JP2014055818A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve inspection efficiency for substrate inspection.SOLUTION: A substrate inspection device comprises: probe units 2a, 2b having a plurality of probes supported by a supporting unit and composed to have respective tip units of respective probes coming into respective contact with respective contact positions of a substrate 100; movement mechanisms 3a, 3b for executing movement processing for moving the probe units 2a, 2b toward the substrate 100; an inspection unit 6 for inspecting the substrate 100 based on electric signals inputted through the probes; and a processing unit 8 for executing a detection process for detecting a deformed state of the substrate 100. In this case, the inspection unit 6 discriminates whether or not respective tip units and respective contact positions are in contact while the movement process is executed by the movement mechanisms 3a, 3b and the processing unit 8 executes a detection processing based on the amount of movement of the probe unit 2a up to the point when respective tip units and respective contact positions are discriminated to be in contact by the inspection unit 6 and a mutual differential value from the supporting unit to respective projection length of respective tip units.

Description

  The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting a substrate using a probe unit having a plurality of probes.

  As this type of board inspection apparatus, a circuit board inspection apparatus disclosed in Japanese Patent Application Laid-Open No. 2011-145136 is known. This circuit board inspection apparatus includes a set base, a pin board, a drive unit, and the like, and is configured to be able to inspect a circuit board. The pin board is provided with a plurality of contact probes, and each contact probe is brought into contact with the circuit board at the time of inspection. The contact probe includes a plunger that comes into contact with the conductive portion of the substrate to be inspected, a barrel into which the plunger is inserted, and an elastic member that is disposed in the barrel and presses the plunger. On the plunger, a marking that is hidden in the barrel when the protruding amount (stroke) of the tip from the barrel is 2/3 of the maximum protruding amount (full stroke) is formed by applying a phosphorescent paint. In addition, a light receiving amount sensor that detects light emitted from the luminous paint of the plunger is provided on the upper surface of the set base. In this circuit board inspection device, the protrusion amount (stroke) of the plunger is determined based on the detection of light by the received light amount sensor, and the pin board is moved by the drive unit so that the protrusion amount becomes an appropriate protrusion amount. Thus, even when the protruding amount of the plunger differs (varies) for each contact probe, each contact probe can be brought into contact with the circuit board.

JP 2011-145136 A (page 8-10, FIG. 1-5)

  However, the conventional circuit board inspection apparatus has the following problems. That is, in this type of circuit board inspection apparatus, it is possible to perform an electrical inspection of a circuit board by bringing a plurality of contact probes into contact with conductive portions of the circuit board. On the other hand, the circuit board may be deformed such as warping or bending due to internal stress of the material or external force applied in the manufacturing process. In such a circuit board having a large deformation, even if the electrical inspection is passed, there is a possibility that a mounting failure may occur when the circuit board is incorporated into a product. However, since the conventional circuit board inspection apparatus does not have a function of detecting the deformation of the circuit board, generally, before or after the electrical inspection by the circuit board inspection apparatus, a human visual inspection or Deformation inspection using other devices is performed, and circuit boards with large deformation are selected and eliminated. As described above, in the inspection using the circuit board inspection apparatus, it is difficult to improve the inspection efficiency because the deformation of the circuit board cannot be detected.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method that can improve the inspection efficiency of substrate inspection.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1 has a plurality of probes supported by a support portion, and each of the probes has a contact position corresponding to each of the probes on the substrate to be inspected. A probe unit configured such that tip portions thereof are in contact with each other, a moving mechanism for performing a moving process for relatively moving either the probe unit or the substrate toward the other, and an input via the probe A substrate inspection apparatus including an inspection unit that inspects the substrate based on the electrical signal, and includes a processing unit that performs a detection process of detecting a deformation state of the substrate, the inspection unit including the moving mechanism In the state where the movement process is executed by the above, whether or not each tip portion and each contact position are in contact is input via each probe. Based on the electrical signal, the processing unit determines the relative movement amount by the moving mechanism until the inspection unit determines that the tip portion and the contact position are in contact with each other. And the detection process based on each projection length of each tip from the support and at least one of the difference values between the projection lengths.

