JP2013534061A - 電子機器を冷却するためのシステムおよび方法 - Google Patents
電子機器を冷却するためのシステムおよび方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05383—Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0068—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【選択図】図1
Description
本出願は、2010年7月13日に出願された米国仮特許出願番号第61/363,723号の利点と優先権を主張し、その全ての内容が参照により本明細書に組み込まれる。
Claims (20)
- 電子機器を冷却するためのシステムであって、
流体入口と流体出口とを有する第1の熱交換器であって、前記第1の熱交換器は、電子機器と熱的に連通する空気の流れに配置されるように構成され、前記第1の熱交換器の前記流体入口は、第1の温度の冷却流体を受け入れるように構成され、前記第1の熱交換器は、第2の温度へ前記冷却流体を加熱させるために前記空気の流れから前記冷却流体へ熱伝導を可能にするように構成される、第1の熱交換器と、
流体入口と流体出口とを有する第2の熱交換器であって、前記第2の熱交換器の前記流体入口は、前記第1の熱交換器の前記流体出口と流体的に連通し、前記第2の熱交換器は、前記第1の熱交換器と前記電子機器との間の前記空気の流れに配置されるように構成され、前記第2の熱交換器の前記流体入口は、前記第1の熱交換器の前記流体出口から前記第2の温度の前記冷却流体を受け入れるように構成され、前記第2の熱交換器は、第3の温度へ前記冷却流体を加熱するために前記空気の流れから前記冷却流体へ熱伝導を可能にする、第2の熱交換器と、
流体入口と流体出口とを有する凝縮器であって、前記凝縮器の前記流体入口は、前記第2の熱交換器の前記流体出口と流体的に連通して前記凝縮器の前記流体出口は、前記第1の熱交換器の前記流体入口と流体的に連通し、前記凝縮器の前記流体入口は、前記第2の熱交換器の前記流体出口から前記第3の温度の前記冷却流体を受け入れ、前記凝縮器は、前記第1のおんどへ前記冷却流体を冷却するために前記冷却流体から冷却源へ熱交換を可能にする、凝縮器と、
を含む、システム。 - 前記第1の熱交換器は、マイクロチャンネル熱交換器である、請求項1に記載のシステム。
- 前記第2の熱交換器は、平板熱交換器である、請求項1に記載のシステム。
- 前記第2の熱交換器は、蛇行熱交換器である、請求項1に記載のシステム。
- 前記第2の熱交換器は、前記第1の熱交換器を通る前記空気の流れを拡散させる、請求項1に記載のシステム。
- 前記凝縮器は、気体から液体へ前記冷却流体を変換する、請求項1に記載のシステム。
- 前記第1の熱交換器は、液体から液体−気体混合物へ前記冷却流体を変換する、請求項1に記載のシステム。
- 前記第2の熱交換器は、液体−気体混合物から気体へ前記冷却流体を変換する、請求項1に記載のシステム。
- 前記第1の温度は、摂氏約18度〜摂氏約24度であり、前記第2の温度は、摂氏約24度〜摂氏約32度であり、前記第3の温度は、摂氏約32度〜摂氏約41度である、請求項1に記載のシステム。
- 電子機器を冷却する方法であって、
液体から液体−気体混合物へ第1の冷却流体を変換するために前記電子機器と熱的に連通する空気の流れに配置される第1の熱交換器に、前記第1の冷却流体を通す工程と、
前記液体−気体混合物から気体へ前記第1の冷却流体を変換するために前記第1の熱交換器と前記電子機器との間の前記空気の流れに配置される第2の熱交換器に、前記第1の冷却流体を通す工程と、
冷却回路を通って流れる前記第1の冷却流体から第2の冷却流体へ熱伝導を可能にすることによって気体から液体に前記第1の冷却流体を液化する工程と、
を含む、方法。 - 前記第1の熱交換器は、マイクロチャンネル熱交換器である、請求項10に記載の方法。
- 前記第2の熱交換器は、平板熱交換器である、請求項10に記載の方法。
- 前記第2の熱交換器は、蛇行熱交換器である、請求項10に記載の方法。
- 前記第2の熱交換器は、前記第1の熱交換器を通る前記空気の流れを拡散させる、請求項10に記載の方法。
- 前記冷却流体を前記第1の熱交換器に通す工程は、第1の温度から第2の温度へ前記冷却流体を加熱することを含み、前記第2の熱交換器を通って前記冷却流体を通過させる工程は、前記第2の温度から第3の温度へ前記冷却流体を加熱することを含み、前記冷却流体を液化する工程は、前記第3の温度から前記第1の温度へ前記冷却流体を冷却することを含む、請求項10に記載の方法。
- 電子機器を冷却するための熱交換アセンブリであって、
前記電子機器と熱的に連通して配置するように構成される第1の熱交換器であって、前記第1の熱交換器は、液体相で冷却流体を受け入れるように構成され、前記第1の熱交換器は、液体相から液体−気体混合相へ前記冷却流体を変換するように構成される、第1の熱交換器と、
前記電子機器と熱的に連通した第2の熱交換器であって、前記第2の熱交換器は、液体−気体混合相で前記冷却流体を受け入れるように構成され、前記第2の熱交換器は、前記液体−気体混合相から気体相へ前記冷却流体を変換するように構成される、第2の熱交換器と、
を含む、熱交換アセンブリ。 - 前記第1の熱交換器および前記第2の熱交換器は、空気の流路に配置するように構成される、請求項16に記載の熱交換アセンブリ。
- 前記第2の熱交換器は、前記第1の熱交換器から上流へ前記空気の流路に配置するように構成される、請求項17に記載の熱交換アセンブリ。
- 前記第2の熱交換器は、前記第1の熱交換器を通る前記空気の流れを拡散させる、請求項18に記載の熱交換アセンブリ。
- 前記第1の熱交換器は、マイクロチャンネル熱交換器であり、前記第2の熱交換器は、平板熱交換器または蛇行熱交換器である、請求項16に記載の熱交換アセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36372310P | 2010-07-13 | 2010-07-13 | |
US61/363,723 | 2010-07-13 | ||
