JP2014045130A - Wiring board and probe card using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which meets a demand for improving the connection reliability with a conductive pin, and to provide a probe card using the wiring board.SOLUTION: A wiring board 3 according to one embodiment of this invention includes: a first resin layer 15a; a second resin layer 15b where the first resin layer 15a is laminated on an upper surface; a through hole P for insertion of a conductive pin 6 which penetrates the first resin layer 15a and the second resin layer 15b in a lamination direction, the through hole P where the first resin layer 15a and the second resin layer 15b are exposed; a pad 18 for connection of the conductive pin 6 which is positioned on an upper surface of the first resin layer 15a; a first via conductor 17a which penetrates through the first resin layer 15a in a thickness direction and connects with the pad 18; and a first conductive layer 16a which is positioned between the first resin layer 15a and the second resin layer 15b and connects with the first via conductor 17a.

Description

  The present invention relates to a wiring board used in a semiconductor wafer inspection apparatus and the like and a probe card using the same.

  Conventionally, a probe card for inspecting the electrical reliability of a semiconductor wafer is used in a semiconductor wafer inspection apparatus.

  As a probe card, for example, [0002] to [0008] of Patent Document 1 have an electrically insulating material substrate and a conductive cylindrical member penetrating the substrate, and the cylindrical member is a male conductive pin. A configuration is described in which a wiring board fixed to a part of the wiring board by a conductive adhesive such as solder is provided.

  In such a wiring board, when a male pin is inserted or removed, for example, the male pin comes into contact with the conductive cylindrical member and friction is generated. Therefore, mechanical stress is applied to the conductive cylindrical member. May be damaged. As a result, the connection failure between the male pin and the wiring board occurs, and as a result, the connection reliability between the wiring board and the male pin tends to be lowered.

JP-A-10-289770

  The present invention provides a wiring board that meets the demand for improving the connection reliability with conductive pins, and a probe card using the wiring board.

  A wiring board according to an embodiment of the present invention includes a first resin layer, a second resin layer having the first resin layer laminated on an upper surface thereof, and penetrating the first resin layer and the second resin layer in a lamination direction. In addition, a through hole for inserting a conductive pin in which the first resin layer and the second resin layer are exposed, a pad for connecting a conductive pin located on the upper surface of the first resin layer, and the first resin layer A first via conductor penetrating in the thickness direction and connected to the pad; and a first conductive layer located between the first resin layer and the second resin layer and connected to the first via conductor. ing.

  A probe card according to an aspect of the present invention includes the above-described wiring board and a probe, a probe head that is positioned on the upper surface side of the wiring board and connected to the wiring board, and a lower surface side of the wiring board. A main board connected to the wiring board while being positioned, a conductive pin inserted into the through-hole and electrically connecting the wiring board and the main board, and a conductive board electrically connecting the conductive pin and the pad With adhesive.

  According to the wiring board concerning one form of this invention, since the pad for a conductive pin connection located in the upper surface of a 1st resin layer is provided, the connection reliability of a wiring board and a conductive pin can be improved. Further, since the first via conductor connected to the pad and the first conductive layer connected to the first via conductor are provided, the bonding strength between the pad and the first resin layer is increased, and the connection reliability between the wiring board and the conductive pin is increased. Can be improved.

  Moreover, according to the probe card concerning one form of this invention, the probe card excellent in the connection reliability of a wiring board and a conductive pin can be obtained by using the said wiring board.

FIG. 1A is a cross-sectional view of a probe card according to an embodiment of the present invention cut in the thickness direction, and FIG. 1B is an enlarged cross-sectional view of the R1 portion of FIG. FIG. 1C is an enlarged cross-sectional view of the R2 portion of FIG. 2A is a top view of the pad 18 in FIG. 1B, FIG. 2B is a top view of the first conductive layer 16a in FIG. 1B, and FIG. These are the top views of the 2nd conductive layer 16b of Drawing 1 (b). FIG. 3 is a top view of the third conductive layer 16c of FIG. 4 (a) to 4 (c) are enlarged cross-sectional views illustrating a portion corresponding to FIG. 1 (b) for explaining the manufacturing process of the probe card shown in FIG. 1 (a).