  The substrate inspection apparatus according to claim 2 is the substrate inspection apparatus according to claim 1, wherein the inspection unit is configured such that one of the probe unit and the conductive flat plate faces toward the other by the moving mechanism. In the state of being moved automatically, it is determined based on the electrical signal input through the probes whether or not the tip portions and the flat plate are in contact with each other. The at least one value used in the detection process is specified based on the relative moving amount by the moving mechanism until it is determined that the tip portion and the flat plate are in contact with each other.

  Furthermore, the substrate inspection method according to claim 3 has a plurality of probes supported by a support portion, and each tip portion of each probe is in a contact position associated with each probe on a substrate to be inspected. A substrate that inspects the substrate based on an electrical signal that is input through the probe, by performing a movement process that relatively moves either the probe unit configured to contact or the substrate toward the other. In the inspection method, in the state in which the movement process is being performed, it is determined based on the electrical signal input through the probes whether or not the tip portions are in contact with the contact positions. And the relative amount of movement until it is determined that the respective front end portions and the respective contact positions are in contact with each other, the respective projection lengths of the respective front end portions from the support portion, and It performs the detection process of detecting the deformation state of the substrate based on at least one value of difference values between mutually respective projection length.

  Furthermore, the substrate inspection method according to claim 4 is the substrate inspection method according to claim 3, wherein either one of the probe unit and the conductive flat plate is relatively moved toward the other. When determining whether or not each tip and the flat plate are in contact with each other based on the electric signal input through the probes and determining that the tip and the flat plate are in contact The at least one value used in the detection process is specified based on the relative movement amount until.

  4. The substrate inspection apparatus according to claim 1, and the substrate inspection method according to claim 3, wherein each tip is in a state in which a movement process of relatively moving one of the probe unit and the substrate toward the other is executed. At least one of the relative movement amount until it is determined that the contact portion and each contact position are in contact with each other, the projection length of each tip from the support portion, and the difference value between each projection length Based on the above, a detection process for detecting the deformation state of the substrate is executed. That is, with this substrate inspection apparatus and substrate inspection method, it is possible to detect the deformation state of the substrate at the time of execution of movement processing, for example, when performing electrical inspection on the substrate to be inspected. Therefore, according to the substrate inspection apparatus and the substrate inspection method, it is not necessary to perform the inspection of the deformation state of the substrate separately from the electrical inspection of the substrate, so that the inspection efficiency can be sufficiently improved accordingly. .

  Moreover, in the board | substrate inspection apparatus of Claim 2, and the board | substrate inspection method of Claim 4, in the state which moved relatively either one of a probe unit and the electrically conductive flat plate toward the other, Values used in the detection process based on the relative amount of movement until it is determined that the tip and the flat plate are in contact (each protrusion length of each tip from the support part and the difference between each protrusion length) At least one of the values). Therefore, according to the substrate inspection apparatus and the substrate inspection method, the probe unit set in the other device is removed as compared with the configuration and method in which the processing for specifying the value used in the detection process is performed using the other device. Thus, the work of resetting the substrate inspection apparatus (the trouble of replacing the probe unit) can be omitted, so that the inspection efficiency can be further improved accordingly.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 2 is a configuration diagram showing a configuration of a probe unit 2. FIG. It is the 1st explanatory view explaining the substrate inspection method using substrate inspection device 1. It is the 2nd explanatory view explaining the substrate inspection method using substrate inspection device 1. It is the 3rd explanatory view explaining the substrate inspection method using substrate inspection device 1.

  Embodiments of a substrate inspection apparatus and a substrate inspection method according to the present invention will be described below with reference to the drawings.

  First, the configuration of the substrate inspection apparatus 1 will be described. As shown in FIG. 1, the substrate inspection apparatus 1 shown in FIG. 1 includes probe units 2a and 2b (hereinafter also referred to as “probe unit 2” when not distinguished) and moving mechanisms 3a and 3b (hereinafter referred to as “move” when not distinguished). Also referred to as “mechanism 3”), a fixed base 4, a measurement unit 5, an inspection unit 6, a storage unit 7 and a processing unit 8, and is configured to be able to inspect the substrate 100 according to a substrate inspection method described later. In this case, in this board | substrate inspection apparatus 1, the 1st test | inspection which test | inspects the presence or absence of deformation | transformation of the board | substrate 100, such as a curvature and a curvature, and the 2nd test | inspection which electrically test | inspects the quality of the board | substrate 100 are performed.

