CN113630963A - Method for improving deformation of ultrathin plate - Google Patents
Method for improving deformation of ultrathin plate Download PDFInfo
- Publication number
- CN113630963A CN113630963A CN202110771429.0A CN202110771429A CN113630963A CN 113630963 A CN113630963 A CN 113630963A CN 202110771429 A CN202110771429 A CN 202110771429A CN 113630963 A CN113630963 A CN 113630963A
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- Prior art keywords
- core plate
- thin core
- horizontal copper
- plate
- thin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 82
- 229910052802 copper Inorganic materials 0.000 claims abstract description 82
- 239000010949 copper Substances 0.000 claims abstract description 82
- 238000009713 electroplating Methods 0.000 claims abstract description 54
- 230000008021 deposition Effects 0.000 claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 30
- 238000002360 preparation method Methods 0.000 claims description 31
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000003749 cleanliness Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 4
- 239000012792 core layer Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 208000029152 Small face Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for improving the deformation of an ultrathin plate, which comprises the steps of selecting a thin core plate and processing the thin core plate in place according to the required size; adjusting the position and the tension direction of a clamping point of the thin core plate in the horizontal copper deposition flash plating and the surface size of the thin core plate, so that a single hole is clamped in the horizontal copper deposition flash plating and the small size faces upwards; pulling the thin core plate along a first direction to carry out copper deposition flash plating; adjusting the position and the tension direction of a clamping point of the thin core plate in primary horizontal copper filling electroplating and the plate placing times to ensure that double holes are clamped and small sides are upward in the primary horizontal copper filling electroplating; pulling the thin core plate along the first direction to perform horizontal copper filling electroplating for one time; adjusting the position and the tension direction of a clamping point of the thin core plate in secondary horizontal copper filling electroplating and the plate placing surface, so that a single hole is clamped and the small surface faces upwards in the secondary horizontal copper filling electroplating; and pulling the thin core plate along a second direction opposite to the first direction to perform horizontal copper filling electroplating for the second time. The tension at the position of the electroplating clamping point is complemented, and the problem of pulling deformation of the thin core plate is solved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for improving deformation of an ultrathin board.
Background
At present, circuit boards are classified into three major categories, i.e., single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight. The circuit board is classified into a Flexible Printed Circuit (FPC), a rigid Printed Circuit (PCB) and a Flexible Printed Circuit Board (FPCB) according to characteristics.
However, the conventional multilayer board has the following drawbacks:
1. in the high-end multilayer plate structure at the present stage, the middle core layer is designed to be thinner and thinner (the thickness of the core layer is 1.6-2.5 mil), the number of holes of laser drilling holes is as high as 80-150 million holes, a thin plate after laser drilling holes needs to be subjected to horizontal copper deposition flash plating LB, first horizontal copper filling electroplating CU18-1 and second horizontal copper filling electroplating CU18-2, and after the thin core layer is pulled by multiple horizontal electroplating lines, the plate is seriously deformed at the pulling position.
2. The deformation of the plate increases the risk of blind hole collapse of the pattern, the blind hole welding ring is enlarged and the CFM windowing process is changed in the early stage of testing, and the defective rate of the blind hole collapse of the pattern is high in the test result, so that a technological method for improving the deformation of the ultrathin plate is required to be found.
Disclosure of Invention
In order to overcome the disadvantages of the prior art, an object of the present invention is to provide a method for improving the deformation of an ultra-thin plate, which can solve the problem of severe plate deformation.
