JP2014033121A - Manufacturing method and manufacturing apparatus of opto-electronic component, and opto-electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an opto-electronic component capable of suppressing leakage of light in an undesired direction to the minimum, in which an optical element is resin-sealed.SOLUTION: A substrate comprising a plurality of unit regions to each of which at least one optical element is mounted is resin-sealed using an upper mold and a lower mold in the manufacturing method of the opto-electronic component. The manufacturing method includes a substrate holding step for holding the substrate so that the optical element faces the lower die side, a fluid resin supply step for supplying a fluid resin to a cavity provided in the lower die while having a unit cavity forming a recessed part each corresponding to the unit region, a mold clamping step for clamping the upper mold and the lower mold by puting them together, and a resin curing step for curing the fluid resin. In the mold clamping step, a communication space for communicating between adjoining unit cavities is formed between the upper mold and the lower mold, and the communication space has the minimum height allowing the fluid resin to reliably flow.

Description

  The present invention relates to an optoelectronic component manufacturing method and apparatus, and an optoelectronic component. In particular, the present invention relates to a method and apparatus for manufacturing an optoelectronic component for sealing an optical element in a transparent resin, and an optoelectronic component manufactured in such a manner.

An optical element such as an LED package is manufactured by sealing an optical element such as an LED in a light-transmitting resin. In many cases, this translucent resin is molded into a predetermined shape and imparted with a lens function.
In recent years, in order to improve manufacturing efficiency, a plurality of optoelectronic components are manufactured at once by mounting a plurality of optical elements on a single substrate and sealing them with resin.

The resin sealing method includes a transfer molding method (for example, Patent Document 1) and a compression molding method (for example, Patent Document 2).
When sealing a plurality of optoelectronic components by transfer molding, a transfer molding mold in which a plurality of cavities are formed between an upper mold and a lower mold is used. While the upper mold and the lower mold of the mold are clamped, a fluid resin is poured from the outside, and the fluid resin is sequentially supplied to each cavity. Then, the fluid resin is cured to form a cured resin. Therefore, it is necessary to provide a flow path for resin supply between the cavities, but the fluid resin in the flow path remains between the molded products in the cavities even after curing. In addition, the waste of the fluid resin increases.

On the other hand, in the molding die for compression molding, the resin is supplied to each cavity before the upper die and the lower die are clamped. Then, the upper die and the lower die are clamped to immerse each optical element in the resin, and the upper die and the lower die are pressed (compressed), and then the resin is cured. Therefore, there is no need to provide a flow path for flowing resin between the cavities. That is, when the compression molding method is used, in principle, an optoelectronic component having no excess cured resin (referred to as a burr) between molded products in each cavity can be manufactured.
However, in the compression molding method, it is necessary to equalize the amount of resin supplied to each cavity, which is difficult to adjust. If the amount of resin supplied to each cavity is excessive, the resin overflows from the cavity and causes burrs. In addition, when the amount of resin supplied to each cavity is insufficient, voids are generated. That is, if an optoelectronic component without burrs is to be manufactured, there arises a problem that the yield (non-defective product rate) cannot be increased due to the generation of undesired burrs. Patent Document 2 discloses a configuration in which communication paths are provided between cavities in order to adjust the amount of resin for each cavity.

JP 2006-351970 A JP 2010-125647 A

  In the method described in Patent Document 2, burrs of cured resin occur on the side of the lens portion of the manufactured optoelectronic component. Originally, all the light generated by the optical element sealed in the transparent resin should be emitted from the lens unit in a desired direction according to its shape, but when such a burr exists, A part leaks from the burr portion to the side and the like to generate light (stray light) in an undesired direction and also reduce the amount of light in the desired direction.

  A problem to be solved by the present invention is a method and apparatus for manufacturing an optoelectronic component in which an optical element is resin-sealed by a compression molding method, and suppresses light leakage in an undesired direction to a minimum. It is an object to provide an optoelectronic component manufacturing method and manufacturing apparatus capable of performing the above. Moreover, the optoelectronic component manufactured using the manufacturing method and manufacturing apparatus of the said optoelectronic component is also provided.