(Probe card)
Hereinafter, a probe card using a wiring board according to an embodiment of the present invention will be described in detail with reference to the drawings.

  A probe card 1 shown in FIGS. 1A and 1B is for inspecting the electrical reliability of a semiconductor wafer by a signal from a measuring instrument (not shown) such as a tester in a semiconductor wafer inspection apparatus. is there. The probe card 1 includes a probe head 2, a wiring board 3 to which the probe head 2 is connected, a main board 4 to which the wiring board 3 is connected, a reinforcing plate 5 to which the main board 4 is connected, and a wiring board 3. And conductive pins 6 that electrically connect the main board 4 to each other and conductive adhesives 7 that electrically connect the conductive pins 6 and the wiring board 3. The probe head 2, the wiring board 3, the main board 4 and the reinforcing plate 5 are connected to each other by, for example, screws.

  The probe head 2 is for inspecting a semiconductor wafer. The probe head 2 includes a plurality of probes 8 and a holding member 9 that holds the probes 8. The probe 8 is a terminal that is in contact with an electrode of the semiconductor wafer, a function of transmitting an electric signal or a power supply voltage between the wiring board 3 and the semiconductor wafer, and a function of connecting the semiconductor wafer to the ground potential via the wiring board 3. Have The probes 8 are arranged according to the wiring pattern of the semiconductor wafer to be inspected, and the pitch between the probes 8 is set to 40 μm or more and 110 μm or less, for example. In the present embodiment, the probe 8 penetrates the holding member 9 in the thickness direction. When one end of the probe 8 is brought into contact with the electrode of the semiconductor wafer, the probe 8 is pressed toward the wiring substrate 3, and the other end of the probe 8 is brought into contact with the electrode of the wiring substrate 3. The electrodes of the wiring board 3 are electrically connected.

  The wiring board 3 functions as a holding member for the probe head 2 and electrically connects the probe 8 and the main board 4. The wiring board 3 has wiring in a pattern corresponding to the arrangement of the probes 8 and the electrodes of the main board 4, and the wiring board 3 corresponding to the probe head 2 to be used is used as appropriate. Furthermore, the wiring board 3 is screwed to the main board 4 so that it can be appropriately replaced according to the semiconductor wafer to be inspected.

  The main board 4 electrically connects the measuring instrument and the wiring board 3. For example, a printed wiring board or the like can be used as the main board 4.

  The reinforcing plate 5 has a function of reinforcing the main substrate 4 and reducing warpage of the main substrate 4. The reinforcing plate 5 can be formed of a metal material such as stainless steel or aluminum.

  The conductive pin 6 penetrates the wiring board 3 in the thickness direction and electrically connects the main board 4 and the wiring board 3. The conductive pin 6 is made of a conductive material such as aluminum. The width of the conductive pin 6 is set to, for example, 50 μm or more and 450 μm or less. In FIG. 1B, two conductive pins 6 are shown, but there may be three or more conductive pins 6 in the cross section shown in FIG. 1B.

  The conductive adhesive 7 is for electrically connecting the conductive pins 6 and the wiring substrate 3 by bonding them to pads 18 and conductive pins 6 described later of the wiring substrate 3. The conductive adhesive 7 is formed of a conductive material such as solder including lead, tin, silver, gold, copper, zinc, bismuth, indium, aluminum, or the like.

(Wiring board)
Next, the wiring board of the present embodiment will be described in detail based on the drawings.

  In the present embodiment, the wiring board 3 includes a core substrate 10 and a pair of buildup layers 11 formed on the upper and lower surfaces of the core substrate 10 in the thickness direction, as shown in FIG. A through hole P for inserting the conductive pin 6 penetrating in the (Z direction) is formed.

  Here, for convenience, the build-up layer 11 disposed on the upper side (probe head 2 side) of the pair of build-up layers 11 is defined as the first build-up layer 11a and disposed on the lower side (main substrate 4 side). The buildup layer 11 is defined as a second buildup layer 11b. In the present embodiment, the probe head 2 side is on the upper side and the main substrate 4 side is on the lower side.

(Core substrate)
The core substrate 10 increases the strength of the wiring substrate 3, and includes a base 12 on which a cylindrical through hole penetrating in the thickness direction is formed, and a cylindrical through hole conductor 13 formed on the inner wall of the through hole. And a columnar insulator 14 disposed inside the through-hole conductor 13.

