CN104603332A - Aluminum plating apparatus and method for producing aluminum film using same - Google Patents

Aluminum plating apparatus and method for producing aluminum film using same Download PDF

Info

Publication number
CN104603332A
CN104603332A CN201380046112.4A CN201380046112A CN104603332A CN 104603332 A CN104603332 A CN 104603332A CN 201380046112 A CN201380046112 A CN 201380046112A CN 104603332 A CN104603332 A CN 104603332A
Authority
CN
China
Prior art keywords
matrix
aluminizing
tank room
described matrix
positive pole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380046112.4A
Other languages
Chinese (zh)
Inventor
西村淳一
细江晃久
奥野一树
木村弘太郎
后藤健吾
境田英彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN104603332A publication Critical patent/CN104603332A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/42Electroplating: Baths therefor from solutions of light metals
    • C25D3/44Aluminium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/66Electroplating: Baths therefor from melts
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/66Electroplating: Baths therefor from melts
    • C25D3/665Electroplating: Baths therefor from melts from ionic liquids
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003Electroplating using gases, e.g. pressure influence
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • C25D5/42Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44Aluminium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0621In horizontal cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0642Anodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Provided is an aluminum plating apparatus which is capable of successfully forming an aluminum plating on the surface of a base even in the cases where the surface is provided with an insulating or poorly conductive metal oxide film or the like. An aluminum plating apparatus for electrodepositing aluminum on a base by conveying the base in a plating bath, wherein: the plating bath is divided into a first electrolysis chamber and a second electrolysis chamber sequentially from the upstream of the conveyance path of the base by a partition plate; a negative electrode provided in the first electrolysis chamber and the base are electrically connected with each other so that the base acts as a positive electrode in the first electrolysis chamber; and a positive electrode provided in the second electrolysis chamber and the base are electrically connected with each other so that the base acts as a negative electrode in the second electrolysis chamber.

