CN107740173A - A kind of quality of edges control method of high tin amount tin plate - Google Patents
A kind of quality of edges control method of high tin amount tin plate Download PDFInfo
- Publication number
- CN107740173A CN107740173A CN201710833204.7A CN201710833204A CN107740173A CN 107740173 A CN107740173 A CN 107740173A CN 201710833204 A CN201710833204 A CN 201710833204A CN 107740173 A CN107740173 A CN 107740173A
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- China
- Prior art keywords
- electroplating bath
- tin
- electroplating
- bath
- current density
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Abstract
The invention discloses a kind of quality of edges control method of high tin amount tin plate, in the tin plating producing line of soluble anode, P electroplating bath is configured with, each electroplating bath is configured with corresponding pressure roller and conductive rollers, the pure tin bar of anode is configured with as tin plating source in each electroplating bath；Wherein, the tin ion concentration in the electroplate liquid of P electroplating bath is all controlled in 19~25g/L；And the current density of M electroplating bath in P electroplating bath is controlled in 28~30A/dm2, the current density of N number of electroplating bath in P electroplating bath controlled in 20~28A/dm2；During tin plating, in M electroplating bath, strip sequentially pass through M electroplating bath carry out it is tin plating after, rolled by pressure roller corresponding to M electroplating bath and conductive rollers mutual cooperation；Afterwards, strip sequentially pass through N number of electroplating bath carry out it is tin plating after, cooperated and rolled by pressure roller corresponding to N number of electroplating bath and conductive rollers, turn into high tin amount tin plate.
Description
Technical field
The application is related to metal material processing technology field, more particularly to a kind of quality of edges control of high tin amount tin plate
Method.
Background technology
Tin plate refers to that two sides is coated with the cold-rolled low carbon steel thin plate of pure tin, and it is anti-corrosion by the intensity of steel and formability and tin
Property, tin-welding are incorporated among a kind of material.The tin plate that tin coating weight therein is 11.2g/m2 is high tin amount tin plate.It is solvable
Property the tin plating producing line of anode refer to, in electroplating process required for tin ion derive from anode pure tin bar, with electroplating process
Progress, tin bar gradually dissolve consumption, it is necessary to constantly change anode tin bar ensure tin ion continuous supply.
During the strip that the tin plating production line of soluble anode produces high tin coating weight, due to soluble anode production line without
Method weakens the edge effect in electroplating process using steel edge portion protective cover, causes the tin layers of steel edge portion to occur and extremely dredges
The coating structure of pine.The loose coating of this steel edge portion is on roller surfaces and cumulative with behind roller contact position, being adhered to,
Ultimately result in that pressure roller is destroyed and finished strip edge has glass putty and dropped.And the speed of this conductive rollers pressure roller damage is very
It hurry up, about produce two coiled strip steels, the roll surface of its conductive rollers pressure roller will damage, and can not ensure the continuous production of strip, and strip edge
Portion is of poor quality.
The content of the invention
Invention provides a kind of quality of edges control method of high tin amount tin plate, to solve the tin layers of steel edge portion
The technical problem of extremely loose coating structure occurs.
In order to solve the above technical problems, the invention provides a kind of quality of edges control method of high tin amount tin plate, institute
The method of stating includes：
In the tin plating producing line of soluble anode, P electroplating bath is configured with, each electroplating bath is configured with corresponding pressure roller and led
Electric roller, the pure tin bar of anode is configured with as tin plating source in each electroplating bath；Wherein, in the electroplate liquid of the P electroplating bath
Tin ion concentration all control in 19~25g/L；And the current density of M electroplating bath in the P electroplating bath is controlled 28
~30A/dm2, the current density of N number of electroplating bath in the P electroplating bath controlled in 20~28A/dm2；
During tin plating, in the M electroplating bath, strip sequentially pass through M electroplating bath carry out it is tin plating after, pass through M
Pressure roller corresponding to individual electroplating bath and conductive rollers, which cooperate, to be rolled；
Afterwards, strip sequentially pass through N number of electroplating bath carry out it is tin plating after, pass through pressure roller and conduction corresponding to N number of electroplating bath
Roller cooperates and rolled, and turns into the high tin amount tin plate.