In order to solve the above-mentioned problems, the present invention provides an optoelectronic component comprising a plurality of unit regions, and a substrate on which at least one optical element is mounted in each unit region is resin-sealed using an upper mold and a lower mold A manufacturing method of
a) a substrate holding step of holding the substrate at a predetermined position on the lower surface side of the upper mold such that the optical element is on the lower mold side;
b) A flowable resin supply step for supplying a flowable resin to a cavity having unit cavities provided in the lower mold and corresponding to the unit regions, respectively.
c) a mold clamping step of combining the upper mold and the lower mold and clamping the mold;
d) a resin curing step for curing the flowable resin;
Have
In the mold clamping step, a communication space that communicates between adjacent unit cavities is formed between the upper mold and the lower mold, and the communication space has a minimum height that allows the flowable resin to flow reliably. It is characterized by having.

  The communication space may be a flat space that communicates with adjacent unit regions over the entire circumference of the unit region. Further, a communication space in which a part of the entire circumference of the unit area communicates with the adjacent unit area may be used.

Another aspect of the present invention made to solve the above-described problems is an optoelectronic component manufacturing apparatus for resin-sealing a substrate having a plurality of unit regions and at least one optical element mounted on each unit region. There,
a) an upper mold for detachably holding a non-mounting surface side of the optical element of the substrate in a predetermined position;
b) a lower mold that includes unit cavities that are concave portions corresponding to the unit regions, respectively, and has a cavity that is large enough to cover the entire unit region in plan view;
c) Fluid resin supply means for supplying fluid resin to the cavity;
d) mold opening and closing means for clamping and opening the upper mold and the lower mold;
With
In a state where the upper mold and the lower mold are clamped by the mold clamping means, a communication space that communicates between adjacent unit cavities is formed between the upper mold and the lower mold, and the communication space However, the flowable resin has a minimum height at which the flowable resin flows reliably.

The flowable resin may be a resin that is liquid at room temperature, or may be a solid resin (powder, granule, granule, flake, lump, sheet) that is liquefied by heating.
The upper mold preferably includes a temporary fixing jig that holds the substrate by aligning the unit region and the unit cavity. Thereby, the optical element can be resin-sealed with high positional accuracy.
In the method of manufacturing an optoelectronic component according to the present invention, the height of the communication space is minimized, so that the thickness of burrs remaining after the plurality of optoelectronic components is separated into pieces can be minimized. Therefore, light leakage from the optoelectronic component can be minimized.
The same effect as described above can also be obtained when an optoelectronic component is manufactured using the optoelectronic component manufacturing apparatus according to the present invention.

The height of the communication space where the flowable resin can flow reliably varies depending on the viscosity of the resin used. The viscosity of the resin is measured with a rotational viscometer. The unit of viscosity of the resin is Pa · s (Pascal second) or P (Poise). In the case of using a resin having a high viscosity, the height is increased, and the fluid resin is spread throughout the cavity through the communication space. The viscosity of a resin generally used in manufacturing an optoelectronic component is about 20 to 200 Pa · s (200 to 2000 P), and the height may be 0.02 mm or more and 0.1 mm or less.
The height is more preferably 0.03 mm or more and 0.06 mm or less. By setting the height to 0.03 mm or more, the strength of the cured resin that connects adjacent optoelectronic components can be increased. Thereby, when removing the resin-sealed substrate from the upper mold, it is possible to prevent the cured resin from being damaged. Further, by setting the upper limit of the height to 0.06 mm, it is possible to suppress the use amount of a relatively expensive resin for encapsulating an optoelectronic component.

  The recess preferably has a shape that adds optical characteristics to the cured resin formed in the unit cavity. Examples of the shape to which optical features are added include a substantially hemispherical lens shape, a Fresnel lens shape, and a prism shape. By forming the concave portion in such a shape, optical features can be added to the manufactured optoelectronic component.

  When the optoelectronic component manufacturing method or manufacturing apparatus according to the present invention is used, the thickness of burrs that reliably remain in each optoelectronic component after singulation can be minimized. Therefore, light leakage from optoelectronic components manufactured using these methods and apparatuses can be minimized.