PCT/US2011/043893 WO2012009460A2 (en) | 2010-07-13 | 2011-07-13 | Systems and methods for cooling electronic equipment |
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JP2013534061A true JP2013534061A (ja) | 2013-08-29 |
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JP2013519799A Pending JP2013534061A (ja) | 2010-07-13 | 2011-07-13 | 電子機器を冷却するためのシステムおよび方法 |
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US (1) | US20120279684A1 (ja) |
EP (1) | EP2593845A4 (ja) |
JP (1) | JP2013534061A (ja) |
KR (1) | KR20130093596A (ja) |
AU (1) | AU2011279239A1 (ja) |
CA (1) | CA2805417A1 (ja) |
SG (1) | SG187000A1 (ja) |
WO (1) | WO2012009460A2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105784141A (zh) * | 2016-05-18 | 2016-07-20 | 龙文凯 | 防滑式电气设备温度监测装置 |
CN105806499A (zh) * | 2016-05-18 | 2016-07-27 | 龙文凯 | 低杂音的电气设备温度监测装置 |
CN105806500A (zh) * | 2016-05-18 | 2016-07-27 | 龙文凯 | 维护方便的电气设备温度监测装置 |
CN106017728A (zh) * | 2016-05-18 | 2016-10-12 | 龙文凯 | 电气设备温度监测装置 |
JP2019502089A (ja) * | 2015-12-10 | 2019-01-24 | 広東合一新材料研究院有限公司Guangdong Hi−1 New Materials Technology Research Institute Co., Ltd. | 各種データセンター用自然冷却源放熱システム |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9025331B2 (en) | 2012-11-12 | 2015-05-05 | International Business Machines Corporation | Inlet-air-cooling door assembly for an electronics rack |
US9460985B2 (en) | 2013-01-04 | 2016-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses having a jet orifice surface with alternating vapor guide channels |
US9484283B2 (en) | 2013-01-04 | 2016-11-01 | Toyota Motor Engineering & Manufacturing North America Inc. | Modular jet impingement cooling apparatuses with exchangeable jet plates |
US8981556B2 (en) | 2013-03-19 | 2015-03-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having non-uniform jet orifice sizes |
JP6157593B2 (ja) * | 2013-03-27 | 2017-07-05 | 三菱電機株式会社 | 熱交換器およびこれを用いた冷凍サイクル空調装置 |
US9247679B2 (en) | 2013-05-24 | 2016-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement coolers and power electronics modules comprising the same |
US9257365B2 (en) | 2013-07-05 | 2016-02-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies and power electronics modules having multiple-porosity structures |
US9803938B2 (en) | 2013-07-05 | 2017-10-31 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling assemblies having porous three dimensional surfaces |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US10182517B2 (en) | 2013-11-20 | 2019-01-15 | Nec Corporation | Electronic apparatus enclosure device and electronic apparatus cooling system |
CN108827491A (zh) * | 2016-05-18 | 2018-11-16 | 惠安县信达友工业设计有限公司 | 温度监测装置 |
US9999157B2 (en) * | 2016-08-12 | 2018-06-12 | Qualcomm Incorporated | Multi-phase heat dissipating device embedded in an electronic device |