  The base 12 forms a main part of the core substrate 10 and increases rigidity. The substrate 12 includes a resin such as an epoxy resin, a base material such as a glass cloth coated with the resin, and an inorganic insulating filler such as a silica filler composed of a plurality of particles coated with the resin. Moreover, the thickness of the base 12 is set to, for example, 0.1 mm or more and 1 mm or less. The coefficient of thermal expansion in the planar direction of the substrate 12 is set to, for example, 5 ppm / ° C. or more and 30 ppm / ° C. or less. The coefficient of thermal expansion in the thickness direction of the substrate 12 is set to, for example, 15 ppm / ° C. or more and 50 ppm / ° C. or less. The Young's modulus of the substrate 12 is set to, for example, 5 GPa or more and 30 GPa or less.

  The thermal expansion coefficient of the substrate 12 is measured by a measuring method according to JISK7197-1991 using a commercially available TMA apparatus. The Young's modulus of the substrate 12 is measured by using Nano Indenter XP / DCM manufactured by MTS Systems. Hereinafter, the coefficient of thermal expansion and Young's modulus of each member are measured in the same manner as the base 12.

  The through-hole conductor 13 is for electrically connecting the buildup layers 11 formed on the upper and lower surfaces of the core substrate 10. The through-hole conductor 13 can be formed of a conductive material such as copper, titanium, molybdenum, chromium, or nickel-chromium alloy.

  The through-hole conductor 13 is attached to the inner wall of a cylindrical through-hole that penetrates the base 12 in the thickness direction. The diameter (diameter) of the through hole is set to, for example, 50 μm or more and 250 μm or less.

  The insulator 14 forms a support surface of a via conductor 17 described later. The insulator 14 can be formed of a resin material such as an epoxy resin.

(Build-up layer)
On the other hand, a pair of buildup layers 11 are formed on the upper and lower surfaces of the core substrate 10 as described above. As shown in FIG. 1B, the build-up layer 11 includes a plurality of resin layers 15 stacked on the core substrate 10 and a plurality of conductive layers partially formed on the base 12 and the resin layer 15. A layer 16 and a plurality of via conductors 17 penetrating the resin layer 15 in the thickness direction are included. Furthermore, the first buildup layer 11a includes a pad 18 for connecting the conductive pin 6 formed on the resin layer 15 (first resin layer 15a described later) located on the uppermost layer (the outermost layer on the probe 8 side). It is out. The conductive layer 16, the via conductor 17 and the pad 18 constitute an electric circuit between the probe 8 and the main substrate 4 (external circuit), and function as a ground wiring, a power supply wiring or a signal wiring.

  The resin layer 15 functions not only as a support member that supports the conductive layer 16 but also as an insulating member that prevents a short circuit between the conductive layers 16. As shown in FIG. 1C, the resin layer 15 includes a film layer 19 and an adhesive layer 20 disposed on the core substrate 10 side with respect to the film layer 19. The thickness of the resin layer 15 is set to, for example, 5 μm or more and 40 μm or less. In the present embodiment, each buildup layer 11 includes three resin layers 15.

  The film layer 19 increases the rigidity of the resin layer 15 and reduces the coefficient of thermal expansion in the planar direction. The film layer 19 includes a film-like resin and an inorganic insulating filler such as a silica filler made of a plurality of particles coated with the resin. As the film-like resin, a thermoplastic resin such as a polyimide resin can be used. The film-like resin desirably has a structure in which the longitudinal direction of each resin molecular chain is parallel to the planar direction of the film layer 19 from the viewpoint of reducing the thermal expansion coefficient in the planar direction.

  The coefficient of thermal expansion in the plane direction of the film layer 19 is set to, for example, 0 ppm / ° C. or more and 30 ppm / ° C. or less. The coefficient of thermal expansion in the thickness direction of the film layer 19 is set to, for example, 20 ppm / ° C. or more and 50 ppm / ° C. or less. The Young's modulus of the film layer 19 is set to 2.5 GPa or more and 10 GPa or less, for example. Further, the film layer 19 is set to have a higher Young's modulus than the adhesive layer 20 and a small thermal expansion coefficient in the planar direction, and as a result, increases the rigidity of the resin layer 15 and reduces the thermal expansion coefficient in the planar direction. be able to.

