JP2007276065A - Substrate adsorption holding device and manufacturing device of wiring substrate unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely adsorb and hold a substrate in such a state that the surface shape of a flexible substrate is made to be flatter. <P>SOLUTION: A flexible hand 9 provided on a manufacturing device 1 of a wiring substrate unit has a substrate adsorption surface 63 where a substrate abutment surface 64 for bringing a main surface 12 of one side of the flexible substrate into contact with, and a substrate abutment member 33 where an intake hole 34 opened to the substrate abutment surface 64 is formed, and is disposed in the intake hole 34 in such a state that the substrate adsorption surface 63 is projected from the opening end of the intake hole 34. The flexible hand is equipped with a substrate adsorption member 32 made of a contractible sponge rubber by an intake action and an intake mechanism 71 which performs air intake in the intake hole 34 so that the substrate adsorption surface 63 which sucks the substrate adsorption member 32 and absorbs a flexible substrate 27 is the same flat surface to the substrate abutment surface 64. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention includes a substrate suction holding device that holds a wiring board while holding it, and a wiring board unit manufacturing apparatus that includes the substrate suction holding device and manufactures a wiring board unit by unitizing a plurality of wiring boards. About.

  In the manufacturing process of electronic components that handle film-like flexible substrates and relatively thin rigid substrates, a substrate holding device is used to eliminate warpage that can occur in such substrates and to improve the positioning accuracy of the substrates. ing.

  As an example of such an apparatus, a warped substrate adsorbed by a plurality of suction cups urged by a coil spring is pressed and warped on a flat stage against the urging force of the coil spring by the driving force of the plunger. There is known a substrate holding device that can solve the problem (for example, see Patent Document 1).

On the other hand, in the plurality of vacuum suction holes perforated on the table on which the substrate is placed, a plurality of suction pads each having a vent hole extending in the end are embedded, and further, vacuum suction is performed. There has also been proposed a substrate holding device that can suck and hold a substrate on the table via a suction pad (for example, see Patent Document 2).
JP 2005-258152 A JP-A-10-520

  However, since the apparatus of Document 1 described above has a specification that the flatness of the substrate can be obtained only after the substrate sucked and held by each suction cup is pressed onto a flat stage, the sucked and held substrate is in space. It is difficult to ensure the planar accuracy between the suction cups (the planar accuracy of the substrates adsorbed to the individual suction cups). Therefore, the apparatus of this document 1 has a problem in the case where it is desired to ensure a certain level of planar accuracy for the substrate in the lifted state as described above. Further, in the apparatus of Document 2, a counterbore portion is secured in the opening of the vacuum suction hole as a deformable region of the suction pad whose tip is widened. This is a factor that can cause warping.

  Accordingly, the present invention has been made to solve such a problem, and a substrate suction holding device that can securely hold the wiring board in a state where the surface shape of the wiring board is flattened and a wiring having the same An object of the present invention is to provide a substrate unit manufacturing apparatus.

  In order to achieve the above object, a substrate suction holding apparatus according to the present invention includes a substrate contact member having a substrate contact surface that contacts the surface of the wiring board and an intake hole that opens to the substrate contact surface. And a substrate suction surface that opens an internal intake passage leading to the suction hole, is disposed in the suction hole with the substrate suction surface protruding from the opening end of the suction hole, and contracts by the suction action A substrate adsorbing member having a possible portion and an air intake in the air intake hole such that the substrate adsorbing surface that adsorbs the wiring substrate by sucking the substrate adsorbing member is flush with the substrate abutting surface. And an intake mechanism for performing the operation.

  That is, according to the present invention, the substrate suction member is contracted so that the substrate suction surface is flush with the substrate contact surface while suctioning the wiring board to the substrate suction surface through the substrate suction member by suction through the suction hole. Thus, the wiring board can be brought into contact with and adsorbed to the board contact surface as a whole. Thus, according to the present invention, the wiring board can be reliably sucked and held in a state where the surface shape of the wiring board is flattened along the board contact surface.

  The substrate adsorbing member is preferably a member having a porous structure and capable of being elastically deformed, and examples of the constituent material thereof include sponge rubber having a plurality of holes functioning as an internal air intake passage. . Further, this sponge rubber substrate adsorbing member has an elastic limit in a state where the protruding end as the substrate adsorbing surface is substantially flush with the substrate abutting surface when contraction occurs due to intake by the intake mechanism. It is preferable to be formed as described above.

