JP2013522047A - 金属製基板の表面をろう付けするための方法 - Google Patents
金属製基板の表面をろう付けするための方法 Download PDFInfo
- Publication number
- JP2013522047A JP2013522047A JP2012557527A JP2012557527A JP2013522047A JP 2013522047 A JP2013522047 A JP 2013522047A JP 2012557527 A JP2012557527 A JP 2012557527A JP 2012557527 A JP2012557527 A JP 2012557527A JP 2013522047 A JP2013522047 A JP 2013522047A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- metal
- metal substrate
- oxide layer
- filler material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 238000005219 brazing Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 title abstract description 42
- 239000002184 metal Substances 0.000 title abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 54
- 239000000945 filler Substances 0.000 claims abstract description 30
- 230000004913 activation Effects 0.000 claims abstract description 20
- 238000005422 blasting Methods 0.000 claims abstract description 15
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 14
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 14
- 238000009736 wetting Methods 0.000 claims abstract description 12
- 230000003213 activating effect Effects 0.000 claims abstract description 9
- 238000003754 machining Methods 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- -1 among others Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Catalysts (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
10 表面
12 金属製基板
14 粉末にした粒子
16 フィラー材料
18 酸化物層
20 ろう付けした表面
22 多孔質構造
24 多孔質が減少した構造
Claims (8)
- 金属製基板(12)の表面(10)をろう付けするための方法(8)であって、前記表面(10)が概して不活性な金属酸化物層(18)を含み、
前記表面(10)上に活性化用材料の粉末にした粒子(14)をグリットブラスティングするステップと、
ろう付け温度においてフィラー材料(16)で前記金属製基板(12)の前記グリットブラスティングした表面(10)を濡らすステップであり、前記活性化用材料が前記ろう付け温度において前記金属酸化物層(18)と容易に反応する、ステップと
を含む方法(8)。 - 前記グリットブラスティングするステップに先立って、前記金属製基板(12)を機械加工することによって前記金属製基板(12)を活性化させるステップ
を含む、請求項1に記載の方法(8)。 - 前記活性化用材料が、炭化ケイ素(SiC)である、請求項1または2に記載の方法。
- 前記表面(10)上に前記活性化用材料の前記粉末にした粒子(14)の前記グリットブラスティングするステップが、3バールから6バールの範囲内の圧力で行われる、請求項1から3のいずれか一項に記載の方法(8)。
- 前記ろう付け温度が、900℃から1260℃の範囲内である、請求項1から4のいずれか一項に記載の方法(8)。
- 前記フィラー材料(16)が、ホウ素、ケイ素、およびリンまたはこれらの組み合わせのうちの少なくとも1つを含む、請求項1から5のいずれか一項に記載の方法(8)。
- 前記フィラー材料(16)が、ニッケルまたは鉄のうちの少なくとも1つを含む、請求項1から6のいずれか一項に記載の方法(8)。
- 前記金属製基板(12)が、アルミニウムまたはチタンまたはクロムまたはこれらの組み合わせを含む、請求項1から7のいずれか一項に記載の方法(8)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10002901A EP2366484A1 (en) | 2010-03-18 | 2010-03-18 | A method for brazing a surface of a metallic substrate |
EP10002901.6 | 2010-03-18 | ||
PCT/EP2011/053897 WO2011113832A1 (en) | 2010-03-18 | 2011-03-15 | A method for brazing a surface of a metallic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013522047A true JP2013522047A (ja) | 2013-06-13 |
JP5792207B2 JP5792207B2 (ja) | 2015-10-07 |
Family
ID=42610053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012557527A Expired - Fee Related JP5792207B2 (ja) | 2010-03-18 | 2011-03-15 | 金属製基板の表面をろう付けするための方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130001277A1 (ja) |
EP (2) | EP2366484A1 (ja) |
JP (1) | JP5792207B2 (ja) |
CN (1) | CN102802858B (ja) |
PL (1) | PL2547482T3 (ja) |
RU (1) | RU2568545C2 (ja) |
WO (1) | WO2011113832A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015061295A1 (en) * | 2013-10-22 | 2015-04-30 | Northeastern University | Flux-less direct soldering by ultrasonic surface activation |
CN105618882A (zh) * | 2016-03-08 | 2016-06-01 | 西北工业大学 | 钎焊接头的封装方法 |
CN110576231B (zh) * | 2019-08-12 | 2021-08-31 | 湖南浩威特科技发展有限公司 | 高硅铝合金半固态钎焊方法和高硅铝合金钎焊接头 |
