JP2013504188A5 - - Google Patents

Download PDF

Info

Publication number
JP2013504188A5
JP2013504188A5 JP2012527269A JP2012527269A JP2013504188A5 JP 2013504188 A5 JP2013504188 A5 JP 2013504188A5 JP 2012527269 A JP2012527269 A JP 2012527269A JP 2012527269 A JP2012527269 A JP 2012527269A JP 2013504188 A5 JP2013504188 A5 JP 2013504188A5
Authority
JP
Japan
Prior art keywords
conversion means
means body
shore
matrix material
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012527269A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013504188A (ja
Filing date
Publication date
Priority claimed from DE102009040148A external-priority patent/DE102009040148A1/de
Application filed filed Critical
Publication of JP2013504188A publication Critical patent/JP2013504188A/ja
Publication of JP2013504188A5 publication Critical patent/JP2013504188A5/ja
Pending legal-status Critical Current

Links

JP2012527269A 2009-09-04 2010-08-10 変換手段体、オプトエレクトロニクス半導体チップ及びオプトエレクトロニクス半導体チップの製造方法 Pending JP2013504188A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009040148.2 2009-09-04
DE102009040148A DE102009040148A1 (de) 2009-09-04 2009-09-04 Konversionsmittelkörper, optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
PCT/EP2010/061648 WO2011026716A1 (de) 2009-09-04 2010-08-10 Konversionsmittelkörper, optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips

Publications (2)

Publication Number Publication Date
JP2013504188A JP2013504188A (ja) 2013-02-04
JP2013504188A5 true JP2013504188A5 (https=) 2013-05-30

Family

ID=42983504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012527269A Pending JP2013504188A (ja) 2009-09-04 2010-08-10 変換手段体、オプトエレクトロニクス半導体チップ及びオプトエレクトロニクス半導体チップの製造方法

Country Status (8)

Country Link
US (1) US9055655B2 (https=)
EP (1) EP2474203B1 (https=)
JP (1) JP2013504188A (https=)
KR (1) KR20120062725A (https=)
CN (1) CN102498751B (https=)
DE (1) DE102009040148A1 (https=)
TW (1) TWI470839B (https=)
WO (1) WO2011026716A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110284866A1 (en) * 2005-01-11 2011-11-24 Tran Chuong A Light-emitting diode (led) structure having a wavelength-converting layer and method of producing
CN102714263B (zh) * 2010-02-25 2015-11-25 韩国莱太柘晶电株式会社 发光二极管及其制造方法
DE102010049312B4 (de) 2010-10-22 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Konversionsplättchens und Konversionsplättchen
WO2014156696A1 (ja) * 2013-03-28 2014-10-02 日東電工株式会社 光半導体装置の製造方法、システム、製造条件決定装置および製造管理装置
DE102014107473A1 (de) * 2014-05-27 2015-12-03 Osram Opto Semiconductors Gmbh Konverterelement zur Konvertierung einer Wellenlänge, optoelektronisches Bauelement mit Konverterelement und Verfahren zum Herstellen eines Konverterelements
US10497838B2 (en) * 2018-04-12 2019-12-03 Osram Opto Semiconductors Gmbh Method for producing an optic device, optic device and assembly comprising such an optic device
DE102021124691A1 (de) 2021-09-23 2023-03-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung von optischen elementen, verfahren zur herstellung von strahlungsemittierenden halbleiterbauteilen, optisches element und strahlungsemittierendes halbleiterbauteil
DE102022122981A1 (de) * 2022-09-09 2024-03-14 Ams-Osram International Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE102023108532A1 (de) * 2023-04-03 2024-10-10 Ams-Osram International Gmbh Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4193446B2 (ja) * 2001-08-22 2008-12-10 日亜化学工業株式会社 発光装置
US7285913B2 (en) 2003-08-29 2007-10-23 Matsushita Electric Industrial Co., Ltd. Plasma display device having blue phosphor layers with alkaline earth metal aluminate containing molybdenum or tungsten
US20050211991A1 (en) * 2004-03-26 2005-09-29 Kyocera Corporation Light-emitting apparatus and illuminating apparatus
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
JP2007019096A (ja) * 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
JP4969088B2 (ja) 2005-11-28 2012-07-04 京セラ株式会社 蛍光体及び波長変換器並びに発光装置
KR100746749B1 (ko) 2006-03-15 2007-08-09 (주)케이디티 광 여기 시트
CN102437152A (zh) * 2006-04-24 2012-05-02 克利公司 侧视表面安装式白光led
WO2008001799A1 (fr) * 2006-06-27 2008-01-03 Mitsubishi Chemical Corporation Dispositif d'éclairage
CN1976069A (zh) * 2006-12-05 2007-06-06 上海纳晶科技有限公司 隔热式封装结构的白光led的制造方法
JP4927019B2 (ja) 2007-04-10 2012-05-09 信越化学工業株式会社 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法
JP5080881B2 (ja) * 2007-06-27 2012-11-21 ナミックス株式会社 発光ダイオードチップの封止体の製造方法
DE102007054800B4 (de) * 2007-09-28 2024-12-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lumineszenzdiodenchip mit Lumineszenzkonversionsvorrichtung und Verfahren zum Herstellen von Lumineszenzdiodenchips mit Lumineszenzkonversionsvorrichtung
US9024340B2 (en) * 2007-11-29 2015-05-05 Nichia Corporation Light emitting apparatus and method for producing the same
JP5078644B2 (ja) 2008-02-06 2012-11-21 日東電工株式会社 光半導体素子封止用樹脂シートおよび光半導体装置
US8890186B2 (en) 2008-03-28 2014-11-18 Panasonic Corporation Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
CN101333422A (zh) 2008-07-11 2008-12-31 包书林 Led芯片粘结胶

Similar Documents

Publication Publication Date Title
JP2013504188A5 (https=)
JP2012524159A5 (https=)
TWI638368B (zh) Conductive adhesive and solar cell module
US9379293B2 (en) LED with ceramic green phosphor and protected red phosphor layer
CN105765736B (zh) 太阳能电池封装用紫外线屏蔽性有机硅粘接剂片及使用其的太阳能电池组件
JP2011505973A5 (https=)
BRPI0917927A2 (pt) composição adesiva fotossensível e um filme adesivo, folha adesiva, padrão de adesivo, wafer semicondutor com camada adesiva e dispositivo semicondutor que utiliza a composição adesiva fotossensível
JP2015065403A (ja) 太陽電池モジュールの製造方法
JP2009537991A5 (https=)
WO2010025047A3 (en) Layered body and method for manufacturing thin substrate using the layered body
TWI456242B (zh) 放射線檢測器
JP2013525572A5 (https=)
WO2010107851A3 (en) Rapid fabrication of a microelectronic temporary support for inorganic substrates
JP2011509338A5 (https=)
JP2013522393A5 (https=)
JP2011228450A5 (https=)
MY160364A (en) Adhesive tape for manufacturing electronic components
TW201614022A (en) Adhesive tape for protecting semiconductor wafer surface and method for processing semiconductor wafer
WO2012157975A3 (ko) 태양전지 모듈용 백 시트 및 이를 포함하는 태양전지 모듈
TW200731518A (en) Semiconductor device and manufacturing method of the same
CN109456710B (zh) 一种封装背板一体化材料及其制备方法
WO2008123210A1 (ja) 感光性樹脂組成物
JP2007266420A5 (https=)
TW202111043A (zh) 黏著片、附黏著劑之光學膜、以及影像顯示裝置之製造方法
KR20140105156A (ko) 반도체 웨이퍼 표면 보호용 점착필름