  Further, the substrate suction member has a cylindrical member having the substrate suction surface on one end face disposed so as to be able to advance and retreat in the suction hole and having a through hole as an internal suction passage, and an opening of the suction hole. An elastically deformable urging member that urges the cylindrical member so that the substrate attracting surface protrudes from the end can also be configured as a unit component. In this case, at the position where the substrate suction surface is flush with the substrate contact surface of the substrate contact member, the cylindrical member is prevented from moving in a direction in which the cylindrical member is retracted by contacting the cylindrical member. It is desirable to provide a stopper portion.

  The substrate suction holding apparatus of the present invention is suitable for holding a flexible substrate or the like by suction. Furthermore, the substrate suction holding apparatus of the present invention includes a moving mechanism for moving the substrate contact member in a three-dimensional direction together with the substrate suction member disposed in the suction hole of the substrate contact member. Also good.

  Here, when such a substrate suction holding device is mounted on the wiring board unit manufacturing apparatus, the surface shape of the wiring board is made as flat as possible and the wiring board is securely held on the wiring board. Since, for example, the position detection of the projections for connecting the terminals can be appropriately performed, the wiring boards to be unitized can be positioned with high accuracy.

  As described above, according to the present invention, there is provided a substrate suction holding device capable of reliably suction-holding a wiring board in a state in which the surface shape of the wiring board is made as flat as possible, and a wiring board unit manufacturing apparatus provided with the same. Can be provided.

The best mode for carrying out the present invention will be described below with reference to the drawings.
[First Embodiment]
FIG. 1 is a diagram schematically showing a wiring board unit manufacturing apparatus according to a first embodiment of the present invention, and FIG. 2 is a block diagram functionally showing the configuration of the wiring board unit manufacturing apparatus.
As shown in FIG. 1, the wiring board unit manufacturing apparatus 1 includes a board assembly station 3 for assembling a rigid board 23 (rigid board assembly 25) and a flexible board 27 to each other, and a flexible board supplied to the board assembly station 3. 27 is provided with a flexible placement station 5 on which 27 is placed, and a rigid substrate supply station (not shown) on which a rigid substrate 23 supplied to the substrate assembling station 3 is placed.

  In addition, as shown in FIG. 2, the wiring board unit manufacturing apparatus 1 includes a rigid board handling apparatus (hereinafter referred to as “rigid hand”) 11 and a flexible board handling apparatus (hereinafter referred to as “flexible hand”) that functions as a board suction holding apparatus. 9), a CCD (Charge Coupled Device), etc., and a rigid position measuring camera 10, a flexible position measuring camera 17, and an image processing device 20 that function as terminal position detecting means, and a temporary function that functions as a fixing means. A stopping heating device 19 and a system controller 18 are provided. The image processing apparatus 20 performs image processing on the video captured by the rigid position measurement camera 10 and the flexible position measurement camera 17. Further, as a device used in a processing step (main fixing step) subsequent to the temporary fixing (temporary fixing) step performed using the temporary fixing heating device 19, a vacuum that functions as a fixing means together with the temporary fixing heating device 19. A multi-stage press (not shown) is provided.

  The flexible placement station 5 is an area for placing a flexible substrate (flexible printed wiring board) 27 supplied to the substrate assembly station 3 side. A flexible mounting table 15 is installed in the flexible mounting station 5, and a flexible mounting table on which a plurality of flexible boards (flexible printed wiring boards) 27 can be mounted on the flexible mounting table 15. A tray 77 is disposed. The substrate supply station is provided to supply a rigid substrate assembly 25 configured by joining one or more rigid substrates 23 to a substrate support frame (substrate support frame) 21 to the substrate assembly station 3 side. It has been.

  The system controller 18 is a control unit that performs overall device control of the wiring board unit manufacturing apparatus 1 and includes a CPU, a RAM, a ROM, and the like. The ROM stores parameters for various controls and calculations performed by the CPU, a board assembly program for assembling the rigid board assembly 25 and the flexible board 27, and the like. The CPU reads, for example, the board assembly program from the ROM, interprets the command statement, and executes the program using the memory space of the RAM. Instead of such a board assembly program (software), the overall operation control of the entire wiring board unit manufacturing apparatus may be configured by hardware that implements various electronic components.