The figure explaining the structure on the board | substrate in one Example of the manufacturing method and manufacturing apparatus of the optoelectronic component which concern on this invention. The figure explaining the manufacturing process of the optoelectronic component in a present Example. The figure explaining the process of separating an optoelectronic component from the resin-sealed board | substrate in a present Example. The figure explaining another Example of the manufacturing method and manufacturing apparatus of the optoelectronic component which concern on this invention. The figure which shows an example of the optoelectronic component manufactured using the manufacturing method and manufacturing apparatus of the optoelectronic component which concern on this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an optoelectronic component manufacturing method, manufacturing apparatus, and optoelectronic component according to the present invention will be described with reference to the drawings. In any of the drawings shown below, in order to facilitate understanding, some of the constituent elements are schematically omitted or emphasized.

  In this embodiment, an optoelectronic component is manufactured by resin-sealing an optical element (LED chip 43) mounted on a reflecting member 38 provided on a substrate (lead frame 32) composed of a plurality of unit regions. Method and apparatus, and optoelectronic components produced thereby.

  FIG. 1 shows a substrate 31 before resin sealing in this embodiment. FIG. 1A is a plan view of the substrate 31 before resin sealing, and FIG. 1B is a cross-sectional view taken along line AA of the substrate 31 before resin sealing. The substrate 31 before resin sealing has a lead frame 32. The lead frame 32 includes an outer frame 33, connecting portions 34 and 35 extending along the X direction and the Y direction, and a plurality of unit regions 37 partitioned in a lattice pattern by virtual lines 36 indicated by two-dot chain lines. Is provided. A reflection member 38 is formed in each unit region 37 on the substrate 31 before resin sealing. The reflection member 38 is formed in advance on the lead frame 32 by a method such as injection molding, transfer molding, or compression molding, and is made of a thermosetting resin containing a filler for reflecting and radiating light. The reflecting member 38 has an upper surface 39, a recess 40, a bottom surface 41, and a slope 42.

  The substrate 31 before resin sealing has a plurality of optical elements (LED chips 43). The plurality of LED chips 43 are respectively attached to the bottom surface 41 of each reflecting member 38. The bottom surface 41 and the slope 42 of each reflecting member 38 reflect the light emitted from the LED chip 43. An electrode (not shown) of the LED chip 43 and a lead (not shown) of the lead frame 32 are electrically connected. This connection is performed by a known method such as wire bonding or flip chip bonding. In this embodiment, the LED chip 43 is mounted on the bottom surface 41 of the reflecting member 38. However, when a reflecting member that does not have a bottom portion (consisting only of a peripheral portion) is used, the LED chip is mounted on the substrate. You may make it do.

The manufacturing process of the optoelectronic component according to this embodiment will be described with reference to FIGS. First, as shown in FIG. 2A, the substrate 31 before resin sealing shown in FIG. 1 and a temporary fixing jig (carrier 50) for fitting the substrate 31 before resin sealing are prepared. The carrier 50 is used to hold the unit region 37 and a unit cavity 21a, which will be described later, in alignment with each other and to seal the LED chip 43 with high positional accuracy. The carrier 50 includes an opening 51 into which the reflecting member 38 of the substrate 31 before resin sealing is fitted, and a thin plate-like support portion 52 provided at the peripheral edge at the lower end of the opening 51.
Next, as shown in FIG. 2 (b), the reflecting member 38 of the substrate 31 before resin sealing is fitted into the opening 51 of the carrier 50. At this time, the upper surface 39 (the lower surface in FIG. 2B) of the reflecting member 38 in which the reflecting member 38 is fitted in the opening 51 is supported by the support portion 52.

  Subsequently, as shown in FIG. 2B, the reflection member 38 of the substrate 31 before resin sealing is fitted into the opening 51 (see FIG. 2A) between the upper mold 10 and the lower mold 20 facing each other. The loaded carrier 50 is carried in, and the carrier 50 is fixed at a predetermined position of the upper mold 10. This predetermined position will be described later. As means for fixing, well-known means such as clamping with a jig and suction are used.

  The lower mold 20 includes a cavity block 26 and a peripheral member 24 provided around the cavity block 26, and is provided with a heater (not shown). A cavity 21 is formed by the upper surface of the cavity block 26 and the inner surface of the peripheral member 24. The cavity 21 is the entire space for supplying the fluid resin as will be described later. The peripheral member 24 is supported by an elastic member 25 made of a coil spring, a disc spring, or the like.

  The cavity 21 has a plurality of unit cavities 21a. Each unit cavity 21a is a recess formed at a position corresponding to each unit region 37 of the substrate 31 before resin sealing. The predetermined position described above when the carrier 50 is fixed to the upper mold 10 means a position where the position of each unit region 37 and each unit cavity 21a coincides.

