DE102009040148A1 - Konversionsmittelkörper, optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips - Google Patents
Konversionsmittelkörper, optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips Download PDFInfo
- Publication number
- DE102009040148A1 DE102009040148A1 DE102009040148A DE102009040148A DE102009040148A1 DE 102009040148 A1 DE102009040148 A1 DE 102009040148A1 DE 102009040148 A DE102009040148 A DE 102009040148A DE 102009040148 A DE102009040148 A DE 102009040148A DE 102009040148 A1 DE102009040148 A1 DE 102009040148A1
- Authority
- DE
- Germany
- Prior art keywords
- conversion agent
- agent body
- semiconductor layer
- layer sequence
- shore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
- H05B33/145—Arrangements of the electroluminescent material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
- C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009040148A DE102009040148A1 (de) | 2009-09-04 | 2009-09-04 | Konversionsmittelkörper, optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| PCT/EP2010/061648 WO2011026716A1 (de) | 2009-09-04 | 2010-08-10 | Konversionsmittelkörper, optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips |
| EP10740673.8A EP2474203B1 (de) | 2009-09-04 | 2010-08-10 | Konversionsmittelkörper, optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips |
| US13/377,593 US9055655B2 (en) | 2009-09-04 | 2010-08-10 | Conversion medium body, optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip |
| KR20127004528A KR20120062725A (ko) | 2009-09-04 | 2010-08-10 | 전환 에이전트 바디, 광전자 반도체 칩 그리고 광전자 반도체 칩을 제조하기 위한 방법 |
| CN201080030130.XA CN102498751B (zh) | 2009-09-04 | 2010-08-10 | 转换剂体、光电子半导体芯片和用于制造光电子半导体芯片的方法 |
| JP2012527269A JP2013504188A (ja) | 2009-09-04 | 2010-08-10 | 変換手段体、オプトエレクトロニクス半導体チップ及びオプトエレクトロニクス半導体チップの製造方法 |
| TW99129814A TWI470839B (zh) | 2009-09-04 | 2010-09-03 | 轉換媒體、光電半導體晶片,及光電半導體晶片之製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009040148A DE102009040148A1 (de) | 2009-09-04 | 2009-09-04 | Konversionsmittelkörper, optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102009040148A1 true DE102009040148A1 (de) | 2011-03-10 |
Family
ID=42983504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102009040148A Withdrawn DE102009040148A1 (de) | 2009-09-04 | 2009-09-04 | Konversionsmittelkörper, optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9055655B2 (https=) |
| EP (1) | EP2474203B1 (https=) |
| JP (1) | JP2013504188A (https=) |
| KR (1) | KR20120062725A (https=) |
| CN (1) | CN102498751B (https=) |
| DE (1) | DE102009040148A1 (https=) |
| TW (1) | TWI470839B (https=) |
| WO (1) | WO2011026716A1 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015181164A1 (de) * | 2014-05-27 | 2015-12-03 | Osram Opto Semiconductors Gmbh | Konverterelement zur konvertierung einer wellenlänge, optoelektronisches bauelement mit konverterelement und verfahren zum herstellen eines konverterelements |
| US9312452B2 (en) | 2010-10-22 | 2016-04-12 | Osram Opto Semiconductors Gmbh | Method for producing a conversion lamina and conversion lamina |
| WO2024052055A1 (de) * | 2022-09-09 | 2024-03-14 | Ams-Osram International Gmbh | Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement |
| DE102023108532A1 (de) * | 2023-04-03 | 2024-10-10 | Ams-Osram International Gmbh | Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110284866A1 (en) * | 2005-01-11 | 2011-11-24 | Tran Chuong A | Light-emitting diode (led) structure having a wavelength-converting layer and method of producing |
| CN102714263B (zh) * | 2010-02-25 | 2015-11-25 | 韩国莱太柘晶电株式会社 | 发光二极管及其制造方法 |
| WO2014156696A1 (ja) * | 2013-03-28 | 2014-10-02 | 日東電工株式会社 | 光半導体装置の製造方法、システム、製造条件決定装置および製造管理装置 |
| US10497838B2 (en) * | 2018-04-12 | 2019-12-03 | Osram Opto Semiconductors Gmbh | Method for producing an optic device, optic device and assembly comprising such an optic device |
| DE102021124691A1 (de) | 2021-09-23 | 2023-03-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung von optischen elementen, verfahren zur herstellung von strahlungsemittierenden halbleiterbauteilen, optisches element und strahlungsemittierendes halbleiterbauteil |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070262339A1 (en) * | 2006-04-24 | 2007-11-15 | Cree, Inc. | Side-View Surface Mount White LED |
| EP2043165A1 (en) * | 2006-06-27 | 2009-04-01 | Mitsubishi Chemical Corporation | Illuminating device |
