JP2014051687A - Aluminum plating apparatus and method for producing aluminum film using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aluminum plating apparatus which is capable of successfully forming an aluminum plating on the surface of a substrate even in the case when an insulating or poorly conductive metal oxide film or the like is formed on the surface of the substrate.SOLUTION: In the aluminum plating apparatus, a substrate 101 is transferred through a plating bath 102, and aluminum is electrodeposited on the substrate 101. The plating bath 102 is divided into a first electrolytic chamber 104 and a second electrolytic chamber 105 sequentially from the upstream side of the transferring path of the substrate 101 by a partition plate 103. In the first electrolytic chamber 104, a negative electrode 107 provided in the first electrolytic chamber 104 and the substrate 101 are electrically connected with each other so that the substrate 101 acts as a positive electrode, and in the second electrolytic chamber 105, a positive electrode 109 provided in the second electrolytic chamber 105 and the substrate 101 are electrically connected with each other so that the substrate 101 acts as a negative electrode.

Description

  The present invention relates to an aluminum plating apparatus for electroplating aluminum on a substrate surface and an aluminum film manufacturing method using the same.

Aluminum is passivated by forming a dense oxide film on its surface and exhibits excellent corrosion resistance. For this reason, the surface of a steel strip or the like is subjected to aluminum plating to improve the corrosion resistance.
In order to perform aluminum plating on the surface of the steel strip, first, the steel strip is continuously fed into the plating tank through the conductor roll, and travels in the anode immersed in the plating solution in the plating tank. At this time, since the steel strip itself is electrically connected so as to act as a cathode, electrolysis occurs between the anode and the steel strip that is the cathode, and aluminum is electrodeposited on the surface of the steel strip. A plating is formed. The direction of the steel strip traveling in the plating solution is changed by the turn roll, and this time it travels upward. In this case as well, plating is performed with the anode. The steel strip on which the aluminum plating is formed exits the plating tank and is taken out of the system through a conductor roll (Japanese Patent Laid-Open No. 05-222599 (Patent Document 1)).

  In addition, a porous body made of aluminum as a metal porous body having a three-dimensional network structure is promising as improving the capacity of the positive electrode of a lithium ion battery. At present, a material obtained by applying an active material such as lithium cobaltate to the surface of an aluminum foil by taking advantage of the excellent characteristics of aluminum such as conductivity, corrosion resistance and light weight is used as a positive electrode of a lithium ion battery. By forming the positive electrode with a porous body made of aluminum, the surface area can be increased and the active material can be filled inside the aluminum. Thereby, even if the electrode is thickened, the utilization factor of the active material is not reduced, the utilization factor of the active material per unit area is improved, and the capacity of the positive electrode can be improved.

The present applicant has proposed a method of electroplating aluminum on a resin molded body having a three-dimensional network structure as a method for producing the aluminum porous body as described above (Japanese Patent Laid-Open No. 2012-007233 (Patent Document 2). )). Since the conventional aluminum molten salt bath needs to have a high temperature, there has been a problem that when the aluminum is electroplated on the surface of the resin molded body, the resin cannot withstand the high temperature and dissolves. However, according to the method described in Patent Document 2, an organic chloride salt such as 1-ethyl-3-methylimidazolium chloride (EMIC) or 1-butylpyridinium chloride (BPC) and aluminum chloride (AlCl ₃ ) are used. By mixing, a liquid aluminum bath is formed at room temperature, and electroplating of aluminum onto the resin molded body becomes possible. In particular, the EMIC-AlCl ₃ system has good liquid properties and is useful as an aluminum plating solution.

To make the surface of the aluminum porous body having an aluminum plating formed as described above or a three-dimensional network structure with a more excellent gloss, or to increase the thickness of the aluminum plating layer Further, it is necessary to further plate aluminum on a substrate whose surface is aluminum.
However, since an oxide film is formed on the surface of aluminum as described above, even if it is intended to electrodeposit aluminum, the surface cannot be energized uniformly and plating is formed in an island shape. There is.

Japanese Patent Laid-Open No. 05-222599 JP 2012-007233 A

  SUMMARY OF THE INVENTION In view of the above problems, the present invention provides an aluminum plating apparatus that can satisfactorily form aluminum plating on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed. Is an issue.

