JP2014003344A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component capable of identifying a direction by radioscopy using an X ray.SOLUTION: An electronic component includes: a laminated body formed by laminating multiple insulation layers; a circuit element which is incorporated in the laminated body and is formed by a conductive layer; and a first via hole conductor penetrating through the insulation layer, which is provided at the upper side or the lower side of the circuit element in a lamination direction, and having a function for identifying a direction of the laminated body. The first via hole conductor is electrically led out on a surface of the laminated body only by the circuit element or is not electrically led out on the surface of the laminated body.

Description

  The present invention relates to an electronic component, and more particularly to an electronic component including a laminated body in which a circuit element configured by a conductor layer is built.

  As a conventional electronic component, for example, a multilayer inductor described in Patent Document 1 is known. The multilayer inductor includes a plurality of insulator layers, a plurality of coil conductor patterns, a plurality of through holes, and two terminal electrodes. The insulator layer is a magnetic layer having a rectangular shape, and constitutes a laminate. The coil conductor pattern is provided on the insulator layer and has a turn number of 1/2. The through hole penetrates the insulator layer and connects adjacent coil conductor patterns in the stacking direction. The multilayer body incorporates a spiral coil formed by connecting a coil conductor pattern and a through hole. Further, the two terminal electrodes are provided on the side surfaces facing each other of the laminate, and are connected to both ends of the coil.

  Incidentally, the multilayer inductor described in Patent Document 1 has a problem that it is difficult to identify the direction of the multilayer inductor during mounting, as will be described below. More specifically, in the multilayer inductor, terminal electrodes are provided on side surfaces of the rectangular parallelepiped laminated body facing each other. Since the terminal electrodes have the same shape, the direction of the multilayer inductor cannot be identified only by the appearance of the multilayer inductor.

  Therefore, it is conceivable to identify the direction of the multilayer inductor by using X-rays to see through the internal structure of the multilayer inductor from the side surface side of the multilayer body. However, when the coil of the multilayer inductor has a point-symmetric structure with respect to the center of the side surface of the multilayer body (for example, see FIG. 2 of Patent Document 1), the direction of the multilayer inductor cannot be identified. .

JP 2003-209016 A

  Accordingly, an object of the present invention is to provide an electronic component whose direction can be identified by fluoroscopy using X-rays.

  An electronic component according to an aspect of the present invention includes a stacked body in which a plurality of insulator layers are stacked, a circuit element built in the stacked body and configured by a conductor layer, and a circuit element A first via-hole conductor having a function of penetrating the insulator layer provided on the upper side or the lower side in the stacking direction in the stacking direction and identifying the direction of the stack. The first via-hole conductor is electrically drawn out to the surface of the multilayer body only by the circuit element, or is not electrically drawn out to the surface of the multilayer body. .

  According to the present invention, the direction of an electronic component can be identified by fluoroscopy using X-rays.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 1st Embodiment. FIG. 3A is a perspective view of the electronic component of FIG. 1 viewed from the y-axis direction. FIG. 3B is a perspective view of the electronic component of FIG. 1 viewed from the x-axis direction. It is a disassembled perspective view of the laminated body of the electronic component which concerns on a 1st modification. It is a disassembled perspective view of the laminated body of the electronic component which concerns on a 2nd modification. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 2nd Embodiment. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 3rd Embodiment.

  The electronic component according to the embodiment of the present invention will be described below.

(First embodiment)
(Configuration of electronic parts)
The electronic component according to the first embodiment will be described with reference to the drawings. FIG. 1 is an external perspective view of electronic components 10a to 10e according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a according to the first embodiment. FIG. 3A is a perspective view of the electronic component 10a of FIG. 1 seen from the y-axis direction. FIG. 3B is a perspective view of the electronic component 10a of FIG. 1 viewed from the x-axis direction. In FIG. 3, the dotted lines indicate the external electrodes 14a and 14b. Hereinafter, the stacking direction of the electronic component 10a is defined as the z-axis direction, the direction along the long side of the electronic component 10a is defined as the x-axis direction, and the direction along the short side of the electronic component 10a is defined as the y-axis direction. To do.

  As shown in FIGS. 1 and 2, the electronic component 10a includes a laminated body 12a, external electrodes 14 (14a, 14b), coils (circuit elements) L (not shown in FIG. 1), and via hole conductors (identification via holes). Conductor) B (not shown in FIG. 1) is provided. The laminated body 12a has a rectangular parallelepiped shape and includes a coil L therein. The external electrode 14a is provided on the side surface of the multilayer body 12a located on the negative direction side in the x-axis direction. The external electrode 14b is provided on the side surface of the stacked body 12a located on the positive side in the x-axis direction. That is, the external electrodes 14a and 14b are provided on the side surfaces of the stacked body 12a that face each other.