Description

To aluminize device and use this device to manufacture the method for aluminium film
Technical field
The present invention relates to for the device of aluminizing to matrix surface Electroplating Aluminum, and utilize aforementioned means to manufacture the method for aluminium film.
Background technology
Aluminium can form dense oxidation film on its passive surface, thus shows excellent erosion resistance.Accordingly, the surface of steel band etc. is carried out aluminize to improve its erosion resistance.
In order to aluminize on the surface of steel band, first, in coating bath, steel band is transmitted by conduction rod continuously.The positive pole that this steel band is being immersed in the plating solution being arranged in coating bath is advanced.Now, steel band is electrically connected in the mode of serving as negative pole, thus between positive pole and the steel band as negative pole, electrolysis occurs.Thus, Aliminuium electrodeposition forms aluminium coat in the surface of steel band.Now, being there is direction and change in the steel band of advancing in the plating solution, thus transfers to and upwards advancing by deflector roll (turn roll).Now, between steel band and positive pole, plating is carried out equally.The steel band it being formed with aluminium coat leaves coating bath, by another conduction rod, and it is taken out from this system (date of publication present patent application Unexamined Patent 05-222599 (patent documentation 1)).
As the metal porous body with tridimensional network, the porous insert be made up of aluminium is expected to the material becoming the positive electrode capacity that can improve lithium ion battery.At present, by utilizing the electroconductibility of aluminium, erosion resistance, light weight and other advantageous feature, the positive pole of lithium ion battery can be used as by obtained material by the active material coating aluminium foil surface with such as lithium cobalt oxide and so on.When by using the porous insert be made up of aluminium to form positive pole, its surface-area can be increased, and even active material can be filled to the inside of aluminium.Thus, even if when thickness of electrode increases, the utilization ratio of active material also can be avoided to reduce.Therefore, the active material utilization of unit surface increases, thus can improve the capacity of positive pole.
As the manufacture method of above-mentioned aluminium porous insert, present applicant has proposed and utilize aluminium to carry out electric plating method (having announced Japanese Patent Application Laid-Open 2012-007233 (patent documentation 2)) to the resin molded body with tridimensional network.Conventional aluminium molten salt bath must be heated to high temperature.Therefore, when the surface of resin molded body is by electroplated aluminum, a problem is in this case: resin cannot be resisted high temperature thus can melting.But, according to the method described in patent documentation 2, the organic chloride salt of 1-ethyl-3-methylimidazolium chloride (EMIC) or 1-butyl pyridinium chloride (BPC) and so on and aluminum chloride (AlCl 3) mix the aluminium bath that formed at room temperature for liquid, thus make it possible to electroplate resin molded body with aluminium.Especially, EMIC-AlCl 3system has good characteristics of liquids, and therefore it can be used as aluminium plating solution.
At above-mentioned aluminum-plated steel strip and have in the aluminium porous insert of tridimensional network, in order to obtain the surface the thickness increasing aluminium coat with excellent gloss, need to aluminize to the matrix with aluminium surface further.
But as mentioned above, aluminium is formed with oxide film on the surface.Therefore, though for by Aliminuium electrodeposition to aluminium on the surface, also cannot power to this surface uniform.Therefore, there will be the problem that plating shape is island.
Reference listing
Patent documentation
Patent documentation 1: date of publication present patent application Unexamined Patent 05-222599 publication
Patent documentation 2: announced Japanese Patent Application Laid-Open 2012-007233 publication
Summary of the invention
Technical problem
In view of the above problems, one is the object of the present invention is to provide to aluminize device, even if on the matrix surface of that be formed with insulation from the teeth outwards or that electroconductibility is poor metal oxide film etc., this device of aluminizing also can form aluminium coat well.
The means of dealing with problems
The present inventor conducts in-depth research to solve the problem, and found that effectively: in coating bath, remove the oxide film being formed at metallic surface in the mode of electrolysis, then aluminize.This completes the present invention.More specifically, the present invention has following formation.
(1) one is aluminized device, and it is for by transfer matrix in coating bath thus by Aliminuium electrodeposition to described matrix.Described device has following feature:
Upstream side on the delivery direction of above-mentioned matrix, above-mentioned coating bath is divided into the first tank room and the second tank room successively by division plate;
In above-mentioned first tank room being provided with negative pole, this negative pole is electrically connected with above-mentioned matrix in the mode making above-mentioned matrix and serve as positive pole; And
In above-mentioned second tank room being provided with positive pole, this positive pole is electrically connected with above-mentioned matrix in the mode making above-mentioned matrix and serve as negative pole.
Device of aluminizing described in above-mentioned (1) has carried out reverse electrolysis in the first tank room.Therefore, even if metal oxide film that is be formed with insulation on matrix surface or poorly conductive, the mode also by electrolysis is removed, thus can electric deposition aluminum well in the second tank room subsequently.
(2) according to the device of aluminizing described in (1), described device comprises the first power supply roller of the upstream side of the entrance being positioned at above-mentioned first tank room, and this first power supply roller applies current potential to above-mentioned matrix and transmits described matrix simultaneously.
Invention described in above-mentioned (2) while transfer matrix, can apply current potential to the matrix near the first tank room.
(3) above-mentioned (1) or the device of aluminizing described in (2), described device comprises the second power supply roller in the downstream side of the outlet being positioned at above-mentioned second tank room, and this second power supply roller applies current potential to above-mentioned matrix and transmits described matrix simultaneously.
Invention described in above-mentioned (3) while transfer matrix, can apply current potential to the matrix near the second tank room.
