JP2014038993A - Core substrate and printed circuit board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a core substrate which reduces distortion occurring during manufacturing processes and adjusts the degree of the distortion for each portion of a printed circuit board, and to provide the printed circuit board which uses the core substrate.SOLUTION: A core substrate 100 includes: at least one or more connection members 101 which are formed therein; multiple heat radiation members 103 which are formed being divided from each other and located adjacent to the connection members 101; and insulation members 105 formed between the multiple heat radiation members 103 which are formed being divided from each other and between the connection member 101 and the heat radiation member 103.

Description

  The present invention relates to a core substrate and a printed circuit board using the same.

  As electronic components become smaller, denser, and thinner, research on thinner and higher-functionality semiconductor package substrates has been actively promoted.

  In particular, in order to implement a technology for stacking and mounting a large number of semiconductor chips on one substrate (MCP; Multi Chip Package) or a technology for stacking a large number of substrates on which chips are mounted (POP; Package On Package) Therefore, it is necessary to develop a substrate having a thermal expansion behavior similar to that of a chip and having excellent distortion characteristics after mounting the chip.

  In recent years, the problem of heat generation has become serious due to an increase in the operation speed accompanying the improvement in performance of the chip, and measures against the distortion problem of the substrate due to this are also in urgent need.

  Therefore, after mounting the chip on the substrate, in order to effectively release the heat generated by driving the chip to the outside, a substrate having a metal core with excellent thermal conductivity inserted is manufactured.

  However, by using the substrate in which the metal core is inserted, it is possible to reduce the distortion of the substrate due to the heat generated from the chip by effectively releasing the heat generated by driving the chip to the outside. There is a problem that the substrate is distorted due to the difference in thermal strain between the inner metal core and the build-up layer formed by lamination with respect to heat or pressure applied during the manufacture of the substrate in which the metal core is inserted.

  On the other hand, US Pat. No. 6,828,224 discloses a substrate structure in which a metal core according to the prior art is inserted.

JP 2003-031719 A

  One object of the present invention is to provide a core substrate and a printed circuit board using the same that can reduce distortion generated during the manufacturing process.

  Another object of the present invention is to provide a core substrate capable of adjusting the degree of distortion for each portion of the printed circuit board and a printed circuit board using the core substrate.

  The core substrate according to the present embodiment includes at least one or more connecting members, a plurality of heat dissipating members adjacent to the connecting members, and a plurality of heat dissipating members divided between the plurality of heat dissipating members. And an insulating member formed between the connecting member and the heat radiating member.

  In this case, the connecting member is at least any selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. Or one.

  The heat dissipation member is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. It can be one.

  The core substrate may have a thickness of 30 μm or less.

  The insulating member may be formed in a lattice shape, and the heat dissipation member may be formed in the lattice shape so as to be in contact with the insulating member.

  The heat dissipating member may be formed in a lattice shape, and the insulating member may be formed in the lattice shape so as to be in contact with the heat dissipating member.

  Further, each of the plurality of heat radiating members can be formed in a columnar shape.

  In addition, the printed circuit board according to the present embodiment includes at least one connecting member, a heat dissipating member that is positioned adjacent to the connecting member, and is divided into a plurality of parts, and is divided into the plurality. An insulating member formed between the heat dissipating members and between the connecting member and the heat dissipating member, a core substrate formed on the core substrate, and an insulating layer formed on the insulating layer. And a first via formed in the insulating layer and electrically connecting the connection member and the circuit pattern.

  In this case, the connecting member is at least any selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. Or one.

  The heat dissipation member is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. It can be one.

  The core substrate may have a thickness of 30 μm or less.

  In addition, the semiconductor device may further include a solder resist layer formed on the insulating layer and having an opening that exposes a part of the circuit pattern.

  In addition, a surface treatment layer formed on the circuit pattern exposed through the opening may be further included.

  The electronic device may further include an electronic component that is incorporated in the core substrate in a thickness direction and has an electrode formed on one surface thereof, and a second via that electrically connects the circuit pattern and the electrode.

  According to the present invention, by dissipating a plurality of heat dissipating members that perform a heat dissipating function in the core substrate inserted into the printed circuit board, the residual stress of the heat dissipating member is dispersed with respect to heat and pressure applied from the outside The distortion generated in the printed circuit board can be reduced.

  In addition, according to the present invention, the degree of distortion for each region can be adjusted by applying a different number of heat dissipation members for each region to the entire printed circuit board, and the printed circuit board manufacturing process There is an effect that it is possible to cope with various forms of distortion occurring in the inside.