  As shown in FIG. 2, the stacked body 12 a is formed by stacking the insulator layers 16 (16 a to 16 m) in this order from the positive direction side in the z-axis direction. The insulator layer 16 is made of a magnetic material (for example, Ni—Cu—Zn ferrite) and has a rectangular shape. The insulator layer 16 is not limited to a magnetic material, and may be a nonmagnetic material or a mixture of a nonmagnetic material and a magnetic material.

  As shown in FIG. 2, the coil L includes coil conductors (conductor layers) 18 (18a to 18g) and via hole conductors (connection via hole conductors) b1 to b6. More specifically, the coil L is formed by connecting coil conductors 18a to 18g and via-hole conductors b1 to b6, and is a spiral coil having a coil axis parallel to the z-axis direction.

  The coil conductors 18a to 18g are respectively provided on the main surfaces on the positive direction side in the z-axis direction of the insulator layers 16d to 16j. Hereinafter, in the coil conductors 18a to 18g, when viewed from the positive side in the z-axis direction, the upstream end in the counterclockwise direction is referred to as the upstream end, and the downstream end in the counterclockwise direction. Is called the downstream end. Each of the coil conductors 18 is a linear conductor that overlaps with each other to form a rectangular annular track and has a turn number of 3/4 turns. That is, the coil conductor 18 has a shape in which a quarter turn of the track is cut out. However, the upstream end of the coil conductor 18a provided on the most positive side in the z-axis direction is drawn out to the short side on the negative direction side in the x-axis direction of the insulator layer 16d and connected to the external electrode 14a. Yes. Similarly, the downstream end of the coil conductor 18g provided on the most negative side in the z-axis direction is drawn out to the short side on the positive direction side in the x-axis direction of the insulator layer 16j and connected to the external electrode 14b. ing. Furthermore, the coil conductor 18g has the same shape as the coil conductor 18a. The coil conductor 18g overlaps the coil conductor 18a by rotating 180 degrees around the z axis about the intersection P of the diagonal lines C1 and C2 of the insulator layer 16j (so as to overlap when viewed in plan from the stacking direction). In). The number of turns of the coil conductor 18 is not limited to 3/4 turns.

  The via-hole conductors b1 to b6 are provided so as to penetrate the insulator layers 16d to 16i in the z-axis direction, and connect the coil conductors 18 adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b1 penetrates the insulator layer 16d in the z-axis direction and is connected to the downstream end of the coil conductor 18a and the upstream end of the coil conductor 18b. The via-hole conductor b2 penetrates the insulator layer 16e in the z-axis direction, and is connected to the downstream end of the coil conductor 18b and the upstream end of the coil conductor 18c. The via-hole conductor b3 penetrates the insulator layer 16f in the z-axis direction, and is connected to the downstream end of the coil conductor 18c and the upstream end of the coil conductor 18d. The via-hole conductor b4 penetrates the insulator layer 16g in the z-axis direction and is connected to the downstream end of the coil conductor 18d and the upstream end of the coil conductor 18e. The via-hole conductor b5 penetrates the insulator layer 16h in the z-axis direction and is connected to the downstream end of the coil conductor 18e and the upstream end of the coil conductor 18f. The via-hole conductor b6 penetrates the insulator layer 16i in the z-axis direction and is connected to the downstream end of the coil conductor 18f and the coil conductor 18g.

  As shown in FIG. 3A, the coil L having the above configuration has a point-symmetric structure centered on the intersection of the diagonal lines on the side surface of the laminate 12a when viewed in plan from the y-axis direction. Yes. In addition, as shown in FIG. 3B, the coil L has a line-symmetric structure with respect to a straight line parallel to the y-axis direction passing through the intersection of diagonal lines on the side surface of the laminate 12a when viewed in plan from the x-axis direction. have. Therefore, even if the structure of the coil L is seen through from the x-axis direction or the y-axis direction by X-rays, it is difficult to identify the direction of the electronic component 10a.

  Therefore, in the electronic component 10a, a via-hole conductor B for identifying the direction of the electronic component 10a is provided. The via-hole conductor B penetrates the insulator layer 16 provided on the positive side or the negative side in the z-axis direction from the coil L in the z-axis direction. In the present embodiment, the via-hole conductor B is provided so as to penetrate the insulator layer 16j provided on the negative side in the z-axis direction from the coil L in the z-axis direction. Accordingly, as shown in FIGS. 3A and 3B, the via-hole conductor B has a structure protruding from the coil conductor 18g toward the negative direction side in the z-axis direction.