  As an example, the probe unit 2 includes a support portion 11, a plurality of probes 12, and an electrode plate 13, as shown in FIG.

  As shown in FIG. 2, the support unit 11 includes, for example, a first support plate 31, a second support plate 32, and a connecting unit 33, and is configured to support the probe 12. The first support plate 31 is a member that supports the distal end portion 21 side of the probe 12 and is formed in a plate shape from a non-conductive resin material or the like. The first support plate 31 has a plurality of insertion holes. In this case, the insertion hole allows the insertion of the distal end portion 21 of the probe 12 and has a size capable of restricting the insertion of the central portion 22 of the probe 12, that is, its diameter is larger than the diameter of the distal end portion 21. In addition, the diameter is smaller than the diameter of the central portion 22.

  The second support plate 32 is a member that supports the proximal end portion 23 side of the probe 12 and is formed in a plate shape from a non-conductive resin material or the like. The second support plate 32 has a plurality of insertion holes. In this case, the insertion hole is formed so that the center portion 22 of the probe 12 can be inserted, that is, the diameter thereof is larger than the diameter of the center portion 22.

  As shown in FIG. 2, the connecting portion 33 connects the first support plate 31 and the second support plate 32 in a parallel state.

  The probe 12 is used to input and output an electrical signal by bringing the tip 21 into contact with the conductor 101 (corresponding to the contact position: see FIG. 4) of the substrate 100 at the time of inspection. It is formed in a rod shape that can be elastically deformed by a metal material having a metal (for example, beryllium copper alloy, SKH (high speed tool steel), tungsten steel, etc.). Further, as shown in FIG. 2, the distal end portion 21 and the proximal end portion 23 of the probe 12 are each formed sharply. An insulating layer is formed on the peripheral surface of the central portion 22 of the probe 12. For this reason, the diameter of the central portion 22 is larger than the diameter of the distal end portion 21 and the diameter of the proximal end portion 23.

  In the probe unit 2, the probe 12 is in a state where the distal end portion 21 is inserted through the insertion hole of the support plate 31 and the proximal end portion 23 is inserted through the insertion hole of the second support plate 32 as shown in FIG. 2. It is supported by the support part 11. Further, as shown in the figure, the probe 12 is supported by the support portion 11 in a state where the central portion 22 is slightly curved in the initial state. In this case, when the probe unit 2 is moved as a whole in a direction approaching the substrate 100, the tip 21 comes into contact with the conductor portion 101 of the substrate 100, and the probe 12 from the conductor portion 101 applied at this time The amount of bending of the central portion 22 increases or decreases according to the pressing force (reaction force), thereby causing the protrusion length of the tip portion 21 from the support portion 11 (first support plate 31) (hereinafter simply referred to as “the protrusion length of the tip portion 21”). Is also changed (increased or decreased).

  In the probe unit 2, as shown in FIG. 4, each probe 12 is arranged such that the tip 21 of each probe 12 comes into contact with the contact position (conductor portion 101) of the substrate 100 associated with each probe 12. The arrangement position is defined.

  The electrode plate 13 is formed in a plate shape from a non-conductive resin material or the like, and is disposed on the upper portion of the second support plate 32 of the support portion 11 as shown in FIG. In addition, a terminal having conductivity is fitted into a contact portion of each electrode 12 on the electrode plate 13 with each base end portion 23, and the probe 12 and the measurement unit 5 are electrically connected to each terminal. Cables not shown for connection are connected to each other.

  The moving mechanism 3 includes an attachment portion (not shown) for attaching the probe unit 2, and the probe unit 2 is fixed to the fixed base 4 (the substrate 100 placed on the fixed base 4) according to the control of the processing portion 8. A moving process is performed in which the robot moves in a direction toward and away from. In this case, the moving mechanism 3 a moves the probe unit 2 a in the direction in contact with the substrate 100 from above the fixed base 4 to bring the probe 12 into contact with the upper surface 100 a of the substrate 100. Further, the moving mechanism 3 b moves the probe unit 2 b from below the fixed base 4 in a direction in contact with the substrate 100 to bring the probe 12 into contact with the lower surface 100 b of the substrate 100.