US10143111B2 (en) * | 2017-03-31 | 2018-11-27 | Hewlett Packard Enterprise Development Lp | Adjustment of a pump speed based on a valve position |
US11202394B1 (en) * | 2018-10-26 | 2021-12-14 | United Sendees Automobile Association (USAA) | Data center cooling system |
US11737238B1 (en) | 2018-10-26 | 2023-08-22 | United Services Automobile Association (Usaa) | Data center cooling system |
US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
DK3787385T3 (da) * | 2019-08-26 | 2022-04-11 | Ovh | Køleanordning til et stativ med elektronisk udstyr og mindst en ventilator |
US11765864B2 (en) | 2019-08-26 | 2023-09-19 | Ovh | Cooling arrangement for a rack hosting electronic equipment and at least one fan |
WO2021058062A2 (de) * | 2019-09-23 | 2021-04-01 | Rittal Gmbh & Co. Kg | Schaltschrankanordnung mit mindestens einem it-rack oder schaltschrankgehäuse und mit mindestens einem kühlgerät sowie ein entsprechendes verfahren |
EP4030119A1 (en) | 2021-01-15 | 2022-07-20 | Johnson Controls Denmark ApS | A refrigerant processing unit, a method for evaporating a refrigerant and use of a refrigerant processing unit |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003028539A (ja) * | 2001-07-18 | 2003-01-29 | Matsushita Electric Ind Co Ltd | 熱交換器および冷凍サイクル装置 |
JP2003294338A (ja) * | 2002-03-29 | 2003-10-15 | Japan Climate Systems Corp | 熱交換器 |
JP2005009808A (ja) * | 2003-06-20 | 2005-01-13 | Shinko Kogyo Co Ltd | 空気調和機の熱交換器。 |
JP2009123212A (ja) * | 2007-11-14 | 2009-06-04 | Internatl Business Mach Corp <Ibm> | エア/液体熱交換器を用いて電子機器ラックの冷却を促進する装置、及びこれを含む電子機器システム及びデータ・センタ |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6116048A (en) * | 1997-02-18 | 2000-09-12 | Hebert; Thomas H. | Dual evaporator for indoor units and method therefor |
JP3765732B2 (ja) * | 2001-04-18 | 2006-04-12 | 株式会社荏原製作所 | ヒートポンプ及び除湿空調装置 |
US6938432B2 (en) * | 2002-01-10 | 2005-09-06 | Espec Corp. | Cooling apparatus and a thermostat with the apparatus installed therein |
US6938433B2 (en) * | 2002-08-02 | 2005-09-06 | Hewlett-Packard Development Company, Lp. | Cooling system with evaporators distributed in series |
US6622519B1 (en) * | 2002-08-15 | 2003-09-23 | Velocys, Inc. | Process for cooling a product in a heat exchanger employing microchannels for the flow of refrigerant and product |
US20040084175A1 (en) * | 2002-10-31 | 2004-05-06 | Bruce Kranz | Multi-zone temperature control system |
TWI318289B (en) * | 2002-11-01 | 2009-12-11 | Cooligy Inc | Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
US20040250994A1 (en) * | 2002-11-05 | 2004-12-16 | Lalit Chordia | Methods and apparatuses for electronics cooling |