  Furthermore, the via-hole conductor B is connected to the end portion on the opposite side to the downstream end of the coil conductor 18g. That is, the via-hole conductor B is connected to the coil conductor 18g at the same position where the via-hole conductor b1 is connected to the coil conductor 18a. Therefore, as shown in FIG. 2, the insulator layer 16d, the coil conductor 18a, and the via hole conductor b1, and the insulator layer 16j, the coil conductor 18g, and the via hole conductor B have the same structure.

  Further, as shown in FIG. 2, the via-hole conductor B is provided so as not to overlap the intersection point P of the diagonal lines C1 and C2 of the insulator layer 16j when viewed in plan from the z-axis direction. Further, as shown in FIG. 2, the via-hole conductor B includes a straight line C3 that is parallel to the long side of the insulator layer 16j and passes through the intersection P when viewed in plan from the z-axis direction, and the insulator layer 16j. It is provided so as not to overlap with the straight line C4 that is parallel to the short side and passes through the intersection point P.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10a is demonstrated, referring FIG.

First, a ceramic green sheet to be the insulator layer 16 is prepared. Specifically, ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio, and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  A binder, a plasticizer, a wetting material, and a dispersant are added to the ferrite ceramic powder and mixed by a ball mill, and then defoamed by decompression. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the insulator layer 16.

  Next, via-hole conductors b1 to b6 and B are formed in the ceramic green sheets to be the insulator layers 16d to 16j, respectively. Specifically, via holes are formed by irradiating a ceramic green sheet to be the insulator layers 16d to 16j with a laser beam. Further, the via holes are filled with a paste made of a conductive material such as Ag, Pd, Cu, Au, or an alloy thereof by a method such as printing and coating to form via hole conductors b1 to b6, B.

  Next, the coil conductors 18a to 18g are formed by applying a paste made of a conductive material on the ceramic green sheets to be the insulator layers 16d to 16j by a method such as a screen printing method or a photolithography method. For example, the paste made of the conductive material is obtained by adding varnish and a solvent to Ag. The step of forming the coil conductors 18a to 18g and the step of filling the via hole with a paste made of a conductive material may be performed in the same step.

  Next, ceramic green sheets to be the insulator layer 16 are laminated to obtain an unfired mother laminate. Specifically, ceramic green sheets to be the insulator layers 16a to 16m are laminated and temporarily press-bonded one by one. The pressure bonding conditions are a pressure of 100 to 120 tons and a time of about 3 seconds to 30 seconds. Then, this press-bonding is performed on the unfired mother laminate by an isostatic press.

  Next, the mother laminate is cut into a laminate 12a having a predetermined dimension (2.5 mm × 2.0 mm × 1.2 mm) with a cutting blade. Thereby, the unsintered laminated body 12a is obtained. This unfired laminate 12a is subjected to binder removal processing and firing. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 500 ° C. for 2 hours. Firing is performed, for example, at 870 ° C. to 900 ° C. for 2.5 hours.

  The fired laminated body 12a is obtained through the above steps. The laminated body 12a is barrel-processed and chamfered. Thereafter, an electrode paste made of a conductive material containing Ag as a main component is applied to the surface of the laminate 12a. Then, the applied electrode paste is baked at a temperature of about 800 ° C. for 1 hour. Thereby, the silver electrode which should become the external electrode 14 is formed.

  Finally, the external electrode 14 is formed by performing Ni plating / Sn plating on the surface of the silver electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed. In addition, you may produce the electronic component 10a by the printing method.

(effect)
According to the electronic component 10a, as described below, the direction of the electronic component 10a in the z-axis direction can be identified by fluoroscopy using X-rays. More specifically, as shown in FIG. 3A, the coil L has a point-symmetric structure around the intersection of diagonal lines on the side surface of the multilayer body 12a when viewed in plan from the y-axis direction. In addition, as shown in FIG. 3B, the coil L has a line-symmetric structure with respect to a straight line parallel to the y-axis direction passing through the intersection of diagonal lines on the side surface of the laminate 12a when viewed in plan from the x-axis direction. have. Therefore, if the via-hole conductor B is not provided, it is difficult to identify the direction of the electronic component 10a in the z-axis direction even if the structure of the coil L is seen through the X-ray from the x-axis direction or the y-axis direction. .