  The adhesive layer 20 adheres the film layers 19 adjacent to each other in the thickness direction and fixes the conductive layer 16 by adhering to the side surface and one main surface of the conductive layer 16. The adhesive layer 20 contains a resin. As the resin of the adhesive layer 20, for example, an epoxy resin, a bismaleimide triazine resin, a cyanate resin, an amide resin, or the like can be used. In addition, although it is desirable that the adhesive layer 20 does not include an inorganic insulating filler from the viewpoint of adhesiveness, the adhesive layer 20 may include an inorganic insulating filler.

  The thermal expansion coefficient in the planar direction and the thickness direction of the adhesive layer 20 is set to, for example, 10 ppm / ° C. or more and 100 ppm / ° C. or less. The Young's modulus of the adhesive layer 20 is set to, for example, 0.05 GPa or more and 0.5 GPa or less. The adhesive layer 20 is set to have a Young's modulus smaller than that of the film layer 19, and as a result, the adhesive strength between the adhesive layer 20, the film layer 19, and the conductive layer 16 can be increased.

  The conductive layer 16 transmits electricity in the planar direction. The conductive layer 16 can be formed of a conductive material such as copper, titanium, molybdenum, chromium, or nickel chromium alloy. The conductive layer 16 preferably includes a base film made of a nickel chromium alloy and a conductor portion made of copper provided on the base film. As a result, the conductivity of the conductive layer 16 can be increased by the conductor portion while the adhesive strength between the conductive layer 16 and the film layer 19 is increased by the base film.

  The thickness of the conductive layer 16 is set to 3 μm or more and 20 μm or less, for example. Moreover, the thermal expansion coefficient of the conductive layer 16 is set to, for example, 16.5 ppm / ° C. or more and 17.5 ppm / ° C. or less. The Young's modulus of the conductive layer 16 is set to 110 GPa or more and 128 GPa or less, for example.

  The via conductor 17 electrically connects the conductive layers 16 separated in the thickness direction or the conductive layers 16 and the pads 18 to transmit electricity in the thickness direction. The via conductor 17 can be formed of the same metal material as that of the conductive layer 16, and preferably includes a base film and a conductor portion similar to those of the conductive layer 16.

  The via conductor 17 is, for example, a tapered shape that becomes narrower toward the core substrate 10, and the upper and lower surfaces thereof are circular. The maximum width of this via conductor 17 (the width of the end opposite to the core substrate 10) is set to 20 μm or more and 50 μm or less, for example. The minimum width of the via conductor 17 (the width of the end on the core substrate 10 side) is set to, for example, 10 μm or more and 40 μm or less.

  The pad 18 functions as a terminal that is electrically connected to the conductive pin 6 through the conductive adhesive 7. The pad 18 can be formed of a metal material similar to that of the conductive layer 16, and preferably includes a base film and a conductor portion similar to those of the conductive layer 16. Further, the pad 18 preferably includes a protective film made of nickel provided on the conductor portion in addition to the base film and the conductor portion. The thickness of the pad 18 is set to 3 μm or more and 20 μm or less, for example.

  Here, for convenience, among the three resin layers 15 constituting the first buildup layer 11a, the resin layer 15 forming the uppermost layer (the outermost layer on the probe 8 side) is referred to as a first resin layer 15a, and an intermediate layer (first layer) The resin layer 15 forming the first resin layer 15a on the upper surface) is the second resin layer 15b, and the resin layer 15 forming the lowermost layer (the layer having the second resin layer 15b stacked on the upper surface) is the third resin. This is layer 15c. The pad 18 is located on the upper surface of the first resin layer 15a.

  Of the plurality of via conductors 17, the first resin layer 15a is penetrated in the thickness direction, the via conductor 17 connected to the pad 18 is defined as the first via conductor 17a, and the second resin layer 15b is penetrated in the thickness direction. A via conductor 17 connected to a first conductive layer 18a to be described later serves as a second via conductor 17b, and a via conductor 17 that penetrates the third resin layer 15c in the thickness direction and is connected to a second conductive layer 18b to be described later serves as a third via. The conductor 17c is used.

