JP2014036150A - Method of manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which allows for smooth cutting of a mother laminate.SOLUTION: A method of manufacturing an electronic component 10 having a laminate 12 formed by laminating a plurality of insulator layers 15, 16, and 20 and including an electronic element consisting of a conductor layer 18 comprises: a first step of producing a mother laminate 112 where a plurality of laminates 12 are arranged in matrix, and a cut mark 21 is provided on a principal surface; and a second step of cutting the mother laminate 112 into a plurality of laminates 12 based on the cut mark 21. In the first step, a first insulation layer 22 having a shape overlapping the whole cut mark 21, in the plan view from the lamination direction, and located between mother insulator layers 115, 120 composing the mother laminate 112 is formed.

Description

  The present invention relates to a method for manufacturing an electronic component, and more specifically, to a method for manufacturing an electronic component having a laminate in which a plurality of insulator layers and conductor layers are laminated.

  As a conventional method for manufacturing an electronic component, for example, a method for manufacturing an electronic component described in Patent Document 1 is known. Below, the manufacturing method of the electronic component of patent document 1 is demonstrated. FIG. 6 is an exploded perspective view of the mother laminate 500 described in Patent Document 1. FIG. Further, the stacking direction of the mother stacked body 500 is defined as a z-axis direction, and directions along each side when viewed in plan from the z-axis direction are defined as an x-axis direction and a y-axis direction.

  The mother laminated body 500 is configured by arranging a laminated body of electronic components in a matrix, and as shown in FIG. 6, mother insulator layers 516 a to 516 g, coil conductor layers 518 a to 518 f, dummy conductor layers 522 a to 522f, cut marks 520a to 520c, and via hole conductors (not shown). The mother insulator layers 516a to 516g are large format magnetic sheets.

  The cut marks 520a to 520c are round conductor layers arranged at equal intervals on the mother insulator layer 516a. The coil conductor layers 518a to 518f are arranged in a matrix on the mother insulator layers 516b to 516g, respectively. The coil conductor layers 518a to 518f are provided at positions that do not overlap with the cut marks 520a to 520c when viewed in plan from the z-axis direction. Further, the coil conductor layers 518a to 518g are connected to each other adjacent to each other in the z-axis direction by a via-hole conductor (not shown) to constitute a spiral coil. The dummy conductor layers 522a to 522f are provided on the mother insulator layers 516b to 516g at positions overlapping the cut marks 520a to 520c when viewed in plan from the z-axis direction.

  By bonding the mother insulator layers 516a to 516g as described above, an unfired mother laminate 500 is obtained. Next, the unfired mother laminate 500 is cut along a cut line indicated by a dotted line in FIG. 6 to obtain a plurality of unfired laminates. At this time, the main surface of the mother laminate 500 on the positive side in the z-axis direction is imaged with a camera, and the positions of the cut marks 520a to 520c are identified by image recognition. And the cut line shown as a dotted line is determined on the basis of the position of the identified cut marks 520a to 520c, and the mother laminate 500 is cut. Then, an electronic component is obtained by baking a some unbaked laminated body and forming an external electrode.

  In the method for manufacturing an electronic component described in Patent Document 1 above, unevenness generated on the upper surface of the mother laminate 500 due to the presence of the coil conductor layers 518a to 518f is prevented by forming the dummy conductor layers 522a to 522f. Yes. Accordingly, the cut marks 520a to 520c face the positive direction side in the z-axis direction, and image recognition of the cut marks 520a to 520c by the camera is facilitated.

  By the way, in the manufacturing method of the electronic component described in Patent Document 1, when the mother laminate 500 is cut, the dummy conductor layers 522a to 522f are cut. Therefore, fragments of the dummy conductor layers 522a to 522f adhere to the blade cut from the mother laminated body 500. And when the next mother laminated body 500 is cut with the cutting blade to which the fragments of the dummy conductor layers 522a to 522f are attached, the dummy conductor layers 522a to 522f attached to the cutting blade are between the cutting blade and the mother laminated body 500. There was a possibility that the mother laminate 500 could not be cut smoothly due to the presence of the fragments.