(4) device of aluminizing in above-mentioned (1) to (3) described in any one, wherein above-mentioned coating bath accommodates the molten salt bath formed primarily of aluminum chloride.
Invention described in above-mentioned (4) makes it possible to use the conventional melt salt formed primarily of aluminum chloride, thus can obtain the aluminium film of good quality.
(5) device of aluminizing in above-mentioned (1) to (4) described in any one, wherein above-mentioned base material is by through conductive processing and the sheet material that forms of the resin molded body with tridimensional network.
Invention described in above-mentioned (5) can manufacture such resin structure continuously, and this resin structure has aluminium film on the surface of resin molded body with tridimensional network.
(6) one is aluminized device, comprises two or more device of aluminizing all according to any one in above-mentioned (1) to (5);
Device described in these is placed in a series arrangement along the delivery direction of above-mentioned matrix.
Invention described in above-mentioned (6) only can arrange a set of attendant equipment (as the feed mechanism of matrix and spooler), thus significantly can reduce the infusion of financial resources to equipment.
(7) one is aluminized device, comprises such device of aluminizing:
This device of aluminizing is arranged in the anterior position of the device of aluminizing according to any one of above-mentioned (1) to (6), and this anterior position is the upstream-most position on the delivery direction of described matrix;
This device of aluminizing transmits in coating bath by making above-mentioned matrix, thus by Aliminuium electrodeposition on above-mentioned matrix; And
The feature of this device of aluminizing is, in the described coating bath being provided with positive pole, this positive pole is electrically connected with above-mentioned matrix in the mode making above-mentioned matrix and serve as negative pole.
When device utilizes the matrix of metal oxide film that is that do not form insulation on the surface or poorly conductive etc., the invention described in above-mentioned (7) can utilize routine to aluminize device in the side, most upstream on matrix delivery direction.In addition, only need to arrange a set of attendant equipment (as the feed mechanism of matrix and spooler), thus significantly reduce the infusion of financial resources to equipment.
(8) manufacture a method for aluminium film, the method is by utilizing the device thus by Aliminuium electrodeposition on matrix of aluminizing according to any one in above-mentioned (1) to (7).
Even if during be formed on the surface of matrix insulation or poorly conductive metal oxide film etc., the method for the manufacture aluminium film described in above-mentioned (8) also can form high-quality aluminium film on the surface of this matrix.
Invention effect
The present invention can provide one to aluminize device, even if this is aluminized, device also can form aluminium coat well on such matrix surface, that the surface of wherein this matrix is formed with insulation or that electroconductibility is poor metal oxide film etc.
Accompanying drawing explanation
Fig. 1 illustrates that the present invention aluminizes the figure of example of device.
Fig. 2 illustrates that the present invention aluminizes the figure of another example of device.
Embodiment
Device of aluminizing of the present invention is for by transfer matrix thus by Aliminuium electrodeposition to the device of aluminizing on this matrix in coating bath.This device has following feature:
Upstream side on the delivery direction of above-mentioned matrix, above-mentioned coating bath is divided into the first tank room and the second tank room successively by division plate;
In above-mentioned first tank room being provided with negative pole, this negative pole is electrically connected with above-mentioned matrix in the mode making above-mentioned matrix and serve as positive pole; And
In above-mentioned second tank room being provided with positive pole, this positive pole is electrically connected with above-mentioned matrix in the mode making above-mentioned matrix and serve as negative pole.
Above-mentioned matrix is had no particular limits.But, when matrix be routine aluminize device cannot thereon well electric deposition aluminum (such as, there is the metal of metal oxide film (passive film) on the surface), show excellent effect.The type of aforementioned substrates comprises steel band (steel plate), has the aluminium porous insert of tridimensional network, SUS plate, Cu or Cu alloy sheets, Zn or Zn alloy sheets.
Above-mentioned coating bath accommodates plating solution.Plating solution is had no particular limits, as long as this plating solution has the composition that can carry out electroplated aluminum.The avidity of aluminium to oxygen is high, and its current potential is lower than the current potential of hydrogen.Therefore, be difficult to electroplate in the plating bath of water solution system, because being employed herein molten salt bath.Advantageously can use the molten salt bath formed primarily of aluminum chloride.
About melting salt, organic melting salt of the eutectic salts form be made up of Organohalogen compounds and aluminum halide can be used, and the inorganic molten salt of the eutectic salts form be made up of alkali metal halide and aluminum halide.When being used in organic molten salt bath of melting under relatively lower temp, can carry out plating and the resin molded body as matrix can not be made to decompose, this be favourable.About Organohalogen compounds, imidazole salts, pyridinium salt etc. can be used.More specifically, preferably 1-ethyl-3-methylimidazolium chloride (EMIC) and butyl pyridinium chloride (BPC).
When moisture or oxygen invade in melting salt, melting salt can deterioration.Therefore, advantageously not only in nitrogen, argon gas or other inert gas atmospheres and in enclosed environment, plating is carried out.
About molten salt bath, the melting salt containing nitrogen is favourable.When use there is tridimensional network resin molded body as above-mentioned matrix time, if use the salt of at high temperature melting as melting salt, then the dissolving of resin in melting salt or decomposition rate faster than the speed of growth of coating.Therefore, coating cannot be formed on the surface of resin molded body.In this case, imidazoles salt bath can advantageously be used.Even if also imidazoles salt bath can be used at relatively low temperature, and can not impact resin.
As imidazole salts, the salt containing having the glyoxaline cation of alkyl in 1 and 3 positions advantageously can be used.Especially, aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl is most preferably used 3-EMIC) be melting salt, this is because this salt-stable is high, be therefore comparatively not easy to decompose.Plating can be carried out on urethane resin foam, melamine resin foam etc.The temperature of molten salt bath is 10 DEG C to 100 DEG C, is preferably 25 DEG C to 45 DEG C.Along with described temperature is down to low temperature, the current density range that can carry out plating narrows, and is therefore difficult to carry out plating on all surfaces of resin molded body.High temperature more than 100 DEG C trends towards the problem producing the shape damaging the resin being used as matrix.