  Of the plurality of conductive layers 16, the conductive layer 16 located between the first resin layer 15a and the second resin layer 15b and connected to the first via conductor 17a is defined as the first conductive layer 16a, and the second resin The conductive layer 16 located between the layer 15b and the third resin layer 15c and connected to the second via conductor 17b is referred to as a second conductive layer 16b. The conductive layer 16 is located between the third resin layer 15c and the base 12 and is second. The conductive layer 16 connected to the three via conductors 17c is referred to as a third conductive layer 16c.

  On the other hand, the wiring board 3 is formed with a through hole P for inserting the conductive pin 6 penetrating in the thickness direction (Z direction). The through holes P are for inserting conductive pins 6 that electrically connect the wiring board 3 and the main board 4. In the present embodiment, the through hole P penetrates the core substrate 10 and the pair of buildup layers 11 in the stacking direction (Z direction), and each resin including the first resin layer 15a and the second resin layer 15b. The layer 15 and the base body 12 are penetrated in the stacking direction. Further, the resin layers 15 including the first resin layer 15a and the second resin layer 15b and the base 12 are exposed on the inner wall of the through hole P, and no conductor is deposited. The width of the through hole P is set to be larger than the width of the conductive pin 6 and is set to, for example, 150 μm or more and 550 μm or less.

  In the present embodiment, the end 6a on the probe head 2 side of the conductive pin 6 inserted into the through hole P is located above the opening O on the probe head 2 side of the through hole P, and this end 6a. The conductive adhesive 7 is bonded. The conductive adhesive 7 is bonded to the pad 18 located on the upper surface of the wiring substrate 3, that is, the upper surface of the first resin layer 15a, so that the end 6a of the conductive pin 6 and the pad 18 of the wiring substrate 3 are bonded. Are electrically connected.

  As described above, the conductive pin 6 is electrically connected to the pad 18 located on the upper surface of the first resin layer 15 a via the conductive adhesive 7. For this reason, since the conductive pin 6 is difficult to contact the pad 18, damage to the pad 18 due to the conductive pin 6 can be suppressed, and as a result, the connection reliability between the wiring board 3 and the conductive pin 6 can be improved. In particular, since the wiring board 3 is appropriately replaced and used, damage to the pad 18 can be satisfactorily suppressed when repeatedly inserting and removing the conductive pin 6 into and from the through hole P.

  The first resin layer 15a and the second resin layer 15b are exposed on the inner wall of the through hole P. As a result, since the conductive adhesive 7 can be prevented from entering the through hole P when the conductive adhesive 7 is melted, the conductive pin 6 can be easily removed from the through hole P. In addition, since no conductor is attached to the inner wall of the through hole P, it is possible to prevent the conductor from being short-circuited between the adjacent through holes P by entering the conductor between the resin layers 15. it can. In the present embodiment, the end 6a of the conductive pin 6 is located above the opening of the through hole P on the probe head 2 side, and the conductive adhesive 7 does not enter the through hole P.

  Further, in the present embodiment, the pad 18 is connected to the first via conductor 17a penetrating the first resin layer 15a in the thickness direction, and the first via conductor 17a is connected to the first resin layer 15a and the second resin. The first conductive layer 16a located between the layers 15b is connected. As a result, the adhesive strength between the pad 18 and the first resin layer 15 can be increased by the first via conductor 17a and the first conductive layer 16a. Therefore, peeling between the pad 18 and the first resin layer 15 to which stress is applied by the conductive pins 6 and the conductive adhesive 7 can be reduced, and as a result, the electrical reliability of the wiring board 3 can be improved.

  The first via conductor 17 a and the first conductive layer 16 a together with the pad 18 constitute an electrical wiring between the conductive pin 6 and the probe 8. With such a configuration of the electrical wiring, the stress applied to the electrical wiring by the conductive pins 6 can be suppressed, so that disconnection in the electrical wiring can be suppressed, and consequently the electrical reliability of the wiring board 3 can be improved.

  Further, in the present embodiment, the pad 18 is separated from the through hole P. That is, the pad 18 is separated from the opening O of the through hole P. Therefore, since the contact between the conductive pin 6 and the pad 18 can be suppressed, damage to the pad 18 can be reduced and peeling between the pad 18 and the first resin layer 15 can be reduced. The distance between the pad 18 and the through hole P is set to, for example, 25 μm or more and 50 μm or less.