  The system controller 18 performs arithmetic processing based on the images of the rigid board assembly 25 and the flexible board 27 captured by the rigid position measuring camera 10 and the flexible position measuring camera 17, for example, biaxial direction (X1-X2 direction). And XY coordinate position in the virtual space in (Y1-Y2 direction). In addition, the system controller 18 moves the rigid hand 11 and the flexible hand 9 that handle the rigid board assembly 25 and the flexible board 27, respectively, in three axis directions (X1-X2, Y1-Y2, and Z1-Z2 directions). Movement control (positioning control) in the rotational direction (θ1-θ2 direction) along the substrate surface (with the horizontal plane as a reference plane) is performed. Further, the system controller 18 controls the movement of the temporary fixing heating device 19 in the triaxial direction and the heating temperature. Further, the vacuum multistage press functioning as the fixing means is controlled by a control unit (not shown) in the pressing pressure and the heating temperature.

  The board assembling station 3 includes an assembling table 14, and a rigid board 23 (rigid board assembly 25) and a flexible board 27 are fixed to each other on the assembling table 14 to form a wiring board unit (wiring board unit). This is a region for producing a flexible / rigid wiring board 31. The rigid substrate assembly 25 is transported from the substrate supply station to the substrate assembly station 3 side by the rigid hand 11, the transport position is detected by the rigid position measurement camera 10, and the rigid substrate assembly 25 is placed (positioned) at a predetermined position on the assembly base 14. The

  On the other hand, the flexible substrate 27 is detected by the flexible position measuring camera 17 while being conveyed by the flexible hand 9 from the flexible placement station 5 side to the substrate assembly station 3 side, and the rigid substrate assembly 25 on the assembly table 14 is detected. Is positioned with respect to. The rigid substrate assembly 25 and the flexible substrate 27 that are positioned on the assembly base 14 are first temporarily fixed by the temporary fixing heating device 19 (resin portion mainly of the edge of the flexible substrate 27 is rigid substrate assembly 25). Spot welded to each other), and further heat-welded with each other by a vacuum multi-stage press.

  Here, the structure of the wiring board unit manufactured by the wiring board unit manufacturing apparatus 1 of this embodiment is illustrated in FIGS. 3a to 3c and FIG. Here, FIGS. 3 a to 3 c are cross-sectional views showing an example of the manufacturing process of the wiring board unit, and FIG. 4 is a plan view showing an example of the wiring board unit that can be manufactured by the wiring board unit manufacturing apparatus 1.

  As shown in FIG. 3 a, the rigid substrate 23 is formed by using a plurality of insulating layers 57 made of glass-epoxy prepreg and the like using an interlayer connection method such as B Squareit [B2it] (registered trademark). For example, it is an eight-layer printed wiring board configured by connecting conductor patterns (including land portions 53 and 56) at positions sandwiching them between layers by a vertical wiring portion 55. In addition, each rigid substrate 23 is subjected to countersink processing on the edge of the side of the substrate main body, which is a connection portion with the flexible substrate 27 (the conductor bump 51), or is equal to the thickness of the flexible substrate 27 to be connected or It has a stepped portion 47 in which the land portion (connection pad portion) 53 that becomes a connection terminal is formed deeply than that.

  On the other hand, as shown in FIG. 3 b, the flexible substrate 27 is configured by connecting the conductive patterns (including the connection terminal portions 27 b) formed on each surface of the base film 58 made of polyimide, for example, with interlayer connection at the vertical wiring portion. For example, a two-layer flexible printed wiring board. Further, on the flexible substrate 27, conductor bumps 51 are formed on the connection terminal portions 27b as projections for connection between terminals with a conductive material such as silver paste. In the flexible substrate 27, a glass-epoxy prepreg 54 is laminated on the formation surface side (the lower side in FIG. 3 c) of the conductor bump 51 so that the tip of the conductor bump 51 protrudes (exposes) to the outside. ing.

  Further, as shown in FIG. 3 c, the (two) rigid substrate 23 and the flexible substrate 27 are fixed to each other by a vacuum multistage press machine after being temporarily fixed by the temporary fixing heating device 19. Here, the conductor bumps 51 of the flexible substrate 27 are plastically deformed to be electrically and mechanically connected to the land portion 53 on the rigid substrate 23 side, and the prepreg 54 on the flexible substrate 27 side is connected to the insulating layer of the rigid substrate 23. Heat fusion. Here, the stepped portion 47 described above is formed by arranging the main surface of the flexible substrate 27 (upper surface in FIG. 3c) and the main surface of the rigid substrate 23 at substantially the same height or lower than this. Thus, it is possible to prevent the main surface of the flexible substrate 27 from becoming an obstacle during component mounting or screen printing that can be performed in a later process.

  Next, the wiring board unit illustrated in FIG. 4 will be described. In the wiring board unit (flexible / rigid wiring board) 31 shown in FIG. 4, the rigid board 23 is arranged on the board support frame 21 so that the stepped parts 47 face each other, and the stepped parts 47 facing each rigid board 23. A flexible substrate 27 is attached across the board.