Preferably, the tin ion concentration in the electroplate liquid of the P electroplating bath is all controlled in 19~25g/L, is under
What the method in face obtained：
Using the method for reducing insolubility anodic current density, the bath concentration control of the P electroplating bath is existed
19~25g/L.
Preferably, the pressure roller of each electroplating bath configuration and the material of conductive rollers are：EU.
Preferably, the P electroplating bath is specially 9 electroplating baths.
Preferably, in 9 electroplating baths, the current density of preceding 5 electroplating baths is controlled in 28~30A/dm2, latter 4
The current density of electroplating bath is controlled in 20~28A/dm2。
Preferably, methods described also includes：
The high tin amount tin plate is monitored, the actual edge glass putty value of high tin amount tin plate described in Real-time Feedback.
Preferably, methods described also includes：
The actual edge glass putty value and default glass putty value are compared；
If the actual edge glass putty value is more than the default glass putty value, control system is fed back to, by control system control
System reduces the current density of the P electroplating bath.
By one or the P technical scheme of the present invention, the invention has the advantages that or advantage：
, will be in the tin plating producing line of soluble anode the invention discloses a kind of quality of edges control method of high tin amount tin plate
On P electroplating bath electroplate liquid in tin ion concentration all control in 19~25g/L；And M electricity in the P electroplating bath
The current density of coating bath is controlled in 28~30A/dm2, the current density of N number of electroplating bath in the P electroplating bath controlled 20
~28A/dm2；And it is tin plating during, in the M electroplating bath, strip sequentially pass through M electroplating bath carry out it is tin plating after, lead to
Cross pressure roller corresponding to M electroplating bath and conductive rollers cooperate and rolled；Afterwards, strip sequentially passes through N number of electroplating bath and carried out
After tin plating, cooperated and rolled by pressure roller corresponding to N number of electroplating bath and conductive rollers, it is tin plating to turn into the high tin amount
Plate.Because the application controls the current density of tin ion concentration and each electroplating bath, so can reduce on tin plate
Glass putty drops, and improves the high tin amount tin plate quality of edges produced.
Further, the pressure roller of each electroplating bath configuration and the material of conductive rollers are：EU.And then it can keep away
Exempt from the damage of conductive rollers pressure roller and guarantee can continuously produce in enormous quantities.
Brief description of the drawings
Fig. 1 is the structure of electroplating bath in the embodiment of the present invention；
Fig. 2 is a kind of implementation process figure of the quality of edges control method of high tin amount tin plate in the embodiment of the present invention.
Embodiment
In order that the application the technical staff in the technical field is more clearly understood that the application, below in conjunction with the accompanying drawings,
Technical scheme is described in detail by specific embodiment.
The invention discloses a kind of quality of edges control method of high tin amount tin plate, it is particularly suitable for tin coating weight in 11.2g/
m2High tin amount Tinplate Production in, especially suitable for all pyrovinic acid electroplate liquid systems vertical channel soluble anode electroplate
Tin production line.The present invention relates to plating process of tin and the selection of conductive pressure roller material.Main means are to improve bath components
In tin ion concentration；Optimize the current density of each passage in electroplating bath；Change the material of conductive rollers pressure roller.
The specific implementation process for describing the present invention in detail below.
First, Fig. 1 is refer to, introduces the structure of electroplating bath of the present invention in the tin plating producing line of soluble anode.
The present invention is configured with P electroplating bath 4 in the tin plating producing line of soluble anode, and each electroplating bath 4 is configured with corresponding
Pressure roller 1 and conductive rollers 2, the pure tin bar 3 that anode is configured with each electroplating bath 4 are used as tin plating source；Wherein, the P plating
Tin ion concentration in the electroplate liquid of groove 4 is all controlled in 19~25g/L；If the too high whole plate face that can cause tin plate of concentration
Degradation, and concentration is too low can cause not plate tin, so, the application controls the tin ion concentration in electroplate liquid 19
~25g/L.And the current density of the M electroplating bath 4 in the P electroplating bath 4 is controlled in 28~30A/dm2, the P plating
The current density of N number of electroplating bath 4 in groove 4 is controlled in 20~28A/dm2.Also for the tin plating quality of control tin plate.
