JP2013522904A - 安定化させたポリマーを持つ光起電性モジュール - Google Patents
安定化させたポリマーを持つ光起電性モジュール Download PDFInfo
- Publication number
- JP2013522904A JP2013522904A JP2013500034A JP2013500034A JP2013522904A JP 2013522904 A JP2013522904 A JP 2013522904A JP 2013500034 A JP2013500034 A JP 2013500034A JP 2013500034 A JP2013500034 A JP 2013500034A JP 2013522904 A JP2013522904 A JP 2013522904A
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- JP
- Japan
- Prior art keywords
- poly
- vinyl butyral
- layer
- benzotriazole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920000642 polymer Polymers 0.000 title claims description 23
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 72
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 50
- 239000010409 thin film Substances 0.000 claims description 25
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000002530 phenolic antioxidant Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 238000004383 yellowing Methods 0.000 abstract description 9
- 230000004888 barrier function Effects 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 14
- 239000000654 additive Substances 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 5
- JOADGALWHMAAKM-UHFFFAOYSA-L magnesium;2-ethylbutanoate Chemical compound [Mg+2].CCC(CC)C([O-])=O.CCC(CC)C([O-])=O JOADGALWHMAAKM-UHFFFAOYSA-L 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- FRQDZJMEHSJOPU-UHFFFAOYSA-N Triethylene glycol bis(2-ethylhexanoate) Chemical compound CCCCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CCCC FRQDZJMEHSJOPU-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- -1 benzimidizole Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 159000000003 magnesium salts Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- OXWDLAHVJDUQJM-UHFFFAOYSA-N 2-[[2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylamino]-2-oxoacetyl]amino]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCNC(=O)C(=O)NCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OXWDLAHVJDUQJM-UHFFFAOYSA-N 0.000 description 2
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 2
- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- NTYJJOPFIAHURM-UHFFFAOYSA-N Histamine Chemical compound NCCC1=CN=CN1 NTYJJOPFIAHURM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000006359 acetalization reaction Methods 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- OJXOOFXUHZAXLO-UHFFFAOYSA-M magnesium;1-bromo-3-methanidylbenzene;bromide Chemical compound [Mg+2].[Br-].[CH2-]C1=CC=CC(Br)=C1 OJXOOFXUHZAXLO-UHFFFAOYSA-M 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 150000003839 salts Chemical group 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- DLZBUNUDESZERL-UHFFFAOYSA-N 1-o-heptyl 6-o-nonyl hexanedioate Chemical compound CCCCCCCCCOC(=O)CCCCC(=O)OCCCCCCC DLZBUNUDESZERL-UHFFFAOYSA-N 0.000 description 1