  As a result of intensive investigations to solve the above problems, the present inventors have found that it is effective to plate aluminum after electrolytically removing the metal surface on which the oxide film is formed in the plating tank, The present invention has been completed. That is, the present invention has the following configuration.

(1) An aluminum plating apparatus for transporting a substrate into a plating tank and electrodepositing aluminum on the substrate,
The plating tank is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in order from the upstream side where the substrate is conveyed,
In the first electrolysis chamber, the cathode and the substrate provided in the first electrolysis chamber are electrically connected so that the substrate acts as an anode,
In the second electrolysis chamber, an aluminum plating apparatus in which an anode provided in the second electrolysis chamber and the base are electrically connected so that the base acts as a cathode.
Since the aluminum plating apparatus described in (1) performs reverse electrolysis in the first electrolysis chamber, even if a metal oxide film or the like having a low insulating property or low conductivity is formed on the surface of the substrate, this is electrolytically removed. In the second electrolytic chamber that follows, aluminum can be electrodeposited satisfactorily.
(2) The aluminum plating apparatus according to (1), further including a first power supply roller that conveys the substrate simultaneously with applying a potential to the substrate on the upstream side of the inlet of the first electrolysis chamber.
According to the invention described in (2) above, it is possible to apply a potential to the substrate in the vicinity of the first electrolysis chamber while transporting the substrate.
(3) The aluminum plating apparatus according to (1) or (2), further including a second power supply roller that conveys the substrate simultaneously with applying a potential to the substrate on the downstream side of the outlet of the second electrolysis chamber.
According to the invention described in (3) above, a potential can be applied to the substrate in the vicinity of the second electrolysis chamber while the substrate is being transported.
(4) The aluminum plating apparatus according to any one of (1) to (3), wherein a molten salt bath mainly composed of aluminum chloride is accommodated in the plating tank.
According to the invention described in (4) above, a conventional molten salt bath mainly composed of aluminum chloride can be used, and a high-quality aluminum film can be obtained.
(5) The aluminum plating apparatus according to any one of (1) to (4), wherein the base is a sheet made of a resin molded body having a conductive three-dimensional network structure.
According to the invention as described in said (5), the resin structure which has an aluminum film on the surface of the resin molding which has a three-dimensional network structure can be manufactured continuously.
(6) An aluminum plating apparatus in which two or more aluminum plating apparatuses according to any one of (1) to (5) are provided in series in the transport direction of the base body.
According to the invention described in the above (6), it is only necessary to provide one incidental facility such as a base supply or winding, and the amount of capital investment can be very low.
(7) In the uppermost stream in the transport direction of the substrate of the aluminum plating apparatus according to any one of (1) to (6),
An aluminum plating apparatus for transporting the substrate into a plating tank and electrodepositing aluminum on the substrate, wherein the substrate is provided in the plating tank so that the substrate acts as a cathode in the plating tank. An aluminum plating apparatus provided with an aluminum plating apparatus in which an anode and the base are electrically connected.
According to the invention described in the above (7), when a substrate on which a metal oxide film or the like having low insulating or low conductivity is used is used, a conventional aluminum plating apparatus is installed at the uppermost stream in the substrate transport direction. Can be used. Further, only one additional facility such as substrate supply or winding is required, and the amount of capital investment can be made extremely low.
(8) A method for producing an aluminum film, in which aluminum is electrodeposited on a substrate using the aluminum plating apparatus according to any one of (1) to (7).
The method for producing an aluminum film described in (8) above can form a high-quality aluminum film on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed. it can.

  According to the present invention, it is possible to provide an aluminum plating apparatus that can satisfactorily form aluminum plating on the surface of a substrate on which a metal oxide film or the like having a low insulating property or low conductivity is formed.

It is a figure which shows an example of the aluminum plating apparatus of this invention. It is a figure which shows another example of the aluminum plating apparatus of this invention.

  An aluminum plating apparatus according to the present invention is an aluminum plating apparatus for transporting a substrate into a plating tank and electrodepositing aluminum on the substrate, wherein the plating tank is sequentially from the upstream side where the substrate is transported. The first electrolysis chamber and the second electrolysis chamber are separated by a partition plate, and the first electrolysis chamber is provided in the first electrolysis chamber so that the base body acts as an anode. The anode and the substrate are electrically connected to each other, and in the second electrolysis chamber, the anode and the substrate provided in the second electrolysis chamber so that the substrate acts as a cathode. Is an aluminum plating apparatus electrically connected.