  The fixed base 4 is configured so that the substrate 100 can be fixedly placed thereon. Further, as shown in FIG. 1, the fixed base 4 has openings 4a for bringing the probes 12 of the probe units 2a and 2b into contact with both the upper surface and the lower surface of the substrate 100 from both above and below. Is provided. The measurement unit 5 measures the resistance value Rm based on an electric signal input / output via the probe 12 according to the control of the processing unit 8.

  The inspection unit 6 determines whether the substrate 100 is good or bad (whether the conductor unit 101 is broken or short-circuited) from the resistance value Rm measured by the measurement unit 5 based on the electrical signal input through the probe 12 according to the control of the processing unit 8. A second inspection process for electrically inspecting is performed. Further, the inspection unit 6 inputs, via the probe 12, whether or not the probe 12 of the probe unit 2 and the conductor unit 101 of the substrate 100 are in contact with each other while the movement process is being performed by the movement mechanism 3. The contact determination process for determining based on the electrical signal is executed.

  The storage unit 7 temporarily stores the resistance value Rm measured by the measurement unit 5 according to the control of the processing unit 8. In addition, the storage unit 7 stores a reference value Rs used in a preliminary inspection and a second inspection process described later, and a movement amount L1 and a difference value G1 specified in the preliminary inspection. The storage unit 7 also stores a movement amount L2 and a difference value G2 that are specified in the movement process with respect to the substrate 100, and a reference value Gs that is used in a first inspection process that will be described later.

  The processing unit 8 controls the movement process by the movement mechanism 3 and the second inspection process by the inspection unit 6. Further, in the preliminary inspection described later, the processing unit 8 moves the moving mechanism from when the probe unit 2a starts moving until when the probe 12 comes into contact with the flat plate 200 described later (when the inspection unit 6 determines that fact). 3 specifies the amount of movement L1 (the amount of movement from the initial position) by which the probe unit 2 has been moved, and the difference value G1 between the amounts of movement L1 (the difference value between the protrusion lengths of each tip 21) Are stored in the storage unit 7.

  Further, in the inspection of the substrate 100, the processing unit 8 moves the probe unit 2 by the movement mechanism 3 from the time when the probe unit 2 a starts to move until the probe 12 and the conductor portion 101 of the substrate 100 come into contact with each other. A first inspection is performed that specifies L2 (movement amount from the initial position) and inspects whether the substrate 100 has deformation such as warpage or curvature based on the movement amount L2 and the difference value G1 described above. To do.

  Next, a substrate inspection method for inspecting the substrate 100 using the substrate inspection apparatus 1 will be described with reference to the drawings. As an example, the substrate 100 to be inspected has a plurality of conductor portions 101 formed on the upper surface 100a (hereinafter, the conductor portions 101 of the upper surface 100a are also referred to as “conductor portions 101a”), and the conductor portion 101a is formed on the lower surface 100b. It is assumed that conductor portions 101 (hereinafter, the conductor portions 101 on the lower surface 100b are also referred to as “conductor portions 101b”) that are electrically connected to each other in a one-to-one correspondence.

  First, prior to the inspection of the substrate 100, a preliminary inspection is performed. In this preliminary inspection, a conductive (for example, metal) flat plate 200 formed in the same shape (size and thickness) as the substrate 100 is fixed to the fixed base 4 and then the substrate inspection apparatus 1 is operated. . At this time, the processing unit 8 controls (moves) the probe unit 2b in a direction approaching the flat plate 200 by controlling the moving mechanism 3b.

  In this case, even if the processing unit 8 varies in the protruding length from the support unit 11 (first support plate 31) of the tip 21 of each probe 12 of the probe unit 2b, all of the tip 21 of each probe 12 is detected. Moves the probe unit 2b by a predetermined amount of movement that reliably contacts the lower surface 200b of the flat plate 200. Thereby, as shown in FIG. 3, the tip 21 of each probe 12 in the probe unit 2 b comes into contact with the lower surface 200 b of the flat plate 200. In addition, illustration of the fixing base 4 is abbreviate | omitted in the same figure and FIG. 4, 5 mentioned later.