- ZFOMEJJNWNWWIB-UHFFFAOYSA-N 2,5-bis(octyldisulfanyl)-1,3,4-thiadiazole Chemical compound CCCCCCCCSSC1=NN=C(SSCCCCCCCC)S1 ZFOMEJJNWNWWIB-UHFFFAOYSA-N 0.000 description 1
- GCDUWJFWXVRGSM-UHFFFAOYSA-N 2-[2-(2-heptanoyloxyethoxy)ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOC(=O)CCCCCC GCDUWJFWXVRGSM-UHFFFAOYSA-N 0.000 description 1
- JEYLQCXBYFQJRO-UHFFFAOYSA-N 2-[2-[2-(2-ethylbutanoyloxy)ethoxy]ethoxy]ethyl 2-ethylbutanoate Chemical compound CCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CC JEYLQCXBYFQJRO-UHFFFAOYSA-N 0.000 description 1
- SSKNCQWPZQCABD-UHFFFAOYSA-N 2-[2-[2-(2-heptanoyloxyethoxy)ethoxy]ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOCCOC(=O)CCCCCC SSKNCQWPZQCABD-UHFFFAOYSA-N 0.000 description 1
- LGYNIFWIKSEESD-UHFFFAOYSA-N 2-ethylhexanal group Chemical group C(C)C(C=O)CCCC LGYNIFWIKSEESD-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- MHCVYAFXPIMYRD-UHFFFAOYSA-N 2-phenylsulfanylethylsulfanylbenzene Chemical compound C=1C=CC=CC=1SCCSC1=CC=CC=C1 MHCVYAFXPIMYRD-UHFFFAOYSA-N 0.000 description 1
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 1
- 150000008085 4,5-dihydro-1H-imidazoles Chemical class 0.000 description 1
- GONPAIMDIMMKMK-UHFFFAOYSA-N 4-[3-carboxy-4-(3,5-ditert-butyl-4-hydroxyphenyl)butyl]sulfanyl-2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]butanoic acid Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC(CCSCCC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(O)=O)C(O)=O)=C1 GONPAIMDIMMKMK-UHFFFAOYSA-N 0.000 description 1
- LJUQGASMPRMWIW-UHFFFAOYSA-N 5,6-dimethylbenzimidazole Chemical compound C1=C(C)C(C)=CC2=C1NC=N2 LJUQGASMPRMWIW-UHFFFAOYSA-N 0.000 description 1
- LRUDIIUSNGCQKF-UHFFFAOYSA-N 5-methyl-1H-benzotriazole Chemical compound C1=C(C)C=CC2=NNN=C21 LRUDIIUSNGCQKF-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 1
- OIUGWVWLEGLAGH-UHFFFAOYSA-N 6-nonoxy-6-oxohexanoic acid Chemical compound CCCCCCCCCOC(=O)CCCCC(O)=O OIUGWVWLEGLAGH-UHFFFAOYSA-N 0.000 description 1