JP 2011-86744 A

  Then, the objective of this invention is providing the manufacturing method of the electronic component which can cut a mother laminated body smoothly.

  The method for manufacturing an electronic component according to the present invention is a laminate in which a plurality of insulator layers are laminated, and the method for producing an electronic component having a laminate including an electronic element made of a conductor layer includes the plurality of laminates. A first step of producing a mother laminate in which bodies are arranged in a matrix and cut marks are provided on a main surface; and the mother laminate is laminated on the basis of the cut marks. A second step of cutting into a body, and having a shape that overlaps the entire cut mark when viewed in plan from the stacking direction in the first step, and constituting the mother stacked body A first insulator layer located between the mother insulator layers is formed.

  According to the present invention, the mother laminate can be cut smoothly.

It is an external appearance perspective view of the electronic component produced by the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a disassembled perspective view of the laminated body of the electronic component produced by the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a disassembled perspective view of the mother laminated body which is an aggregate | assembly of the laminated body of the electronic component produced by the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is sectional drawing of the mother laminated body which is an aggregate | assembly of the laminated body of the electronic component produced by the manufacturing method of the electronic component which does not satisfy | fill the structural requirements of this invention. It is sectional drawing in AA of the mother laminated body which is an aggregate | assembly of the laminated body of the electronic component produced by the manufacturing method of the electronic component which concerns on one Embodiment of this invention. It is a disassembled perspective view of the mother laminated body of the electronic component produced by the manufacturing method of the electronic component which concerns on invention of patent document 1. FIG.

  Below, the manufacturing method of the electronic component which concerns on one Embodiment of this invention is demonstrated.

(Configuration of electronic parts)
Hereinafter, a configuration of an electronic component manufactured by an electronic component manufacturing method according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of an electronic component 10 manufactured by an electronic component manufacturing method according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the laminate 12 of the electronic component 10 produced by the electronic component manufacturing method according to the embodiment of the present invention. Hereinafter, the stacking direction of the electronic component 10 is defined as the z-axis direction, the direction along the short side of the electronic component 10 is defined as the x-axis direction, and the direction along the long side of the electronic component 10 is defined as the y-axis direction. To do.

  As shown in FIGS. 1 and 2, the electronic component 10 includes a laminate 12, external electrodes 14 (14 a and 14 b), and a coil L (not shown in FIG. 1). The laminated body 12 has a rectangular parallelepiped shape and incorporates a coil L. Hereinafter, the surface on the positive side in the z-axis direction is referred to as the upper surface.

  Each of the external electrodes 14 a and 14 b is connected to a coil L built in the multilayer body 12. The external electrode 14a is provided on the side surface of the multilayer body 12 located on the negative direction side in the y-axis direction. Furthermore, the external electrode 14b is provided on the side surface of the multilayer body 12 positioned on the positive direction side in the y-axis direction. That is, the external electrodes 14 a and 14 b are provided on the side surfaces of the stacked body 12 that face each other.

  As shown in FIG. 2, the stacked body 12 includes insulator layers 15 a to 15 e, 16 a to 16 f, and 20 a to 20 f. Each of the insulator layers 15a to 15e has a rectangular shape, and is a single sheet-like magnetic layer made of Ni—Cu—Zn-based ferrite. The insulator layers 15a to 15c are stacked in this order on the positive side in the z-axis direction from the region where the coil conductor layers 18a to 18f are provided, and constitute an outer layer. The insulator layers 15d and 15e are laminated in this order on the negative side in the z-axis direction from the region where the coil conductor layers 18a to 18f are provided, and constitute an outer layer.

  As shown in FIG. 2, the insulator layers 20 a to 20 f have a rectangular shape and are a single sheet-like magnetic layer made of Ni—Cu—Zn-based ferrite.

  As shown in FIG. 2, the coil L includes coil conductor layers 18a to 18f and via hole conductors b1 to b5. The coil L has an axis extending in the z-axis direction, and has a spiral shape that advances from the positive side to the negative side in the z-axis direction while turning counterclockwise.