  Subsequently, the processing unit 8 controls the measurement unit 5 to execute measurement processing. In this measurement process, the measuring unit 5 is based on the electrical signals input and output via the probes 12 and the contact positions of the probes 100 of the probe unit 2a and the substrate 100 respectively associated with the probes 12 ( The process of measuring the resistance value Rm between the probe 12 of the probe unit 2b corresponding to the conductor portion 101) (between the probes 12 corresponding to each other in the probe units 2a and 2b) is repeated at predetermined time intervals. And execute. At the start of the measurement process, the probe unit 2a is located at the initial position, and each probe 12 of the probe unit 2a is not in contact with the flat plate 200. Next, the processing unit 8 controls the moving mechanism 3a to execute the moving process. In this movement process, the movement mechanism 3a moves (lowers) the probe unit 2a in a direction approaching the flat plate 200.

  Moreover, the process part 8 controls the test | inspection part 6, and performs a contact determination process. In this contact determination process, the inspection unit 6 compares the resistance value Rm repeatedly measured by the measurement unit 5 with the reference value Rs stored in the storage unit 7, and compares the probe 12 and the probe unit 2b of the probe unit 2a. When the resistance value Rm between the probe 12 and the probe 12 becomes equal to or less than the reference value Rs, it is determined that the probe 12 (for example, the probe 12a shown in FIG. 3) and the upper surface 200a of the flat plate 200 are in contact with each other ( Hereinafter, it is also referred to as “contact determination has been made”). In this case, the reference value Rs is slightly larger than the resistance value Rm between the two probes 12 measured by the measurement unit 5 when the two probes 12 are in contact with the upper surface 200a and the lower surface 200b of the flat plate 200. It is stipulated in.

  In addition, the processing unit 8 moves when the moving mechanism 3 moves the probe unit 2 from the time when the probe unit 2 starts moving by the moving mechanism 3 to when the contact is determined when the inspection unit 6 determines the contact. The amount L1 (see FIG. 3) is specified, and information for identifying the probe 12 for which contact determination has been made and the movement amount L1 are associated with each other and stored in the storage unit 7. Subsequently, the processing unit 8 similarly identifies the movement amount L1 and stores it in the storage unit 7 every time the inspection unit 6 determines that all the other probes 12 are contacted.

  Next, the processing unit 8 specifies a difference value G1 between the movement amounts L1 of the probes 12. Specifically, the processing unit 8 selects one of the movement amounts L1 (for example, the movement amount L1 (the shortest movement amount L1) of the probe 12 for which contact determination is first performed among the probes 12. In this example, the movement amount L1) for the probe 12a is set as the reference value Ls1, and the difference value G1 (for example, G1 = L1-Ls1) between the movement amount L1 and the reference value Ls1 for the other probes 12 is obtained. calculate.

  In this case, the difference value G1 which is a difference value between the movement amount L1 and the reference value Ls1 (a value obtained by subtracting the reference value Ls1 from the movement amount L1) is the value of each probe 12 from the support portion 11 (first support plate 31). It corresponds to a difference value between the protrusion lengths of the tip portions 21, and the difference value G1 becomes smaller as the protrusion length of the tip portion 21 of the other probe 12 is closer to the protrusion length of the tip portion 21 of the probe 12 a. The difference value G1 increases as the protruding length of the distal end portion 21 of the probe 12 is shorter than the protruding length of the distal end portion 21 of the probe 12a. Subsequently, the processing unit 8 stores the information for identifying the probe 12 and the calculated difference value G1 in the storage unit 7 in association with each other.

  Next, the processing unit 8 controls the moving mechanisms 3a and 3b to move the probe units 2a and 2b in directions away from the flat plate 200, respectively. Thus, the preliminary inspection is completed.

  Next, inspection (first inspection and second inspection) of the substrate 100 is performed. First, the board | substrate 100 is fixed to the fixing stand 4, and the board | substrate inspection apparatus 1 is operated subsequently. At this time, the processing unit 8 controls (moves) the probe unit 2b in a direction approaching the substrate 100 by controlling the moving mechanism 3b. In this case, in the same manner as in the preliminary inspection, the processing unit 8 is configured such that all of the tip portions 21 of the probes 12 have the bottom surface of the substrate 100 even if the protrusion length of the tip portion 21 of each probe 12 of the probe unit 2b varies. The probe unit 2b is moved by a predetermined amount of movement as the amount of movement that reliably contacts each conductor 101b formed on 100b. Thereby, as shown in FIG. 4, the tip portions 21 of all the probes 12 in the probe unit 2 b come into contact with the respective conductor portions 101 b of the substrate 100.