  In the present embodiment, the first conductive layer 16a is separated from the through hole P. That is, a part of the first resin layer 15a is disposed between the first conductive layer 16a and the through hole P, and the first conductive layer 16a is not exposed on the inner wall of the through hole P. As a result, it is possible to suppress the conductive pin 6 from being applied to the first conductive layer 16a and to suppress the disconnection of the electrical wiring. Moreover, since the 1st conductive layer 16a is not exposed to the inner wall of the through-hole P, it can suppress that the conductive adhesive 7 penetrates into the through-hole P. The distance between the first conductive layer 16a and the through hole P is set to be the same as the distance between the pad 18 and the through hole P, for example, and the error between the distance between the pad 18 and the through hole P is ± 10. It is set to be within%.

  In the present embodiment, as shown in FIGS. 2A and 2B, a plurality of first via conductors 17a are connected to the pad 18 and the first conductive layer 16a. As a result, the adhesive strength between the pad 18 and the first resin layer 15 can be increased. Even if a connection failure occurs between any of the first via conductors 17a and the pad 18 or the first conductive layer 16a, the electrical connection between the pad 18 and the first conductive layer 16a is caused by the other first via conductor 17a. Since the connection can be maintained, the electrical reliability of the wiring board 3 can be enhanced. In this case, the number of first via conductors 17a connected to the pad 18 and the first conductive layer 16a is set to, for example, 2 or more and 22 or less. Note that the number of the first via conductors 17a connected to the first conductive layer 16a may be one.

  In the present embodiment, the pad 18 surrounds the through hole P as shown in FIGS. 1B and 2A. As a result, the adhesive strength between the pad 18 and the conductive adhesive 7 can be increased. Further, since the stress applied to the pad 18 by the conductive adhesive 7 can be dispersed, the adhesive strength between the pad 18 and the first resin layer 15 can be increased, and the pad 18 and the first via conductor 17a The connection strength can be increased. In addition, the pad 18 is disk shape which has the column-shaped 1st hole H1 penetrated to the thickness direction, for example. The diameter of the pad 18 is set to 400 μm or more and 800 μm or less, for example, and the diameter of the first hole H1 is set to 200 μm or more and 600 μm or less, for example.

  In the present embodiment, as shown in FIG. 1B and FIG. 2B, the first conductive layer 16a surrounds the through hole P, and the plurality of first via conductors 17a are connected to the through hole P. Are arranged to surround As a result, since the stress applied to the plurality of first via conductors 17a can be dispersed, poor connection between the first via conductor 17a and the pad 18 or the first conductive layer 16a can be suppressed. In addition, the 1st conductive layer 16a is disk shape which has the column-shaped 2nd hole H2 penetrated to the thickness direction, for example. The diameter of the first conductive layer 16a is set to be the same as the diameter of the pad 18, for example, and is set so that an error from the diameter of the pad 18 is within ± 10%. Further, the diameter of the second hole H2 is set to be the same as the diameter of the first hole H1, for example, and the error from the diameter of the first hole H1 is set within ± 10%. Yes.

  In the present embodiment, as shown in FIGS. 1B and 2B, the plurality of first via conductors 17a are arranged so as to surround the through holes P in two rows. As a result, the number of the first via conductors 17a connected to the pad 18 and the first conductive layer 16a can be increased. The plurality of first via conductors 17a may be arranged in a plurality of rows of three or more.

  In the present embodiment, as shown in FIGS. 1B, 2B, and 2C, the first conductive layer 16a includes a plurality of second resin layers 15b penetrating in the thickness direction. A second via conductor 15b is connected, and the second via conductor 15b further includes a second conductive layer 15b positioned between the second resin layer 15b and the third resin layer 15c. As a result, the adhesive strength between the pad 18 and the first resin layer 15 can be further increased by the second via conductor 15b and the second conductive layer 15b, and the electrical wiring in the wiring board 3 can be densified. it can.