  Although the said base | substrate is not specifically limited, A base | substrate which cannot electrodeposit aluminum well with the conventional aluminum plating apparatus like the metal in which the metal oxide film (passive film) is formed in the surface In this case, a remarkable effect is exhibited. Examples of such a substrate include a steel strip (steel plate), a porous aluminum body having a three-dimensional network structure, a SUS plate, a Cu or Cu alloy plate, a Zn or Zn alloy plate, and the like.

  The plating bath contains a plating solution, but the plating solution is not particularly limited as long as it is a composition capable of electroplating aluminum. Since aluminum has a large affinity for oxygen and a potential lower than that of hydrogen, it is difficult to perform electroplating with an aqueous plating bath. Therefore, a molten salt bath is used. As the molten salt bath, a bath mainly composed of aluminum chloride can be preferably used.

As the molten salt, an organic molten salt that is a eutectic salt of an organic halide and an aluminum halide, or an inorganic molten salt that is a eutectic salt of an alkali metal halide and an aluminum halide can be used. Use of an organic molten salt bath that melts at a relatively low temperature is preferable because plating can be performed without decomposing the resin molded body as a base material. As the organic halide, imidazolium salt, pyridinium salt and the like can be used, and specifically, 1-ethyl-3-methylimidazolium chloride (EMIC) and butylpyridinium chloride (BPC) are preferable.
Since the molten salt deteriorates when moisture or oxygen is mixed in the molten salt, the plating is preferably performed in an atmosphere of an inert gas such as nitrogen or argon and in a sealed environment.

  As the molten salt bath, a molten salt bath containing nitrogen is preferable. When using a resin molded body having a three-dimensional network structure as the substrate, if a salt that melts at a high temperature is used as the molten salt, it is faster that the resin dissolves or decomposes in the molten salt than the growth of the plating layer. Therefore, the plating layer cannot be formed on the surface of the resin molded body. In this case, an imidazolium salt bath can be preferably used. The imidazolium salt bath can be used without affecting the resin even at a relatively low temperature.

As the imidazolium salt, a salt containing an imidazolium cation having an alkyl group at the 1,3-position is preferably used. In particular, an aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl ₃ -EMIC) molten salt is used. It is most preferably used because it is highly stable and hardly decomposes. Plating onto foamed urethane resin or foamed melamine resin is possible, and the temperature of the molten salt bath is 10 ° C to 100 ° C, preferably 25 ° C to 45 ° C. The lower the temperature, the narrower the current density range that can be plated, and the more difficult it is to plate the entire surface of the resin molded body. At a high temperature exceeding 100 ° C., a problem that the shape of the base resin is impaired tends to occur.

In addition, when a substrate having a high melting point such as a steel strip is used as the substrate, an inorganic salt bath can be used as the molten salt. The inorganic salt bath is typically a binary or multicomponent salt of AlCl ₃ -XCl (X: alkali metal). Such an inorganic salt bath generally has a higher melting temperature than an organic salt bath such as an imidazolium salt bath, but is less restricted by environmental conditions such as moisture and oxygen, and can be put into practical use at a low cost overall. .

  Additives such as xylene, benzene, toluene, 1,10-phenanthroline may be added for the purpose of improving the smoothness and gloss of the aluminum plating film formed on the substrate surface. In particular, 1,10-phenanthroline can be preferably used. The addition amount of such an additive is preferably 0.25 to 7 g / L. By setting it to 0.25 g / L or more, a sufficiently smooth aluminum plating film can be obtained, and by setting it to 7 g / L or less, a decrease in plating efficiency can be suppressed.

Hereinafter, the present invention will be described in more detail with reference to the drawings as appropriate.
FIG. 1 is a diagram showing an example of the configuration of the aluminum plating apparatus of the present invention. As shown in FIG. 1, in the aluminum plating apparatus of the present invention, a plating tank (102) in which a plating solution is accommodated is divided into a first electrolytic chamber (104) and a second electrolytic chamber (105) by a partition plate (103). It is divided into. The substrate (101) is continuously conveyed from the first electrolysis chamber (104) to the second electrolysis chamber (105).

