JP2013243204A - Holding device and holding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding device which holds a plate member inhibiting the plate member from moving in a direction perpendicular to a surface direction thereof while holding the plate member with an elastic member.SOLUTION: A holding device includes: a table including a holding surface 15 holding a plate member such as a semiconductor wafer WF etc.; contact means 20, each of which is provided in the holding surface 15 and includes a contact surface 18 providing suction force while being deformed so as to follow a surface shape of a held surface 11A of the wafer WF; and suction force providing means 24 providing the suction force to the contact surfaces 18. Each contact means 20 is provided so that the contact surface 18 is positioned on substantially the same surface as the holding surface 15 of the table and attracts the wafer WF to the holding surface 15 and holds the wafer WF when the suction force is provided to the contact surface 18.

Description

  The present invention relates to a holding device and a holding method, and more specifically, when a plate-like member is sucked and held, the suction force is surely ensured even if the held surface of the plate-like member has unevenness, step, inclination, etc. The present invention relates to a holding device and a holding method that can be held by applying the above.

A semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) and a plate-like member such as a substrate are subjected to various treatments on the surface while being held by a holding device such as a table. The holding device used in such a process employs a suction structure that can suck the plate-like member through the porous member on the holding surface of the table.
Patent Document 1 proposes a holding device having a suction structure including a porous holder capable of holding a plate-like member (substrate) having an uneven surface.

Japanese Patent Laid-Open No. 9-36599

However, in the holding device described in Patent Document 1, although the plate unit can be prevented from moving in the surface direction by the lock unit, the holder is elastically deformed, so the plate member is in the surface direction. There is an inconvenience that the movement in the intersecting direction cannot be suppressed.
Therefore, for example, when a plate-like member is thinly ground, there arises a disadvantage that unevenness in thickness occurs on the plate-like member after grinding.

[Object of invention]
An object of the present invention is to provide a holding device and a holding method capable of holding a plate member with an elastic member while suppressing the movement of the plate member in a direction intersecting the surface direction. There is.

  In order to achieve the above object, the present invention is a holding device that holds the plate member by abutting the held surface of the plate member and sucking the held surface, and holds the plate member. A table having a holding surface, a contact means comprising an elastic member having a contact surface capable of sucking the held surface in an elastically deformed state following the surface shape of the held surface, and the contact surface A suction force applying means for applying a suction force to the plate-like member so as to be able to contact the held surface of the plate-like member at a position where the contact surface protrudes from the holding surface, When the suction force is applied by the suction force applying means, the contact surface sucks the held surface, and the contact surface is positioned substantially in the same plane as the holding surface of the table. A configuration in which a member is provided to be able to be held by being attracted to the holding surface. You have me.

  In the present invention, a configuration is adopted in which a ventilation preventing means is further provided that is disposed on a side surface that is continuous with the contact surface and that prevents the suction force applied to the contact surface from leaking while being in close contact with the held surface. Is preferred.

  The present invention may further include a heating unit that heats the contact unit.

  Furthermore, it can be set as the structure provided with the pressing means which presses the said plate-shaped member against the said contact surface.

  Further, the present invention is a holding method for holding the plate-like member by contacting the held surface of the plate-like member and sucking the held surface, following the surface shape of the held surface. Using a contact means made of an elastic member having a contact surface capable of sucking the held surface in an elastically deformed state, the contact surface of the contact means protruding from the holding surface; A step of bringing a holding surface into contact with the abutting surface; a step of sucking the held surface by applying a suction force to the abutting surface; And a step of attracting and holding the plate-like member on the holding surface while being positioned substantially in the same plane as the holding surface.

According to the present invention, the holding surface of the plate-shaped member is sucked by the elastically deformable contact surface, and the held surface can be held by the holding surface of the table. While holding the member, the plate-like member can be held while being suppressed from moving in the direction intersecting the surface direction.
In addition, by providing the ventilation preventing means on the side surface continuous to the contact surface, the contact surface can be positioned in the closed space, and the suction force leaks between the contact surface and the held surface. Fear can be avoided.
Further, if the heating means is provided to heat the contact means, the contact means and the ventilation prevention means can be easily deformed, and the shape of the held surface can be followed without difficulty.
Moreover, the structure provided with the pressing means can assist the suction of the held surface at the contact surface and the operation in which the contact surface is positioned substantially in the same plane as the holding surface of the table.

The top view of the holding | maintenance apparatus which concerns on embodiment. The A arrow directional cross-sectional view of FIG. 1 which shows the whole structure of the said holding | maintenance apparatus. Sectional drawing of the principal part of a holding | maintenance apparatus. Sectional drawing of the principal part of a holding | maintenance apparatus when a to-be-held surface has an unevenness | corrugation and inclination.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, for example, when a direction such as up, down, left, right, front, or back is indicated, all of FIG. When viewed from the appropriate orientation), the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction orthogonal to the page. To do.