When use has dystectic matrix (as steel band), inorganic salt bath also can be used as melting salt.Inorganic salt bath is generally AlCl 3the two-pack of – XCl (X: basic metal) or the salt of multicomponent system.The melt temperature of aforementioned inorganic salt bath is usually above organic salt bath (as imidazoles salt bath), but the less-restrictive of envrionment conditions (as humidity and oxygen), therefore make practical application cost on the whole lower.
In order to improve smoothness and the glossiness of the aluminium plated film be formed on matrix surface, additive can be added, as dimethylbenzene, benzene, toluene and 1,10-phenanthroline.
Particularly, 1,10-phenanthroline can advantageously be used.Preferably, the addition of above-mentioned additive is 0.25g/L to 7g/L.When addition is more than 0.25g/L, enough level and smooth aluminium plated film can be obtained.When addition is below 7g/L, the reduction of plating efficiencies can be suppressed.
Below, by suitably with reference to the elaboration that accompanying drawing carries out specifically to the present invention.
Fig. 1 illustrates that the present invention aluminizes the structure example of device.As shown in Figure 1, aluminize in device of the present invention, by division plate 103, the coating bath 102 containing plating solution is divided into the first tank room 104 and the second tank room 105.Continuously matrix 101 is sent to the second tank room 105 by the first tank room 104.
Arrange division plate 103 with by the first tank room 104 and the second tank room 105 electrically separated.Advantageously can use the division plate of insulation.Such as, Teflon (registered trademark), pottery, glass, superengineering plastics can be used as polyether-ether-ketone (PEEK) and thermotolerance vinyl chloride resin.
Division plate 103 be provided with matrix by mouth (passing aperture).Advantageously, the minimum possibility size that matrix only can be made to pass through should be had by mouthpiece.Such as, advantageously, matrix is slit-shaped by mouth.
First matrix 101 is transferred into the first tank room 104, and this first tank room 104 is provided with negative pole 107, and it is electrically connected in the mode of the positive pole making matrix 101 and serve as in the first tank room 104.This being formed between negative pole 107 and matrix 101 produces electrolysis.Therefore, the metal oxide film be formed on matrix 101 surface is removed by electrolysis, thus the metallic surface of formation matrix 101 is come out.
Anticathode 107 has no particular limits.Such as, aluminium, titanium and copper can advantageously be used.
As an example, Fig. 1 illustrates the situation being provided with two negative poles 107: a negative pole 107 is positioned at above matrix 101, and another negative pole 107 is positioned at below matrix 101.But the number of anticathode 107 has no particular limits.An electrode, three electrodes or more electrode can be adopted.The position being provided with negative pole 107 is had no particular limits.But, advantageously, negative pole 107 is arranged at the position that distance matrix 101 is near as far as possible, so that effectively electrolysis can be carried out.
In order to make matrix 101 serve as positive pole in the first tank room 104, the power supply positive terminal be connected with negative pole 107 is connected with matrix 101.In this case, in order to effectively carry out electrolysis, advantageously, matrix 101 is connected with positive pole at the upstream side near the first tank room 104 entrance.
Fig. 1 shows such situation: wherein, and the upstream side of the ingress of the first tank room 104 is provided with the first power supply roller 106, and this first power supply roller 106 is connected with the positive pole of power supply.By adopting this formation, continuously while transfer matrix 101 by the first power supply roller 106 and the first transfer roller 110, applying voltage by the first power supply roller 106 to matrix 101, thus making matrix 101 serve as positive pole in the first tank room 104.In situation illustrated in fig. 1, the first transfer roller 110 is arranged at the offside of the first power supply roller 106.But, the power supply roller that is connected with positive pole can be set to replace the first transfer roller 110.
Can according to the amount of the oxide film be formed on matrix 101 suitably to regulate in the first tank room 104 want electrolysis to remove the amount of metal oxide film.Such as, when matrix is made of aluminum, deposition or the meltage of aluminium can be regulated based on following equation:
Meltage [g]=0.3352 × I [A] × t [Hr] (equation) of the deposition/aluminium of aluminium
In above-mentioned equation, " " represent current value, " t " represents the time to I.Constant 0.3352 is constant specific to aluminium, and when matrix is made up of other metals, this constant can be changed into the peculiar constant of this metal to calculate.
Next, the matrix 101 having removed metal oxide film is as mentioned above sent to the second tank room 105 by the slit be formed in division plate 103.Second tank room 105 is provided with positive pole 109, and it is electrically connected in the mode making matrix 101 serve as negative pole in the second tank room 105.This being formed between positive pole 109 and matrix 101 produces electrolysis.Consequently, Aliminuium electrodeposition is on the surface of matrix 101.
As mentioned above, in the first tank room 104, the metal oxide film that matrix 101 is formed on the surface is eliminated.Thus, in the second tank room 105, uniform aluminium coat can be formed on the surface of matrix 101.
Positive pole 109 is had no particular limits.Such as, aluminium, titanium and copper can advantageously be used.
The same with the situation of negative pole 107, as an example, Fig. 1 shows the situation being provided with two positive poles 109: a positive pole 109 is arranged at the top of matrix 101, and another positive pole 109 is arranged at the below of matrix 101.But, the number of positive pole 109 is had no particular limits.An electrode, three electrodes or more electrode can be adopted.The position being provided with positive pole 109 is had no particular limits.But, advantageously, positive pole 109 is arranged at the position that distance matrix 101 is near as far as possible, so that effectively electrolysis can be carried out.
In order to make matrix 101 serve as negative pole in the second tank room 105, the negative terminal of the power supply be connected with positive pole 109 is connected with matrix 101.In this case, in order to effectively carry out electrolysis, advantageously, matrix 101 is connected with negative pole in the downstream side near the second tank room 105 exit.