| DE102007054800A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lumineszenzkonversionsvorrichtung und Verfahren zum Herstellen von Lumineszenzdiodenchips mit einer derartigen Vorrichtung |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4193446B2 (ja) * | 2001-08-22 | 2008-12-10 | 日亜化学工業株式会社 | 発光装置 |
| US7285913B2 (en) | 2003-08-29 | 2007-10-23 | Matsushita Electric Industrial Co., Ltd. | Plasma display device having blue phosphor layers with alkaline earth metal aluminate containing molybdenum or tungsten |
| US20050211991A1 (en) * | 2004-03-26 | 2005-09-29 | Kyocera Corporation | Light-emitting apparatus and illuminating apparatus |
| US7858408B2 (en) * | 2004-11-15 | 2010-12-28 | Koninklijke Philips Electronics N.V. | LED with phosphor tile and overmolded phosphor in lens |
| JP2007019096A (ja) * | 2005-07-05 | 2007-01-25 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
| JP4969088B2 (ja) | 2005-11-28 | 2012-07-04 | 京セラ株式会社 | 蛍光体及び波長変換器並びに発光装置 |
| KR100746749B1 (ko) | 2006-03-15 | 2007-08-09 | (주)케이디티 | 광 여기 시트 |
| CN1976069A (zh) * | 2006-12-05 | 2007-06-06 | 上海纳晶科技有限公司 | 隔热式封装结构的白光led的制造方法 |
| JP4927019B2 (ja) | 2007-04-10 | 2012-05-09 | 信越化学工業株式会社 | 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法 |
| JP5080881B2 (ja) * | 2007-06-27 | 2012-11-21 | ナミックス株式会社 | 発光ダイオードチップの封止体の製造方法 |
| US9024340B2 (en) * | 2007-11-29 | 2015-05-05 | Nichia Corporation | Light emitting apparatus and method for producing the same |
| JP5078644B2 (ja) | 2008-02-06 | 2012-11-21 | 日東電工株式会社 | 光半導体素子封止用樹脂シートおよび光半導体装置 |
| US8890186B2 (en) | 2008-03-28 | 2014-11-18 | Panasonic Corporation | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
| CN101333422A (zh) | 2008-07-11 | 2008-12-31 | 包书林 | Led芯片粘结胶 |
-
2009
- 2009-09-04 DE DE102009040148A patent/DE102009040148A1/de not_active Withdrawn
-
2010
- 2010-08-10 WO PCT/EP2010/061648 patent/WO2011026716A1/de not_active Ceased
- 2010-08-10 JP JP2012527269A patent/JP2013504188A/ja active Pending
- 2010-08-10 CN CN201080030130.XA patent/CN102498751B/zh not_active Expired - Fee Related
- 2010-08-10 KR KR20127004528A patent/KR20120062725A/ko not_active Ceased
- 2010-08-10 US US13/377,593 patent/US9055655B2/en not_active Expired - Fee Related
- 2010-08-10 EP EP10740673.8A patent/EP2474203B1/de not_active Not-in-force
- 2010-09-03 TW TW99129814A patent/TWI470839B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070262339A1 (en) * | 2006-04-24 | 2007-11-15 | Cree, Inc. | Side-View Surface Mount White LED |
| EP2043165A1 (en) * | 2006-06-27 | 2009-04-01 | Mitsubishi Chemical Corporation | Illuminating device |
| DE102007054800A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lumineszenzkonversionsvorrichtung und Verfahren zum Herstellen von Lumineszenzdiodenchips mit einer derartigen Vorrichtung |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9312452B2 (en) | 2010-10-22 | 2016-04-12 | Osram Opto Semiconductors Gmbh | Method for producing a conversion lamina and conversion lamina |
| US9691946B2 (en) | 2010-10-22 | 2017-06-27 | Osram Opto Semiconductors Gmbh | Method for producing a conversion lamina and conversion lamina |
| US10164157B2 (en) | 2010-10-22 | 2018-12-25 | Osram Opto Semiconductors Gmbh | Method for producing a conversion lamina and conversion lamina |
| WO2015181164A1 (de) * | 2014-05-27 | 2015-12-03 | Osram Opto Semiconductors Gmbh | Konverterelement zur konvertierung einer wellenlänge, optoelektronisches bauelement mit konverterelement und verfahren zum herstellen eines konverterelements |
| WO2024052055A1 (de) * | 2022-09-09 | 2024-03-14 | Ams-Osram International Gmbh | Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement |
| DE102023108532A1 (de) * | 2023-04-03 | 2024-10-10 | Ams-Osram International Gmbh | Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102498751B (zh) | 2016-05-18 |
| TWI470839B (zh) | 2015-01-21 |
| WO2011026716A1 (de) | 2011-03-10 |
| TW201117432A (en) | 2011-05-16 |
| JP2013504188A (ja) | 2013-02-04 |
| EP2474203B1 (de) | 2017-08-02 |
| EP2474203A1 (de) | 2012-07-11 |
| US9055655B2 (en) | 2015-06-09 |
| US20120146076A1 (en) | 2012-06-14 |
| CN102498751A (zh) | 2012-06-13 |
| KR20120062725A (ko) | 2012-06-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| R005 | Application deemed withdrawn due to failure to request examination |