CN102823005A - 半导体热电偶和传感器 - Google Patents

半导体热电偶和传感器 Download PDF

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Publication number
CN102823005A
CN102823005A CN2010800659377A CN201080065937A CN102823005A CN 102823005 A CN102823005 A CN 102823005A CN 2010800659377 A CN2010800659377 A CN 2010800659377A CN 201080065937 A CN201080065937 A CN 201080065937A CN 102823005 A CN102823005 A CN 102823005A
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China
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layer
conductive
conductive layer
forming
path
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Pending
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CN2010800659377A
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English (en)
Chinese (zh)
Inventor
D·T·特瑞福诺夫
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Texas Instruments Inc
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Texas Instruments Inc
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Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to CN201710055694.2A priority Critical patent/CN107068635B/zh
Publication of CN102823005A publication Critical patent/CN102823005A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/028—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples using microstructures, e.g. made of silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
CN2010800659377A 2010-03-30 2010-12-23 半导体热电偶和传感器 Pending CN102823005A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710055694.2A CN107068635B (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/750,408 US8304851B2 (en) 2010-03-30 2010-03-30 Semiconductor thermocouple and sensor
US12/750,408 2010-03-30
PCT/US2010/062055 WO2011126530A1 (en) 2010-03-30 2010-12-23 Semiconductor thermocouple and sensor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710055694.2A Division CN107068635B (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

Publications (1)

Publication Number Publication Date
CN102823005A true CN102823005A (zh) 2012-12-12

Family

ID=44708663

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010800659377A Pending CN102823005A (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器
CN201710055694.2A Active CN107068635B (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201710055694.2A Active CN107068635B (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

Country Status (4)

Country Link
US (2) US8304851B2 (enExample)
JP (1) JP6038771B2 (enExample)
CN (2) CN102823005A (enExample)
WO (1) WO2011126530A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109906505A (zh) * 2016-11-26 2019-06-18 德州仪器公司 互连区上方的集成电路纳米颗粒热路由结构

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2973164B1 (fr) * 2011-03-25 2013-04-26 Commissariat Energie Atomique Capteur differentiel de temperature et ses capacites en technologie cmos/bicmos
US10672969B2 (en) 2017-06-29 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Thermocouple device
US11312621B2 (en) 2018-08-06 2022-04-26 Invensense, Inc. Sensing thermal gradients within a microelectromechanical device
KR20210098474A (ko) * 2018-11-21 2021-08-10 마크 더존 방사선 구동식 고 선량률 및 고 선량 방사선 센서
US11635334B2 (en) * 2020-06-30 2023-04-25 Apple Inc. Miniature external temperature sensing device for estimating subsurface tissue temperatures
US11408778B2 (en) 2020-07-21 2022-08-09 Apple Inc. Temperature gradient sensing in portable electronic devices
US11771329B2 (en) 2020-09-24 2023-10-03 Apple Inc. Flexible temperature sensing devices for body temperature sensing
US12460976B2 (en) * 2022-06-06 2025-11-04 Microchip Technology Incorporated Integrated thermocouple

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5689087A (en) * 1994-10-04 1997-11-18 Santa Barbara Research Center Integrated thermopile sensor for automotive, spectroscopic and imaging applications, and methods of fabricating same
US20040208345A1 (en) * 2003-04-16 2004-10-21 Chou Bruce C. S. Thermoelectric sensor for fingerprint thermal imaging
US20070095381A1 (en) * 2005-10-28 2007-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked thermoelectric device for power generation
CN101114690A (zh) * 2006-07-24 2008-01-30 C.R.F.阿西安尼顾问公司 用于将电磁辐射转换成电能的设备及相应工艺

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US3393328A (en) 1964-09-04 1968-07-16 Texas Instruments Inc Thermal coupling elements
JPS6140523A (ja) * 1984-08-01 1986-02-26 Matsushita Electric Ind Co Ltd 熱電堆型赤外検出素子
US5343064A (en) 1988-03-18 1994-08-30 Spangler Leland J Fully integrated single-crystal silicon-on-insulator process, sensors and circuits
US5059543A (en) 1990-09-21 1991-10-22 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Method of manufacturing thermopile infrared detector
US5909004A (en) 1996-04-17 1999-06-01 General Electric Company Thermocouple array and method of fabrication
JP2001208606A (ja) * 2000-01-27 2001-08-03 Alps Electric Co Ltd 赤外線センサ
JP2001349787A (ja) 2000-06-06 2001-12-21 Seiko Epson Corp 赤外線検出素子および測温計
JP4009046B2 (ja) 2001-04-10 2007-11-14 浜松ホトニクス株式会社 赤外線センサ
US6531899B1 (en) 2001-12-27 2003-03-11 Texas Instruments Incorporated Integrated differential current comparator with input to output electrical isolation
US6828172B2 (en) 2002-02-04 2004-12-07 Delphi Technologies, Inc. Process for a monolithically-integrated micromachined sensor and circuit
US6793389B2 (en) 2002-02-04 2004-09-21 Delphi Technologies, Inc. Monolithically-integrated infrared sensor
CN1221213C (zh) * 2002-06-25 2005-10-05 祥群科技股份有限公司 温度传感器及其运用该温度传感器的指纹辨识晶片
JP2004033610A (ja) * 2002-07-05 2004-02-05 Lightuning Technology Inc 温度差検出セル及びそれを応用した指紋サーモグラフ読み取り装置
US6987223B2 (en) 2002-08-28 2006-01-17 Delphi Technologies, Inc. Heat sink for silicon thermopile
US7042690B2 (en) 2002-12-19 2006-05-09 Texas Instruments Incorporated Power-line, differential, isolation loss detector
US7321701B2 (en) * 2003-09-05 2008-01-22 Authentec, Inc. Infrared biometric finger sensor and associated methods
JP2005241457A (ja) * 2004-02-26 2005-09-08 Hamamatsu Photonics Kk 赤外線センサ及びその製造方法
JP2009210289A (ja) * 2008-02-29 2009-09-17 Panasonic Electric Works Co Ltd 赤外線検出システム
US7902625B2 (en) 2008-04-21 2011-03-08 International Business Machines Corporation Metal-gate thermocouple

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5689087A (en) * 1994-10-04 1997-11-18 Santa Barbara Research Center Integrated thermopile sensor for automotive, spectroscopic and imaging applications, and methods of fabricating same
US20040208345A1 (en) * 2003-04-16 2004-10-21 Chou Bruce C. S. Thermoelectric sensor for fingerprint thermal imaging
US20070095381A1 (en) * 2005-10-28 2007-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked thermoelectric device for power generation
CN101114690A (zh) * 2006-07-24 2008-01-30 C.R.F.阿西安尼顾问公司 用于将电磁辐射转换成电能的设备及相应工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109906505A (zh) * 2016-11-26 2019-06-18 德州仪器公司 互连区上方的集成电路纳米颗粒热路由结构
CN109906505B (zh) * 2016-11-26 2023-06-27 德州仪器公司 互连区上方的集成电路纳米颗粒热路由结构

Also Published As

Publication number Publication date
CN107068635A (zh) 2017-08-18
US20130040413A1 (en) 2013-02-14
US20110241155A1 (en) 2011-10-06
WO2011126530A1 (en) 2011-10-13
US8802476B2 (en) 2014-08-12
JP6038771B2 (ja) 2016-12-07
JP2013524506A (ja) 2013-06-17
US8304851B2 (en) 2012-11-06
CN107068635B (zh) 2020-05-05

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