- SXKCDRRSQHPBOI-UHFFFAOYSA-N 6-o-cyclohexyl 1-o-hexyl hexanedioate Chemical compound CCCCCCOC(=O)CCCCC(=O)OC1CCCCC1 SXKCDRRSQHPBOI-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZNZYKNKBJPZETN-WELNAUFTSA-N Dialdehyde 11678 Chemical compound N1C2=CC=CC=C2C2=C1[C@H](C[C@H](/C(=C/O)C(=O)OC)[C@@H](C=C)C=O)NCC2 ZNZYKNKBJPZETN-WELNAUFTSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000004262 Ethyl gallate Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- MQHWFIOJQSCFNM-UHFFFAOYSA-L Magnesium salicylate Chemical compound [Mg+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O MQHWFIOJQSCFNM-UHFFFAOYSA-L 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
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- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 125000004036 acetal group Chemical group 0.000 description 1
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- 150000001279 adipic acids Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
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- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 238000002845 discoloration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 150000002148 esters Chemical class 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229960001340 histamine Drugs 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
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- 239000001257 hydrogen Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000012939 laminating adhesive Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 229940072082 magnesium salicylate Drugs 0.000 description 1
- ZIKGDWWRHXYIQQ-UHFFFAOYSA-L magnesium;2-aminobenzoate Chemical compound [Mg+2].NC1=CC=CC=C1C([O-])=O.NC1=CC=CC=C1C([O-])=O ZIKGDWWRHXYIQQ-UHFFFAOYSA-L 0.000 description 1
- HDGZVUGGOOMFHA-UHFFFAOYSA-L magnesium;3-carboxynaphthalen-2-olate Chemical compound [Mg+2].C1=CC=C2C=C(C([O-])=O)C(O)=CC2=C1.C1=CC=C2C=C(C([O-])=O)C(O)=CC2=C1 HDGZVUGGOOMFHA-UHFFFAOYSA-L 0.000 description 1
- LBYCWLBCHNSWFE-UHFFFAOYSA-L magnesium;pyridine-3-carboxylate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CN=C1.[O-]C(=O)C1=CC=CN=C1 LBYCWLBCHNSWFE-UHFFFAOYSA-L 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical compound SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
Description
本発明の薄膜光起電性装置は、ここでの説明に従って調合されたポリ(ビニルブチラール)層を含み、該層は、当該光起電性装置に優れた接着性、抵抗率、密封性、加工性、及び耐性を提供すると共に、1H-ベンゾトリアゾールを含む。
安定性及び性能を高めるために本発明のポリマー層に含めることのできる更なる添加剤には、例えばIrganox MD-1024(登録商標) (CAS
32687-78-8)及びNaugard XL-1(登録商標)(CAS 70331-94-1)などの金属不活性化剤、 例えばTinuvin 123(登録商標)(CAS129757-67-1)などのヒンダード・アミン光安定化剤、及び、例えばAnox 70(登録商標)(2,2’ -チオジエチレンビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート] CAS 41484-35-9)などのフェノール系抗酸化剤がある。
本発明の薄膜光起電性モジュールは、ポリ(ビニルブチラール)の層を、保護基質に対して光起電性装置を密封するために用いられる積層接着剤として用いることで、本発明の光起電性モジュールを形成する。
