JP2014030980A5 - - Google Patents

Download PDF

Info

Publication number
JP2014030980A5
JP2014030980A5 JP2012173756A JP2012173756A JP2014030980A5 JP 2014030980 A5 JP2014030980 A5 JP 2014030980A5 JP 2012173756 A JP2012173756 A JP 2012173756A JP 2012173756 A JP2012173756 A JP 2012173756A JP 2014030980 A5 JP2014030980 A5 JP 2014030980A5
Authority
JP
Japan
Prior art keywords
bump
electrode pad
head according
protrusion
ejection head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012173756A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014030980A (ja
JP6066612B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012173756A priority Critical patent/JP6066612B2/ja
Priority claimed from JP2012173756A external-priority patent/JP6066612B2/ja
Priority to US13/956,737 priority patent/US9174439B2/en
Publication of JP2014030980A publication Critical patent/JP2014030980A/ja
Publication of JP2014030980A5 publication Critical patent/JP2014030980A5/ja
Application granted granted Critical
Publication of JP6066612B2 publication Critical patent/JP6066612B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012173756A 2012-08-06 2012-08-06 液体吐出ヘッド及びその製造方法 Expired - Fee Related JP6066612B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012173756A JP6066612B2 (ja) 2012-08-06 2012-08-06 液体吐出ヘッド及びその製造方法
US13/956,737 US9174439B2 (en) 2012-08-06 2013-08-01 Liquid ejection head and method for manufacturing liquid ejection head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012173756A JP6066612B2 (ja) 2012-08-06 2012-08-06 液体吐出ヘッド及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014030980A JP2014030980A (ja) 2014-02-20
JP2014030980A5 true JP2014030980A5 (OSRAM) 2015-09-10
JP6066612B2 JP6066612B2 (ja) 2017-01-25

Family

ID=50025075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012173756A Expired - Fee Related JP6066612B2 (ja) 2012-08-06 2012-08-06 液体吐出ヘッド及びその製造方法

Country Status (2)

Country Link
US (1) US9174439B2 (OSRAM)
JP (1) JP6066612B2 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016141149A (ja) * 2015-02-05 2016-08-08 キヤノン株式会社 液体吐出ヘッド用基板の製造方法、及び該製造方法で製造された液体吐出ヘッド用基板
TWI645586B (zh) * 2017-12-05 2018-12-21 國家中山科學研究院 一種可提升光均勻度之中空奈米結構二次光學透鏡之製作方法
CN119852281B (zh) * 2025-03-19 2025-09-23 深圳市联合蓝海应用材料科技股份有限公司 一种半导体器件结构及其制备方法和芯片

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797587B2 (ja) * 1987-03-12 1995-10-18 株式会社東芝 半導体装置の製造方法
JP2653179B2 (ja) * 1989-08-21 1997-09-10 富士電機株式会社 集積回路装置用バンプ電極の製造方法
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
JP3584509B2 (ja) * 1994-12-27 2004-11-04 松下電器産業株式会社 インクジェットプリンタヘッド及びその製造方法
US6833613B1 (en) * 1997-12-18 2004-12-21 Micron Technology, Inc. Stacked semiconductor package having laser machined contacts
US6426556B1 (en) * 2001-01-16 2002-07-30 Megic Corporation Reliable metal bumps on top of I/O pads with test probe marks
JP4630680B2 (ja) * 2005-01-31 2011-02-09 キヤノン株式会社 半導体素子の製造方法およびインクジェット記録ヘッドの製造方法
JP2009500820A (ja) * 2005-06-29 2009-01-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ アセンブリを製造する方法及びアセンブリ
US8438729B2 (en) * 2006-03-09 2013-05-14 Canon Kabushiki Kaisha Method of producing liquid discharge head
JP4822353B2 (ja) * 2006-03-09 2011-11-24 キヤノン株式会社 液体吐出ヘッド及びその製造方法
JP2007307833A (ja) 2006-05-19 2007-11-29 Canon Inc インクジェット記録ヘッド
JP5168443B2 (ja) * 2006-08-08 2013-03-21 セイコーエプソン株式会社 圧電素子、アクチュエータ装置、液体噴射ヘッド及び液体噴射装置
JP2008153470A (ja) * 2006-12-18 2008-07-03 Renesas Technology Corp 半導体装置および半導体装置の製造方法
JP5379527B2 (ja) * 2009-03-19 2013-12-25 パナソニック株式会社 半導体装置
US8581420B2 (en) * 2010-10-18 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Under-bump metallization (UBM) structure and method of forming the same

Similar Documents

Publication Publication Date Title
CN107783024B (zh) 垂直式探针卡之探针装置
JP2014508600A5 (OSRAM)
MY171777A (en) Pane with an electrical connection element
TW200633089A (en) Conductive bump structure of circuit board and method for fabricating the same
JP2011122924A5 (OSRAM)
JP2014103295A5 (OSRAM)
JP2014172178A5 (OSRAM)
JP2008263125A5 (OSRAM)
JP2013538467A5 (OSRAM)
MY171050A (en) Semiconductor component and method of manufacture
JP2012069952A5 (OSRAM)
JP2013115214A5 (OSRAM)
JP2015518229A5 (ja) ヘッドサスペンションの電気的相互接続およびその形成方法
JP2009110983A5 (OSRAM)
CN103857197A (zh) 电路板及其制作方法
EP2624288A3 (en) Semiconductor package with improved testability
JP2011249718A5 (OSRAM)
JP2014030980A5 (OSRAM)
JP2009276316A5 (OSRAM)
JP2010219513A5 (OSRAM)
JP2015141917A (ja) チップ実装構造体およびその製造方法
JP2014107427A5 (OSRAM)
JP2017183664A5 (OSRAM)
JP2013091264A5 (OSRAM)
JP2010054496A (ja) プローブカード及びその製造方法