  The coil conductor layer 18 is made of a conductive material mainly composed of Ag, and constitutes a part of the spiral coil L. Specifically, the coil conductor layers 18a to 18f are linear conductors provided on the surfaces of the insulator layers 20a to 20f, respectively, as shown in FIG. In the coil conductor layers 18a to 18e, the upstream end in the counterclockwise direction is referred to as an upstream end, and the downstream end in the counterclockwise direction is referred to as a downstream end.

  The coil conductor layer 18a is provided on the upper surface of the insulator layer 20a and has a length corresponding to 5/8 rounds. The upstream end of the coil conductor layer 18a is drawn to the negative side of the insulator layer 20a in the y-axis direction. Further, the downstream end of the coil conductor layer 18a is connected to the positive end of the via-hole conductor b1 in the z-axis direction in the vicinity of the midpoint of the negative side in the x-axis direction of the insulator layer 20a. Yes.

  The coil conductor layer 18b is provided on the upper surface of the insulator layer 20b and has a length corresponding to 7/8 rounds. The upstream end of the coil conductor layer 18b is connected to the end on the negative side in the z-axis direction of the via-hole conductor b1 in the vicinity of the midpoint of the negative side in the x-axis direction of the insulator layer 20b. The downstream end of the coil conductor layer 18b is in the vicinity of the angle formed by the side on the negative direction side in the x-axis direction of the insulator layer 20b and the side on the positive direction side in the y-axis direction. Is connected to the end of the positive direction side.

  The coil conductor layer 18c is provided on the upper surface of the insulator layer 20c and has a length corresponding to 7/8 rounds. The upstream end of the coil conductor layer 18c is connected to the via-hole conductor b2 in the vicinity of the angle formed by the negative side in the x-axis direction and the positive side in the y-axis direction of the insulator layer 20c. The downstream end of the coil conductor layer 18c is connected to the end of the via hole conductor b3 on the positive direction side in the z-axis direction near the midpoint of the side on the positive direction side in the y-axis direction of the insulator layer 20c. Yes.

  The coil conductor layer 18d is provided on the surface of the insulator layer 20d and has a length corresponding to 7/8 rounds. The upstream end of the coil conductor layer 18d is connected to the end of the via hole conductor b3 on the negative side in the z-axis direction in the vicinity of the midpoint of the side on the positive direction side in the y-axis direction of the insulator layer 20d. The downstream end of the coil conductor layer 18d is in the vicinity of the angle formed by the side on the positive direction side in the x-axis direction of the insulator layer 20d and the side on the positive direction side in the y-axis direction. Is connected to the end of the positive direction side.

  The coil conductor layer 18e is provided on the upper surface of the insulator layer 20e and has a length corresponding to 7/8 rounds. The upstream end of the coil conductor layer 18e is near the angle formed by the side on the positive direction side in the x-axis direction and the side on the positive direction side in the y-axis direction of the insulator layer 20e, and is negative in the z-axis direction of the via-hole conductor b4. It is connected to the end on the direction side. Further, the downstream end of the coil conductor layer 18e is connected to the positive end of the via-hole conductor b5 in the z-axis direction in the vicinity of the midpoint of the side on the positive direction side in the x-axis direction of the insulator layer 20e. Yes.

  The coil conductor layer 18f is provided on the upper surface of the insulator layer 20f, and extends from the vicinity of the midpoint of the side of the insulator layer 20f on the positive side in the x-axis direction toward the positive side in the y-axis direction. ing. The upstream end of the coil conductor layer 18f is connected to the end of the via hole conductor b5 on the negative direction side in the z-axis direction in the vicinity of the midpoint of the side on the positive direction side in the x-axis direction of the insulator layer 20f. Further, the downstream end of the coil conductor layer 18f is drawn out to the side on the positive direction side in the y-axis direction of the insulator layer 20f. The coil conductor layers 18a to 18f overlap each other to form a rectangular annular track when viewed in plan from the z-axis direction.