The partition plate (103) is provided for the purpose of electrically separating the first electrolysis chamber (104) and the second electrolysis chamber (105), and an insulating material can be preferably used. For example, Teflon (registered trademark), ceramics, glass, super engineering plastic such as PEEK (polyetheretherketone), heat-resistant vinyl chloride resin, or the like can be used.
In addition, the partition plate (103) is provided with a passage through the base, but the passage is preferably the minimum through which the base can pass. For example, it is preferable that the passage of the substrate has a slit shape.

A cathode (107) is provided in the first electrolysis chamber (104) in which the substrate (101) is first transported, and the substrate (101) acts as an anode in the first electrolysis chamber (104). So that it is electrically connected. As a result, electrolysis occurs between the cathode (107) and the substrate (101), and the metal oxide film formed on the surface of the substrate (101) is removed by electrolysis, so that the metal surface constituting the substrate (101) is removed. Exposed.
The cathode (107) is not particularly limited, and for example, aluminum, titanium, copper or the like can be preferably used.

  FIG. 1 illustrates the case where two cathodes (107) are provided in the vertical direction of the base body (101), but the number of cathodes (107) is not particularly limited, and one or three or more are provided. It doesn't matter. Further, the position where the cathode (107) is provided is not particularly limited, but it is preferable that the cathode (107) is provided as close as possible to the base (101) because electrolysis occurs efficiently.

  In order for the substrate (101) to act as an anode in the first electrolysis chamber (104), the anode terminal of the power source connected to the cathode (107) and the substrate (101) are connected. That's fine. At this time, it is preferable that the substrate (101) is connected to the anode on the upstream side in the vicinity of the inlet of the first electrolysis chamber (104) because electrolysis occurs efficiently.

  FIG. 1 shows a case where a first power supply roller (106) is provided upstream of the inlet of the first electrolysis chamber (104) and the first power supply roller (106) is connected to the anode of the power source. ing. As a result, the substrate (101) is applied with a potential from the first power supply roller (106) while being continuously transported by the first power supply roller (106) and the first transport roller (110). It will act as an anode in the electrolysis chamber (104). Although FIG. 1 shows the case where the first conveying roller (110) is provided on the opposite side of the first power supply roller (106), it is connected to the anode instead of the first conveying roller (110). A power feeding roller may be provided.

What is necessary is just to adjust suitably the quantity of the metal oxide film electrolytically removed in a 1st electrolysis chamber (104) according to the quantity of the oxide film currently formed on the base | substrate (101). For example, when the substrate is aluminum, the precipitation amount or dissolution amount of aluminum can be prepared based on the following formula.
Aluminum precipitation / electrolysis [g]
= 0.3352 × I [A] × t [Hr] (formula)
In the above formula, I represents a current value, t represents time, a constant 0.3352 is a constant peculiar to aluminum, and when the substrate is another metal, it is calculated by changing to a constant peculiar to that metal. Good.

  The substrate (101) from which the metal oxide film has been removed as described above is subsequently transferred to the second electrolysis chamber (105) through a slit provided in the partition plate (103). An anode (109) is provided in the second electrolysis chamber (105), and the base (101) is electrically connected so as to act as a cathode in the second electrolysis chamber (105). As a result, electrolysis occurs between the anode (109) and the substrate (101), and aluminum is electrodeposited on the surface of the substrate (101).

Since the metal oxide film formed on the surface of the base (101) as described above is removed in the first electrolysis chamber (104), the second electrolysis chamber (105) is formed on the surface of the base (101). It is possible to form a uniform aluminum plating.
The anode (109) is not particularly limited, and for example, aluminum, titanium, copper or the like can be preferably used.

  As in the case of the cathode (107), FIG. 1 illustrates the case where two anodes (109) are provided in the vertical direction of the base (101), but the number of anodes (109) is not particularly limited. One or three or more may be used. Further, the position where the anode (109) is provided is not particularly limited, but it is preferable to provide the anode (109) as close to the substrate (101) as possible because electrolysis occurs efficiently.

  In order for the substrate (101) to act as a cathode in the second electrolysis chamber (105), the cathode terminal of the power source connected to the anode (109) and the substrate (101) are connected. That's fine. At this time, it is preferable that the substrate (101) is connected to the cathode on the downstream side in the vicinity of the outlet of the second electrolysis chamber (105) because electrolysis occurs efficiently.