  The fluid resin 22 is supplied to the cavity 21 including the unit cavity 21a. In this example, a resin (liquid resin) having a viscosity of 100 Pa · s and having a viscosity of 100 Pa · s was used as the fluid resin. The fluid resin 22 is not limited to a liquid resin, and may be a solid resin (powder, granule, granule, flake, lump, sheet) that melts (liquefies) by heating. Further, from the viewpoints of characteristics and types of resins, a thermosetting resin having translucency, such as an epoxy resin and a silicone resin, can be used as the resin material. Further, a fine phosphor may be mixed in advance with a liquid resin. In this application document, the phrase “supplying fluid resin to the cavity” means “supplying liquid resin to the cavity” and “heating and melting after supplying solid resin to the cavity” "Means both.

  Next, the upper mold 10 and the lower mold 20 are clamped, and the lower surface of the carrier 50 and the upper surface of the peripheral member 24 are brought into contact with each other. Subsequently, the upper die 10 and the lower die 20 are completely clamped by lowering the upper die 10. In this way, each LED chip 43 is immersed in the fluid resin 22.

Here, the characteristic content of the optoelectronic component manufacturing method and manufacturing apparatus according to the present invention will be described.
In a state where the upper mold 10 and the lower mold 20 are completely clamped, a communication space 27 that communicates between the unit cavities 21a provided corresponding to the unit regions 37 is intentionally formed (FIG. 2 (c)). )). In this embodiment, a flat communication space 27 that covers each unit cavity 21a is formed. The unit cavity 21 a provided corresponding to the unit region 37 communicates with all adjacent unit cavities 21 on the entire circumference of the unit cavity 21 through the communication space 27. The height of the communication space 27 is a minimum height at which the flowable resin 22 reliably flows in all the communication spaces 27. In this embodiment using the flowable resin 22 having a viscosity of 100 Pa · s, the height is about 0.05 mm. This height is changed according to the viscosity of the fluid resin used. In the case of using a resin having a high viscosity, the height of the communication space is set high, and the fluid resin is spread throughout the cavity through the communication space. The viscosity of a resin generally used in manufacturing an optoelectronic component is about 20 to 200 Pa · s (200 to 2000 P), and the height may be 0.02 mm or more and 0.1 mm or less. Thereby, the fluid resin 22 can be filled uniformly over the entire cavity 21 including the unit cavity 21a.
Note that, unlike the present embodiment, a communication space in which a part of the entire circumference of the unit cavity 21a provided corresponding to the unit region 37 communicates with the adjacent unit region may be used.

  In the state shown in FIG. 2 (c), the fluid resin 22 is heated and cured to form a cured resin 23, and the LED chip 43 is sealed. At this time, the inside of the cavity is evacuated by the decompression means (not shown) to exhaust the air inside the cavity 21. This prevents voids from occurring in the optoelectronic component after resin sealing. Thus, a resin-sealed substrate 31a having the lead frame 32, the reflecting member 38, the LED chip 43, and the cured resin 23 is formed. The resin-sealed substrate 31 a is formed in a state where the reflecting member 38 is fitted in the carrier 50 and is fixed to the upper mold 10. Thereafter, the upper mold 10 is raised, and the upper mold 10 and the lower mold 20 are opened (FIG. 2 (d)). Then, the resin-sealed substrate 31 a fitted in the carrier 50 is removed from the upper mold 10.

  As shown in FIG. 2 (d), the resin-sealed substrate 31 a has a convex lens portion 28 made of a cured resin 23 and a thin plate-like communication portion 29. The lens portion 28 is a curable resin 23 formed in the unit cavity 21 a, and the communication portion 29 is a curable resin 23 formed in the communication space 27. As is apparent from FIGS. 2C and 2D, the height of the communication space 27 is equal to the thickness of the thin plate-like communication portion 29 in the resin-sealed substrate 31a.

  Next, as shown in FIG. 3A, the resin-sealed substrate 31 a fitted in the carrier 50 is placed on the fixing jig 61. Thereafter, the resin sealed substrate 31a is protruded from the carrier 50 by protruding the communicating portion 29 of the resin sealed substrate 31a using the protruding means 60.

