CN1495296A - Electroplating method and device for wire stock, and electroplate wire stock - Google Patents
Electroplating method and device for wire stock, and electroplate wire stock Download PDFInfo
- Publication number
- CN1495296A CN1495296A CNA031249175A CN03124917A CN1495296A CN 1495296 A CN1495296 A CN 1495296A CN A031249175 A CNA031249175 A CN A031249175A CN 03124917 A CN03124917 A CN 03124917A CN 1495296 A CN1495296 A CN 1495296A
- Authority
- CN
- China
- Prior art keywords
- plated wire
- anode
- polar body
- plated
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP275386/2002 | 2002-09-20 | ||
JP2002275386A JP4177626B2 (en) | 2002-09-20 | 2002-09-20 | Electroplating method of wire, electroplating apparatus, and electroplated wire |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1495296A true CN1495296A (en) | 2004-05-12 |
CN100500948C CN100500948C (en) | 2009-06-17 |
Family
ID=32271602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031249175A Expired - Fee Related CN100500948C (en) | 2002-09-20 | 2003-09-19 | Electroplating method and device for wire stock, and electroplating wire stock |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4177626B2 (en) |
KR (1) | KR20040025854A (en) |
CN (1) | CN100500948C (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102888634A (en) * | 2011-07-18 | 2013-01-23 | 天津市大港镀锌厂 | Method for enhancing corrosion resistance of galvanizing layer |
CN103590079A (en) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | Electroplating method |
CN104603332A (en) * | 2012-09-05 | 2015-05-06 | 住友电气工业株式会社 | Aluminum plating apparatus and method for producing aluminum film using same |
CN107142485A (en) * | 2017-05-18 | 2017-09-08 | 广西正润新材料科技有限公司 | A kind of method of mesohigh anode high-purity aluminum foil surface generalization modification |
CN109807554A (en) * | 2019-01-15 | 2019-05-28 | 江阴润源机械有限公司 | A kind of manufacturing process of cold roll |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108342753A (en) * | 2018-04-24 | 2018-07-31 | 哈尔滨秋冠光电科技有限公司 | A kind of method of continuous production diamond wire |
-
2002
- 2002-09-20 JP JP2002275386A patent/JP4177626B2/en not_active Expired - Fee Related
-
2003
- 2003-09-19 KR KR1020030065079A patent/KR20040025854A/en not_active Application Discontinuation
- 2003-09-19 CN CNB031249175A patent/CN100500948C/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102888634A (en) * | 2011-07-18 | 2013-01-23 | 天津市大港镀锌厂 | Method for enhancing corrosion resistance of galvanizing layer |
CN103590079A (en) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | Electroplating method |
CN104603332A (en) * | 2012-09-05 | 2015-05-06 | 住友电气工业株式会社 | Aluminum plating apparatus and method for producing aluminum film using same |
CN107142485A (en) * | 2017-05-18 | 2017-09-08 | 广西正润新材料科技有限公司 | A kind of method of mesohigh anode high-purity aluminum foil surface generalization modification |
CN107142485B (en) * | 2017-05-18 | 2019-04-09 | 广西正润新材料科技有限公司 | A kind of method of mesohigh anode high-purity aluminum foil surface generalization modification |
CN109807554A (en) * | 2019-01-15 | 2019-05-28 | 江阴润源机械有限公司 | A kind of manufacturing process of cold roll |
CN109807554B (en) * | 2019-01-15 | 2020-09-22 | 江阴润源机械有限公司 | Manufacturing process of cold roll |
Also Published As
Publication number | Publication date |
---|---|
JP4177626B2 (en) | 2008-11-05 |
JP2004107776A (en) | 2004-04-08 |
KR20040025854A (en) | 2004-03-26 |
CN100500948C (en) | 2009-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: ONO WIRE CO., LTD. Effective date: 20040924 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20040924 Address after: Osaka Japan Applicant after: Kansai Engineering Co., Ltd. Address before: Osaka Japan Applicant before: Kansai Engineering Co., Ltd. Co-applicant before: Onokazu wire Corp |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090617 Termination date: 20120919 |