  FIG. 1 shows a case where a second power supply roller (108) is provided on the downstream side of the outlet of the second electrolysis chamber (105), and the second power supply roller (108) is connected to the cathode of the power source. ing. As a result, the substrate (101) is applied with a potential from the second power supply roller (108) while being continuously transported by the second power supply roller (108) and the second transport roller (111). It comes to act as a cathode in the electrolysis chamber (105). Although FIG. 1 shows the case where the second transport roller (111) is provided on the opposite side of the second power supply roller (108), it is connected to the cathode instead of the second transport roller (111). A power feeding roller may be provided.

  The amount of aluminum deposited in the second electrolysis chamber (105) can be calculated by the above formula. Therefore, the current value and time may be adjusted so that desired aluminum is electrodeposited on the surface of the substrate (101). The time can be adjusted by changing the conveyance speed of the substrate (101).

As described above, by using the aluminum plating apparatus of the present invention, it is possible to satisfactorily form aluminum plating on the surface of a substrate on which a metal oxide film or the like having low insulation or conductivity is formed.
In addition, when aluminum plating is applied to a long substrate such as a sheet made of a resin band having a steel strip or a three-dimensional network structure, the linear velocity can be increased by using the aluminum plating apparatus of the present invention. Products can be manufactured efficiently.

In order to increase the production capacity by increasing the wire speed with a single aluminum plating machine, the conventional plating tank, for example, deepens the plating tank when plating in the gravity direction, and plating when plating in the horizontal direction. It is conceivable to lengthen the anode by elongating the tank. However, in practice, the length of the anode effective for plating is limited. In other words, it is plated at a high current density at a location close to the conductor roll, but is not plated at a location far from the conductor roll. Can not.
For this reason, it is conceivable to increase the wire speed by configuring the plating tanks with two or more tanks, but even if the conventional plating apparatus is arranged in tandem with two or more tanks, the surface is made like aluminum. In the case of a metal that easily forms an oxide film, there is a problem that aluminum cannot be plated well on the film formed in the previous plating tank. That is, an oxide film is formed on the surface of the aluminum between the plating tanks, and if there is an oxide film, the aluminum is deposited in an island shape, and plating cannot be performed well. Note that even if an inert atmosphere such as N _{2 was used} between the plating tanks, oxygen could not be completely removed, and oxygen was present in the order of ppm, and this was the case when it was exposed to this small amount of oxygen. However, an oxide film (passive film) is formed on the aluminum surface.

  In order to solve the above problems, the aluminum plating apparatus of the present invention can remove the oxide film formed on the aluminum surface in the first electrolysis chamber. By providing two or more on the surface, smooth and good-quality aluminum plating can be formed even after the second tank. With such an aluminum plating apparatus in which two or more aluminum plating apparatuses are provided in series in the conveyance direction of the base, it is possible to increase the linear velocity of the base, thereby improving the production efficiency of the product. Furthermore, since the aluminum plating apparatus performs continuous aluminum plating using a plurality of aluminum plating apparatuses, only one additional facility such as a base supply or winding is required, and the amount of capital investment is extremely low. can do.

  The number of aluminum devices provided in series is not particularly limited, and may be appropriately selected according to the purpose, such as the thickness of the aluminum plating film to be formed. For example, when a resin molded body having a three-dimensional network structure is used as the substrate, an aluminum porous body can be efficiently produced by disposing about 2 to 20 pieces.

Further, when a resin molded body having a three-dimensional network structure subjected to a conductive treatment by carbon coating or the like is used as a substrate, a conventional aluminum plating apparatus is installed at the uppermost stream in the substrate transport direction of the aluminum plating apparatus of the present invention. It may be provided. As a conventional aluminum plating apparatus, as shown in FIG. 2, an aluminum plating apparatus for electrodepositing aluminum on a base by passing the base (101) through a plating tank (202), 202) an aluminum plating apparatus in which the anode (209) provided in the plating tank (202) and the substrate (101) are electrically connected so that the substrate (101) acts as a cathode. Can be preferably used.
That is, the aluminum plating apparatus according to the present invention is an aluminum plating apparatus in which the base is transported in a plating tank to the uppermost stream in the transport direction of the base of the aluminum plating apparatus and aluminum is electrodeposited on the base. An aluminum plating apparatus provided with an aluminum plating apparatus in which an anode provided in the plating tank and the base are electrically connected so that the base acts as a cathode in the plating tank It is. By performing aluminum plating by arranging the aluminum plating apparatus of the present invention having the first electrolysis chamber for performing reverse electrolysis in series with the second and subsequent aluminum plating apparatuses provided in series, It becomes possible to efficiently form a uniform and high-quality aluminum plating on the substrate. In addition, as described above, the aluminum plating apparatus of the present invention requires only one auxiliary equipment such as a base supply and winding, so that the amount of capital investment can be made extremely low.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, these Examples are illustrations, Comprising: The aluminum plating apparatus of this invention etc. are not limited to these. The scope of the present invention is defined by the scope of the claims, and includes meanings equivalent to the scope of the claims and all modifications within the scope.