  The protruding means 60 has cylindrical portions 60a corresponding to the lens portions 28 of the resin-sealed substrate 31a. The cylindrical portion 60 a includes the lens portion 28 in plan view, and has a slightly larger planar dimension than the lens portion 28.

  When the cylindrical portion 60a projects the resin-sealed substrate 31a from the state shown in FIG. 3A, the lens portion 28 and the communication portion 29 are separated from each other in the resin-sealed substrate 31a as shown in FIG. 3B. . At this time, a burr 30 is generated in a portion separated from the communication portion 29 in the lens portion 28. However, as described above, since the height of the communication space 27 is minimized in this embodiment, the thickness of the burr 30 is also minimized.

  Next, as shown in FIG. 3 (c), the resin-sealed substrate 31a is fixed on a stage (not shown) and cut along a predetermined cutting line using a rotary blade or the like (full cut). To do). In this way, the resin-sealed substrate 31a is separated into individual optoelectronic components. The final product, an optoelectronic component (LED package), includes a substrate portion (not shown) corresponding to a part obtained by dividing the substrate, a reflecting member 38, an LED chip 43, and a lens portion 28. As described above, the burr 30 remains on the side of the lens portion 28, but the thickness thereof is minimized, so that light leakage in an undesired direction is minimized.

As described above, in this embodiment, in the state where the upper mold 10 and the lower mold 20 are clamped, a communication space 27 that communicates between the adjacent unit cavities 21a is formed between them, and the communication The height of the space 27 is suppressed to the minimum height at which the fluid resin 22 flows reliably. Therefore, in an optoelectronic component such as an LED package manufactured by the method of this embodiment, light leakage in an undesired direction can be minimized.
In addition, a high yield can be realized as compared with the case where an optoelectronic component without burr is manufactured.
In addition, since the communication space 27 is formed so that the fluid resin 22 flows between the unit cavities 21a and spreads over the entire cavity 21, the fluid resin 22 is uniformly filled in the entire cavity 21 including the unit cavities 21a. be able to. Therefore, no void is generated in the lens portion 28 formed in each unit region 37, and the size and shape of the lens portion 28 can be made uniform.
Further, the communication portion 29 is made thin by minimizing the height of the communication space 27. Therefore, the resin-sealed substrate 31a can be easily and smoothly protruded from the carrier 50, and an optoelectronic component having excellent appearance quality can be manufactured.

  In the step of cutting the resin-sealed substrate 31a, a laser beam, a wire saw, a band saw, a water jet, or the like may be used in addition to the rotary blade. Further, as shown in FIG. 3C, the resin-sealed substrate 31a is not fully cut, and a groove is formed in the thickness direction at the cutting line of the resin-sealed substrate 31a (after half-cut), and then the resin sealing is performed. An external force can be applied to the stopped substrate 31a to divide it into optoelectronic components.

  In the present embodiment, an example in which one LED chip 43 is mounted in each unit region 37 has been described. However, the present invention can be applied even when a plurality of LED chips 43 are mounted in one unit region 37. Can be applied.

Hereinafter, another aspect of the embodiment of the method and apparatus for manufacturing an optoelectronic component according to the present invention will be described with reference to FIG. The description of the same components and steps as those in the above-described embodiment will be omitted as appropriate.
In the present embodiment, a film support member 75 that is supported by an elastic member and moves up and down and a frame-like member 74 are provided outside the peripheral member 76 of the lower mold 70. A film pressing member 72 is provided above the film support member 75. Seal members 73a and 73b are provided between the upper surface of the frame-shaped member 74 and the film pressing member 72, and between the film pressing member 72 and the lower surface of the upper mold 10, respectively. A movable member 77 that moves up and down in response to a pressure from the fluid resin 22 is provided in the vicinity of the peripheral edge of the cavity block 78.

  In this embodiment, the release film 71 is disposed above the mold surface constituting the entire cavity 21 before performing the resin supply process. Thereafter, as shown in FIG. 4 (a), the film pressing member 72 is lowered to sandwich the release film 71, and release is performed using suction means (not shown) provided on the lower mold 70 side. The film 71 is adsorbed on the mold surface. Subsequently, the fluid resin 22 is supplied to the cavity 21. Next, the upper mold | type 10 is dropped and the seal member 73b and the film pressing member 72 are made to contact. As a result, the upper mold 10 and the lower mold 70 are clamped intermediately.