  In the present embodiment, as shown in FIGS. 1B and 2B, the plurality of first via conductors 17a and the plurality of second via conductors 17b are separated in the plane direction (XY plane direction). Yes. As a result, the first via conductor 17a and the second via conductor 17b are more conductive than the case where the first via conductor 17a and the second via conductor 17b are not separated in the plane direction (when the first via conductor 17a and the second via conductor 17b are stacked). Stress applied to the connecting portion of the first via conductor 17a and the second via conductor 17b from the adhesive 7 through the pad 18 can be dispersed, and disconnection between the first via conductor 17a and the second via conductor 17b can be reduced. Can do.

  In the present embodiment, as shown in FIG. 2B, the plurality of first via conductors 17a and the plurality of second via conductors 17b are alternately arranged so as to surround the through holes P in the planar direction. ing. As a result, when the first via conductor 17a and the second via conductor 17b are separated in the planar direction, the plurality of first via conductors 17a and the plurality of first via conductors 17b can be arranged uniformly in the planar direction. . As a result, connection failures in each of the plurality of first via conductors 17a and the plurality of second via conductors 17b can be reduced.

  In the present embodiment, as shown in FIGS. 2B, 2C and 3, the first conductive layer 16a and the second conductive layer 16b are only the lands 21 to which the via conductors 17 are connected. The third conductive layer 16 c includes a land 21 and a linear wiring conductor 22 connected to the land 21. As a result, the first conductive layer 16a, the second conductive layer 16b, the third conductive layer 16c, the first via conductor 17a, the second via conductor 17b, and the third via conductor 17c are bonded to the pad 18 and the first resin layer 15a. The electrical wiring can be routed in the plane direction by the wiring conductor 22 of the third conductive layer 16c while increasing the strength.

  Thus, the probe card 1 described above contacts the probe 8 of the probe head 2 with the signal of the measuring instrument connected to the main substrate 4 by sequentially transmitting signals with the main board 4, the wiring board 3 and the probe head 2. It can be transmitted to a semiconductor wafer. Moreover, the probe card 1 can transmit the signal of a semiconductor wafer to a measuring device by transmitting a signal in the reverse direction. As a result, the probe card 1 enables inspection of the electrical reliability of the semiconductor wafer and exhibits a desired function.

(Probe card manufacturing method)
Next, the manufacturing method of the probe card 1 mentioned above is demonstrated based on FIG.

(Production of core substrate)
(1) As shown in FIG. 4A, the core substrate 10 having the conductive layers 16 formed on both main surfaces is manufactured. Specifically, for example, it is performed as follows.

  First, for example, a plurality of uncured resin sheets are laminated, a copper foil is laminated on the outermost layer, and the laminated body is heated and pressurized to be cured, thereby producing the substrate 12. The uncured state is an A-stage or B-stage according to ISO 472: 1999. Next, a through hole penetrating the base 12 in the thickness direction is formed by, for example, drilling or laser processing. Next, the through-hole conductor 13 is formed by depositing a conductive material on the inner wall of the through-hole, for example, by electroless plating or electroplating. Next, the inside of the through-hole conductor 13 is filled with resin or the like to form the insulator 14. Next, after depositing a conductive material on the exposed portion of the insulator 14, the conductive layer 16 is formed by patterning the copper foil into a desired shape by a conventionally known photolithography method, etching method or the like.

(Production of wiring board)
(2) As shown in FIGS. 4B and 4C, a pair of buildup layers 11 are formed on both main surfaces of the core substrate 10 to fabricate the wiring substrate 3. Specifically, for example, it is performed as follows.

  First, after disposing the film layer 19 on the core substrate 10 through the uncured adhesive layer 20, the core substrate 10, the adhesive layer 20 and the film layer 19 are heated and pressurized to cure the adhesive layer 20, A resin layer 15 is formed on the core substrate 10. Next, a via hole is formed in a desired portion of the resin layer 15 using laser processing such as a YAG laser device or a carbon dioxide laser device, and at least a part of the conductive layer 16 is exposed in the via hole. Next, a base film is formed on the resin layer 15 and the inner surface of the via hole by sputtering. Next, a resist patterned in a desired shape is formed on the base film using photolithography, and then a conductor portion is partially formed on the base film using electroplating. Next, after removing the resist from the base film, the conductive layer 16 and the via conductor 17 are formed by removing the non-formation region of the conductor portion in the base film using an etching method.