  As shown in FIG. 2, the via-hole conductors b1 to b5 penetrate the insulator layers 20a to 20e in the z-axis direction, and connect the coil conductor layers 18a to 18f adjacent in the z-axis direction as described above. ing.

  As shown in FIG. 2, the insulator layers 16a to 16f are provided on portions other than the coil conductor layers 18a to 18f on the upper surfaces of the insulator layers 20a to 20f, respectively. Accordingly, the surfaces of the insulator layers 20a to 20f are covered with the insulator layers 16a to 16f and the coil conductor layers 18a to 18f. Further, the upper surfaces of the insulator layers 16a to 16f and the coil conductor layers 18a to 18f each constitute one plane. That is, there is no step in the joints between the upper surfaces of the insulator layers 16a to 16f and the coil conductor layers 18a to 18f.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring FIG. 1 thru | or FIG. FIG. 3 is an exploded perspective view of the mother laminated body 112 that is an aggregate of the laminated bodies 12. In FIG. 3, the new insulator layers 22 a to 22 f are hatched in order to facilitate understanding of the shape of the new insulator layer 22.

  In the method for manufacturing an electronic component according to an embodiment of the present invention, a plurality of electronic components 10 are manufactured simultaneously. First, ceramic green sheets (mother insulator layers) 115 and 120 to be the insulator layers 15 and 20 in FIG. 2 are prepared. Specifically, each material obtained by weighing iron oxide, zinc oxide, nickel oxide and copper oxide at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  A binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting agent, and a dispersing agent are added to the ferrite ceramic powder and mixed by a ball mill, and then defoamed by reducing pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce ceramic green sheets 115 and 120.

  Next, a ferrite paste (insulating paste) of a ceramic green layer to be the insulator layer 16 is prepared. Specifically, each material obtained by weighing iron oxide, zinc oxide, nickel oxide and copper oxide at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  A binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting agent, and a dispersing agent are added to the ferrite ceramic powder and mixed with a ball mill. A ferrite paste of the ceramic green layer to be obtained is obtained.

  Next, via-hole conductors b1 to b5 are formed in the ceramic green sheets 120a to 120e to be the insulator layers 20a to 20f, respectively. Specifically, the ceramic green sheets 120a to 120e are irradiated with a laser beam to form via holes. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.

  Next, a conductive paste such as Ag, Pd, Cu, Au, or an alloy thereof is applied to the upper surfaces of the ceramic green sheets 120a to 120f by a method such as a screen printing method or a photolithography method, whereby the coil conductor layers 18a to 18a. 18f and cut marks 21a to 21c are formed.

  Specifically, the cut marks 21 are formed on the surface (main surface) of the ceramic green sheet 115a at equal intervals along the side of the ceramic green sheet 115a. As shown in FIG. 3, the cut mark 21 is a circular conductor layer provided on the upper surface of the mother laminated body 112, and is provided on the intersection of the cut lines CLx and CLy indicated by dotted lines.

  Each of the cut lines CLx and CLy extends in the x-axis direction or the y-axis direction, and indicates a position where the mother stacked body 112 is cut. Then, when the mother laminate 112 is cut, the cut lines CLx and CLy are positioned based on the cut mark 21. In FIG. 3, only representative ones of the cut lines CLx and CLy are denoted by reference numerals in order to prevent the drawing from becoming complicated.

  Next, coil conductor layers 18a to 18f are formed on the respective surfaces of the ceramic green sheets 120a to 120f. That is, the coil conductor layers 18a to 18f are formed in a matrix on the respective surfaces of the ceramic green sheets 120a to 120f. The coil conductor layers 18a to 18f are formed by screen printing. Note that the step of forming the coil conductor layers 18a to 18f and the step of filling the via hole with the conductive paste may be performed in the same step.

  Next, the ceramic green sheets 116a to 116f that are to become the insulator layers 16a to 16f are formed on the surface of the ceramic green sheets 120a to 120f except for the region where the coil conductor layers 18a to 18f are formed. The ceramic green sheets 116a to 116f are formed by screen printing.