It is sectional drawing which shows the structure of the core board | substrate by one Example of this invention. 3 is a plan view illustrating pattern shapes of a heat dissipation member and an insulating member of a core substrate according to an embodiment of the present invention. 1 is a cross-sectional view illustrating a structure of a printed circuit board according to an embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating a structure in which an electronic component is embedded in the printed circuit board of FIG. 3.

  Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments with reference to the accompanying drawings. In this specification, when adding reference numerals to the components of each drawing, it is noted that the same components are given the same number as much as possible even if they are shown in different drawings. There must be. The terms “one side”, “other side”, “first”, “second” and the like are used to distinguish one component from another component, and the component is the term It is not limited by. Hereinafter, in describing the present invention, detailed descriptions of known techniques that may obscure the subject matter of the present invention are omitted.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Core Substrate FIG. 1 is a cross-sectional view illustrating a structure of a core substrate according to an embodiment of the present invention, and FIG. 2 is a plan view illustrating shapes of heat dissipation members and insulating members in the core substrate of FIG.

  Referring to FIG. 1, a core substrate 100 according to the present embodiment is formed with a connection member 101, a heat dissipation member 103 formed adjacent to the connection member 101 and divided into a plurality, and the plurality of divisions. Insulating members 105 formed between the heat dissipation members 103 and between the connecting member 101 and the heat dissipation member 103 can be included.

  In this embodiment, as shown in FIG. 3, the connection member 101 is electrically connected to the first via 203 formed in the insulating layer 201 formed on the core substrate 100 in the subsequent process, and the circuit pattern 205 is connected. It serves as a bridge function for the interlayer connection.

  In this embodiment, the connection member 101 is selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. Although it can be at least any one, it is not specifically limited to this.

  In this embodiment, the heat radiating member 103 is formed adjacent to the connecting member 101 as shown in FIG. 1, but can be divided into a plurality of parts.

  Here, the heat radiating member 103 is copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof in the same manner as the connecting member 101 described above. It can be at least one selected from the group consisting of, but is not particularly limited to this.

  The heat dissipation member of the core substrate according to the prior art is not divided and formed as in the present invention. For this reason, when a printed circuit board is manufactured using a conventional core substrate, the printed circuit board may be distorted by the residual stress of the heat dissipation member with respect to heat or pressure applied to the product.

  That is, when a printed circuit board is manufactured, heat or pressure may be applied to the product, but the product is manufactured as a result of different thermal strains between the core substrate made of metal and the build-up layer made of insulating material and metal. The printed circuit board is distorted.

  Therefore, as in this embodiment, the heat radiating member 103 made of a metal having a relatively large thermal strain is divided into a plurality of parts, and the insulating member 105 having a relatively small thermal strain is formed between the heat radiating members 103. Therefore, conventionally, residual stress concentrated in one place can be dispersed throughout the core substrate 100.

  In this way, by dispersing the residual stress concentrated on one location of the core substrate 100, the degree of strain behavior of the printed circuit board formed by the subsequent process can be adjusted.

  At this time, the number of divisions of the heat dissipation member 103 can be adjusted according to the situation.

  For example, in order to form the printed circuit board 200 to be flat as a whole, when there are a region where the degree of distortion should be minimized and a region where the degree of distortion exists, the number of divisions of the heat radiation member 103 located in the region is appropriately adjusted. Thus, the degree of distortion for each region can be minimized or maximized.

  Further, as described above, it can be said that the number of divisions of the heat dissipation member 103 can be simply adjusted for each region, or the areas of the heat dissipation member 103 and the insulating member 105 can be adjusted for each region.

  In addition, the core substrate 100 according to the present embodiment may include an insulating member 105 formed between the heat radiating members 103 divided into a plurality of pieces and between the heat radiating member 103 and the connecting member 101.

  Each heat dissipating member 103 divided into a plurality of parts via the insulating member 105, the heat dissipating member 103 and the connecting member 101 can be electrically insulated.

  The insulating member 105 can be formed by etching a part of the metal core to form a through hole (not shown) and filling the through hole (not shown) with an insulating material. This is only one example, and the method is not particularly limited to this.

  At this time, as shown in FIG. 2A, the heat dissipating member 103 is formed in a lattice shape, and the insulating member 105 can be formed in contact with the heat dissipating member 103 in the lattice shape.