One of the purposes of the invention is realized by adopting the following technical scheme:
a method for improving the deformation of an ultrathin plate comprises the following steps:
cutting preparation: selecting a thin core plate and processing the thin core plate in place according to the required size;
a first preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in the horizontal copper deposition flash plating and the surface size of the thin core plate, so that a single hole is clamped in the horizontal copper deposition flash plating and the small size faces upwards;
the copper deposition flash plating step: pulling the thin core plate along a first direction to carry out copper deposition flash plating;
a secondary preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in primary horizontal copper filling electroplating and the plate placing times to ensure that double holes are clamped and small sides are upward in the primary horizontal copper filling electroplating;
a step of horizontal copper filling electroplating: pulling the thin core plate along the first direction to carry out horizontal copper deposition flash plating;
the third preparation step: adjusting the position and the tension direction of the thin core plate at the clamping point of the secondary horizontal copper filling electroplating and the plate placing surface, so that a single hole is clamped in the secondary horizontal copper filling electroplating and the small surface faces upwards;
secondary horizontal copper filling electroplating step: and pulling the thin core plate along a second direction opposite to the first direction to perform horizontal copper filling electroplating for the second time.
Further, in the cutting preparation step, whether the size is processed in place or not is checked, if so, the next step is executed, and if not, the reworking treatment is carried out.
Further, in the material cutting preparation step, the surface is cleaned after the machining is completed.
Further, in the cutting preparation step, whether the surface smoothness and the cleanliness of the thin core plate meet requirements or not is checked, if yes, the next step is executed, and if not, rework treatment or scrap treatment is carried out.
Further, in the cutting preparation step, a thin core plate with the thickness of 1.6-2.5mil is selected.
Further, in the primary preparation step, whether the clamping part in the horizontal copper deposition flash plating is a single hole or not and whether the small surface faces upwards or not is checked, if so, the next step is executed, and if not, readjustment is carried out.
Further, in the secondary preparation step, whether the clamping hole is a double hole or not and whether the small face faces upwards in the primary horizontal copper filling electroplating is checked, if so, the next step is executed, and if not, readjustment is carried out.
Further, in the third preparation step, whether the clamping hole in the second horizontal copper filling electroplating is a single hole or a small hole is upward is checked, if so, the next step is executed, and if not, readjustment is performed.
Further, in the step of copper deposition flash plating, the thin core plate is pulled leftwards to perform copper deposition flash plating.
Further, in the secondary horizontal copper filling electroplating step, the thin core plate is pulled rightwards to carry out secondary horizontal copper filling electroplating.
Compared with the prior art, the invention has the beneficial effects that:
selecting a thin core plate and processing the thin core plate in place according to the required size; adjusting the position and the tension direction of a clamping point of the thin core plate in the horizontal copper deposition flash plating and the surface size of the thin core plate, so that a single hole is clamped in the horizontal copper deposition flash plating and the small size faces upwards; pulling the thin core plate along a first direction to carry out copper deposition flash plating; adjusting the position and the tension direction of a clamping point of the thin core plate in primary horizontal copper filling electroplating and the plate placing times to ensure that double holes are clamped and small sides are upward in the primary horizontal copper filling electroplating; pulling the thin core plate along the first direction to perform horizontal copper filling electroplating for one time; adjusting the position and the tension direction of a clamping point of the thin core plate in secondary horizontal copper filling electroplating and the plate placing surface, so that a single hole is clamped and the small surface faces upwards in the secondary horizontal copper filling electroplating; and pulling the thin core plate along a second direction opposite to the first direction to perform horizontal copper filling electroplating for the second time. The tension at the position of the electroplating clamping point is complemented, and the problem of pulling deformation of the thin core plate is solved. When electroplating, the direction and the number of the plate walking are specified, the uniformity of the copper thickness of the plate surface is improved, the copper thickness is uniformly distributed and has a strong rule, the grabbing of DES etching parameters is strongly helped, and the etching yield is effectively improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a method for improving the deformation of an ultra-thin plate according to a preferred embodiment of the present invention;
FIG. 2 is a schematic view of a pinch point location;
fig. 3 is a stacked pattern of a multilayer board.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a method for improving the deformation of an ultra-thin plate includes the following steps:
cutting preparation: selecting a thin core plate and processing the thin core plate in place according to the required size; preferably, in the cutting preparation step, whether the size is processed in place or not is checked, if so, the next step is executed, and if not, the reworking treatment is carried out. And cleaning the surface after finishing the processing. And (4) checking whether the surface finish and the cleanliness of the thin core plate meet the requirements, if so, executing the next step, and if not, performing rework treatment or scrapping treatment.