Fig. 1 shows the second power supply roller 108 and is arranged at the outlet downstream side of the second tank room 105 and situation about being connected with power cathode.By adopting this formation, coming continuously while transfer matrix 101 by the second power supply roller 108 and the second transfer roller 111, apply voltage by the second power supply roller 108 to matrix 101, matrix 101 serves as negative pole in the second tank room 105 thus.Fig. 1 shows the situation that the second transfer roller 111 is arranged at the offside of the second power supply roller 108.But, the power supply roller that is connected with negative pole can be set to replace the second transfer roller 111.
By using above-mentioned equation to calculate the al deposition amount in the second tank room 105.Therefore, current value and time can be regulated like this, be electrically deposited on the surface of matrix 101 to make the aluminium of aequum.Transfer rate by changing matrix 101 carrys out regulating time.
As mentioned above, the device of aluminizing of the application of the invention, even if when being formed with the metal oxide film etc. of insulativity or poorly conductive on matrix surface, also can form aluminium coat well on the surface of this matrix.
When the matrix that the sheet material being steel band and be made up of the resin molded body with tridimensional network is isometric is aluminized, use device of aluminizing of the present invention can pass through improve linear velocity thus effectively produce product.
When the routine of being furnished with a coating bath aluminizes device, when attempting by improving linear velocity thus promoting throughput, the length increasing positive pole can be considered.Such as, when vertically carrying out plating, coating bath is deepened; And when flatly carrying out plating, then coating bath is lengthened.But, in fact, the positive pole limited length of effective plating can be carried out.More specifically, although carry out plating in the position near conductive rollers with high current density, do not carry out plating in the position away from conduction rod.Therefore, in the device being furnished with a coating bath, the increase of linear velocity is limited, therefore cannot promote throughput.
Based on this reason, the coating bath by there is two or more groove can be considered thus raising linear velocity.But, even if when installing two or more conventional plater to carry out operate continuously in the mode of series connection, be easy in the situation of the metal (as aluminium) forming oxide film from the teeth outwards, then there is such problem, that is: can not aluminize to the film formed in the coating bath of position before well.More specifically, the space place between coating bath can form oxide film on the surface of aluminium.When forming oxide film, aluminium deposits with island.In other words, plating cannot be carried out well.Even if the space between coating bath is full of N 2or during other inert atmospheres, also cannot remove deoxidation completely, oxygen can remain with the magnitude of ppm.Even if when aluminium is exposed to the oxygen of above-mentioned small quantity, also oxide film (passive film) can be formed on aluminum surfaces.
In order to avoid producing the problems referred to above, device of aluminizing of the present invention can remove the oxide film be formed on aluminium surface in the first tank room.Therefore, when along matrix delivery direction with the mode of series connection arrange two or more aluminize device time, second and coating bath subsequently also can form level and smooth high-quality Al coating.By using such device of aluminizing, can improve the linear velocity of matrix, thus improve the production efficiency of product, wherein aluminize in device described, the delivery direction along matrix arranges two or more above-mentioned device of aluminizing in the mode of series connection.Because aforementioned device of aluminizing being aluminized continuously by using multiple device of aluminizing, therefore only needing a set of attendant equipment (as the feed mechanism of matrix and spooler), thus significantly reducing the infusion of financial resources to equipment.
The quantity of the aluminium device arranged in a series arrangement is had no particular limits.Suitably its quantity can be selected according to object (thickness of the aluminium coat that such as, be formed).Such as, when use there is tridimensional network resin molded body as matrix time, the device of aluminizing arranging about 2 to 20 can manufacture aluminium porous insert effectively.
When being used as matrix through the resin molded body with tridimensional network of (such as) carbon applying conductive process, the anterior position place that can state device of aluminizing on the invention arranges routine and to aluminize device, and described anterior position is the upstream-most position on matrix delivery direction.To aluminize device about this routine, advantageously can use following device of aluminizing.As shown in Figure 2, aluminize device by making matrix 101 by coating bath 202 thus by Aliminuium electrodeposition to matrix, the feature of this device of aluminizing is: in coating bath 202, is arranged at positive pole 209 in coating bath 202 and is electrically connected with above-mentioned matrix 101 in the mode making above-mentioned matrix 101 and serve as negative pole.
In other words, device of aluminizing of the present invention has following device of aluminizing:
This device of aluminizing is positioned at the anterior position of above-mentioned device of aluminizing, and described anterior position is the upstream-most position on above-mentioned matrix delivery direction;
This device of aluminizing passes through in coating bath, transmit above-mentioned matrix, thus by Aliminuium electrodeposition to above-mentioned matrix; And
The feature of this device of aluminizing is, in the coating bath being provided with positive pole, this positive pole is electrically connected with above-mentioned matrix in the mode making above-mentioned matrix and serve as negative pole.
By above-mentioned device of aluminizing of the present invention (it is provided with the first tank room carrying out reverse electrolysis) and second or device of aluminizing subsequently to be arranged in a series arrangement in the device of aluminizing of arranged in series as above and to aluminize, even and high-quality aluminium coat effectively can be formed on matrix.In addition, as mentioned above, device of aluminizing of the present invention only can arrange a set of attendant equipment (as the feed mechanism of matrix and spooler), thus significantly reduces the input to equipment.
Embodiment