  Therefore, in the electronic component 10a, a via-hole conductor B that penetrates the insulator layer 16j provided on the negative side in the z-axis direction from the coil L in the z-axis direction is provided. Thereby, as shown in FIGS. 3A and 3B, the laminated body 12a is seen through the X-ray from the x-axis direction or the y-axis direction, and the position of the via-hole conductor B is confirmed. The z-axis direction of the component 10a can be identified. That is, when the state shown in FIGS. 3A and 3B is the upright state of the electronic component 10a, the via-hole conductor B is positioned on the negative side in the z-axis direction from the coil L. It can be seen that the electronic component 10a is in an upright state, and when the via-hole conductor B is positioned on the positive side in the z-axis direction with respect to the coil L, the electronic component 10a is in an inverted state. As a result, the electronic component 10a can be accurately mounted on the printed circuit board. Since the electronic component 10a can be accurately mounted, the coil L of the electronic component 10a and another coil are accurately coupled or decoupled, and the setting and evaluation of the combined inductance of these coils is also accurate. become able to.

  Further, in the electronic component 10a, as described below, it is possible to identify at least one of the x-axis direction and the y-axis direction in addition to the z-axis direction of the electronic component 10a by fluoroscopy using X-rays. If the via-hole conductor B overlaps with the intersection point P when viewed in plan from the z-axis direction, in FIGS. 3A and 3B, in the x-axis direction and the y-axis direction of the multilayer body 12a, The point protrudes from the coil conductor 18g toward the negative side in the z-axis direction. Therefore, even if the position of the via-hole conductor B is confirmed, the x-axis direction and the y-axis direction of the electronic component 10a cannot be identified.

  Therefore, as shown in FIG. 2, the via-hole conductor B is provided so as not to overlap the intersection point P of the diagonal lines C1 and C2 of the insulator layer 16j when viewed in plan from the z-axis direction. As a result, when the multilayer body 12a is seen through with X-rays from the x-axis direction or the y-axis direction, the via-hole conductor B is formed of at least one of the multilayer body 12a in FIG. 3 (a) or FIG. It protrudes from the coil conductor 18g to the negative direction side in the z-axis direction at a position shifted from the midpoint in the x-axis direction or the y-axis direction. Therefore, in the electronic component 10a, at least one of the x-axis direction and the y-axis direction of the electronic component 10a can be identified by fluoroscopic observation using X-rays.

  Furthermore, in the electronic component 10a, in addition to the z-axis direction of the electronic component 10a, both the x-axis direction and the y-axis direction can be identified by fluoroscopy using X-rays as described below. That is, all directions can be identified for the electronic component 10a. If the via-hole conductor B overlaps with the straight line C3 or the straight line C4 when viewed in plan from the z-axis direction, the x-axis of the multilayer body 12a in either one of FIG. 3A or FIG. It protrudes from the coil conductor 18g toward the negative side in the z-axis direction at the middle point in the direction or the y-axis direction. Therefore, even if the position of the via-hole conductor B is confirmed, only one of the x-axis direction and the y-axis direction of the electronic component 10a can be identified.

  Therefore, as shown in FIG. 2, the via-hole conductor B is provided so as not to overlap the straight line C3 and the straight line C4 when viewed in plan from the z-axis direction. Thereby, when the laminated body 12a is seen through with X-rays from the x-axis direction or the y-axis direction, the via-hole conductor B is in the x-axis direction of the laminated body 12a in both FIGS. And it protrudes from the coil conductor 18g to the negative direction side in the z-axis direction at a position deviated from the middle point in the y-axis direction. Therefore, in the electronic component 10a, it is possible to identify both the x-axis direction and the y-axis direction in addition to the z-axis direction of the electronic component 10a by perspective using X-rays.

  In the electronic component 10a, the insulator layer 16d, the coil conductor 18a, and the via hole conductor b1, and the insulator layer 16j, the coil conductor 18g, and the via hole conductor B have the same structure. Therefore, the insulator layer 16d, the coil conductor 18a, and the via hole conductor b1, and the insulator layer 16j, the coil conductor 18g, and the via hole conductor B can be manufactured in the same process. As a result, the manufacturing process of the electronic component 10a is simplified, and the manufacturing cost of the electronic component 10a is reduced.

  In the electronic component 10a, the direction of the electronic component 10a can be easily identified. It is conceivable to use another conductor layer for identifying the direction of the electronic component 10a. However, the conductor layer extends in the x-axis direction or the y-axis direction, and when the conductor layer is formed very thin, it may not be visible when viewed through X-rays from the x-axis direction or the y-axis direction. On the other hand, the electronic component 10a uses the via-hole conductor B for direction identification. Since the via-hole conductor B extends in the z-axis direction, the via-hole conductor B can be easily seen as compared with the conductor layer when viewed through X-rays from the x-axis direction or the y-axis direction. Therefore, in the electronic component 10a, the direction of the electronic component 10a can be easily identified.