  Next, insulator layers 22a to 22f (first insulator layers) are formed on the respective surfaces of the ceramic green sheets 120a to 120f. The insulator layers 22a to 22f are formed at positions overlapping the cut mark 21 when viewed in plan from the z-axis direction. The formation of the insulator layers 22a to 22f is performed by screen printing. Moreover, the shape of the insulator layers 22a to 22f has a shape that overlaps with the cut mark 21 when viewed in plan from the z-axis direction. In the laminating process described later, the ceramic green sheets 120a to 120f are laminated, so that the insulator layers 22a to 22f are positioned between the ceramic green sheets (mother insulator layers) 115 and 120, respectively. Hereinafter, the cut mark 21a and the insulator layer 22a will be described in detail as an example.

  As shown in FIG. 3, the cut mark 21a is provided at the intersection of the cut lines CLx and CLy. Therefore, the cut mark 21a straddles the four stacked bodies 12 when viewed in plan from the z-axis direction. Then, an insulating layer 22a that overlaps the entire cut mark 21 when viewed in plan from the z-axis direction is formed in a portion corresponding to the four laminated bodies 12 in the ceramic green sheet 120a. The insulator layer 22 a is a film-like insulator layer that covers substantially the entire portion corresponding to the four stacked bodies 12. Further, the step of forming the insulator layers 22a to 22f and the step of forming the ceramic green sheets 116a to 116f may be performed in the same step.

  Next, the ceramic green sheets 115a to 115c, the ceramic green sheets 120a to 120f on which the coil conductor layers 18 and the like are formed, and the ceramic green sheets 115d and 115e are moved from the positive side in the z-axis direction toward the negative direction. Lamination is performed in order to obtain an unfired mother laminate. Specifically, the ceramic green sheets 115e and 115d, the ceramic green sheets 120e, 120d, 120c, 120b, and 120a on which the coil conductor layer 18 and the like are formed, and the ceramic green sheets 115b and 115a in this order are arranged in the z-axis direction. Lamination and temporary pressure bonding are performed one by one so as to line up from the negative direction side to the positive direction side. Thereafter, the unfired mother laminate is pressed by an isostatic press to perform the main pressing. The conditions of the hydrostatic press are, for example, a pressure of 100 MPa and a temperature of 45 ° C.

  Next, the mother laminated body 112 is cut into a laminated body 12 having a predetermined size by a dicing saw. At this time, a cutting device having a camera, a table, a feeding device, and a dicing saw is used. First, the mother laminate 112 is placed on the table. Next, the upper surface of the mother laminated body 112 is imaged with a camera, and the position of the cut mark 21 is identified by image recognition. Next, the cut lines CLx and CLy are determined based on the identified cut mark 21. And the mother laminated body 112 is cut into the some laminated body 12 along the cut lines CLx and CLy with a dicing saw. At this time, the operation of moving the table by a predetermined distance by the feeding device and the operation of cutting the mother laminated body 112 through the dicing saw are repeated. Through the above steps, a plurality of unfired laminates 12 are obtained. Note that the stacked body 12 including the insulator layer 22 is discarded.

  Next, the unbaked laminate 12 is subjected to binder removal processing and baking. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 850 ° C. for 2 hours. Firing is performed, for example, at 870 ° C. to 900 ° C. for 2.5 hours.

  The fired laminated body 12 is obtained through the above steps. The laminated body 12 is chamfered by barrel processing. Thereafter, a conductive paste such as Ag, Pd, Cu, Au, or an alloy containing Ag as a main component is applied to the surface of the laminate 12. Then, the applied conductive paste is baked at a temperature of about 800 ° C. for 1 hour. Thereby, the silver electrode which should become external electrode 14a, 14b is formed.

  Finally, the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode. Through the above steps, the electronic component 10 as shown in FIG. 1 is completed.

(effect)
According to the manufacturing method of the electronic component 10 as described above, the mother laminated body 112 can be smoothly cut as described below.