  The above steps are repeated to form a pair of buildup layers 11 as shown in FIG. At this time, by forming a base film and a conductor portion on the uppermost first resin layer 15c by the same method as that of the conductive layer 16, by using an electroless plating method, a protective film is provided on the conductor portion, The pad 18 is formed. Next, as shown in FIG.4 (c), the wiring board 3 is produced by forming the through-hole P which penetrates the core board | substrate 10 and a pair of buildup layer 11 in a thickness direction using a drill process. be able to.

(Production of probe card)
(3) By connecting the probe head 2, the wiring board 3, the main board 4 and the reinforcing plate 5 in sequence, the probe card 1 shown in FIG. 1A can be manufactured.

  Here, when connecting the wiring board 3 and the main board 4, the conductive pins 6 are inserted into the through holes P, and the end portions 6 a of the conductive pins 6 are arranged above the openings O of the through holes P, and then the conductive pins 6 are connected. The conductive pin 6 and the pad 18 are electrically connected by soldering the end portion 6 a of the conductive pin 6 and the pad 18 using the conductive adhesive 7. As a result, the wiring board 3 and the main board 4 can be electrically connected.

  The present invention is not limited to the above-described embodiments, and various modifications, improvements, combinations, and the like can be made without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the probe card including the probe head, the wiring board, the main board, the reinforcing plate, and the conductive pins has been described as an example, but the probe card only needs to include the wiring board and the conductive pins. Other configurations may be different.

  In the above-described embodiment, the configuration in which the build-up layer is formed by the three resin layers has been described as an example. However, the resin layer may be one or more layers.

  Further, in the above-described embodiment, the configuration using the film layer and the adhesive layer as the resin layer has been described as an example, but another configuration may be used as the resin layer.

DESCRIPTION OF SYMBOLS 1 Probe card 2 Probe head 3 Wiring board 4 Main board 5 Reinforcement board 6 Conductive pin 7 Conductive adhesive 8 Probe 9 Holding member 10 Core board 11 Build-up layer 12 Base body 13 Through-hole conductor 14 Insulator 15 Resin layer 16 Conductive layer 17 Via conductor 18 Pad 19 Film layer 20 Adhesive layer 21 Land 22 Wiring conductor P Through-hole O Opening H1 First hole H2 Second hole

Claims (7)

  A first resin layer; a second resin layer having the first resin layer laminated on an upper surface; the first resin layer and the second resin layer penetrating in a laminating direction; and the first resin layer and the first resin layer 2 through holes for inserting conductive pins with exposed resin layers, conductive pin connecting pads located on the top surface of the first resin layer, and through the first resin layer in the thickness direction, connected to the pads A wiring board comprising: a first via conductor; and a first conductive layer located between the first resin layer and the second resin layer and connected to the first via conductor.   The wiring board according to claim 1, wherein the first conductive layer and the pad are separated from the through hole.   The wiring board according to claim 1, wherein a plurality of the first via conductors are connected to the pad and the first conductive layer.   4. The wiring board according to claim 3, wherein each of the pad and the first conductive layer surrounds the through hole, and the plurality of first via conductors are arranged to surround the through hole. A wiring board characterized by.   4. The wiring board according to claim 3, wherein the second resin layer is laminated on an upper surface thereof, and a plurality of second resin layers that penetrate the second resin layer in the thickness direction and are connected to the first conductive layer. A plurality of first via conductors, and a plurality of first via conductors and the plurality of first via conductors that are located between the second resin layer and the third resin layer and connected to the two via conductors. A wiring board characterized in that it is separated from the second via conductor in a planar direction.   6. The wiring board according to claim 5, wherein each of the pad, the first conductive layer, and the second conductive layer surrounds the through hole, and the plurality of first via conductors and the plurality of second via conductors. Is a wiring board that is alternately arranged so as to surround the through-holes in a planar direction.   The wiring board according to claim 1, having a probe, connected to the wiring board while being located on the upper surface side of the wiring board, and connected to the wiring board while being located on the lower surface side of the wiring board And a conductive pin that is inserted into the through-hole and electrically connects the wiring substrate and the main substrate, and a conductive adhesive that electrically connects the conductive pin and the pad. Featured probe card.

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