US20050207116A1 (en) * | 2004-03-22 | 2005-09-22 | Yatskov Alexander I | Systems and methods for inter-cooling computer cabinets |
US20070095087A1 (en) * | 2005-11-01 | 2007-05-03 | Wilson Michael J | Vapor compression cooling system for cooling electronics |
US20070209782A1 (en) * | 2006-03-08 | 2007-09-13 | Raytheon Company | System and method for cooling a server-based data center with sub-ambient cooling |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
US7963119B2 (en) * | 2007-11-26 | 2011-06-21 | International Business Machines Corporation | Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center |
US8170724B2 (en) * | 2008-02-11 | 2012-05-01 | Cray Inc. | Systems and associated methods for controllably cooling computer components |
US8312734B2 (en) * | 2008-09-26 | 2012-11-20 | Lewis Donald C | Cascading air-source heat pump |
-
2011
- 2011-07-13 CA CA 2805417 patent/CA2805417A1/en not_active Abandoned
- 2011-07-13 US US13/517,089 patent/US20120279684A1/en not_active Abandoned
- 2011-07-13 SG SG2013001755A patent/SG187000A1/en unknown
- 2011-07-13 JP JP2013519799A patent/JP2013534061A/ja active Pending
- 2011-07-13 AU AU2011279239A patent/AU2011279239A1/en not_active Abandoned
- 2011-07-13 EP EP11807469.9A patent/EP2593845A4/en not_active Withdrawn
- 2011-07-13 WO PCT/US2011/043893 patent/WO2012009460A2/en active Application Filing
- 2011-07-13 KR KR20137002714A patent/KR20130093596A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003028539A (ja) * | 2001-07-18 | 2003-01-29 | Matsushita Electric Ind Co Ltd | 熱交換器および冷凍サイクル装置 |
JP2003294338A (ja) * | 2002-03-29 | 2003-10-15 | Japan Climate Systems Corp | 熱交換器 |
JP2005009808A (ja) * | 2003-06-20 | 2005-01-13 | Shinko Kogyo Co Ltd | 空気調和機の熱交換器。 |
JP2009123212A (ja) * | 2007-11-14 | 2009-06-04 | Internatl Business Mach Corp <Ibm> | エア/液体熱交換器を用いて電子機器ラックの冷却を促進する装置、及びこれを含む電子機器システム及びデータ・センタ |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019502089A (ja) * | 2015-12-10 | 2019-01-24 | 広東合一新材料研究院有限公司Guangdong Hi−1 New Materials Technology Research Institute Co., Ltd. | 各種データセンター用自然冷却源放熱システム |
CN105784141A (zh) * | 2016-05-18 | 2016-07-20 | 龙文凯 | 防滑式电气设备温度监测装置 |
CN105806499A (zh) * | 2016-05-18 | 2016-07-27 | 龙文凯 | 低杂音的电气设备温度监测装置 |
CN105806500A (zh) * | 2016-05-18 | 2016-07-27 | 龙文凯 | 维护方便的电气设备温度监测装置 |
CN106017728A (zh) * | 2016-05-18 | 2016-10-12 | 龙文凯 | 电气设备温度监测装置 |
Also Published As
Publication number | Publication date |
---|---|
SG187000A1 (en) | 2013-02-28 |
WO2012009460A3 (en) | 2012-04-26 |
KR20130093596A (ko) | 2013-08-22 |
CA2805417A1 (en) | 2012-01-19 |
US20120279684A1 (en) | 2012-11-08 |
EP2593845A2 (en) | 2013-05-22 |
WO2012009460A2 (en) | 2012-01-19 |
EP2593845A4 (en) | 2015-04-22 |
AU2011279239A1 (en) | 2013-01-31 |
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