  Further, in the electronic component 10a, the via-hole conductor B is provided at a position that overlaps an annular track formed by the coil conductors 18 overlapping each other when viewed in plan from the z-axis direction. Therefore, the via-hole conductor B hardly disturbs the magnetic flux generated by the coil L. As a result, the electronic component 10a can obtain a high inductance value.

(Modification)
Hereinafter, an electronic component according to a first modification will be described with reference to the drawings. FIG. 4 is an exploded perspective view of the multilayer body 12b of the electronic component 10b according to the first modification.

  The electronic component 10b is different from the electronic component 10a in the shapes of the coil conductors 18a ′ and 18g ′. More specifically, in the electronic component 10a, the coil conductors 18a and 18g each have a turn number of 3/4, and the short side or insulation on the negative side of the insulator layer 16d in the x-axis direction. It is drawn out to the short side on the positive direction side of the body layer 16j.

  On the other hand, in the electronic component 10b, the coil conductors 18a ′ and 18g ′ are linearly short from the connection points with the via-hole conductors b1 and b6, respectively, or the short side or the insulator layer on the negative side in the x-axis direction of the insulator layer 16d. It is drawn to the short side of the positive direction side of 16j. The electronic component 10b having such a structure can also exhibit the same effects as the electronic component 10a.

  Next, an electronic component according to a second modification will be described with reference to the drawings. FIG. 5 is an exploded perspective view of the multilayer body 12c of the electronic component 10c according to the second modification.

  The electronic component 10c is different from the electronic component 10a in that insulator layers 16n and 16o, coil conductors 20a and 20g, and via-hole conductors b7 and b8 are added. More specifically, the insulator layer 16n, the coil conductor 20a, and the via hole conductor b7 have the same structure as the insulator layer 16d, the coil conductor 18a, and the via hole conductor b1. The insulator layer 16n provided with the coil conductor 20a and the via-hole conductor b7 is provided between the insulator layer 16c and the insulator layer 16d. Thereby, the coil conductor 18a and the coil conductor 20a are connected in parallel. The insulator layer 16o and the coil conductor 20g have the same structure as the insulator layer 16j and the coil conductor 18g, respectively. The insulator layer 16o provided with the coil conductor 20g and the via-hole conductor b8 is provided between the insulator layer 16i and the insulator layer 16j. Thereby, the coil conductor 18g and the coil conductor 20g are connected in parallel.

  As described above, the coil conductor 18a and the coil conductor 20a are connected in parallel, and the coil conductor 18g and the coil conductor 20g are connected in parallel, whereby the DC resistance of the coil L is reduced. The insulator layer 16j, the coil conductor 18g, and the via-hole conductor B have the same structure that is inverted by 180 ° compared to the insulator layers 16n and 16d, the coil conductors 20a and 18a, and the via-hole conductors b7 and b1. .

  Note that the electronic component 10c having the above-described configuration can exhibit substantially the same operational effects as the electronic component 10a.

(Second Embodiment)
Next, an electronic component according to a second embodiment will be described with reference to the drawings. FIG. 6 is an exploded perspective view of the multilayer body 12d of the electronic component 10d according to the second embodiment. FIG. 1 is used for an external perspective view of the electronic component 10d.

  As shown in FIGS. 1 and 6, the electronic component 10d includes a laminated body 12d, external electrodes 14 (14a and 14b), coils (circuit elements) L1 and L2 (not shown in FIG. 1), and via-hole conductors (identification). Via hole conductor) B (not shown in FIG. 1). The laminated body 12d has a rectangular parallelepiped shape and incorporates coils L1 and L2. The external electrode 14a is provided on the side surface of the stacked body 12d located on the negative side in the x-axis direction. The external electrode 14b is provided on the side surface of the stacked body 12d located on the positive direction side in the x-axis direction. That is, the external electrodes 14a and 14b are provided on the side surfaces of the stacked body 12d that face each other.

  As shown in FIG. 6, the stacked body 12 d is formed by stacking the insulator layers 26 (26 a to 26 l) in this order from the positive direction side in the z-axis direction. The insulator layer 26 is made of a magnetic material (for example, Ni—Cu—Zn ferrite) and has a rectangular shape.

  As shown in FIG. 6, the coil L1 includes a coil conductor (conductor layer) 28 (28a to 28c) and via-hole conductors (connection via-hole conductors) b11 and b12. More specifically, the coil L1 is configured by connecting the coil conductors 28a to 28c and the via-hole conductors b11 and b12, and is a spiral coil having a coil axis parallel to the z-axis direction.