  In the conventional method for manufacturing an electronic component, when the mother laminate 500 is cut, the dummy conductor layers 522a to 522f are cut. Therefore, fragments of the dummy conductor layers 522a to 522f adhere to the blade cut from the mother laminated body 500. Then, when the next mother laminate 500 is cut with the blade to which the pieces of the dummy conductor layers 522a to 522f are attached, the pieces of the dummy conductor layers 522a to 522f attached to the blade are between the blade and the mother laminate 500. There was a possibility that the mother laminate 500 could not be cut smoothly.

  Therefore, in the method of manufacturing the electronic component 10, the ceramic green sheets 120a to 120f under the cut mark 21 are provided with insulator layers 22a to 22f as shown in FIG. 3 instead of the dummy conductor layers. Therefore, fragments of the insulator layers 22a to 22f adhere to the blade from which the cut mark has been cut. However, the fragments of the insulator layers 22a to 22f attached to the blade are soft. Therefore, even if the next mother laminated body 112 is cut with the blade to which the fragments of the insulator layers 22a to 22f are attached, the fragments of the insulator layers 22a to 22f attached to the blade are also cut simultaneously with the cutting of the mother laminated body 112. Disconnected. Therefore, the mother laminated body 112 can be cut smoothly.

  Further, in the conventional method for manufacturing an electronic component, fragments of the dummy conductor layers 522a to 522f adhere to the blade cut from the mother laminated body 500. As a result, the dummy conductor layers 522a to 522f are interposed between the blade and the mother laminated body 500, and stress concentrates on this portion, and there is a possibility that the mother laminated body 500 is cracked.

  On the other hand, in the manufacturing method of the electronic component 10, although the fragments of the insulator layers 22a to 22f adhere to the blade, the fragments of the insulator layers 22a to 22f attached to the blade are soft. Therefore, simultaneously with the cutting of the mother laminate 112, the pieces of the insulator layers 22a to 22f attached to the blade are also cut. Therefore, when the mother laminate 112 is cut, the mother laminate 112 is not cracked.

  Furthermore, in the conventional method for manufacturing an electronic component, when the mother laminated body 500 is cut, the dummy conductor layers 522a to 522f are cut. The dummy conductor layers 522a to 522f are made of Ag that is harder than the material of the insulator layers 22a to 22f. Therefore, in the conventional method for manufacturing an electronic component, the cutting blade is easily damaged, and the replacement frequency of the cutting blade is often increased.

  On the other hand, in the manufacturing method of the electronic component 10, the cutting blade cuts the insulator layers 22a to 22f that are softer than the dummy conductor layers 522a to 522f. Therefore, in the manufacturing method of the electronic component 10, the cutting blade is less likely to be damaged and the replacement frequency of the cutting blade can be reduced compared to the conventional manufacturing method of the electronic component.

  Moreover, in the manufacturing method of the electronic component 10, the insulator which has the shape which overlaps with the whole cut mark 21 (21a-21c) in the laminated body 12 which overlaps with the cut mark 21 when planarly viewed from the z-axis direction. Layer 22 (22a-22f) is formed. That is, as shown in FIG. 3, a plurality of insulator layers 22 (22 a to 22 f) are positioned on the negative side of the cut mark 21 in the z-axis direction.

  Here, suppose that the mother laminated body in which the insulator layer 22 (22a-22f) is not formed is mentioned as an example. In this case, as shown in FIG. 4, the laminated body 12 in which the coil conductor layers 18a to 18f and the insulator layers 16a to 16f are formed exists around the laminated body 12 in which the cut mark 21 is formed. At this time, the thickness in the z-axis direction of the laminate 12 in which the coil conductor layers 18a to 18f and the insulator layers 16a to 16f are formed is cut by the amount of the coil conductor layers 18a to 18f and the insulator layers 16a to 16f. It becomes thicker than the laminate 12 on which the mark 21 is formed. Accordingly, a depression is generated on the upper surface of the mother laminate 112.