[Example 1]
Ten aluminum devices of the present invention shown in FIG. 1 were arranged in series to form an aluminum plating film on the substrate.
-Substrate-
A resin molded body having a three-dimensional network structure in which an aluminum film was formed on the surface by a sputtering method was used as a substrate.
As the resin molding having a three-dimensional network structure, a foamed urethane resin molding having a porosity of 95%, the number of pores per one inch (number of cells), a pore diameter of about 550 μm, a width of 500 mm, and a thickness of 1 mm was used. . An aluminum film having a basis weight of 10 g / m ² was formed on the foamed urethane resin molded body by a sputtering method, and subjected to a conductive treatment.
It was confirmed that a 30 nm aluminum oxide film was formed on the aluminum film on the surface of the resin molded body.

-Aluminum plating equipment-
Ten aluminum devices shown in FIG. 1 were prepared and arranged in series. Nitrogen was filled so that the atmosphere between the aluminum plating apparatuses became an inert atmosphere. The rotation speed of the roller was adjusted so that the linear velocity of the substrate to be conveyed was 0.1 to 1.0 m / min. The configuration of each aluminum device was as follows.

(Molten salt bath)
In a nitrogen atmosphere, a molten salt bath was prepared by mixing to 33 mol% EMIC-67 mol% AlCl ₃ . Further, 1,10-phenanthroline was added so as to be 0.5 g / L.
Further, nitrogen was introduced into the plating solution so that an oxide film was not formed while aluminum was electrodeposited.
(Partition plate)
A partition plate made of Teflon (registered trademark) was disposed in the plating tank, and the plating tank was partitioned into a first electrolysis chamber and a second electrolysis chamber. The partition plate was formed with a slit having a width of 560 mm and a height of 5 mm to serve as a passage for the substrate.

(First feeding roller)
A first feeding roller made of aluminum having the center of the roller connected to the anode terminal of the power source was used.
(cathode)
An aluminum cathode was provided in the first electrolysis chamber. As shown in FIG. 1, the cathodes were arranged at two locations on the upper surface side and the lower surface side of the substrate.
(First electrolysis chamber)
In the first electrolysis chamber, electrolysis occurred between the substrate and the cathode so that the current density was 10 A / dm ² .

(Second feeding roller)
A second feeding roller made of aluminum having the center of the roller connected to the cathode terminal of the power source was used.
(anode)
An aluminum anode was provided in the second electrolysis chamber. As shown in FIG. 1, the anode was disposed at two locations on the upper surface side and the lower surface side of the substrate.
(Second electrolysis chamber)
In the second electrolysis chamber, electrolysis occurred between the substrate and the anode so that the current density was 5 A / dm ² .

  The above-mentioned electrified substrate was continuously conveyed to 10 aluminum devices having the above-described configuration, and an aluminum plating film was formed on the substrate surface. As a result, a 10 μm aluminum film was formed on the substrate surface. Further, the formed plating film was homogeneous and good quality.

  From the above, it was confirmed that by using the aluminum plating apparatus of the present invention, a high-quality aluminum plating film can be further formed even on a substrate having an aluminum oxide film formed on the surface.

[Example 2]
As shown in FIG. 2, a conventional aluminum plating apparatus is disposed on the most upstream side with respect to the substrate transport direction. Nine aluminum devices of the present invention used in Example 1 were arranged in series on the downstream side to form an aluminum plating film on the substrate.
-Substrate-
A resin molded body having the same three-dimensional network structure as in Example 1 was used.
The conductive treatment of the resin molding was performed by applying a carbon paint as a conductive paint to the porous resin other surface. The component of the carbon paint includes 25% of carbon particles, and includes a resin binder, a penetrating agent, and an antifoaming agent. The particle size of carbon black was 0.5 μm.