  The coil conductors 28a to 28c are provided on the main surfaces on the positive direction side in the z-axis direction of the insulator layers 26d to 26f, respectively. Each of the coil conductors 28 is a linear conductor that forms a rectangular annular track by overlapping each other. Hereinafter, in the coil conductors 28a to 28c, when viewed from the positive side in the z-axis direction, the upstream end in the counterclockwise direction is referred to as the upstream end, and the downstream end in the counterclockwise direction. Is called the downstream end. The upstream end of the coil conductor 28a is drawn to the short side of the insulator layer 26d on the negative side in the x-axis direction and connected to the external electrode 14a. Similarly, the downstream end of the coil conductor 28c is led out to the short side of the insulator layer 26f on the positive side in the x-axis direction and connected to the external electrode 14b.

  The via-hole conductors b11 and b12 are provided so as to penetrate the insulator layers 26d and 26e in the z-axis direction, and connect the coil conductors 28 adjacent in the z-axis direction. Specifically, the via-hole conductor b11 penetrates the insulator layer 26d in the z-axis direction, and is connected to the downstream end of the coil conductor 28a and the upstream end of the coil conductor 28b. The via-hole conductor b12 penetrates the insulator layer 26e in the z-axis direction, and is connected to the downstream end of the coil conductor 28b and the upstream end of the coil conductor 28c.

  As shown in FIG. 6, the coil L2 includes a coil conductor (conductor layer) 28 (28d to 28f) and via-hole conductors (connection via-hole conductors) b13 and b14. More specifically, the coil L2 is configured by connecting the coil conductors 28d to 28f and the via-hole conductors b13 and b14, and is a spiral coil having a coil axis parallel to the z-axis direction.

  The coil conductors 28d to 28f are provided on the main surfaces on the positive side in the z-axis direction of the insulator layers 26g to 26i, respectively. Each of the coil conductors 28 is a linear conductor that forms a rectangular annular track by overlapping each other. Hereinafter, in the coil conductors 28d to 28f, when viewed from the positive side in the z-axis direction, the upstream end in the counterclockwise direction is referred to as the upstream end, and the downstream end in the counterclockwise direction. Is called the downstream end. The upstream end of the coil conductor 28d is led out to the short side of the insulator layer 26g on the negative side in the x-axis direction and connected to the external electrode 14a. Similarly, the downstream end of the coil conductor 28f is drawn out to the short side on the positive side in the x-axis direction of the insulator layer 26i and connected to the external electrode 14b.

  The via-hole conductors b13 and b14 are provided so as to penetrate the insulator layers 26g and 26h in the z-axis direction, and connect the coil conductors 28 adjacent in the z-axis direction. Specifically, the via-hole conductor b13 penetrates the insulating layer 26g in the z-axis direction, and is connected to the downstream end of the coil conductor 28d and the upstream end of the coil conductor 28e. The via-hole conductor b14 penetrates the insulator layer 26h in the z-axis direction, and is connected to the downstream end of the coil conductor 28e and the upstream end of the coil conductor 28f.

  The coils L1 and L2 as described above are connected in parallel between the external electrodes 14a and 14b.

  By the way, the coils L1 and L2 of the electronic component 10d have a point-symmetric structure around the intersection of the diagonal lines on the side surface of the multilayer body 12d when viewed in plan from the y-axis direction. Therefore, it is difficult to identify the direction of the electronic component 10d even if the structures of the coils L1 and L2 are seen through from the y-axis direction with X-rays.

  Therefore, the electronic component 10d is provided with a via-hole conductor B for identifying the direction of the electronic component 10d. The via-hole conductor B penetrates the insulator layer 26 provided on the positive side or the negative side in the z-axis direction from the coils L1 and L2 in the z-axis direction. More specifically, the via-hole conductor B is provided so as to penetrate in the z-axis direction through the insulator layer 26i provided on the negative side in the z-axis direction from the coils L1 and L2. Thereby, the via-hole conductor B has a structure protruding from the coil conductor 28f toward the negative direction side in the z-axis direction.

  Also in the electronic component 10d having the above configuration, substantially the same operational effects as the electronic component 10a can be achieved. Also, by providing a via hole conductor B ′ connected to the upstream end of the coil conductor 28c, the insulator layer 26f, the coil conductor 28c and the via hole conductor B ′, the insulator layer 26i, the coil conductor 28f and the via hole conductor B Have the same structure, and the manufacturing process can be simplified. In addition, since the manufacturing method of the electronic component 10d which concerns on 2nd Embodiment is the same as the manufacturing method of the electronic component 10a, description is abbreviate | omitted.

(Third embodiment)
Next, an electronic component according to a third embodiment will be described with reference to the drawings. FIG. 7 is an exploded perspective view of the multilayer body 12e of the electronic component 10e according to the third embodiment. FIG. 1 is used for an external perspective view of the electronic component 10e.

