JP2013524506A5 - - Google Patents
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- Publication number
- JP2013524506A5 JP2013524506A5 JP2013502561A JP2013502561A JP2013524506A5 JP 2013524506 A5 JP2013524506 A5 JP 2013524506A5 JP 2013502561 A JP2013502561 A JP 2013502561A JP 2013502561 A JP2013502561 A JP 2013502561A JP 2013524506 A5 JP2013524506 A5 JP 2013524506A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- conductive layer
- interconnect
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 15
- 238000001465 metallisation Methods 0.000 claims 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 10
- 229910052782 aluminium Inorganic materials 0.000 claims 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 7
- 229920005591 polysilicon Polymers 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000010949 copper Substances 0.000 claims 6
- 229910052802 copper Inorganic materials 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 238000005530 etching Methods 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 3
- 235000012239 silicon dioxide Nutrition 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/750,408 US8304851B2 (en) | 2010-03-30 | 2010-03-30 | Semiconductor thermocouple and sensor |
| US12/750,408 | 2010-03-30 | ||
| PCT/US2010/062055 WO2011126530A1 (en) | 2010-03-30 | 2010-12-23 | Semiconductor thermocouple and sensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013524506A JP2013524506A (ja) | 2013-06-17 |
| JP2013524506A5 true JP2013524506A5 (enExample) | 2014-02-06 |
| JP6038771B2 JP6038771B2 (ja) | 2016-12-07 |
Family
ID=44708663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013502561A Active JP6038771B2 (ja) | 2010-03-30 | 2010-12-23 | 半導体熱電対及びセンサ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8304851B2 (enExample) |
| JP (1) | JP6038771B2 (enExample) |
| CN (2) | CN102823005A (enExample) |
| WO (1) | WO2011126530A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2973164B1 (fr) * | 2011-03-25 | 2013-04-26 | Commissariat Energie Atomique | Capteur differentiel de temperature et ses capacites en technologie cmos/bicmos |
| US10529641B2 (en) * | 2016-11-26 | 2020-01-07 | Texas Instruments Incorporated | Integrated circuit nanoparticle thermal routing structure over interconnect region |
| US10672969B2 (en) | 2017-06-29 | 2020-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thermocouple device |
| US11312621B2 (en) | 2018-08-06 | 2022-04-26 | Invensense, Inc. | Sensing thermal gradients within a microelectromechanical device |
| KR20210098474A (ko) * | 2018-11-21 | 2021-08-10 | 마크 더존 | 방사선 구동식 고 선량률 및 고 선량 방사선 센서 |
| US11635334B2 (en) * | 2020-06-30 | 2023-04-25 | Apple Inc. | Miniature external temperature sensing device for estimating subsurface tissue temperatures |
| US11408778B2 (en) | 2020-07-21 | 2022-08-09 | Apple Inc. | Temperature gradient sensing in portable electronic devices |
| US11771329B2 (en) | 2020-09-24 | 2023-10-03 | Apple Inc. | Flexible temperature sensing devices for body temperature sensing |
| US12460976B2 (en) * | 2022-06-06 | 2025-11-04 | Microchip Technology Incorporated | Integrated thermocouple |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3393328A (en) | 1964-09-04 | 1968-07-16 | Texas Instruments Inc | Thermal coupling elements |
| JPS6140523A (ja) * | 1984-08-01 | 1986-02-26 | Matsushita Electric Ind Co Ltd | 熱電堆型赤外検出素子 |
| US5343064A (en) | 1988-03-18 | 1994-08-30 | Spangler Leland J | Fully integrated single-crystal silicon-on-insulator process, sensors and circuits |
| US5059543A (en) | 1990-09-21 | 1991-10-22 | The Board Of Regents Acting For And On Behalf Of The University Of Michigan | Method of manufacturing thermopile infrared detector |
| US5689087A (en) | 1994-10-04 | 1997-11-18 | Santa Barbara Research Center | Integrated thermopile sensor for automotive, spectroscopic and imaging applications, and methods of fabricating same |
| US5909004A (en) | 1996-04-17 | 1999-06-01 | General Electric Company | Thermocouple array and method of fabrication |
| JP2001208606A (ja) * | 2000-01-27 | 2001-08-03 | Alps Electric Co Ltd | 赤外線センサ |
| JP2001349787A (ja) | 2000-06-06 | 2001-12-21 | Seiko Epson Corp | 赤外線検出素子および測温計 |
| JP4009046B2 (ja) | 2001-04-10 | 2007-11-14 | 浜松ホトニクス株式会社 | 赤外線センサ |
| US6531899B1 (en) | 2001-12-27 | 2003-03-11 | Texas Instruments Incorporated | Integrated differential current comparator with input to output electrical isolation |
| US6828172B2 (en) | 2002-02-04 | 2004-12-07 | Delphi Technologies, Inc. | Process for a monolithically-integrated micromachined sensor and circuit |
| US6793389B2 (en) | 2002-02-04 | 2004-09-21 | Delphi Technologies, Inc. | Monolithically-integrated infrared sensor |
| CN1221213C (zh) * | 2002-06-25 | 2005-10-05 | 祥群科技股份有限公司 | 温度传感器及其运用该温度传感器的指纹辨识晶片 |
| JP2004033610A (ja) * | 2002-07-05 | 2004-02-05 | Lightuning Technology Inc | 温度差検出セル及びそれを応用した指紋サーモグラフ読み取り装置 |
| US6987223B2 (en) | 2002-08-28 | 2006-01-17 | Delphi Technologies, Inc. | Heat sink for silicon thermopile |
| US7042690B2 (en) | 2002-12-19 | 2006-05-09 | Texas Instruments Incorporated | Power-line, differential, isolation loss detector |
| US7406185B2 (en) * | 2003-04-16 | 2008-07-29 | Ligh Tuning Technology Inc. | Thermoelectric sensor for fingerprint thermal imaging |
| US7321701B2 (en) * | 2003-09-05 | 2008-01-22 | Authentec, Inc. | Infrared biometric finger sensor and associated methods |
| JP2005241457A (ja) * | 2004-02-26 | 2005-09-08 | Hamamatsu Photonics Kk | 赤外線センサ及びその製造方法 |
| US20070095381A1 (en) | 2005-10-28 | 2007-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stacked thermoelectric device for power generation |
| ATE468615T1 (de) * | 2006-07-24 | 2010-06-15 | Fiat Ricerche | Vorrichtung zur wandlung von elektromagnetischer strahlung in elektrische energie und korrespondierende wandlungsverfahren |
| JP2009210289A (ja) * | 2008-02-29 | 2009-09-17 | Panasonic Electric Works Co Ltd | 赤外線検出システム |
| US7902625B2 (en) | 2008-04-21 | 2011-03-08 | International Business Machines Corporation | Metal-gate thermocouple |
-
2010
- 2010-03-30 US US12/750,408 patent/US8304851B2/en active Active
- 2010-12-23 CN CN2010800659377A patent/CN102823005A/zh active Pending
- 2010-12-23 WO PCT/US2010/062055 patent/WO2011126530A1/en not_active Ceased
- 2010-12-23 JP JP2013502561A patent/JP6038771B2/ja active Active
- 2010-12-23 CN CN201710055694.2A patent/CN107068635B/zh active Active
-
2012
- 2012-10-18 US US13/654,591 patent/US8802476B2/en active Active
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