And in specific implementation process, P electroplating bath 4 is specially 9 electroplating baths 4.It is preceding in 9 electroplating baths 4
The current density of 5 electroplating baths 4 is controlled in 28~30A/dm2, the current density control of rear 4 electroplating baths 4 is in 20~28A/dm2。
And the tin ion concentration in this 9 electroplating baths 4 is all controlled in 19~25g/L.Further, it is tin plating to produce high tin amount
Before plate, using the method for reducing insolubility anodic current density, bath concentration is promoted to 19~25g/L.
For convenience of description with explain the present invention, only marked three electroplating baths 4 in Fig. 1, other electroplating baths 4 and this
The structure of three electroplating baths 4 is similar, so repeat no more.
Certainly, in actual applications, can be in each 4 enterprising rower of electroplating bath for the ease of distinguishing this 9 electroplating baths 4
Number distinguish.Such as mark 1-9, then the current density of the electroplating bath 4 of No. 1-5 is controlled in 28~30A/dm2, the electricity of No. 6-9
The current density of coating bath 4 is controlled in 20~28A/dm2。
Certainly, dropped to further reduce glass putty, the pressure roller 1 and the material of conductive rollers 2 that each electroplating bath 4 configures use
EU.Because EU is wear-resisting, so even glass putty drops, pressure roller 1 and conduction are not interfered with yet
The service life of roller 2, the life-span of pressure roller 1 and conductive rollers 2 can be ensured and the high tin amount plating of continuous production high quality can be reached
The effect of sheet tin.
The tin plating process of explanation in detail below.
Step 11, during tin plating, in the M electroplating bath 4, strip sequentially pass through M electroplating bath 4 carry out it is tin plating it
Afterwards, cooperated and rolled by pressure roller 1 corresponding to M electroplating bath 4 and conductive rollers 2；
Step 12, afterwards, strip sequentially pass through N number of electroplating bath 4 carry out it is tin plating after, pass through N number of electroplating bath 4 corresponding to press
Roller 1 and conductive rollers 2, which cooperate, to be rolled, and turns into the high tin amount tin plate.
Further, the high tin amount tin plate can be monitored, the reality of high tin amount tin plate described in Real-time Feedback
Edge glass putty value.Afterwards, the actual edge glass putty value and default glass putty value are compared；If the actual edge glass putty value
More than the default glass putty value, then control system is fed back to, the electric current that the P electroplating bath 4 is reduced by control system control is close
Degree.
Specifically, according to high tin amount tin plate finished product quality of edges, 6~9 cell current density of electroplating bath 4 are entered
Row regulation, if the more reduction current density of edge glass putty；If edge light meets that standard maintains electric current without glass putty and coating
Density is constant.High tin amount tin plate (thickness of coating >=11.2g/m can effectively be improved using this method2) quality of edges,
Avoid the pressure roller 1 of conductive rollers 2 from damaging, and the high tin amount tin plate of continuous production high quality can be reached.
By one or more embodiment of the present invention, the invention has the advantages that or advantage：
, will be in the tin plating producing line of soluble anode the invention discloses a kind of quality of edges control method of high tin amount tin plate
On P electroplating bath electroplate liquid in tin ion concentration all control in 19~25g/L；And M electricity in the P electroplating bath
The current density of coating bath is controlled in 28~30A/dm2, the current density of N number of electroplating bath in the P electroplating bath controlled 20
~28A/dm2；And it is tin plating during, in the M electroplating bath, strip sequentially pass through M electroplating bath carry out it is tin plating after, lead to
Cross pressure roller corresponding to M electroplating bath and conductive rollers cooperate and rolled；Afterwards, strip sequentially passes through N number of electroplating bath and carried out
After tin plating, cooperated and rolled by pressure roller corresponding to N number of electroplating bath and conductive rollers, it is tin plating to turn into the high tin amount
Plate.Because the application controls the current density of tin ion concentration and each electroplating bath, so produced height can be improved
Tin amount tin plate quality of edges.
Further, the pressure roller of each electroplating bath configuration and the material of conductive rollers are：EU.And then it can keep away
Exempt from the damage of conductive rollers pressure roller and guarantee can continuously produce in enormous quantities.
Although having been described for the preferred embodiment of the application, one of ordinary skilled in the art once knows substantially
Creative concept, then other change and modification can be made to these embodiments.So appended claims are intended to be construed to wrap
Include preferred embodiment and fall into having altered and changing for the application scope.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the application to the application
God and scope.So, if these modifications and variations of the application belong to the scope of the application claim and its equivalent technologies
Within, then the application is also intended to comprising including these changes and modification.