  Alternatively, as illustrated in FIG. 2B, the insulating member 105 is formed in a lattice shape, and the heat dissipating member 103 is formed in contact with the insulating member 105 in the lattice shape, contrary to the shape described above. be able to.

  Alternatively, as illustrated in FIG. 2C, the plurality of heat radiating members 103 can each be formed in a columnar shape and separated from the insulating member 105.

  Of course, the shapes of the heat dissipating member 103 and the insulating member 105 of the core substrate 100 according to the present embodiment are not limited to the above-described examples, and can be embodied in various forms.

  Here, as the insulating member 105, a resin insulating material can be used. As the resin insulating material, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or inorganic filler, for example, a prepreg is used. In addition, a thermosetting resin and / or a photocurable resin can be used, but it is not particularly limited thereto.

  In the present embodiment, the thickness of the core substrate 100 can be 30 μm or less, but is not particularly limited thereto.

  This is because the thickness of the core substrate inserted into the printed circuit board that has been thinned recently is also preferably reduced. In the unlikely event that the thickness of the core board is the same as the conventional one, This is because when only the buildup layer formed on the substrate is thinned, the thermal strain of the core substrate becomes much larger than the thermal strain of the buildup layer, and the printed circuit board may be distorted.

Printed Circuit Board FIG. 3 is a cross-sectional view illustrating the structure of a printed circuit board according to an embodiment of the present invention.

  Referring to FIG. 3, the printed circuit board 200 according to the present embodiment includes a connection member 101, a heat dissipating member 103 positioned adjacent to the connection member 101 and divided into a plurality of pieces, and the plurality of divided members. A core substrate 100 composed of insulating members 105 formed between the heat dissipation members 103 and between the connection member 101 and the heat dissipation member 103, and an insulating layer 201 formed on the core substrate 100. The circuit pattern 205 formed on the insulating layer 201 and the first via 203 formed on the insulating layer 201 and electrically connecting the connection member 101 and the circuit pattern 205 may be included.

  Although not shown in the drawing, a surface treatment layer (not shown) for improving the adhesion reliability with the insulating layer 201 can be formed on the core substrate 100. At this time, the surface treatment layer (not shown) may be an oxide film layer, a Cu sputter, or a copper plating layer, but is not particularly limited thereto.

  In the present embodiment, as shown in FIG. 3, the core substrate 100 is inserted into the printed circuit board 200 for mounting the semiconductor chip, and heat generated from the semiconductor chip during the operation of the mounted semiconductor chip is externally applied. The distortion of the printed circuit board 200 can be prevented.

  In this embodiment, the core substrate 100 includes at least one connecting member 101, a plurality of heat dissipating members 103 adjacent to the connecting member 101, and a plurality of heat dissipating members. And an insulating member 105 formed between the connecting members 101 and the heat dissipating member 103.

  Here, the connection member 101 can function as a bridge for connection between the layers of the circuit pattern 205 by being electrically connected to the first via 203 formed in the insulating layer 201.

  The connecting member 101 is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. Although it can be one, it is not limited to this.

  In addition, the heat radiating member 103 functions to effectively release heat generated from the semiconductor chip (not shown) when the semiconductor chip (not shown) mounted on the printed circuit board 200 is driven thereafter.

  In this embodiment, the heat radiating member 103 is made of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and the like, like the connecting member 101. Although it can be set to at least one selected from the group consisting of alloys, it is not particularly limited to this.

  In this embodiment, the heat dissipating member 103 is formed adjacent to the connecting member 101 as shown in FIG. 3, but can be divided into a plurality of parts.

  The heat dissipating member of the core substrate according to the prior art is not divided and formed as in the present invention. Therefore, conventionally, when a printed circuit board is manufactured using a core substrate, the printed circuit board may be distorted by the residual stress of the heat dissipation member with respect to heat or pressure applied to the product.

  That is, when the printed circuit board is manufactured, heat or pressure can be applied to the product, but the thermal strain between the core substrate made of metal and the build-up layer made of insulating material and metal is different and manufactured. The printed circuit board is distorted.

  Thus, as in this embodiment, the heat radiating member 103 made of metal having relatively large thermal strain is divided into a plurality of parts, and the insulating member 105 having relatively small thermal strain is formed between the heat radiating members 103. By doing so, the residual stress concentrated in one conventional location can be dispersed throughout the core substrate 100.