Hereinafter, further will elaborate the present invention based on embodiment.These embodiments are schematic, are not construed as limiting device etc. of aluminizing of the present invention.Scope of the present invention is illustrated by the scope of claims, and it covers the implication suitable with Claims scope and included whole change and change within the scope of this.
Embodiment 1
Aluminium device of the present invention shown in ten Fig. 1 is arranged, in a series arrangement to form aluminium plated film on matrix.
Matrix
As described matrix, employ the resin molded body with tridimensional network, the surface of wherein this resin molded body is formed with aluminium film by sputtering method.
As the described resin molded body with tridimensional network, employ such foaming polyurethane resin molding, its porosity is 95%, the number of pores (cell number) of per inch is about 50, aperture is about 550 μm, and width is 500mm, and thickness is 1mm.On this foaming polyurethane resin molding, forming coating weight by sputtering method is 10g/m 2aluminium film, thus carry out conductive processing.
Verified, in the aluminium film on resin molded body surface, define the pellumina of 30nm.
To aluminize device
Prepare the aluminium device of the present invention shown in 10 Fig. 1, and it is arranged in a series arrangement.The space of aluminizing between device is full of nitrogen, to form inert atmosphere.The speed of rotation of dancer rools, makes the linear velocity of transmitted matrix reach 0.1m/min to 1.0m/min.The structure of single aluminium device will be described below.
Molten salt bath
By by EMIC and AlCl 3mix in nitrogen atmosphere, consist of 33 % by mole of EMIC-67 % by mole of AlCl to prepare 3molten salt bath.In addition, add 1,10-phenanthroline, make its concentration be 0.5g/L.
In addition, nitrogen is introduced in plating solution, to prevent from forming oxide film in the process of electric deposition aluminum.
Division plate
The division plate be made up of Teflon (registered trademark) is placed, coating bath to be divided into the first tank room and the second tank room in coating bath.Division plate is provided with the slit by mouth as matrix, the wide 560mm of this slit, high 5mm.
First power supply roller
Employ the first power supply roller made of aluminum, the center of this roller is connected with the positive terminal of power supply.
Negative pole
Negative pole made of aluminum is provided with in the first tank room.As shown in fig. 1, negative pole is set in following two positions: a negative pole is placed in above matrix, and another negative pole is placed in below matrix.
First tank room
In order to carry out electrolysis in the first tank room between matrix and negative pole, current density is set to 10A/dm 2.
Second power supply roller
Use the second power supply roller of aluminum, roller center is connected with the negative terminal of power supply.
Positive pole
The positive pole of aluminum is placed in the second tank room.As shown in fig. 1, positive pole is set in following two positions: a positive pole is placed in above matrix, and another positive pole is placed in below matrix.
Second tank room
In order to carry out electrolysis in the second tank room between matrix and positive pole, current density is set to 5A/dm 2.
The above-mentioned matrix through conductive processing is sent to ten continuously all to be had in the aluminium device of said structure, to form aluminium plated film on matrix surface.This operates in aluminium film matrix surface defining 10 μm.The plated film formed is even and high-quality film.
As mentioned above, verified, even if when this operation employs the matrix being formed with pellumina on the surface, use device of aluminizing of the present invention still can form high-quality aluminium plated film.
Embodiment 2
As shown in Figure 2, the device of aluminizing of routine is placed on the side, most upstream on matrix delivery direction.The aluminium device of the present invention used in 9 embodiments 1 is placed in a series arrangement above-mentioned routine to aluminize the downstream side of device, thus on matrix, forms aluminium plated film.
Matrix
Employ the resin molded body with tridimensional network in the same manner as in Example 1.
By being coated on the surface of resin porous insert by the carbon coating as conductive coating paint, thus carry out the electroconductibility process of resin molded body.This carbon coating contain 25% carbon granule, resin glue, introfier and defoamer.The particle diameter of carbon black is 0.5 μm.
To aluminize device
Described routine device (it is placed in the side, most upstream on matrix delivery direction) of aluminizing has the identical structure of the second tank room of aluminize device used with embodiment 1.More specifically, plating solution, power supply roller and positive pole have roller of powering with plating solution used in embodiment 1, second structure identical with positive pole respectively.
Second aluminize device and device of aluminizing subsequently identical with the structure of device of aluminizing used in embodiment 1.Above-mentioned nine devices are arranged in a series arrangement.
Matrix effects on surface being formed with aluminium plated film is observed, and result shows the aluminium film defining 10 μm on matrix surface, and the plated film formed is even and high-quality film.
Comparative example 1
By the operation identical with operation used in embodiment 1, matrix surface is formed aluminium plated film, and difference is: as device of aluminizing, and employs 10 routines of placing in a series arrangement and to aluminize device.To aluminize device as described routine, employ in embodiment 2 device of aluminizing being placed in side, most upstream.In the same manner as in Example 1, the space of aluminizing between device is full of nitrogen, to form inert atmosphere.
Observe the aluminium plated film that is formed on matrix surface, result shows, this formation of deposits island, and film quality is inferior to the film quality formed by using the device of embodiment 1.
Comparative example 2
By the operation identical with operation used in embodiment 2, matrix surface is formed aluminium plated film, and difference is: as device of aluminizing, and employs 10 routines of placing in a series arrangement and to aluminize device.To aluminize device as described routine, employ in embodiment 2 device of aluminizing being placed in side, most upstream.In the same manner as in Example 2, the space of aluminizing between device is full of nitrogen, to form inert atmosphere.
Observe the aluminium plated film that is formed on matrix surface, result shows, this formation of deposits island, and film quality is inferior to the film quality formed by using the device of embodiment 2.
Symbol list
101: matrix
102: coating bath
103: division plate
104: the first tank rooms
105: the second tank rooms
106: the first power supply rollers
107: negative pole
108: the second power supply rollers
109: positive pole
110: the second transfer rollers
111: the second transfer rollers
202: coating bath
208: power supply roller
209: positive pole