  However, in the method for manufacturing the electronic component 10, as shown in FIG. 5, a plurality of insulator layers 22 (22 a to 22 f) are provided on the negative side in the z-axis direction of the cut mark 21, and the mother laminated body 112. It is suppressing that a dent arises in the upper surface of. Thereby, the cut marks 20a to 20c face the positive direction side in the z-axis direction, and image recognition of the cut marks 20a to 20c by the camera becomes easy.

  Moreover, in the manufacturing method of the electronic component 10, new insulator layers 22a to 22f are provided for all the ceramic green sheets 120a to 120f on which the coil conductor layers 18a to 18f are provided. Thereby, in the manufacturing method of the electronic component 10, compared with the case where only one new insulator layer is provided, the occurrence of a depression on the upper surface of the mother laminated body 112 is further suppressed.

  Furthermore, in the manufacturing method of the electronic component 10, the step of forming the insulator layers 16a to 16f and the formation of the insulator layers 22a to 22f can be simultaneously performed by screen printing. Thereby, the manufacturing process of the electronic component 10 can be simplified more.

  By the way, in the manufacturing method of the electronic component 10, as described above, new insulator layers 22a to 22f are provided on all the ceramic green sheets 120a to 120f on which the coil conductor layers 18a to 18f are provided. However, the new insulator layer 22 may be provided for at least one of the ceramic green sheets 120a to 120f.

  In the method of manufacturing the electronic component 10, the mother laminated body 112 is manufactured by laminating and press-bonding a plurality of ceramic green sheets 120. However, the manufacturing method of the mother laminated body 112 is not limited to this. The mother laminated body 112 may be produced by a printing method, for example.

  In addition, the electronic component 10 includes a coil L as an electronic element. However, the electronic element is not limited to the coil L. That is, the electronic element may be a capacitor or other element.

  As described above, the present invention is useful for a method of manufacturing an electronic component, and is particularly excellent in that the mother laminate can be cut smoothly.

CLx, CLy Cut line L Coil b1-b5 Via-hole conductor 10 Electronic component 12 Laminated body 14a, 14b External electrode 15a-15e, 16a-16f, 20a-20f, 22a-22f Insulator layer 18a-18f Coil conductor layer 21a-21c Cut mark 112 Mother laminate 115a to 115e, 116a to 116f, 120a to 120f Ceramic green sheet

Claims (6)

In a method of manufacturing an electronic component having a laminate in which a plurality of insulator layers are laminated and including an electronic element made of a conductor layer,
A first step of producing a mother laminate in which a plurality of the laminates are arranged in a matrix and cut marks are provided on the main surface;
A second step of cutting the mother laminate into the plurality of laminates based on the cut marks;
With
In the first step, the first insulation has a shape that overlaps with the entire cut mark when viewed in plan from the stacking direction, and is located between the layers of the mother insulator layer constituting the mother stack. Forming a body layer,
A method of manufacturing an electronic component characterized by In the first step, each of the plurality of mother insulator layers on which the conductor layer is formed has a shape that overlaps the entire cut mark when viewed in plan from the stacking direction. The method of manufacturing an electronic component according to claim 1, wherein: The conductor layer is a coil conductor layer;
The method for manufacturing an electronic component according to claim 1, wherein: A plurality of the coil conductor layers constitute an annular track by overlapping each other when viewed in plan from the stacking direction;
The method of manufacturing an electronic component according to claim 3. The first step includes
A third step of forming the cut mark on the mother insulator layer constituting the mother laminate;
A fourth step of forming the conductor layer on the mother insulator layer different from the mother insulator layer on which the cut mark is formed;
A fifth step of forming the first insulator layer on the mother insulator layer on which the conductor layer is formed;
A sixth step of laminating and pressure-bonding the mother insulator layer to obtain the mother laminate;
Including
The method for manufacturing an electronic component according to claim 1, wherein: In the fifth step, a second insulator layer is provided on a portion other than the conductor layer on the mother insulator layer different from the mother insulator layer on which the cut mark is formed, and the first insulator layer is provided. Forming with,
The method of manufacturing an electronic component according to claim 5.

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