be suppressed. However, the depth D of the recess 6 can be appropriately set in consideration of thermal resistance and the like.

  Next, the formation procedure of the recessed part 6 of this Embodiment is demonstrated. FIG. 3 schematically shows the positional relationship between the virtual semiconductor module 2, the recess 6 to be formed, and the locus of the cutting tool 7. As shown in FIG. 3, for example, when the recess 6 is formed on the surface of the heat dissipation member 3 facing the insulating member 4 using the cutting tool 7, the cutting tool 7 is moved along the periphery of the virtual semiconductor module 2. . At this time, the cutting speed at the outside is faster than the cutting speed at the center of rotation of the cutting tool 7, and the processing time at the outside is longer than the processing time at the center of rotation of the cutting tool 7 on the trajectory. For these reasons, the center cutting selectively proceeds and deepens. Thereby, the recessed part 6 which becomes shallow outward from the approximate center can be formed easily.

  In the electronic component 1 having such a configuration, a viscous member is first disposed in a recess (not shown) formed in the semiconductor module 2 or the insulating member 4, and the semiconductor module 2 and the insulating member 4 are connected via the viscous member. Laminate. Further, the viscous member 5 is disposed in the recess 6 formed on the surface of the heat radiating member 3 facing the insulating member 4, and the insulating member 4 and the heat radiating member 3 are laminated via the viscous member 5. Then, the semiconductor module 2 and the heat dissipation member 3 are pressed. As a result, the semiconductor module 2, the insulating member 4, and the heat radiating member 3 are adhered via the viscous member. At this time, the viscous member 5 is well expanded in the recess 6 as described above and spreads to the corner of the recess 6, and the protrusion of the viscous member 5 from the periphery of the electronic component 1 is suppressed by the inner peripheral wall of the recess 6. Is done.

  The embodiment of the electronic component according to the present invention has been described above. However, the present invention is not limited to the above, and can be changed without departing from the technical idea of the present invention.

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Semiconductor module, 21 Main electrode terminal, 22 Signal terminal 3 Heat radiating member 4 Insulating member 5 Viscous member 6 Recessed part 7 Cutting tool 101 Semiconductor module 102 Insulating plate 103 Heat sink 104 Gel grease 105 Terminal

Claims (6)

A semiconductor module;
A heat dissipating member to which heat of the semiconductor module is transmitted;
An insulating member disposed between the semiconductor module and the heat dissipation member;
A viscous member disposed between the semiconductor module and the insulating member or between the insulating member and the heat dissipating member and having thermal conductivity;
A recess in which the viscous member is accommodated;
With electronic components. The concave portion is a surface facing the insulating member in the semiconductor module, a surface facing the semiconductor module in the insulating member, a surface facing the heat radiating member in the insulating member, or a surface facing the insulating member in the heat radiating member. Is formed,
The electronic component according to claim 1, wherein the electronic member is assembled by sandwiching the viscous member between opposing members and pressing the opposing members.   The depth of the said recessed part is an electronic component of Claim 1 or 2 in which the direction of the center or substantially center is deeper than outward.   4. The electronic component according to claim 1, wherein the recess includes a planar region substantially equal to a main surface of the semiconductor module.   The depth of the deepest portion of the concave portion is approximately 1/3 or more of the total thickness of the viscous member, excluding the thickness in the concave portion, and from the total thickness of the viscous member, 5. The electronic component according to claim 1, wherein the thickness is equal to or less than a thickness excluding a thickness in the recess.   The electronic component according to claim 1, wherein the viscous member is a heat dissipating grease.

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