Claims (7)
1. a kind of quality of edges control method of high tin amount tin plate, it is characterised in that methods described includes：
In the tin plating producing line of soluble anode, P electroplating bath is configured with, each electroplating bath is configured with corresponding pressure roller and conduction
Roller, the pure tin bar of anode is configured with as tin plating source in each electroplating bath；Wherein, in the electroplate liquid of the P electroplating bath
Tin ion concentration is all controlled in 19~25g/L；And the current density control of M electroplating bath in the P electroplating bath 28~
30A/dm2, the current density of N number of electroplating bath in the P electroplating bath controlled in 20~28A/dm2；
During tin plating, in the M electroplating bath, strip sequentially pass through M electroplating bath carry out it is tin plating after, pass through M it is electric
Pressure roller corresponding to coating bath and conductive rollers, which cooperate, to be rolled；
Afterwards, strip sequentially pass through N number of electroplating bath carry out it is tin plating after, pass through pressure roller corresponding to N number of electroplating bath and conductive rollers phase
Mutually coordinate and rolled, turn into the high tin amount tin plate.
2. the method as described in claim 1, it is characterised in that described, the tin ion in the electroplate liquid of the P electroplating bath is dense
Degree is all controlled in 19~25g/L, is obtained by the following method：
Using the method for reducing insolubility anodic current density, by the bath concentration control of the P electroplating bath 19~
25g/L。
3. the method as described in claim 1, it is characterised in that the pressure roller of each electroplating bath configuration and the material of conductive rollers
For：EU.
4. the method as described in claim 1, it is characterised in that the P electroplating bath is specially 9 electroplating baths.
5. method as claimed in claim 4, it is characterised in that in 9 electroplating baths, the electric current of preceding 5 electroplating baths is close
Degree control is in 28~30A/dm2, the current density control of rear 4 electroplating baths is in 20~28A/dm2。
6. the method as described in claim 1, it is characterised in that methods described also includes：
The high tin amount tin plate is monitored, the actual edge glass putty value of high tin amount tin plate described in Real-time Feedback.
7. method as claimed in claim 6, it is characterised in that methods described also includes：
The actual edge glass putty value and default glass putty value are compared；
If the actual edge glass putty value is more than the default glass putty value, control system is fed back to, is controlled and dropped by control system
The current density of the low P electroplating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710833204.7A CN107740173B (en) | 2017-09-15 | 2017-09-15 | Edge quality control method of high-tin-content tin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710833204.7A CN107740173B (en) | 2017-09-15 | 2017-09-15 | Edge quality control method of high-tin-content tin plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107740173A true CN107740173A (en) | 2018-02-27 |
| CN107740173B CN107740173B (en) | 2020-12-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710833204.7A Active CN107740173B (en) | 2017-09-15 | 2017-09-15 | Edge quality control method of high-tin-content tin plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107740173B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023496A (en) * | 2018-06-26 | 2018-12-18 | 南通汇丰电子科技有限公司 | It is a kind of for controlling the method and system of electroplated Sn-Bi alloy |
| CN110029381A (en) * | 2019-04-25 | 2019-07-19 | 首钢集团有限公司 | A kind of production method of high tin coating weight tin plate |
| CN114108062A (en) * | 2021-11-02 | 2022-03-01 | 首钢集团有限公司 | Tin plate bright edge defect control method and device |
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| JPS5521544A (en) * | 1978-08-02 | 1980-02-15 | Kawasaki Steel Corp | Method of manufacturing electroplated tin plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023496A (en) * | 2018-06-26 | 2018-12-18 | 南通汇丰电子科技有限公司 | It is a kind of for controlling the method and system of electroplated Sn-Bi alloy |
| CN110029381A (en) * | 2019-04-25 | 2019-07-19 | 首钢集团有限公司 | A kind of production method of high tin coating weight tin plate |
| CN114108062A (en) * | 2021-11-02 | 2022-03-01 | 首钢集团有限公司 | Tin plate bright edge defect control method and device |
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| Publication number | Publication date |
|---|---|
| CN107740173B (en) | 2020-12-15 |
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