  For example, as shown in FIG. 2, the wafer WF as the plate-like member in the present embodiment includes an annular reinforcing portion 11 on the outer periphery and a thin portion 12 on the inner side, and the lower surface side of the reinforcing portion 11 is The surface to be held is 11A.

  As shown in FIGS. 1 and 2, the holding device 10 is provided in the holding surface 15 and a table 16 having a holding surface (upper surface) 15 for holding the wafer WF, and the surface shape of the held surface 11A. A contact means 20 made of an elastic member having an abutment surface (upper surface) 18 capable of attracting the held surface 11A in a state of being elastically deformed in accordance with the pressure, and a vacuum pump or vacuum that applies a suction force to the abutment surface 18 A suction force applying means 24 such as an ejector, and an air flow preventing means 22 that is disposed on a side surface continuous to the contact surface 18 and prevents the suction force applied to the contact surface 18 from leaking while being in close contact with the held surface 11A. The heating means 25 for heating the contact means 20 and the pressing means 27 for pressing the wafer WF against the contact surface 18 are provided.

  In the present embodiment, the table 16 is provided so as not to be deformable, and is provided with a rectangular outer shape in plan view, and includes a chamber 36 therein. An annular groove 32 is provided in the holding surface 15, and the contact means 20 is accommodated in the groove 32 as shown in FIG. 2. A through hole 34 communicating with the chamber 36 is formed at the bottom of the concave groove 32. The chamber 36 is formed with a bottom through-hole 37 that opens to the bottom surface of the table 16, and the suction force applying means 24 is connected to the bottom through-hole 37. In addition, a vent 30 that opens on one side surface of the table 16 is provided at the center of the table 16.

  The abutment means 20 is composed of a porous elastic member such as a sponge or resin having holes connected to each other, and is configured in an annular shape that fits in the concave groove 32. The width of the contact surface 18 is set smaller than the width of the held surface 11A, and is provided in a planar shape or size that does not protrude from the held surface 11A. The contact means 20 is provided so that the contact surface 18 protrudes upward from the holding surface 15 in a state where no load is applied, and when the suction force is applied by the suction force application means 24. The held surface 11A is sucked by the contact surface 18 and elastically deformed (contracted) so that the contact surface 18 is positioned substantially in the same plane as the holding surface 15 of the table 16 and the wafer WF is placed on the holding surface 15. It is provided so that it can be attracted and held.

  The ventilation prevention means 22 is made of a ring-shaped elastic body such as rubber or resin, and is provided on the inner peripheral ring member 22A provided on the inner peripheral side surface continuous to the contact surface 18 and on the outer peripheral side surface. The outer peripheral ring member 22B is provided. The inner and outer ring members 22A and 22B have upper ends that are the same height as the contact surface 18, and are set to a height that fits in the groove 32 in a state where no load is applied, and can slide in the groove 32. Is provided. In addition, it is preferable to use the material by which elastic deformation is accelerated | stimulated for the ventilation | gas_flow prevention means 22 and the contact means 20 when heated.

  The heating means 25 includes an inner coil heater 25A disposed along the inner periphery of the inner ring member 22A and an outer coil heater 25B disposed along the outer periphery of the outer ring member 22B. It is provided so that it can be heated through a vessel.

  The pressing means 27 supports the suction plate 40 having a suction surface on the lower surface side to which a decompression means such as a decompression pump or a vacuum ejector (not shown) is connected, and the suction plate 40 by its output shaft 42. A first linear motion motor 41 as a drive device that can move in the vertical direction, and a drive device that supports the first linear motion motor 41 by its slider 44 and that allows the first linear motion motor 41 to move in the left-right direction. As a second linear motion motor 45.

  Next, a wafer holding method in the present embodiment will be described with reference to FIGS.

  The pressing means 27 drives a decompression means (not shown) and sucks and holds the wafer WF by the suction plate 40, and then drives the second linear motor 45 to move the wafer WF above the table 16 as shown in FIG. Transport.

  At this time, the heating means 25 energizes the inner and outer coil heaters 25A and 25B, and the ventilation prevention means 22 and the contact means 20 are kept in a state where they are easily elastically deformed by the conduction heat.