CN110576232B (zh) * | 2019-08-12 | 2021-07-16 | 湖南浩威特科技发展有限公司 | 高体积分数碳化硅颗粒增强铝基复合材料与铝硅合金的钎焊方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994026455A1 (en) * | 1993-05-12 | 1994-11-24 | Nippon Steel Corporation | Method of soldering heat resisting alloy having insulating oxide film on its surface, and preheated type exhaust gas cleaning metal support and method of manufacturing the same |
JPH08229819A (ja) * | 1994-12-22 | 1996-09-10 | Mitsubishi Heavy Ind Ltd | 二段階ブラスト処理によるロー付け方法 |
JP2010059549A (ja) * | 2009-11-09 | 2010-03-18 | Eltech Systems Corp | 低い塩素過電圧のためのPd含有コーティング |
JP2010523812A (ja) * | 2007-03-30 | 2010-07-15 | プラクスエア・テクノロジー・インコーポレイテッド | 接合されたスパッタリングターゲット及び製造方法 |
JP2011523670A (ja) * | 2008-05-23 | 2011-08-18 | ロックタイト (アール アンド ディー) リミテッド | 一液型カチオン硬化性組成物の表面促進型硬化 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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SU697269A1 (ru) * | 1977-07-14 | 1979-11-15 | Предприятие П/Я В-8624 | Способ пайки металлов с керамикой |
GB2144064A (en) * | 1983-07-30 | 1985-02-27 | Marconi Co Ltd | A method of soldering together two surfaces |
US4572939A (en) * | 1984-01-27 | 1986-02-25 | The United States Of America As Represented By The United States Department Of Energy | Brazing technique |
JP3132850B2 (ja) * | 1991-07-29 | 2001-02-05 | 三菱重工業株式会社 | Ni基耐熱合金のろう付方法 |
US7043819B1 (en) * | 1996-12-23 | 2006-05-16 | Recast Airfoil Group | Methods for forming metal parts having superior surface characteristics |
US6575353B2 (en) * | 2001-02-20 | 2003-06-10 | 3M Innovative Properties Company | Reducing metals as a brazing flux |
DE10342242A1 (de) * | 2003-09-11 | 2005-04-07 | Behr Gmbh & Co. Kg | Lötwerkstück, Lötverfahren und Wärmetauscher |
RU2354514C2 (ru) * | 2007-05-21 | 2009-05-10 | Андрей Валентинович Полторыбатько | Способ пайки алюминия, плакированного силумином, и алюминиевых сплавов, плакированных силумином |
JP2010149175A (ja) * | 2008-12-26 | 2010-07-08 | Honda Motor Co Ltd | ニッケル合金材のろう付け方法 |
CN101502904A (zh) * | 2009-03-03 | 2009-08-12 | 北京科技大学 | 微电子封装用铝碳化硅复合材料与可伐合金的钎焊方法 |
-
2010
- 2010-03-18 EP EP10002901A patent/EP2366484A1/en not_active Withdrawn
-
2011
- 2011-03-15 PL PL11708841T patent/PL2547482T3/pl unknown
- 2011-03-15 US US13/634,261 patent/US20130001277A1/en not_active Abandoned
- 2011-03-15 WO PCT/EP2011/053897 patent/WO2011113832A1/en active Application Filing
- 2011-03-15 EP EP11708841.9A patent/EP2547482B1/en active Active
- 2011-03-15 CN CN201180013981.8A patent/CN102802858B/zh active Active
- 2011-03-15 JP JP2012557527A patent/JP5792207B2/ja not_active Expired - Fee Related
- 2011-03-15 RU RU2012144322/02A patent/RU2568545C2/ru active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994026455A1 (en) * | 1993-05-12 | 1994-11-24 | Nippon Steel Corporation | Method of soldering heat resisting alloy having insulating oxide film on its surface, and preheated type exhaust gas cleaning metal support and method of manufacturing the same |
JPH08229819A (ja) * | 1994-12-22 | 1996-09-10 | Mitsubishi Heavy Ind Ltd | 二段階ブラスト処理によるロー付け方法 |
JP2010523812A (ja) * | 2007-03-30 | 2010-07-15 | プラクスエア・テクノロジー・インコーポレイテッド | 接合されたスパッタリングターゲット及び製造方法 |
JP2011523670A (ja) * | 2008-05-23 | 2011-08-18 | ロックタイト (アール アンド ディー) リミテッド | 一液型カチオン硬化性組成物の表面促進型硬化 |
JP2010059549A (ja) * | 2009-11-09 | 2010-03-18 | Eltech Systems Corp | 低い塩素過電圧のためのPd含有コーティング |
Also Published As
Publication number | Publication date |
---|---|
RU2568545C2 (ru) | 2015-11-20 |
US20130001277A1 (en) | 2013-01-03 |
EP2547482A1 (en) | 2013-01-23 |
WO2011113832A1 (en) | 2011-09-22 |
EP2547482B1 (en) | 2015-07-01 |
PL2547482T3 (pl) | 2015-11-30 |
RU2012144322A (ru) | 2014-04-27 |
CN102802858B (zh) | 2015-11-25 |
JP5792207B2 (ja) | 2015-10-07 |
EP2366484A1 (en) | 2011-09-21 |
CN102802858A (zh) | 2012-11-28 |
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