JP2013538455A - 基板加熱装置 - Google Patents

基板加熱装置 Download PDF

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Publication number
JP2013538455A
JP2013538455A JP2013526482A JP2013526482A JP2013538455A JP 2013538455 A JP2013538455 A JP 2013538455A JP 2013526482 A JP2013526482 A JP 2013526482A JP 2013526482 A JP2013526482 A JP 2013526482A JP 2013538455 A JP2013538455 A JP 2013538455A
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JP
Japan
Prior art keywords
zone
susceptor
substrate
thickness
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
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JP2013526482A
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English (en)
Japanese (ja)
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JP2013538455A5 (enExample
Inventor
ローラン デスポント
マルクス ポッペラー
ラルフ シュモール
Original Assignee
テーエーエル・ソーラー・アーゲー
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Application filed by テーエーエル・ソーラー・アーゲー filed Critical テーエーエル・ソーラー・アーゲー
Publication of JP2013538455A publication Critical patent/JP2013538455A/ja
Publication of JP2013538455A5 publication Critical patent/JP2013538455A5/ja
Withdrawn legal-status Critical Current

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    • H10P72/0432—
    • H10P72/70—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10P72/0434—

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  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013526482A 2010-09-03 2011-09-02 基板加熱装置 Withdrawn JP2013538455A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37987610P 2010-09-03 2010-09-03
US61/379,876 2010-09-03
PCT/EP2011/065168 WO2012028704A1 (en) 2010-09-03 2011-09-02 Substrate heating device

Publications (2)

Publication Number Publication Date
JP2013538455A true JP2013538455A (ja) 2013-10-10
JP2013538455A5 JP2013538455A5 (enExample) 2014-06-26

Family

ID=44735886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013526482A Withdrawn JP2013538455A (ja) 2010-09-03 2011-09-02 基板加熱装置

Country Status (5)

Country Link
EP (1) EP2612351A1 (enExample)
JP (1) JP2013538455A (enExample)
KR (1) KR20130102577A (enExample)
CN (1) CN103081084A (enExample)
WO (1) WO2012028704A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103614709B (zh) * 2013-12-12 2015-10-07 济南大学 用于mocvd反应室的组合基座式电磁加热装置
DE102016111236A1 (de) * 2016-06-20 2017-12-21 Heraeus Noblelight Gmbh Substrat-Trägerelement für eine Trägerhorde, sowie Trägerhorde und Vorrichtung mit dem Substrat-Trägerelement
US10655226B2 (en) * 2017-05-26 2020-05-19 Applied Materials, Inc. Apparatus and methods to improve ALD uniformity
KR102263718B1 (ko) * 2019-06-10 2021-06-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN110396680A (zh) * 2019-07-19 2019-11-01 西安奕斯伟硅片技术有限公司 一种外延反应设备
CN111694181B (zh) * 2020-07-07 2022-06-21 中航华东光电有限公司 低温均匀加热的液晶屏组件方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054688A (en) * 1997-06-25 2000-04-25 Brooks Automation, Inc. Hybrid heater with ceramic foil serrated plate and gas assist
US6399926B2 (en) * 2000-04-03 2002-06-04 Sigmameltec Ltd. Heat-treating apparatus capable of high temperature uniformity
JP2002151412A (ja) * 2000-10-30 2002-05-24 Applied Materials Inc 半導体製造装置
US6962732B2 (en) 2001-08-23 2005-11-08 Applied Materials, Inc. Process for controlling thin film uniformity and products produced thereby
WO2005017984A1 (ja) * 2003-08-18 2005-02-24 Tokyo Electron Limited 基板保持構造物および基板処理装置
JP2006137650A (ja) * 2004-11-15 2006-06-01 Taiheiyo Cement Corp 軽量高剛性セラミック部材
JP4756695B2 (ja) * 2006-02-20 2011-08-24 コバレントマテリアル株式会社 面状ヒータ

Also Published As

Publication number Publication date
EP2612351A1 (en) 2013-07-10
CN103081084A (zh) 2013-05-01
KR20130102577A (ko) 2013-09-17
WO2012028704A1 (en) 2012-03-08

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