  In this way, by dispersing the residual stress concentrated on one location of the core substrate 100, the degree of strain behavior of the printed circuit board formed by the subsequent process can be adjusted.

  At this time, the number of divisions of the heat dissipation member 103 can be adjusted according to the situation.

  For example, when there are a region where the degree of distortion should be minimized and a region where the degree of distortion exists in order to form the printed circuit board 200 as a whole flat, the number of divisions of the heat radiation member 103 located in the region is appropriately adjusted. Thus, the degree of distortion for each region can be minimized or maximized.

  Further, as described above, it can be said that the number of divisions of the heat dissipation member 103 can be simply adjusted for each region, or the areas of the heat dissipation member 103 and the insulating member 105 can be adjusted for each region.

  In this embodiment, an insulating member 105 is formed not only between the heat radiating members 103 but also between the heat radiating member 103 and the connecting member 101, and the heat radiating member 103 and the connecting member 101 are electrically insulated.

  The insulating member 105 can be formed by etching a part of the metal core to form a through hole (not shown) and filling the through hole (not shown) with an insulating material. This is only one example, and the method is not particularly limited to this.

  At this time, as shown in FIG. 2A, the heat dissipating member 103 is formed in a lattice shape, and the insulating member 105 can be formed in contact with the heat dissipating member 103 in the lattice shape.

  Alternatively, as shown in FIG. 2B, the insulating member 105 is formed in a lattice shape, and the heat dissipating member 103 is formed in contact with the insulating member 105 in the lattice shape, contrary to the shape described above. Can do.

  Alternatively, as shown in FIG. 2C, the plurality of heat radiating members 103 may each be formed in a columnar shape and separated from the insulating member 105.

  Needless to say, the shapes of the heat dissipating member 103 and the insulating member 105 of the core substrate 100 according to the present embodiment are not limited to the above-described examples, and can be embodied in various forms.

  Here, a resin insulating material can be used as the insulating member 105. As the resin insulating material, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as glass fiber or an inorganic filler, for example, a prepreg is used. In addition, a thermosetting resin and / or a photocurable resin can be used, but is not particularly limited thereto.

  In the present embodiment, the thickness of the core substrate 100 can be 30 μm or less, but is not particularly limited thereto.

  This is because the thickness of the core substrate inserted into the printed circuit board, which is being thinned recently, is also preferably thin. This is because when only the build-up layer formed thereon is thinned, the printed circuit board may be distorted because the thermal strain of the core substrate is much larger than the thermal strain of the build-up layer.

  The printed circuit board 200 according to the present embodiment may further include an insulating layer 201 formed on the core substrate 100, and a first via 203 and a circuit pattern 205 formed in the insulating layer 201.

  FIG. 3 shows that build-up layers each including the insulating layer 201, the first via 203, and the circuit pattern 205 are formed on both surfaces of the core substrate 100. However, the present invention is not limited to this. It can also be said that it is possible to form a build-up layer only on one side of the substrate 100.

  Further, in this embodiment, it is shown that one build-up layer is formed on each side of the core substrate 100, but it can be said that it is also possible to form two or more build-up layers.

  Here, as with the insulating member 105 described above, a resin insulating material can be used for the insulating layer 201, but the insulating layer 201 is not particularly limited thereto.

  In this embodiment, the process of forming the first via 203 and the circuit pattern 205 in the insulating layer 201 is as follows.

  After processing a via hole (not shown) at a position corresponding to the connecting member 101 of the core substrate 100 in the insulating layer 201, a seed layer (not shown) is formed on the insulating layer 201 including the inner wall of the via hole (not shown). A plating resist pattern (not shown) having an opening for forming a circuit pattern 205 is formed on the seed layer (not shown).

  Thereafter, a plating process is performed to form a plating layer in the opening for forming the circuit pattern 205. After removing the plating resist pattern (not shown), the exposed seed layer (not shown) is removed. Thus, the first via 203 and the circuit pattern 205 can be formed.

  Here, the seed layer and the plating layer can be formed by an electroless plating method and an electrolytic plating method, respectively, and the processing of the via hole and the formation of a plating resist pattern are already known in the art. Detailed description is omitted.

  The printed circuit board 200 according to the present embodiment further includes a solder resist layer 210 having an opening 210a that is formed on the insulating layer 201 and exposes a portion of the circuit pattern 205 that becomes, for example, a pad. it can.

  The solder resist layer 210 functions as a protective layer that protects the outermost layer circuit, and is formed for electrical insulation. The solder resist layer 210 is known in the art, and may be composed of, for example, a solder resist ink, a solder resist film, or an encapsulating agent, but is not particularly limited thereto.

