JP2013543254A - 基礎上に配置されるリソグラフィシステム、及び基礎上にリソグラフィシステムを配置する方法 - Google Patents

基礎上に配置されるリソグラフィシステム、及び基礎上にリソグラフィシステムを配置する方法 Download PDF

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Publication number
JP2013543254A
JP2013543254A JP2013529091A JP2013529091A JP2013543254A JP 2013543254 A JP2013543254 A JP 2013543254A JP 2013529091 A JP2013529091 A JP 2013529091A JP 2013529091 A JP2013529091 A JP 2013529091A JP 2013543254 A JP2013543254 A JP 2013543254A
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JP
Japan
Prior art keywords
base plate
lithography system
foundation
resin material
cured resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2013529091A
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English (en)
Japanese (ja)
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JP2013543254A5 (https=
Inventor
ペイスター、ジェリー
Original Assignee
マッパー・リソグラフィー・アイピー・ビー．ブイ．
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Application filed by マッパー・リソグラフィー・アイピー・ビー．ブイ． filed Critical マッパー・リソグラフィー・アイピー・ビー．ブイ．
Publication of JP2013543254A publication Critical patent/JP2013543254A/ja
Publication of JP2013543254A5 publication Critical patent/JP2013543254A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/046—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means using combinations of springs of different kinds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Vibration Prevention Devices (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
JP2013529091A 2010-09-20 2011-09-20 基礎上に配置されるリソグラフィシステム、及び基礎上にリソグラフィシステムを配置する方法 Withdrawn JP2013543254A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38469010P 2010-09-20 2010-09-20
US61/384,690 2010-09-20
NL2005374A NL2005374C2 (en) 2010-09-20 2010-09-20 Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation.
NL2005374 2010-09-20
PCT/NL2011/050630 WO2012039606A1 (en) 2010-09-20 2011-09-20 Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation

Publications (2)

Publication Number Publication Date
JP2013543254A true JP2013543254A (ja) 2013-11-28
JP2013543254A5 JP2013543254A5 (https=) 2014-11-13

Family

ID=43920813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013529091A Withdrawn JP2013543254A (ja) 2010-09-20 2011-09-20 基礎上に配置されるリソグラフィシステム、及び基礎上にリソグラフィシステムを配置する方法

Country Status (6)

Country Link
EP (1) EP2619629A1 (https=)
JP (1) JP2013543254A (https=)
KR (1) KR20130132769A (https=)
NL (1) NL2005374C2 (https=)
TW (1) TW201217915A (https=)
WO (1) WO2012039606A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018071072A (ja) * 2016-10-25 2018-05-10 株式会社マルテー大塚 道路鋲補修用カバー

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL267672B2 (en) 2016-12-30 2023-04-01 Asml Netherlands Bv An adjustable assembly and a substrate exposure system containing this adjustable assembly
US10048599B2 (en) 2016-12-30 2018-08-14 Mapper Lithography Ip B.V. Adjustment assembly and substrate exposure system comprising such an adjustment assembly
TWI794964B (zh) * 2021-09-09 2023-03-01 協崑股份有限公司 極紫外光設備（ｅｕｖ）之高精密度承載基座及其實施方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805000A (en) * 1986-01-17 1989-02-14 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
KR100250152B1 (ko) * 1997-11-15 2000-03-15 유무성 노광장치
AU5447499A (en) * 1998-09-03 2000-03-27 Nikon Corporation Exposure apparatus and exposure method, and device and method for producing the same
WO2000025352A1 (en) * 1998-10-28 2000-05-04 Nikon Corporation Stage device, exposure system, method of device manufacture, and device
JP2001148341A (ja) * 1999-11-19 2001-05-29 Nikon Corp 露光装置
JP2004063653A (ja) * 2002-07-26 2004-02-26 Nikon Corp 防振装置、ステージ装置及び露光装置
TWI307526B (en) * 2002-08-06 2009-03-11 Nikon Corp Supporting device and the mamufacturing method thereof, stage device and exposure device
US20040149881A1 (en) * 2003-01-31 2004-08-05 Allen David S Adjustable support structure for air conditioner and the like
US7460208B2 (en) * 2005-02-18 2008-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009164307A (ja) * 2007-12-28 2009-07-23 Canon Inc 支持構造、露光装置、支持構造の形成方法、及び、デバイス製造方法
US8739383B2 (en) * 2009-04-20 2014-06-03 Nikon Corporation Method and apparatus for aligning mirror blocks of a multi-element mirror assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018071072A (ja) * 2016-10-25 2018-05-10 株式会社マルテー大塚 道路鋲補修用カバー

Also Published As

Publication number Publication date
EP2619629A1 (en) 2013-07-31
WO2012039606A9 (en) 2012-06-28
WO2012039606A1 (en) 2012-03-29
TW201217915A (en) 2012-05-01
NL2005374C2 (en) 2012-03-22
KR20130132769A (ko) 2013-12-05
WO2012039606A4 (en) 2012-05-18

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