Preferably, in the cutting preparation step, a thin core board with the thickness of 1.6-2.5mil is selected.
A first preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in the horizontal copper deposition flash plating and the surface size of the thin core plate, so that a single hole is clamped in the horizontal copper deposition flash plating and the small size faces upwards; preferably, in the one-time preparation step, whether the clamping part in the horizontal copper deposition flash plating is a single hole or a small-scale part is upward is checked, if so, the next step is executed, and if not, readjustment is carried out.
The copper deposition flash plating step: pulling the thin core plate along a first direction to carry out copper deposition flash plating;
a secondary preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in primary horizontal copper filling electroplating and the plate placing times to ensure that double holes are clamped and small sides are upward in the primary horizontal copper filling electroplating; preferably, in the secondary preparation step, whether the clamping hole is a double hole or a small hole is upward in the primary horizontal copper filling electroplating is checked, if so, the next step is executed, and if not, readjustment is performed.
A step of horizontal copper filling electroplating: pulling the thin core plate along the first direction to perform horizontal copper filling electroplating for one time;
the third preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in secondary horizontal copper filling electroplating and the plate placing surface, so that a single hole is clamped and the small surface faces upwards in the secondary horizontal copper filling electroplating; preferably, in the three preparation steps, whether the clamping hole in the secondary horizontal copper filling electroplating is a single hole or a small hole is upward is checked, if so, the next step is executed, and if not, readjustment is performed.
Secondary horizontal copper filling electroplating step: and pulling the thin core plate along a second direction opposite to the first direction to perform horizontal copper filling electroplating for the second time. The tension at the position of the electroplating clamping point is complemented, and the problem of pulling deformation of the thin core plate is solved. When electroplating, the direction and the number of the plate walking are specified, the uniformity of the copper thickness of the plate surface is improved, the copper thickness is uniformly distributed and has a strong rule, the grabbing of DES etching parameters is strongly helped, and the etching yield is effectively improved.
Specifically, when the pattern is exposed in a transferring manner, the deformation of the thin core plate is small, and the problem of pattern collapse blind holes caused by plate deformation is reduced.
Specifically, in the step of copper deposition flash plating, the thin core plate is pulled leftwards to perform copper deposition flash plating, namely, the first direction is leftwards. In the secondary horizontal copper filling electroplating step, the thin core plate is pulled rightwards to carry out secondary horizontal copper filling electroplating, namely the second direction is rightwards. In the present application, the single hole is a single L-hole, and the double holes are double L-holes, please refer to fig. 2 specifically, which is a schematic diagram of the pinch point position of the present application. Referring specifically to FIG. 3, a multilayer board of the present invention is shown.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A method for improving the deformation of an ultrathin plate is characterized by comprising the following steps:
cutting preparation: selecting a thin core plate and processing the thin core plate in place according to the required size;
a first preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in the horizontal copper deposition flash plating and the surface size of the thin core plate, so that a single hole is clamped in the horizontal copper deposition flash plating and the small size faces upwards;
the copper deposition flash plating step: pulling the thin core plate along a first direction to carry out copper deposition flash plating;
a secondary preparation step: adjusting the position and the tension direction of a clamping point of the thin core plate in primary horizontal copper filling electroplating and the plate placing times to ensure that double holes are clamped and small sides are upward in the primary horizontal copper filling electroplating;
a step of horizontal copper filling electroplating: pulling the thin core plate along the first direction to carry out horizontal copper deposition flash plating;
the third preparation step: adjusting the position and the tension direction of the thin core plate at the clamping point of the secondary horizontal copper filling electroplating and the plate placing surface, so that a single hole is clamped in the secondary horizontal copper filling electroplating and the small surface faces upwards;
secondary horizontal copper filling electroplating step: and pulling the thin core plate along a second direction opposite to the first direction to perform horizontal copper filling electroplating for the second time.
2. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the cutting preparation step, whether the size is processed in place or not is checked, if so, the next step is executed, and if not, the reworking treatment is carried out.
3. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the cutting preparation step, the surface is cleaned after the machining is completed.
4. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the cutting preparation step, whether the surface smoothness and the cleanliness of the thin core plate meet the requirements or not is checked, if yes, the next step is executed, and if not, reworking treatment or scrapping treatment is carried out.
5. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the cutting preparation step, a thin core plate with the thickness of 1.6-2.5mil is selected.
6. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the primary preparation step, whether the clamping part in the horizontal copper deposition flash plating is a single hole or not and whether the small surface faces upwards or not is checked, if so, the next step is executed, and if not, readjustment is carried out.
7. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the secondary preparation step, whether the clamping hole is a double hole or not and whether the small surface faces upwards in the primary horizontal copper filling electroplating is checked, if so, the next step is executed, and if not, readjustment is carried out.
8. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the third preparation step, whether the clamping hole in the second horizontal copper filling electroplating is a single hole or a small hole is upward is checked, if so, the next step is executed, and if not, readjustment is carried out.
9. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: and in the step of copper deposition flash plating, the thin core plate is pulled leftwards to perform copper deposition flash plating.
10. The method for improving the deformation of an ultra-thin plate as claimed in claim 1, wherein: in the secondary horizontal copper filling electroplating step, the thin core plate is pulled rightwards to carry out secondary horizontal copper filling electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110771429.0A CN113630963A (en) | 2021-07-08 | 2021-07-08 | Method for improving deformation of ultrathin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110771429.0A CN113630963A (en) | 2021-07-08 | 2021-07-08 | Method for improving deformation of ultrathin plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113630963A true CN113630963A (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110771429.0A Pending CN113630963A (en) | 2021-07-08 | 2021-07-08 | Method for improving deformation of ultrathin plate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1788337A (en) * | 2003-05-27 | 2006-06-14 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| CN104603332A (en) * | 2012-09-05 | 2015-05-06 | 住友电气工业株式会社 | Aluminum plating apparatus and method for producing aluminum film using same |
| CN108884583A (en) * | 2016-03-30 | 2018-11-23 | 株式会社尼康 | Plating processing method, plating processing unit and sensor device |
| CN112437558A (en) * | 2020-11-16 | 2021-03-02 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
| CN112492776A (en) * | 2020-12-21 | 2021-03-12 | 惠州市大亚湾科翔科技电路板有限公司 | Method for selective plating of inner blind holes of ultrathin plate |
-
2021
- 2021-07-08 CN CN202110771429.0A patent/CN113630963A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1788337A (en) * | 2003-05-27 | 2006-06-14 | 株式会社荏原制作所 | Plating apparatus and plating method |
| CN101270493A (en) * | 2007-03-23 | 2008-09-24 | 富士胶片株式会社 | Method and apparatus for producing conductive material |
| CN104603332A (en) * | 2012-09-05 | 2015-05-06 | 住友电气工业株式会社 | Aluminum plating apparatus and method for producing aluminum film using same |
| CN108884583A (en) * | 2016-03-30 | 2018-11-23 | 株式会社尼康 | Plating processing method, plating processing unit and sensor device |
| CN112437558A (en) * | 2020-11-16 | 2021-03-02 | 淮安特创科技有限公司 | Blind hole electroplating hole filling method and circuit board |
| CN112492776A (en) * | 2020-12-21 | 2021-03-12 | 惠州市大亚湾科翔科技电路板有限公司 | Method for selective plating of inner blind holes of ultrathin plate |
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