  Next, the processing unit 8 controls the measurement unit 5 to calculate the resistance value Rm between the probes 12 corresponding to each other in the probe units 2a and 2b based on the electrical signals input and output via the probes 12. A measurement process for repeatedly measuring the measurement process at predetermined time intervals is executed. Subsequently, the processing unit 8 controls the moving mechanism 3 a to execute the moving process, and moves (lowers) the probe unit 2 a in a direction approaching the substrate 100.

  Moreover, the process part 8 controls the test | inspection part 6, and performs a contact determination process. In this contact determination process, when the resistance value Rm between the probe 12 of the probe unit 2a and the probe 12 of the probe unit 2b becomes equal to or less than the reference value Rs, the inspection unit 6 It is determined that the probe 12a) shown in FIG. 4 is in contact with the conductor portion 101a formed on the upper surface 100a of the substrate 100.

  In addition, the processing unit 8 moves when the moving mechanism 3 moves the probe unit 2 from the time when the probe unit 2 starts moving by the moving mechanism 3 to when the contact is determined when the inspection unit 6 determines the contact. The amount L2 (see FIG. 4) is specified, and information for identifying the probe 12 for which contact determination has been made and the movement amount L2 are associated with each other and stored in the storage unit 7. Next, the processing unit 8 specifies the movement amount L <b> 2 and stores it in the storage unit 7 every time the inspection unit 6 determines contact for all other probes 12 in the same manner.

  Subsequently, the processing unit 8 performs a first inspection. In the first inspection, the processing unit 8 reads the movement amount L2 and the above-described difference value G1 from the storage unit 7, and calculates the correction value L3 of the movement amount L2 based on each movement amount L2 and the difference value G1. . In this case, the difference value G1 corresponds to the difference value between the protruding length of the distal end portion 21 of the probe 12a (probe 12 as the reference value Ls1: see FIG. 4) and the protruding length of the distal end portion 21 of the other probe 12. By subtracting the difference value G1 from the movement amount L2, it is assumed that the tip portion 21 of each probe 12 protrudes by the same protruding length as the tip portion 21 of the probe 12a (that is, the difference value G1 is “0”). A correction value L3 of the movement amount L2 is calculated.

  Next, the processing unit 8 calculates a difference value G2 (for example, G2 = L3−Ls2) between the correction value L3 and the reference value Ls2 for the other probes 12 by using the correction value L3 for the probe 12a as the reference value Ls2. . In this case, when the difference value G1 is assumed to be “0”, this corresponds to the difference value of the moving amount by which the probe unit 2a is moved until each probe 12 contacts the conductor portion 101a of the substrate 100. That is, the difference value G <b> 2 corresponds to a position difference (height difference) between the conductor portions 101 a in the thickness direction of the substrate 100. Therefore, when the difference value G2 is small, it indicates that the substrate 100 is not warped or curved as shown in FIG. 4, and when the difference value G2 is large, the substrate 100 has a difference value G2 as shown in FIG. This indicates that deformation such as warping or bending has occurred.

  Subsequently, the processing unit 8 reads the reference value Gs stored in the storage unit 7 (a predetermined value as an upper limit value allowed as the difference value G2), and compares the difference value G2 with the reference value Gs. To do. In this case, for example, when the maximum value of the difference value G2 is equal to or less than the reference value Gs, the processing unit 8 determines that the substrate 100 is not deformed such as warping or bending, and the maximum value of the difference value G2 is the reference value. When Gs is exceeded, it is determined that the substrate 100 is deformed such as warping or bending.

  Next, when all the probes 12 have contacted the conductor portion 101 (contact determination has been made by the inspection unit 6), the processing unit 8 controls the moving mechanism 3 to move the probe unit 2 by a predetermined amount of movement. Further move (lower). Thereby, the front-end | tip part 21 of all the probes 12 is made to contact the conductor part 101 reliably.