  As shown in FIGS. 1 and 7, the electronic component 10e includes a laminated body 12e, external electrodes 14 (14a and 14b), coils (circuit elements) L3 and L4 (not shown in FIG. 1), and via-hole conductors (identification). Via hole conductor) B (not shown in FIG. 1). The laminated body 12e has a rectangular parallelepiped shape and incorporates coils L3 and L4. The external electrode 14a is provided on the side surface of the multilayer body 12e located on the negative direction side in the x-axis direction. The external electrode 14b is provided on the side surface of the multilayer body 12e located on the positive direction side in the x-axis direction. That is, the external electrodes 14a and 14b are provided on the side surfaces of the stacked body 12e that face each other.

  As shown in FIG. 7, the stacked body 12 e is formed by stacking the insulator layers 36 (36 a to 36 m) in this order from the positive direction side in the z-axis direction. The insulator layer 36 is made of a magnetic material (for example, Ni—Cu—Zn ferrite) and has a rectangular shape.

  As shown in FIG. 7, the coil L3 includes coil conductors (conductor layers) 38 (38a to 38d) and via hole conductors (connection via hole conductors) b21 to b23. More specifically, the coil L3 is configured by connecting the coil conductors 38a to 38d and the via-hole conductors b21 to b23, and is a spiral coil having a coil axis parallel to the z-axis direction.

  The coil conductors 38a to 38d are provided on the principal surfaces on the positive direction side in the z-axis direction of the insulator layers 36d to 36g, respectively. Each of the coil conductors 38 is a linear conductor that forms a rectangular annular track by overlapping each other. Hereinafter, in the coil conductors 38a to 38d, when viewed in plan from the positive side in the z-axis direction, the upstream end in the clockwise direction is referred to as the upstream end, and the downstream end in the clockwise direction is the downstream. Call the end. The upstream end of the coil conductor 38a is drawn out to the short side on the negative side in the x-axis direction of the insulator layer 36d and connected to the external electrode 14a. Similarly, the downstream end of the coil conductor 38d is drawn out to the short side of the insulator layer 36g on the positive side in the x-axis direction and connected to the external electrode 14b.

  The via-hole conductors b21 to b23 are provided so as to penetrate the insulator layers 36d to 36f in the z-axis direction, and connect the coil conductors 38 adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b21 penetrates the insulator layer 36d in the z-axis direction, and is connected to the downstream end of the coil conductor 38a and the upstream end of the coil conductor 38b. The via-hole conductor b22 penetrates the insulator layer 36e in the z-axis direction, and is connected to the downstream end of the coil conductor 38b and the upstream end of the coil conductor 38c. The via-hole conductor b23 penetrates the insulator layer 36f in the z-axis direction, and is connected to the downstream end of the coil conductor 38c and the upstream end of the coil conductor 38d.

  As shown in FIG. 7, the coil L4 includes coil conductors (conductor layers) 38 (38d to 28g) and via hole conductors (connection via hole conductors) b24 to b26. More specifically, the coil L4 is configured by connecting the coil conductors 38d to 38g and the via-hole conductors b24 to b26, and is a spiral coil having a coil axis parallel to the z-axis direction.

  The coil conductors 38d to 38g are provided on the main surfaces on the positive direction side in the z-axis direction of the insulator layers 36g to 36j, respectively. Each of the coil conductors 38 is a linear conductor that forms a rectangular annular track by overlapping each other. Hereinafter, in the coil conductors 38d to 38g, when viewed from the positive side in the z-axis direction, the upstream end in the clockwise direction is referred to as the upstream end, and the downstream end in the clockwise direction is the downstream. Call the end. The downstream end of the coil conductor 38d is drawn to the short side of the insulator layer 36g on the positive side in the x-axis direction and connected to the external electrode 14b. Similarly, the upstream end of the coil conductor 38g is led out to the short side of the insulator layer 36j on the negative side in the x-axis direction and connected to the external electrode 14a.

  The via-hole conductors b24 to b26 are provided so as to penetrate the insulator layers 36g to 36i in the z-axis direction, and connect the coil conductors 38 adjacent to each other in the z-axis direction. Specifically, the via-hole conductor b24 penetrates the insulator layer 36g in the z-axis direction, and is connected to the upstream end of the coil conductor 38d and the downstream end of the coil conductor 38e. The via-hole conductor b25 penetrates the insulator layer 36h in the z-axis direction, and is connected to the upstream end of the coil conductor 38e and the downstream end of the coil conductor 38f. The via-hole conductor b26 penetrates the insulator layer 36i in the z-axis direction and is connected to the upstream end of the coil conductor 38f and the downstream end of the coil conductor 38g.