Science & Technology, 3rd edition, Volume 8, pages 381-399,
by B.E. Wade (2003) のビニルアセタールポリマーに記載された溶媒法を用いることができる。別の実施態様では、そこで記載された水性の方法を用いることができる。ポリ(ビニルブチラール)は多様な形で、例えばミズーリ州セントルイスのソルシア社から Butvar(登録商標)
樹脂としてなど、多様な形で市販されている。
79992-76-0)などがある。本発明の多様な実施態様では、マグネシウム塩はマグネシウムビス(2-エチルブチレート)である。
217号に開示されたものなどのアジピン酸、並びに前述の混合物及び組合せ、がある。用いることのできる他の可塑剤は、米国特許第5,013,779号に開示された通り、C4
乃至 C9 アルキルアルコール及びシクロC4 乃至C10 アルコール、及びアジピン酸ヘキシルなどのC6 乃至C8 アジピン酸エステルから作製された混合アジピン酸塩である。多様な実施態様では、用いられる可塑剤はアジピン酸ジヘキシル及び/又はトリエチレン
グリコールジ-2 エチルヘキサノエートである。
図1では素子12として示されている、本発明の基盤基質は、本発明の光起電性装置を上に形成することができれば、いずれの適した基質であってもよい。例には、限定はしないが、ガラス、及び「剛性の」薄膜モジュールを生じる合成の可塑性グレージング材料、及び、「軟性の」薄膜モジュールを生じる、例えばポリ(エチレンテレフタレート)、ポリイミド、フルオロポリマー等の薄膜プラスチック・フィルムがある。一般的には、基盤基質が、350乃至1,200 ナノメートルの範囲の入射光のほとんどを透過させられることが好ましいが、当業者であれば、保護基質を通じて光が光起電性装置に入光するような変更も含め、変更が可能であることは認識されよう。
図1では素子14で示される、本発明の薄膜光起電性装置は、基盤基質上に直接、形成される。典型的な装置の製造は、用途に応じて、第一導電層の蒸着、第一導電層の腐食、半導体層の蒸着及び腐食、第二導電層の蒸着、第二導電層の腐食、及び、バス導電体及び保護層の塗布を含む。選択的には、電気的絶縁層を第一導電層及び基質基盤間の基盤基質上に形成することができる。この選択的な層は、例えば、シリコン層であってもよい。
又はPN 構造の水素付加非晶質シリコンを含むことができる。該シリコンは典型的には厚さが最高で約500ナノメートルであってよく、典型的には厚さが3 乃至25 ナノメートルのp-層、20 乃至450 ナノメートルのi-層、そして20 乃至 40 ナノメートルのn-層を含む。蒸着は、例えば米国特許第4,064,521号などに記載された通り、シラン又はシラン及び水素の混合物中でのグロー放電によることができる。
図1で素子18として示される、本発明の保護基質は、ポリマー層に接着するのに用いることができ、その下の装置を充分に保護することができればいずれの適した基質であってもよい。例には、限定はしないが、ガラス、剛性プラスチック、及び薄膜プラスチック・フィルム、例えばポリ(エチレンテレフタレート)、ポリイミド、フルオロポリマー等がある。保護基質が350乃至1,200ナノメートル範囲の入射光のほとんどの通過を可能にすることが概ね好ましいが、当業者であれば、本光起電性装置への入射光のすべてが基盤基質を通って進入するような変更を含め、変更が可能であることは認識されよう。これらの実施態様では、保護基質は透明である必要はなく、又はそうである必要はほぼなく、例えば、保護基質を通じて光起電性装置から光が脱出できなくするような反射性フィルムであってもよい。
本発明の薄膜光起電性モジュールの最終的な組立は、薄膜光起電性装置と接触した状態にポリ(ビニルブチラール)層を、該当する場合には基盤基質上に形成されたバス・バーと一緒に、配置するステップと、保護基質をポリ(ビニルブチラール)層と接触させて配置するステップと、該組立体を積層してモジュールを形成するステップとを含む。
実施例1
小型の研究室規格の押出し機を用いて、ビニルアルコール含有量が18.7 wt % で残留ビニルアセテート0.5-4
wt %の約750グラムのポリ(ビニルブチラール)樹脂を、可塑剤としての285 グラムのトリエチレン グリコールジ-(2-エチルヘキサノエート)、 2.63 グラムの紫外線吸収剤
Tinuvin 328(登録商標)、接着制御塩としての 0.19グラムのマグネシウム (2-エチルブチレート) 、及び表1に示す通りの多様な添加物と混合し、0.76 ミリメートル厚のシートに押し出した。
Plastics” 法の表1内に提示された「黄化指数の方程式の係数」の「C,1931」カラムを用いて計算する。
Claims (19)
- 基盤基質;
前記基盤基質に接触して配置された光起電性装置であって、金属成分を含む、光起電性装置;
前記光起電性装置に接触して配置されたポリ(ビニルブチラール)であって、1H-ベンゾトリアゾール又は1H-ベンゾトリアゾール塩を含む、ポリ(ビニルブチラール);及び
前記ポリ(ビニルブチラール)層に接触して配置された保護基質、
を含む光起電性モジュール。 - 前記光起電性装置が薄膜光起電性装置である、請求項1に記載のモジュール。
- 前記ポリ(ビニルブチラール)層が0.001乃至5 重量パーセントの1H-ベンゾトリアゾールを含む、請求項2に記載のモジュール。
- 前記ポリ(ビニルブチラール)層が0.1乃至0.4 重量パーセントの1H-ベンゾトリアゾールを含む、請求項2に記載のモジュール。
- 前記ポリ(ビニルブチラール)層が1乃至5 重量パーセントの1H-ベンゾトリアゾールを含む、請求項2に記載のモジュール。
- 前記ポリ(ビニルブチラール)層がフェノール系抗酸化剤を更に含む、請求項2に記載のモジュール。