-Aluminum plating equipment-
The conventional aluminum plating apparatus disposed on the most upstream side with respect to the substrate transport direction has the same configuration as the second electrolysis chamber in the aluminum plating apparatus used in Example 1. That is, the plating solution, the power supply roller, and the anode were respectively configured in the same manner as the plating solution, the second power supply roller, and the anode of Example 1.
The second and subsequent aluminum plating apparatuses have the same configuration as the aluminum plating apparatus used in Example 1, and nine such apparatuses are arranged in series.

  When the base having the aluminum plating film formed on the surface was observed, an aluminum film of 10 μm was formed on the surface of the base, and the formed plating film was a homogeneous and high-quality film.

[Comparative Example 1]
An aluminum plating film was formed on the substrate surface in the same manner as in Example 1 except that ten conventional aluminum plating apparatuses were arranged in series as the aluminum plating apparatus. As a conventional aluminum plating apparatus, the aluminum plating apparatus arranged on the most upstream side in Example 2 was used. In addition, it was set as the conditions similar to Example 1 also to fill between nitrogen plating apparatuses with nitrogen, and to make it inert atmosphere.
When the aluminum plating film formed on the substrate surface was observed, it was deposited in an island shape and was inferior in quality to the film formed using the apparatus of Example 1.

[Comparative Example 2]
An aluminum plating film was formed on the substrate surface in the same manner as in Example 2 except that ten conventional aluminum plating apparatuses were arranged in series as the aluminum plating apparatus. As a conventional aluminum plating apparatus, the aluminum plating apparatus arranged on the most upstream side in Example 2 was used. In addition, it was set as the conditions similar to Example 2 also to fill between nitrogen plating apparatuses with nitrogen, and to make it inert atmosphere.
When the aluminum plating film formed on the substrate surface was observed, it was deposited in an island shape and was inferior in quality to the film formed using the apparatus of Example 2.

DESCRIPTION OF SYMBOLS 101 Base body 102 Plating tank 103 Partition plate 104 1st electrolysis chamber 105 2nd electrolysis chamber 106 1st feed roller 107 Cathode 108 2nd feed roller 109 Anode 110 2nd conveyance roller 111 2nd conveyance roller 202 Plating Tank 208 Feed roller 209 Anode

Claims (8)

An aluminum plating apparatus for conveying a substrate into a plating tank and electrodepositing aluminum on the substrate,
The plating tank is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in order from the upstream side where the substrate is conveyed,
In the first electrolysis chamber, the cathode and the substrate provided in the first electrolysis chamber are electrically connected so that the substrate acts as an anode,
In the second electrolysis chamber, an aluminum plating apparatus in which an anode provided in the second electrolysis chamber and the base are electrically connected so that the base acts as a cathode.   2. The aluminum plating apparatus according to claim 1, further comprising a first power supply roller that conveys the substrate simultaneously with applying a potential to the substrate on the upstream side of the inlet of the first electrolysis chamber.   The aluminum plating apparatus of Claim 1 or 2 which has a 2nd electric power feeding roller which conveys a base | substrate simultaneously with applying a potential to the said base | substrate at the downstream of the exit of said 2nd electrolysis chamber.   The aluminum plating apparatus as described in any one of Claims 1-3 in which the molten salt bath which has aluminum chloride as a main component is accommodated in the said plating tank.   The aluminum plating apparatus according to any one of claims 1 to 4, wherein the base is a sheet made of a resin molded body having a conductive three-dimensional network structure.   The aluminum plating apparatus as described in any one of Claims 1-5 is provided with two or more in series in the conveyance direction of the said base | substrate. In the uppermost stream in the conveyance direction of the substrate of the aluminum plating apparatus according to any one of claims 1 to 6,
An aluminum plating apparatus for transporting the substrate into a plating tank and electrodepositing aluminum on the substrate, wherein the substrate is provided in the plating tank so that the substrate acts as a cathode in the plating tank. An aluminum plating apparatus provided with an aluminum plating apparatus in which an anode and the base are electrically connected.   The manufacturing method of the aluminum film which electrodeposits aluminum on a base | substrate using the aluminum plating apparatus as described in any one of Claims 1-7.

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