  Next, after the pressing unit 27 drives the first linear motor 41 to lower the wafer WF to a position where the held surface 11A of the wafer WF contacts the contact surface 18, the decompression unit (not shown) is stopped and the wafer WF is stopped. The held surface 11 </ b> A is placed in contact with the contact surface 18. Then, the suction force applying means 24 drives a vacuum pump, a vacuum ejector, etc. (not shown) to hold the wafer WF by suction. At this time, the abutting surface 18 is located and closed in a region surrounded by the held surface 11A, the inner ring member 22A, and the outer ring member 22B, and the held surface is not leaked. Thus, the wafer WF is sucked and held. Thereafter, as shown in FIG. 3, the abutting means 20 holds the wafer WF with the abutting surface 18 positioned substantially in the same plane as the holding surface 15 of the table 16 by the suction force of the suction force applying means 24. It will be attracted to 15 and held. Accordingly, while the wafer WF is held by the contact surface 18, the held surface 11A of the wafer WF is attracted to the non-deformable holding surface 15, and the wafer WF is prevented from moving in a direction intersecting the surface direction. Can be held. Then, the pressing means 27 drives the first linear motor 41 and the second linear motor 45 to move the suction plate 40 to the initial position.

  Here, as shown in FIG. 4, when the held surface 11 </ b> A has an uneven surface 11 </ b> B or an inclined surface 11 </ b> C due to partial chipping on the outer peripheral side, when a suction force is applied to the contact means 20. The contact surface 18 deforms and adheres closely to the shape of the unevenness 11B or the inclined surface 11C. At the same time, the upper ends of the inner and outer ring members 22A and 22B are also deformed and brought into close contact with the unevenness 11B and the inclined surface 11C. Although the unevenness | corrugation 11B is not specifically limited, For example, a thing about 1-1000 micrometers, such as a crack and a crack, can be illustrated.

  Therefore, according to such an embodiment, it is possible to suppress and hold the wafer WF from moving in a direction intersecting the surface direction. For example, the wafer WF is thinly ground. However, it is possible to eliminate the inconvenience that the wafer WF after grinding is uneven in thickness.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the abutting means 20 is applied with a suction force to attract the held surface 11A of the wafer WF to the holding surface 15, but before and after the suction force is applied to the abutting means 20. The pressing means 27 may be configured to push the wafer WF downward.

  Further, the contact means 20 may be arranged in a scattered manner at positions corresponding to the held surface 11A. The contact means 20 can also be provided on a plurality of concentric circles centered on one point on the holding surface 15. Further, the abutting means 20 may be configured such that the lower portion is made of an elastic member different from the upper portion, or the elastic member constituting the lower portion is made of an elastic member such as a spring. Further, the abutting means 20 may be a single porous material having a single hole instead of a porous material.

  Further, the ventilation preventing means 22 may be constituted by a closed-cell porous member whose pores are not connected to each other.

The wafer WF can be exemplified by a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer. In addition to the wafer WF, not only the wafer WF but also the optical disk substrate, glass plate, steel plate, resin plate, substrate, etc., and other members as well as members and articles of any form can be targeted. It can also be applied as a holding structure.
Furthermore, the plate-like member is formed in a flat shape in which the reinforcing portion 11 is not formed, that is, a flat surface having a flat bottom surface, in addition to the one in which the annular reinforcing portion 11 is formed on the outer periphery as in the embodiment. It may be what was done.

  Further, the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

  The heating means 25 may be constituted by hot air, hot water, a discharge heater, an infrared heater or the like other than the coil heater.

DESCRIPTION OF SYMBOLS 10 Holding device 11A Holding surface 15 Holding surface 16 Table 18 Contact surface 20 Contact means 22 Air flow prevention means 24 Suction force provision means 25 Heating means 27 Pushing means WF Semiconductor wafer (plate-like member)

Claims (5)

A holding device that holds the plate member by abutting the held surface of the plate member and sucking the held surface,
A table having a holding surface for holding the plate member;
A contact means made of an elastic member having a contact surface capable of sucking the held surface in a state of being elastically deformed following the surface shape of the held surface;
Suction force applying means for applying a suction force to the contact surface;
The contact means is provided so as to be able to contact the held surface of the plate-like member at a position where the contact surface protrudes from the holding surface, and when the suction force is applied by the suction force applying means, The abutting surface sucks the held surface, and the abutting surface is positioned substantially in the same plane as the holding surface of the table so that the plate-like member is attracted to the holding surface and can be held. A holding device.   The air-flow prevention means which is arrange | positioned at the side surface which continues to the said contact surface, and adheres to the said to-be-held surface, and prevents that the suction | attraction force provided to the contact surface leaks is provided. Holding device.   The holding device according to claim 1, further comprising a heating unit that heats the contact unit.   The holding device according to claim 1, further comprising pressing means for pressing the plate-like member against the contact surface. A holding method for holding the plate member by abutting the held surface of the plate member and sucking the held surface,
Using a contact means made of an elastic member having a contact surface capable of sucking the held surface in a state of being elastically deformed following the surface shape of the held surface,
A step of causing the contact surface of the contact means to protrude from the holding surface;
Contacting the held surface with the contact surface;
Sucking the held surface by applying a suction force to the contact surface;
A holding method comprising: a step of elastically deforming the abutting means so that the abutting surface is positioned substantially in the same plane as the holding surface and attracting and holding the plate-like member to the holding surface. .

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