- 前記金属がビスマス、銅、カドミウム、鉛、すず、亜鉛、銀、金、インジウム、パラジウム、プラチナ、アルミニウム、アンチモニー、クロム、鉄、ニッケル、ロジウム、タンタル、チタン、又はヴァナジウムである、請求項2に記載のモジュール。
- 前記金属が銀である、請求項2に記載のモジュール。
- 前記金属成分が導電層として用いられる、請求項2に記載のモジュール。
- 0.001 乃至5 重量パーセントの1H-ベンゾトリアゾールを含むポリ(ビニルブチラール)シートを含むポリマー中間層。
- 前記ポリ(ビニルブチラール)シートが0.1 乃至0.4 重量パーセントの1H-ベンゾトリアゾールを含む、請求項10に記載の中間層。
- 前記ポリ(ビニルブチラール)シートが1 乃至5 重量パーセントの1H-ベンゾトリアゾールを含む、請求項10に記載の中間層。
- 前記ポリ(ビニルブチラール)シートが更にフェノール系抗酸化剤を含む、請求項10に記載の中間層。
- 第一基質;
前記第一基質と接触して配置された金属成分;
前記金属成分と接触して配置されたポリ(ビニルブチラール)層であって、1H-ベンゾトリアゾール又は1H-ベンゾトリアゾール塩を含む、ポリ(ビニルブチラール)層;及び
前記ポリ(ビニルブチラール)層と接触して配置された第二基質、
を含む多層積層物。 - 前記ポリ(ビニルブチラール)シートが0.1乃至0.4 重量パーセントの1H-ベンゾトリアゾールを含む、請求項14に記載の多層積層物。
- 前記ポリ(ビニルブチラール)シートが1乃至5 重量パーセントの1H-ベンゾトリアゾールを含む、請求項14に記載の多層積層物
- 前記ポリ(ビニルブチラール)シートが0.001乃至5重量パーセントを含む、請求項14に記載の多層積層物。
- 前記ポリ(ビニルブチラール)シートがフェノール系抗酸化剤を更に含む、請求項14に記載の多層積層物。
- 光起電性モジュールを作製する方法であって、
基盤基質を提供するステップと;
光起電性装置を前記基盤基質上に形成するステップであって、前記光起電性装置が金属成分を含む、ステップと;
ポリ(ビニルブチラール)層を前記光起電性装置と接触して配置するステップであって、前記ポリ(ビニルブチラール)層が1H-ベンゾトリアゾール又は1H-ベンゾトリアゾール塩を含む、ステップと;
前記ポリ(ビニルブチラール)層と接触して保護基質を配置するステップと;
前記基質、前記光起電性装置、前記ポリ(ビニルブチラール)層、及び前記保護基質を積層して前記モジュールを形成するステップと、
を含む、方法。
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PCT/US2010/027976 WO2011115628A1 (en) | 2010-03-19 | 2010-03-19 | Photovoltaic module with stabilized polymer |
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EP (1) | EP2547516A1 (ja) |
JP (1) | JP2013522904A (ja) |
KR (1) | KR20130010889A (ja) |
CN (1) | CN102811854A (ja) |
AU (1) | AU2010348376A1 (ja) |
BR (1) | BR112012022911A2 (ja) |
CA (1) | CA2791015A1 (ja) |
MX (1) | MX2012010354A (ja) |
RU (1) | RU2528397C2 (ja) |
SG (1) | SG183430A1 (ja) |
WO (1) | WO2011115628A1 (ja) |
ZA (1) | ZA201206288B (ja) |
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WO2016032837A1 (en) * | 2014-08-25 | 2016-03-03 | Solutia Inc. | Thin film photovoltaic module with stabilized polymer |
EP3185309A1 (en) * | 2015-12-23 | 2017-06-28 | Amcor Flexibles Transpac | Heat reflective solar module |
RU168774U1 (ru) * | 2016-03-04 | 2017-02-17 | Валентин Петрович Пивнов | Отражающая пленка |
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KR20130010889A (ko) | 2013-01-29 |
RU2528397C2 (ru) | 2014-09-20 |
SG183430A1 (en) | 2012-09-27 |
CN102811854A (zh) | 2012-12-05 |
CA2791015A1 (en) | 2011-09-22 |
MX2012010354A (es) | 2012-11-16 |
ZA201206288B (en) | 2013-05-29 |
WO2011115628A1 (en) | 2011-09-22 |
BR112012022911A2 (pt) | 2019-09-24 |
RU2012144439A (ru) | 2014-04-27 |
AU2010348376A1 (en) | 2012-09-27 |
EP2547516A1 (en) | 2013-01-23 |
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