  Further, the printed circuit board 200 according to the present embodiment may further include a surface treatment layer (not shown) formed on the circuit pattern 205 exposed through the opening 210a of the solder resist layer 210.

  The surface treatment layer (not shown) is formed in order to prevent the circuit pattern 205 from being oxidized and to increase the bonding strength with the semiconductor chip bumps to be connected thereafter. There is no particular limitation, for example, electrolytic gold plating, electroless gold plating, OSP (Organic Solderability Preservative), or electroless tin plating (Immersion Tin Plating), electroless silver plating I , ENIG (Electroless Nickel and immersion gold; electroless nickel plating / displacement gold plating), DIG plating (D It can be formed by direct immersion gold plating (HA) or HASL (hot air solder leveling).

  On the other hand, FIG. 4 shows the structure of a printed circuit board in which electronic components are embedded.

  Here, since the printed circuit board has the same structure as the printed circuit board shown in FIG. 3, the description of the same configuration corresponding to the printed circuit board of FIG. 3 is omitted.

  Referring to FIG. 4, the printed circuit board 300 according to the present embodiment may further include an electronic component 310 that is embedded in the thickness direction of the core substrate 100 of the printed circuit board 200 illustrated in FIG. 3.

  At this time, an electrode 311 connected to the circuit pattern 205 can be formed on one surface of the electronic component 310, and the circuit pattern 205 and the electrode 311 of the electronic component 310 are electrically connected to the insulating layer 201. A second via 313 can be formed.

  Further, the heat dissipating member 103 between the electronic component 310 embedded in the core substrate 100 and the connecting member 101 can be divided into two or more as shown in FIG. Is not to be done.

  As described above, the present invention has been described in detail based on the specific embodiments. However, the present invention is only for explaining the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that modifications and improvements within the technical idea of the present invention are possible.

  All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

DESCRIPTION OF SYMBOLS 100 Core board | substrate 101 Connection member 103 Heat dissipation member 105 Insulation member 200, 300 Printed circuit board 201 Insulation layer 203 1st via | veer 205 Circuit pattern 210 Solder resist layer 210a Opening part 310 Electronic component 311 Electrode 313 2nd via | veer

Claims (14)

At least one connecting member formed;
A heat dissipating member located adjacent to the connecting member and divided into a plurality of parts;
Insulating members formed between the plurality of heat dissipation members divided and formed between the connection member and the heat dissipation member,
Including a core substrate.   The connection member is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. The core substrate according to claim 1, wherein   The heat dissipation member is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. The core substrate according to claim 1, wherein   The core substrate according to claim 1, wherein the core substrate has a thickness of 30 μm or less.   The core substrate according to claim 1, wherein the insulating member is formed in a lattice shape, and the heat radiating member is formed in contact with the insulating member in the lattice shape.   The core substrate according to claim 1, wherein the heat radiating member is formed in a lattice shape, and the insulating member is formed in the lattice shape so as to be in contact with the heat radiating member.   The core substrate according to claim 1, wherein each of the plurality of heat dissipation members is formed in a columnar shape. At least one or more connecting members formed, a plurality of heat dissipating members adjacent to the connecting member, and between the heat dissipating members divided into a plurality of members, and the connecting member and the heat dissipating member A core substrate made of an insulating member formed between
An insulating layer formed on the core substrate;
A circuit pattern formed on the insulating layer;
A first via formed in the insulating layer and electrically connecting the connection member and the circuit pattern;
Including a printed circuit board.   The connection member is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. The printed circuit board according to claim 8, wherein   The heat dissipation member is at least one selected from the group consisting of copper (Cu), nickel (Ni), tungsten (W), molybdenum (Mo), tantalum (Ta), aluminum (Al), and alloys thereof. The printed circuit board according to claim 8, wherein   The printed circuit board according to claim 8, wherein the core board has a thickness of 30 μm or less.   The printed circuit board according to claim 8, further comprising a solder resist layer formed on the insulating layer and having an opening that exposes a part of the circuit pattern.   The printed circuit board according to claim 12, further comprising a surface treatment layer formed on the circuit pattern exposed by the opening. An electronic component incorporated in the core substrate in the thickness direction and having electrodes formed on one surface;
A second via that electrically connects the circuit pattern and the electrode;
The printed circuit board according to claim 8, further comprising:

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