  The coils L3 and L4 as described above are connected in parallel between the external electrodes 14a and 14b.

  Incidentally, the coils L3 and L4 of the electronic component 10e have a line-symmetric structure with respect to a straight line parallel to the x-axis direction passing through the intersection of diagonal lines on the side surface of the multilayer body 12e when viewed in plan from the y-axis direction. . Furthermore, the coils L3 and L4 of the electronic component 10e have a line-symmetric structure with respect to a straight line parallel to the y-axis direction passing through the intersection of diagonal lines on the side surface of the multilayer body 12e when viewed in plan from the x-axis direction. Yes. Therefore, even if the structure of the coils L3 and L4 is seen through from the x-axis direction or the y-axis direction by X-rays, it is difficult to identify the direction of the electronic component 10e.

  Therefore, the electronic component 10e is provided with a via-hole conductor B for identifying the direction of the electronic component 10e. The via-hole conductor B penetrates the insulator layer 36 provided on the positive side or the negative side in the z-axis direction from the coils L3 and L4 in the z-axis direction. More specifically, the via-hole conductor B is provided so as to penetrate the insulator layer 36j provided on the negative side in the z-axis direction from the coils L3 and L4 in the z-axis direction. Thereby, the via-hole conductor B has a structure protruding from the coil conductor 38g toward the negative direction side in the z-axis direction.

  Also in the electronic component 10e having the above-described configuration, the same operational effects as the electronic component 10a can be achieved. In addition, since the manufacturing method of the electronic component 10e which concerns on 3rd Embodiment is the same as the manufacturing method of the electronic component 10a, description is abbreviate | omitted.

(Other embodiments)
The electronic component according to the present invention is not limited to those shown in the electronic components 10a to 10e according to the embodiment, and can be changed within the scope of the gist thereof. For example, in the electronic components 10a to 10e, the via-hole conductor B is provided closer to the negative direction side in the z-axis direction than the coils L and L1 to L4, but is more positive in the z-axis direction than the coils L and L1 to L4. It may be provided on the side. The via-hole conductor B is connected to the coil conductors 18, 28, and 38, but may not be connected to the coil conductors 18, 28, and 38.

The present invention is useful for electronic components, and is excellent in that the direction can be identified by fluoroscopy using X-rays.

B, b1 to b8, b11 to b14, b21 to b26 Via-hole conductor C1, C2 Diagonal C3, C4 Straight line L, L1 to L4 Coil P Intersection 10a to 10e Electronic parts 12a to 12e Laminated body 14a, 14b External electrodes 16a to 16o, 26a to 26l, 36a to 36m Insulator layers 18a to 18g, 18a ', 18g', 20a, 20g, 28a to 28f, 38a to 38
g Coil conductor

Claims (7)

A laminate formed by laminating a plurality of insulator layers;
A circuit element built in the laminate and configured by a conductor layer;
A first via-hole conductor having a function of penetrating the insulator layer provided above or below the circuit element in the stacking direction in the stacking direction and identifying the direction of the stack When,
With
The first via-hole conductor is electrically drawn out to the surface of the multilayer body only by the circuit element, or is not electrically drawn out to the surface of the multilayer body,
Electronic parts characterized by The insulator layer has a rectangular shape,
The first via-hole conductor is provided so as not to overlap an intersection of diagonal lines of the insulator layer when viewed in plan from the stacking direction;
The electronic component according to claim 1. The first via-hole conductor is parallel to the long side of the insulator layer and passes through the intersection when viewed in plan from the stacking direction, and to the short side of the insulator layer. Provided not to overlap with the straight line passing through the intersection,
The electronic component according to claim 2. The circuit element is a coil configured by connecting a plurality of the conductor layers and connecting via-hole conductors;
The electronic component according to any one of claims 1 to 3, wherein: The plurality of conductor layers form an annular track when viewed in plan from the stacking direction,
The first via-hole conductor overlaps the track when viewed in plan from the stacking direction;
The electronic component according to claim 4. A first external electrode and a second external electrode provided on opposite side surfaces of the laminate,
In addition,
The plurality of conductor layers include a first conductor layer provided on the uppermost side in the stacking direction, and a second conductor layer provided on the lowermost side in the stacking direction,
The first conductor layer is connected to the first external electrode;
The second conductor layer is connected to the second external electrode and has the same shape as the first conductor layer;
The electronic component according to claim 4, wherein: The connection via-hole conductor is connected to the first conductor layer,
The first via hole conductor is connected to the second conductor layer at the same position as the connection via hole conductor is connected to the first conductor layer;
The electronic component according to claim 6.

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