JP2013247143A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2013247143A
JP2013247143A JP2012117676A JP2012117676A JP2013247143A JP 2013247143 A JP2013247143 A JP 2013247143A JP 2012117676 A JP2012117676 A JP 2012117676A JP 2012117676 A JP2012117676 A JP 2012117676A JP 2013247143 A JP2013247143 A JP 2013247143A
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Japan
Prior art keywords
film
oxide
insulating film
transistor
layer
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JP2012117676A
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Japanese (ja)
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JP2013247143A5 (enExample
Inventor
Junichiro Sakata
淳一郎 坂田
Hidetomo Kobayashi
英智 小林
Hiroyuki Tomatsu
浩之 戸松
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2012117676A priority Critical patent/JP2013247143A/ja
Publication of JP2013247143A publication Critical patent/JP2013247143A/ja
Publication of JP2013247143A5 publication Critical patent/JP2013247143A5/ja
Withdrawn legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
JP2012117676A 2012-05-23 2012-05-23 半導体装置 Withdrawn JP2013247143A (ja)

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JP2012117676A JP2013247143A (ja) 2012-05-23 2012-05-23 半導体装置

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JP2013247143A true JP2013247143A (ja) 2013-12-09
JP2013247143A5 JP2013247143A5 (enExample) 2015-06-25

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160028959A (ko) 2014-09-04 2016-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20160039546A (ko) 2014-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 배선층 및 그 제작 방법
JP2016082238A (ja) * 2014-10-16 2016-05-16 株式会社半導体エネルギー研究所 半導体装置、モジュールおよび電子機器
KR20160061262A (ko) 2014-11-21 2016-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2017049239A (ja) * 2015-08-31 2017-03-09 株式会社半導体エネルギー研究所 監視ｉｃ付き蓄電装置
JP2017143239A (ja) * 2015-08-04 2017-08-17 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作成方法
US10096718B2 (en) 2016-06-17 2018-10-09 Semiconductor Energy Laboratory Co., Ltd. Transistor, electronic device, manufacturing method of transistor
JP2019009259A (ja) * 2017-06-23 2019-01-17 株式会社半導体エネルギー研究所 半導体装置
JP2022168145A (ja) * 2014-01-28 2022-11-04 株式会社半導体エネルギー研究所 半導体装置
WO2023281795A1 (ja) * 2021-07-09 2023-01-12 ソニーセミコンダクタソリューションズ株式会社 保護回路及び半導体装置
JP2023017887A (ja) * 2014-01-16 2023-02-07 株式会社半導体エネルギー研究所 半導体装置
WO2025196596A1 (ja) * 2024-03-21 2025-09-25 株式会社半導体エネルギー研究所 半導体装置及びその作製方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02310970A (ja) * 1989-05-25 1990-12-26 Nec Corp 不揮発性記憶装置
JPH0997851A (ja) * 1995-07-27 1997-04-08 Sony Corp 不揮発性半導体メモリ装置
JP2004039965A (ja) * 2002-07-05 2004-02-05 Renesas Technology Corp 不揮発性半導体記憶装置
JP2010141230A (ja) * 2008-12-15 2010-06-24 Renesas Electronics Corp 半導体装置及び半導体装置の製造方法
JP2011155249A (ja) * 2009-12-28 2011-08-11 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2012028731A (ja) * 2010-06-22 2012-02-09 Renesas Electronics Corp 半導体装置、及び、半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02310970A (ja) * 1989-05-25 1990-12-26 Nec Corp 不揮発性記憶装置
JPH0997851A (ja) * 1995-07-27 1997-04-08 Sony Corp 不揮発性半導体メモリ装置
JP2004039965A (ja) * 2002-07-05 2004-02-05 Renesas Technology Corp 不揮発性半導体記憶装置
JP2010141230A (ja) * 2008-12-15 2010-06-24 Renesas Electronics Corp 半導体装置及び半導体装置の製造方法
JP2011155249A (ja) * 2009-12-28 2011-08-11 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2012028731A (ja) * 2010-06-22 2012-02-09 Renesas Electronics Corp 半導体装置、及び、半導体装置の製造方法

