JP2014053603A5 - - Google Patents
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- Publication number
- JP2014053603A5 JP2014053603A5 JP2013172995A JP2013172995A JP2014053603A5 JP 2014053603 A5 JP2014053603 A5 JP 2014053603A5 JP 2013172995 A JP2013172995 A JP 2013172995A JP 2013172995 A JP2013172995 A JP 2013172995A JP 2014053603 A5 JP2014053603 A5 JP 2014053603A5
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heat
- dissipation layer
- layer
- communication module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000017525 heat dissipation Effects 0.000 claims 92
- 230000003287 optical effect Effects 0.000 claims 25
- 239000002184 metal Substances 0.000 claims 19
- 230000005693 optoelectronics Effects 0.000 claims 10
- 238000000926 separation method Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/600,334 | 2012-08-31 | ||
| US13/600,334 US9146368B2 (en) | 2012-08-31 | 2012-08-31 | Methods and systems for dissipating heat in optical communications modules |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014053603A JP2014053603A (ja) | 2014-03-20 |
| JP2014053603A5 true JP2014053603A5 (de) | 2015-10-15 |
Family
ID=50187309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013172995A Ceased JP2014053603A (ja) | 2012-08-31 | 2013-08-23 | 光通信モジュールにおける放熱のための方法及びシステム |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9146368B2 (de) |
| JP (1) | JP2014053603A (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9063305B2 (en) * | 2012-11-26 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods and systems for dissipating heat in optical communications modules |
| US9750158B2 (en) | 2014-05-02 | 2017-08-29 | Honeywell International Inc. | Reduced thermal transfer to Peltier cooled FETs |
| US9645333B2 (en) * | 2014-10-17 | 2017-05-09 | Lumentum Operations Llc | Optomechanical assembly |
| US10749312B2 (en) * | 2015-05-28 | 2020-08-18 | Vixar, Inc. | VCSELs and VCSEL arrays designed for improved performance as illumination sources and sensors |
| US10367284B2 (en) | 2015-07-27 | 2019-07-30 | Hewlett Packard Enterprise Development Lp | Socket to support boards in a spaced relation |
| CN107534029B (zh) * | 2015-07-31 | 2021-11-26 | 慧与发展有限责任合伙企业 | 多芯片模块 |
| KR101925476B1 (ko) * | 2015-11-25 | 2018-12-05 | 주식회사 옵텔라 | 광학 모듈 및 이를 포함하는 광학 엔진 |
| US10624240B2 (en) | 2016-04-29 | 2020-04-14 | Hewlett Packard Enterprise Development Lp | First and second shields for thermal isolation |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094170A (ja) * | 2000-09-13 | 2002-03-29 | Hitachi Ltd | 光モジュール |
| US6773532B2 (en) | 2002-02-27 | 2004-08-10 | Jds Uniphase Corporation | Method for improving heat dissipation in optical transmitter |
| US6859470B2 (en) | 2002-02-27 | 2005-02-22 | Jds Uniphase Corporation | Air trench that limits thermal coupling between laser and laser driver |
| GB2405993A (en) | 2003-09-11 | 2005-03-16 | Agilent Technologies Inc | An arrangement for dissipating heat in an electro-optical system |
| JP2007012856A (ja) * | 2005-06-30 | 2007-01-18 | Toyoda Gosei Co Ltd | Ｌｅｄ装置及びｌｅｄ装置用筐体 |
| US7331720B1 (en) * | 2006-10-19 | 2008-02-19 | Avago Technologies Fiber Ip Pte Ltd | Transceiver module for optical communications and method for transmitting and receiving data |
| US7543994B2 (en) * | 2006-10-19 | 2009-06-09 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Multi-optical fiber connector module for use with a transceiver module and method for coupling optical signals between the transceiver module and multiple optical fibers |
| KR101491138B1 (ko) | 2007-12-12 | 2015-02-09 | 엘지이노텍 주식회사 | 다층 기판 및 이를 구비한 발광 다이오드 모듈 |
| US8559824B2 (en) * | 2008-09-30 | 2013-10-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Parallel optical transceiver module having a balanced laser driver arrangement |
| US8351794B2 (en) * | 2009-03-10 | 2013-01-08 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Parallel optical transceiver module having a heat dissipation system that dissipates heat and protects components of the module from particulates and handling |
| US8041160B2 (en) * | 2009-04-15 | 2011-10-18 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical communications device having a mounting core and method |
| US8280203B2 (en) * | 2009-07-07 | 2012-10-02 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Parallel optical communications device having weldable inserts |
| US8936402B2 (en) * | 2010-02-23 | 2015-01-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Method and apparatus for mounting and positioning parallel optical transceiver modules in a mid-plane mounting configuration with improved mounting density and alignment accuracy |
| US8414309B2 (en) * | 2010-05-03 | 2013-04-09 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Receptacle for an optical transceiver module for protecting the module from airborne particles |
| US8563918B2 (en) * | 2011-01-06 | 2013-10-22 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Laser hammering technique for aligning members of a constructed array of optoelectronic devices |
| US9063305B2 (en) * | 2012-11-26 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods and systems for dissipating heat in optical communications modules |
-
2012
- 2012-08-31 US US13/600,334 patent/US9146368B2/en active Active
-
2013
- 2013-08-23 JP JP2013172995A patent/JP2014053603A/ja not_active Ceased
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