  At this point, the following state is realized. First, the cavity 21 is blocked from the outside. Second, the cavity 21 is filled with the flowable resin 22. Third, wrinkles occur in the release film 71 in the vicinity of the outer edge of the cavity 21. At this point, the inside of the cavity 21 is evacuated by evacuating the inside of the cavity 21 by a decompression means (not shown) as in the above-described embodiment.

  Subsequently, the upper mold 10 and the lower mold 70 are completely clamped. As described above, since the movable member 77 that moves up and down in response to the pressure from the fluid resin 22 is provided in the cavity block 78, when the supply amount of the fluid resin 22 is excessive, the movable member is excessive. The liquid resin 22 is pressed and moved downward (FIG. 4B). As a result, even when the supply amount of the fluid resin 22 varies, an optoelectronic component can be manufactured without affecting the size and shape of the lens portion 28 formed in each unit region 37. In addition, wrinkles are intentionally generated in the release film 71 near the outer edge of the cavity 21. Thereby, it is possible to suppress the wrinkles of the release film 71 from adversely affecting the surface of the lens portion 28.

Each of the above-described embodiments is an example, and appropriate modifications can be made in accordance with the spirit of the present invention.
In the above embodiment, the example in which the optical element (LED chip 43) mounted on the bottom surface 41 of the reflecting member 38 is sealed with resin has been described. However, the optical element mounted directly on the substrate without using the reflecting member 38. In the case of sealing with resin, it can be carried out in the same manner as in the above embodiment. Moreover, although the example which uses a temporary fixing jig was demonstrated in the said Example, an optoelectronic component can also be manufactured without using a temporary fixing jig.

  In the above embodiment, an example in which the hemispherical lens portion 28 is formed has been described. However, by appropriately changing the shape of the unit cavity 21a, an optical feature is added to the cured resin formed in the unit cavity. be able to. A typical example of a shape to which an optical feature is added is shown in FIG. Fig. 5 (a) shows a groove prism shape (entire surface), Fig. 5 (b) shows a groove prism shape (no center), Fig. 5 (c) shows a honeycomb lens shape, and Fig. 5 (d) shows a groove Fresnel lens. Shape. These are only examples, and an optoelectronic component can be manufactured by appropriately forming a lens portion 28 having a shape well known to those skilled in the art.

  In the above embodiment, the case where the lead frame 32 is used as the substrate body has been described. As the substrate body, it is possible to use a printed circuit board based on a laminated material such as glass epoxy, a ceramic material, or a metal material. Moreover, the flexible printed circuit board which uses a resin film as a base material can also be used. Furthermore, the planar shape of the substrate body is not limited to a quadrilateral, and may be a substantially circular shape (the same shape as a semiconductor wafer).

  Moreover, in the said Example, LED chip 43 was demonstrated as an example as an optical element with which the board | substrate 31 before resin sealing is mounted | worn, and the LED package was each demonstrated as an optoelectronic component manufactured. The present invention is not limited to this, and the present invention may be applied using a combination of a light emitting element and a light receiving element as an optical element mounted on the substrate 31 before resin sealing. In this case, a light receiving / emitting element can be manufactured as an optoelectronic component. Further, the present invention may be applied using a laser diode chip as an optical element mounted on the substrate 31 before resin sealing. In this case, a laser diode package can be manufactured as an optoelectronic component.

DESCRIPTION OF SYMBOLS 10 ... Upper mold | type 20,70 ... Lower mold | type 21 ... Cavity 21a ... Unit cavity 22 ... Fluid resin 23 ... Curing resin 24 ... Peripheral member 25 ... Elastic member 26 ... Cavity block 27 ... Communication space 28 ... Lens part 29 ... Communication part DESCRIPTION OF SYMBOLS 30 ... Burr 31 ... Pre-resin sealing substrate 31a ... Resin sealed substrate 32 ... Lead frame 33 ... Outer frame 34, 35 ... Connection part 36 ... Virtual line 37 ... Unit area 38 ... Reflective member 39 ... Upper surface 40 ... Recess 41 ... Bottom 42 ... Slope 43 ... LED chip 50 ... Carrier 51 ... Opening 52 ... Supporting part 60 ... Extruding means 60a ... Cylindrical part 61 ... Fixing jig 71 ... Release film 72 ... Film pressing members 73a and 73b ... Sealing member 74 ... Frame member 75 ... Film support member 76 ... Peripheral member 77 ... Movable member 78 ... Cavity block