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023017887A (ja) * 2014-01-16 2023-02-07 株式会社半導体エネルギー研究所 半導体装置
JP7455928B2 (ja) 2014-01-16 2024-03-26 株式会社半導体エネルギー研究所 半導体装置
JP7528163B2 (ja) 2014-01-28 2024-08-05 株式会社半導体エネルギー研究所 半導体装置
JP2022168145A (ja) * 2014-01-28 2022-11-04 株式会社半導体エネルギー研究所 半導体装置
KR20160028959A (ko) 2014-09-04 2016-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2016058731A (ja) * 2014-09-04 2016-04-21 株式会社半導体エネルギー研究所 半導体装置
KR20230002234A (ko) 2014-10-01 2023-01-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기
US11616085B2 (en) 2014-10-01 2023-03-28 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
US11211408B2 (en) 2014-10-01 2021-12-28 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
US9773820B2 (en) 2014-10-01 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
US11901372B2 (en) 2014-10-01 2024-02-13 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
US12183747B2 (en) 2014-10-01 2024-12-31 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
US10304864B2 (en) 2014-10-01 2019-05-28 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
US10644039B2 (en) 2014-10-01 2020-05-05 Semiconductor Energy Laboratory Co., Ltd. Wiring layer and manufacturing method therefor
KR20240101770A (ko) 2014-10-01 2024-07-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기
KR20160039546A (ko) 2014-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 배선층 및 그 제작 방법
JP2016082238A (ja) * 2014-10-16 2016-05-16 株式会社半導体エネルギー研究所 半導体装置、モジュールおよび電子機器
JP7631596B2 (ja) 2014-11-21 2025-02-18 株式会社半導体エネルギー研究所 半導体装置
KR20210071897A (ko) 2014-11-21 2021-06-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102264974B1 (ko) 2014-11-21 2021-06-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2024105377A (ja) * 2014-11-21 2024-08-06 株式会社半導体エネルギー研究所 半導体装置
KR20200131204A (ko) 2014-11-21 2020-11-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102401610B1 (ko) * 2014-11-21 2022-05-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20220068212A (ko) 2014-11-21 2022-05-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TWI699897B (zh) * 2014-11-21 2020-07-21 日商半導體能源研究所股份有限公司 半導體裝置
KR20250011999A (ko) 2014-11-21 2025-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20240036540A (ko) 2014-11-21 2024-03-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2025065305A (ja) * 2014-11-21 2025-04-17 株式会社半導体エネルギー研究所 半導体装置
US9590115B2 (en) 2014-11-21 2017-03-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2016105469A (ja) * 2014-11-21 2016-06-09 株式会社半導体エネルギー研究所 半導体装置
KR20230047993A (ko) 2014-11-21 2023-04-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20160061262A (ko) 2014-11-21 2016-05-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US11217668B2 (en) 2015-08-04 2022-01-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP7032585B2 (ja) 2015-08-04 2022-03-08 株式会社半導体エネルギー研究所 半導体装置および電子機器
JP2021090065A (ja) * 2015-08-04 2021-06-10 株式会社半導体エネルギー研究所 半導体装置および電子機器
JP2017143239A (ja) * 2015-08-04 2017-08-17 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作成方法
JP2017049239A (ja) * 2015-08-31 2017-03-09 株式会社半導体エネルギー研究所 監視ｉｃ付き蓄電装置
US10096718B2 (en) 2016-06-17 2018-10-09 Semiconductor Energy Laboratory Co., Ltd. Transistor, electronic device, manufacturing method of transistor
JP7137913B2 (ja) 2017-06-23 2022-09-15 株式会社半導体エネルギー研究所 半導体装置
JP2019009259A (ja) * 2017-06-23 2019-01-17 株式会社半導体エネルギー研究所 半導体装置
WO2023281795A1 (ja) * 2021-07-09 2023-01-12 ソニーセミコンダクタソリューションズ株式会社 保護回路及び半導体装置
WO2025196596A1 (ja) * 2024-03-21 2025-09-25 株式会社半導体エネルギー研究所 半導体装置及びその作製方法

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