  Subsequently, the processing unit 8 controls the inspection unit 6 to execute the second inspection process. In this inspection process, the inspection unit 6 inspects the conductor unit 101 for disconnection and short circuit based on the resistance value Rm measured by the measurement unit 5.

  Next, the processing unit 8 displays the inspection results (the results of the first inspection and the results of the second inspection) on a display unit outside the drawing. Thus, the inspection of the substrate 100 is completed. Subsequently, when inspecting a new substrate 100, the new substrate 100 is fixed to the fixing base 4, and then the substrate inspection apparatus 1 is operated to execute the first inspection and the second inspection described above.

  As described above, in the substrate inspection apparatus 1 and the substrate inspection method, the distal end portion 21 of the probe 12 and the conductor portion 101a are in contact with each other in a state where the movement process for moving the probe unit 2a toward the substrate 100 is being performed. The deformation state of the substrate 100 is detected based on the amount of movement L2 of the probe unit 2 until it is determined that the probe unit 2 is determined and the difference value G1 between the protrusion lengths of the tip portions 21 from the support portion 11. That is, in the substrate inspection apparatus 1 and the substrate inspection method, the deformation state of the substrate 100 can be detected when an electrical inspection (second inspection) is performed on the inspection target substrate 100. Therefore, according to the substrate inspection apparatus 1 and the substrate inspection method, the inspection of the deformation state of the substrate 100 does not need to be performed separately from the electrical inspection of the substrate 100, and thus the inspection efficiency is sufficiently improved accordingly. be able to.

  Further, in the substrate inspection apparatus 1 and the substrate inspection method, whether or not the tip portion 21 of each probe 12 is in contact with the flat plate 200 in a state where the probe unit 2a is moved toward the flat plate 200 is determined for each probe. 12 and the difference value G1 is specified based on the movement amount L1 of the probe unit 2a until it is determined that the respective tip portions 21 and the flat plate 200 are in contact with each other. For this reason, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, the probe unit 2a set to the other apparatus is removed compared with the structure and method which perform the process which specifies the difference value G1 using another apparatus. Thus, the work of resetting the substrate inspection apparatus 1 (the trouble of replacing the probe unit 2a) can be omitted, and the inspection efficiency can be further improved accordingly.

  The substrate inspection apparatus and the substrate inspection method are not limited to the above configuration and method. For example, although the example in which the second inspection is performed for each substrate 100 has been described above, the configuration and method for performing the second inspection only once for each of the plurality of substrates 100 (for example, only once for one production lot). Can also be adopted.

  In addition, the configuration and the method for specifying the difference value G1 by executing the preliminary inspection have been described above. However, when the difference value G1 is specified in advance, or the protrusion length of the distal end portion 21 is adjusted so that the difference value G1 is eliminated. When the probe unit 2 is used, this preliminary inspection can be omitted.

  Further, instead of the configuration and method for performing the preliminary inspection and specifying the difference value G1, the protrusion length of each tip 21 is measured using a three-dimensional measuring machine or the like, and the protrusion length and the movement amount L2 described above are measured. It is also possible to adopt a configuration and method for specifying the difference value G2 based on the above (that is, detecting the deformation state).

  Further, the example in which the processing unit 8 compares the difference value G2 indicating the deformation amount with the reference value Gs to determine the quality of the substrate 100 and displays the determination result has been described above. Instead, or together with the display of the determination result, it is possible to employ a configuration and method for displaying an image showing the distribution of variation in the difference value G2 on the display unit.

  Further, the example using the probe unit 2 provided with the elastically deformable rod-shaped probe 12 has been described above. However, the cylindrical housing, the rod-shaped (needle-shaped) slide portion in which the base end side is accommodated in the housing, and It is also possible to adopt a configuration and a method using a probe unit including a probe that is biased by a coil spring and configured to change the protruding length of the tip from the housing.