Claims (17)

A method of manufacturing an optoelectronic component comprising a plurality of unit regions, wherein a substrate on which at least one optical element is mounted in each unit region is resin-sealed using an upper mold and a lower mold,
a) a substrate holding step of holding the substrate at a predetermined position on the lower surface side of the upper mold such that the optical element is on the lower mold side;
b) A flowable resin supply step for supplying a flowable resin to a cavity having unit cavities provided in the lower mold and corresponding to the unit regions, respectively.
c) a mold clamping step of combining the upper mold and the lower mold and clamping the mold;
d) a resin curing step for curing the flowable resin;
Have
In the mold clamping step, a communication space that communicates between adjacent unit cavities is formed between the upper mold and the lower mold, and the communication space has a minimum height that allows the flowable resin to flow reliably. A method for manufacturing an optoelectronic component, comprising:   2. The method of manufacturing an optoelectronic component according to claim 1, wherein the height is 0.02 mm to 0.1 mm.   3. The method of manufacturing an optoelectronic component according to claim 2, wherein the height is 0.03 mm or more and 0.06 mm or less.   4. The method of manufacturing an optoelectronic component according to claim 1, wherein the concave portion has a shape in which an optical feature is added to the cured resin formed in the unit cavity.   Before the fluid resin supply step, a film supply step for supplying a release film between the upper die and the lower die, and a film adhesion step for bringing the release film into close contact with the bottom and side surfaces of the cavity, 5. The method of manufacturing an optoelectronic component according to claim 1, wherein:   6. The method of manufacturing an optoelectronic component according to claim 1, wherein the cavity is evacuated in the mold clamping step.   The method for producing an optoelectronic component according to any one of claims 1 to 6, wherein the flowable resin is either a resin that is liquid at normal temperature or a solid resin that is liquefied by heating.   The method for manufacturing an optoelectronic component according to claim 1, wherein the substrate has a reflecting member formed in advance on the substrate. An apparatus for manufacturing an optoelectronic component comprising a plurality of unit areas and resin-sealing a substrate on which at least one optical element is mounted in each unit area,
a) an upper mold for detachably holding a non-mounting surface side of the optical element of the substrate in a predetermined position;
b) a lower mold that includes unit cavities that are concave portions corresponding to the unit regions, respectively, and has a cavity that is large enough to cover the entire unit region in plan view;
c) Fluid resin supply means for supplying fluid resin to the cavity;
d) mold opening and closing means for clamping and opening the upper mold and the lower mold;
With
In a state where the upper mold and the lower mold are clamped by the mold clamping means, a communication space that communicates between adjacent unit cavities is formed between the upper mold and the lower mold, and the communication space However, the optoelectronic component manufacturing apparatus is characterized in that the flowable resin has a minimum height that allows the flowable resin to flow reliably.   The apparatus for manufacturing an optoelectronic component according to claim 9, wherein the height is 0.02 mm or more and 0.1 mm or less.   The apparatus for manufacturing an optoelectronic component according to claim 10, wherein the height is 0.03 mm or more and 0.06 mm or less.   12. The apparatus for manufacturing an optoelectronic component according to claim 9, wherein the concave portion has a shape in which an optical feature is added to the cured resin formed in the unit cavity. e) film supply means for supplying a release film between the upper mold and the lower mold;
f) film adhesion means for bringing the release film into close contact with the bottom and side surfaces of the cavity;
The apparatus for manufacturing an optoelectronic component according to claim 9, comprising: The apparatus for producing an optoelectronic component according to claim 9, further comprising a decompression unit that evacuates the cavity in a state where the upper mold and the lower mold are clamped.   15. The flowable resin supply means supplies liquid resin at room temperature, or heats and liquefies after supplying solid resin. The manufacturing apparatus of the optoelectronic component in any one.   The apparatus for manufacturing an optoelectronic component according to claim 9, wherein the substrate has a reflective member formed in advance on the substrate.   The optoelectronic component manufactured using either the manufacturing method of the optoelectronic component in any one of Claims 1-8, or the optoelectronic component manufacturing apparatus in any one of Claims 9-16.

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