Claims (8)

1. aluminize a device, it is for by transfer matrix in coating bath thus by Aliminuium electrodeposition to described matrix, the feature of described device is:
Upstream side on the delivery direction of described matrix, described coating bath is divided into the first tank room and the second tank room successively by division plate;
In described first tank room being provided with negative pole, this negative pole is electrically connected with described matrix in the mode making described matrix and serve as positive pole; And
In described second tank room being provided with positive pole, this positive pole is electrically connected with described matrix in the mode making described matrix and serve as negative pole.
2. device of aluminizing according to claim 1, described device comprises the first power supply roller of the upstream side of the entrance being positioned at described first tank room, and this first power supply roller applies current potential to described matrix and transmits described matrix simultaneously.
3. device of aluminizing according to claim 1 and 2, described device comprises the second power supply roller in the downstream side of the outlet being positioned at described second tank room, and this second power supply roller applies current potential to described matrix and transmits described matrix simultaneously.
4. device of aluminizing as claimed in any of claims 1 to 3, wherein said coating bath accommodates the molten salt bath formed primarily of aluminum chloride.
5. device of aluminizing as claimed in any of claims 1 to 4, wherein said matrix is by through conductive processing and the sheet material that forms of the resin molded body with tridimensional network.
6. to aluminize a device, comprise two or more device of aluminizing all as claimed in any of claims 1 to 5;
Device described in these is placed in a series arrangement along the delivery direction of described matrix.
7. to aluminize a device, comprise such device of aluminizing:
This device of aluminizing is arranged in the anterior position of the device of aluminizing described in claim 1 to 6 any one, and this anterior position is the upstream-most position on the delivery direction of described matrix;
This device of aluminizing transmits in coating bath by making described matrix, thus by Aliminuium electrodeposition on described matrix; And
The feature of this device of aluminizing is, in the described coating bath being provided with positive pole, this positive pole is electrically connected with described matrix in the mode making described matrix and serve as negative pole.
8. manufacture a method for aluminium film, the method utilizes device of aluminizing in claim 1 to 7 described in any one by Aliminuium electrodeposition on matrix.
CN201380046112.4A 2012-09-05 2013-06-13 Aluminum plating apparatus and method for producing aluminum film using same Pending CN104603332A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-194779 2012-09-05
JP2012194779A JP5880364B2 (en) 2012-09-05 2012-09-05 Aluminum plating apparatus and aluminum film manufacturing method using the same
PCT/JP2013/066294 WO2014038263A1 (en) 2012-09-05 2013-06-13 Aluminum plating apparatus and method for producing aluminum film using same