  Further, the configuration and method for moving the probe unit 2a toward the flat plate 200 and the substrate 100 (hereinafter also referred to as “probing target”) have been described above, but the tip 21 of each probe 12 of the probe unit 2b is in contact with the probing target. It is also possible to employ a configuration and method for moving the probing target toward the probe unit 2a in the state where the probe is made. In this configuration and method, the movement amount obtained by moving the probing target toward the probe unit 2a corresponds to the movement amounts L1 and L2 (relative movement amounts) described above. Further, a configuration and a method for moving both the probing target and the probe unit 2a in a state where the tip portion 21 of the probe 12 of the probe unit 2b is in contact with each other are adopted so that the probe unit 2a and the probing target are in contact with each other. You can also. In this configuration and method, the total value of the movement amount obtained by moving the probe unit 2a toward the probing target and the movement amount obtained by moving the probing target toward the probe unit 2a is the above-described movement amounts L1, L2 (relative Equivalent to the movement amount).

  Further, the probe unit 2a and the probing target are relatively moved and specified so that the upper surface 100a of the substrate 100 or the upper surface 200a of the flat plate 200 and each probe 12 of the probe unit 2a are in contact with each other (that is, the probe Although the configuration and method for executing the detection process based on the movement amounts L1 and L2 (specified using the unit 2a) have been described above, the lower surface 100b of the substrate 100, the lower surface 200b of the flat plate 200, and each probe 12 of the probe unit 2b A configuration in which detection processing is executed based on movement amounts L1 and L2 specified by relatively moving either one of the probe unit 2b and the probing target so as to come into contact (that is, specified using the probe unit 2b); The method can also be adopted. Furthermore, it is also possible to employ a configuration and method for executing detection processing based on the movement amounts L1 and L2 specified using both the probe units 2a and 2b.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2a, 2b Probe unit 3a, 3b Movement mechanism 6 Inspection part 7 Memory | storage part 8 Processing part 11 Support part 12 Probe 21 Tip part 100 Substrate 101, 101a, 101b Conductor part L1, L2 Movement amount G1, G2 Difference value L3 correction value Gs, Ls1, Ls2 reference value

Claims (4)

A probe unit having a plurality of probes supported by a support unit and configured to contact each tip of each probe at a contact position associated with each probe on a substrate to be inspected; A moving mechanism for performing a moving process for relatively moving one of the probe unit and the substrate toward the other; and an inspection unit for inspecting the substrate based on an electric signal input through the probe. Board inspection equipment,
A processing unit for performing a detection process for detecting a deformation state of the substrate;
In the state in which the movement process is being performed by the movement mechanism, the inspection unit determines whether or not each tip portion and each contact position are in contact with each electric signal input via each probe. Discriminate based on
The processing unit includes the relative moving amount by the moving mechanism until the inspection unit determines that the tip portions and the contact positions are in contact with each other, and the respective units from the support unit. A substrate inspection apparatus that performs the detection processing based on each protrusion length of the tip and at least one value of a difference value between the protrusion lengths. In the state in which one of the probe unit and the conductive flat plate is relatively moved toward the other by the moving mechanism, the inspection unit is in contact with the tip portion and the flat plate. Whether or not based on the electrical signal input through the probes,
The processing unit is the at least one used in the detection process based on the relative movement amount by the moving mechanism until the tip part is determined to be in contact with the flat plate by the inspection unit. The substrate inspection apparatus according to claim 1, wherein the value is specified. A probe unit having a plurality of probes supported by a support portion and configured so that each tip portion of each probe contacts a contact position associated with each probe on a substrate to be inspected, and the substrate A substrate inspection method for performing a movement process for relatively moving either one of the two toward the other and inspecting the substrate based on an electrical signal input via the probe,
In the state in which the movement process is being performed, it is determined based on the electrical signal input through the probes whether or not the tip portions are in contact with the contact positions, and the tip portions are And the relative movement amount until it is determined that the contact positions are in contact with each other, and the respective protrusion lengths of the tip portions from the support portion and the difference values between the protrusion lengths. A substrate inspection method for executing a detection process for detecting a deformation state of the substrate based on at least one value. In the state where either one of the probe unit or the conductive flat plate is relatively moved toward the other, whether or not the tip portion and the flat plate are in contact with each other is determined via the probes. Discriminate based on the input electrical signal,
The substrate inspection method according to claim 3, wherein the at least one value used in the detection process is specified based on the relative movement amount until it is determined that the tip portions and the flat plate are in contact with each other.

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