Publications (1)

Publication Number Publication Date
CN104603332A true CN104603332A (en) 2015-05-06

Family

ID=50236886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380046112.4A Pending CN104603332A (en) 2012-09-05 2013-06-13 Aluminum plating apparatus and method for producing aluminum film using same

Country Status (6)

Country Link
US (1) US20150211143A1 (en)
JP (1) JP5880364B2 (en)
KR (1) KR20150046013A (en)
CN (1) CN104603332A (en)
DE (1) DE112013004355T5 (en)
WO (1) WO2014038263A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107644973A (en) * 2017-09-21 2018-01-30 中航锂电技术研究院有限公司 A kind of complex lithium band process units and production method
CN110546312A (en) * 2017-05-16 2019-12-06 住友电气工业株式会社 aluminum-plated film and method for preparing aluminum-plated film
CN113630963A (en) * 2021-07-08 2021-11-09 广州美维电子有限公司 Method for improving deformation of ultrathin plate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014210959A (en) * 2013-04-19 2014-11-13 日東電工株式会社 Plating apparatus, plating method, manufacturing method of wiring circuit board, and wiring circuit board
DE102015121349A1 (en) * 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Apparatus for surface treatment of a continuous material and its use
WO2021164474A1 (en) * 2020-02-20 2021-08-26 深圳市海瀚新能源技术有限公司 Coating conductive device, coating system and coating method for conductive film
TWI806455B (en) * 2022-03-01 2023-06-21 日商荏原製作所股份有限公司 Plating device and plating method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129485A (en) * 1976-10-12 1978-12-12 Agency Of Industrial Science & Technology Method for electrolytic removal of scale from band steel
CN1495296A (en) * 2002-09-20 2004-05-12 关西工程有限会社 Electroplating method and device for wire stock, and electroplate wire stock
JP2010232171A (en) * 2009-03-05 2010-10-14 Hitachi Metals Ltd Aluminum porous material and its manufacturing method, and power storage device using the aluminum porous material as electrode current collector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126999A (en) * 1980-10-06 1982-08-06 Fuji Photo Film Co Ltd Electrolytic treatment of strip like metal plate
JPS60100697A (en) * 1983-11-02 1985-06-04 Fuji Photo Film Co Ltd Electrolytic treatment
AT399167B (en) * 1991-06-10 1995-03-27 Andritz Patentverwaltung METHOD AND DEVICE FOR ELECTROLYTICALLY STICKING CONTINUOUSLY CONTINUOUS ELECTRICALLY CONDUCTIVE GOODS
TW200741037A (en) * 2006-01-30 2007-11-01 Ibiden Co Ltd Plating apparatus and plating method
JP2008218777A (en) * 2007-03-06 2008-09-18 Bridgestone Corp Production process of light-permeable electromagnetic wave shielding material
JP2012144763A (en) * 2011-01-11 2012-08-02 Sumitomo Electric Ind Ltd Method for producing aluminum structure, and aluminum structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129485A (en) * 1976-10-12 1978-12-12 Agency Of Industrial Science & Technology Method for electrolytic removal of scale from band steel
CN1495296A (en) * 2002-09-20 2004-05-12 关西工程有限会社 Electroplating method and device for wire stock, and electroplate wire stock
JP2010232171A (en) * 2009-03-05 2010-10-14 Hitachi Metals Ltd Aluminum porous material and its manufacturing method, and power storage device using the aluminum porous material as electrode current collector

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
T. JIANG ET AL: "Electrodeposition of aluminium from ionic liquids: Part I—electrodeposition and surface morphology of aluminium from aluminium chloride (AlCl3)–1-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquid", 《SURFACE & COATINGS TECHNOLOGY》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110546312A (en) * 2017-05-16 2019-12-06 住友电气工业株式会社 aluminum-plated film and method for preparing aluminum-plated film
CN107644973A (en) * 2017-09-21 2018-01-30 中航锂电技术研究院有限公司 A kind of complex lithium band process units and production method
CN107644973B (en) * 2017-09-21 2023-12-15 中创新航技术研究院(江苏)有限公司 Composite lithium belt production device and production method
CN113630963A (en) * 2021-07-08 2021-11-09 广州美维电子有限公司 Method for improving deformation of ultrathin plate

Also Published As

Publication number Publication date
KR20150046013A (en) 2015-04-29
DE112013004355T5 (en) 2015-05-28
JP5880364B2 (en) 2016-03-09
JP2014051687A (en) 2014-03-20
US20150211143A1 (en) 2015-07-30
WO2014038263A1 (en) 2014-03-13

Similar Documents

Publication Publication Date Title
CN104603332A (en) Aluminum plating apparatus and method for producing aluminum film using same
US8110076B2 (en) Apparatus and foam electroplating process
CN104053824A (en) Method for manufacturing aluminum film and method for manufacturing aluminum foil
USRE30005E (en) Method for the electrolytic recovery of metal employing improved electrolyte convection
JP5950162B2 (en) Method for producing aluminum film
JP5791021B2 (en) Aluminum molded body manufacturing method, aluminum analysis method, and aluminum plating system
CN202440558U (en) Electroplating device of strip materials
CN105980606A (en) Aluminum film manufacturing method and manufacturing device
JPS58199895A (en) Method and apparatus for plating metal wire
KR20120063824A (en) Electric plating apparatus with horizontal cell
CN107740173A (en) A kind of quality of edges control method of high tin amount tin plate
US11117805B2 (en) Roll-to-roll graphene production, transfer of graphene, and substrate recovery
JP5704026B2 (en) Method for manufacturing aluminum structure
US4702812A (en) Electrolytic apparatus and a method of operating it
CN113529140B (en) Novel electrolytic copper foil production method
CN218175174U (en) Plating solution tank for film plating machine and film plating machine
CN113445084B (en) Electrolytic copper foil raw foil device
CN215757681U (en) Novel electrolytic copper foil raw foil device
KR20120029206A (en) Electroplating hanger
GB338173A (en) Continuous electrolytic process for the production of metallic sheets, strip and ribbon
EP0362924B1 (en) Apparatus for the continuous electrolytic treatment of wire-shaped objects
JP2012255187A (en) Manufacturing method and manufacturing apparatus for aluminum porous body
US20200109486A1 (en) Plating device for printed interconnect boards and metal jig
JPS61113790A (en) Method and apparatus for applying metal layer to web or ropeby electroplating
KR20010063655A (en) Tin electroplating process using insoluble anode for the metal strip

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150506

WD01 Invention patent application deemed withdrawn after publication