  Further, as shown in FIG. 4, the substrate support frame 21 includes reference marks 41, 42, 43, 44, which can be used for position measurement of the rigid substrate 23 by the rigid position measurement camera 10 and the flexible position measurement camera 17. 45 and 46 are patterned. The reference marks 41 and 42 are used as a positioning reference for the substrate support frame 21 main body (or assembly product). Further, the reference marks 43, 44, 45, 46 can be applied as positioning references for the mounting positions of the individual rigid substrates 23 attached to the substrate support frame 21.

  Next, the structure of the flexible mounting tray 77 for suitably mounting the flexible substrate 27 will be described with reference to FIG. Here, FIG. 5 is a cross-sectional view showing the flexible placement tray 77 in a state where the flexible substrate 27 is placed. As shown in the figure, the flexible mounting tray 77 is provided with a flexible support member 78 having a concave portion 79 that is recessed so as to avoid the outer shape portion of the conductor bump 51 in the mounting portion of the flexible substrate 27. . In this flexible mounting tray 77, physical interference (contact) with the conductor bump 51 is avoided by the recess 79, so that the conductor bump 51 is prevented from being damaged and the conductor bump 51 is joined. The connection reliability of the conductive part can be improved.

  Further, the configurations of the flexible hand 9, the temporary fixing heating device 19, the rigid position measuring camera 10, and the flexible position measuring camera 17 will be briefly described with reference to FIGS. 6a to 6d, 7, 8, and 9. FIG. Here, FIGS. 6 a to 6 d are perspective views showing a process of temporarily fixing (temporarily fixing) the rigid substrate 23 and the flexible substrate 27, and FIG. 7 shows the relationship between the flexible hand 9 and the temporary fixing heating device 19. It is a figure for demonstrating a structure and a function simply. FIG. 8 is a diagram for explaining the position detection of the land portion of the rigid board and the conductor bump of the flexible board by the wiring board unit manufacturing apparatus 1, and FIG. 9 is a diagram showing the flexible board and the flexible board of FIG. It is a figure for demonstrating positioning with a board | substrate and temporary fixing of these board | substrates.

  As shown in FIGS. 6 a to 6 d, the temporary fixing between the rigid substrate 23 and the flexible substrate 27 is performed by aligning the land portion 53 provided in the stepped portion 47 of the rigid substrate 23 and the conductor bump 51 of the flexible substrate 27. After that, the edge 27a of the corner portion of the flexible substrate 27 is spot-welded to the stepped portion 47 on the rigid substrate 23 side by the tip 19a of the temporary fixing heating device 19 functioning as a temporary fixing means. More specifically, the heat-sealed portion 27c shown in FIG. 6d is a portion where the prepreg 54 through which the conductor bumps 51 of the flexible substrate 27 penetrate is heat-sealed with the stepped portion 47 on the rigid substrate 23 side (FIG. 3c). FIG. 9).

  In FIG. 7, in order to perform spot heat fusion of the edge 27a of the corner portion of the handled flexible substrate 27, the temporary fixing heating devices 19 are arranged at the four corners of the flexible hand 9 formed in a rectangular shape. Alternatively, one temporary fixing heating device 19 may be sequentially moved to the four corners, or a heating device may be provided inside the flexible hand 9, for example. Examples of the heating device include constant heat using a heating wire, a ceramic heater, and a pulse heater. Examples of the heating device include a structure incorporated through a spring or the like. In FIG. 7, when the pulse heater is applied to the four corners of the flexible hand 9, it is desirable to connect the wirings of the individual heaters in series. Thereby, when metal materials, such as tungsten and titanium, are used for the heating device, it is possible to simplify the wiring of the pulse heater that requires a relatively thick conductive line.

  Further, here, when the rigid substrate 23 and the flexible substrate 27 are fixed, the terminal portions of the wiring substrates to be fixed to each other (that is, the land portion 53 of the rigid substrate 23 and the conductor bump of the flexible substrate 27). The ultrasonic vibration by an ultrasonic welder or the like or a high frequency vibration having a higher frequency than the ultrasonic vibration is applied to at least one of the peripheral portion (between the terminal portion 51) and the peripheral portion (the edge 27a of the corner portion). Thus, these wiring boards may be fixed to each other. Alternatively, electromagnetic induction heating is applied to at least one of the conductor bumps 51 located between the terminal portions of the wiring boards to be fixed to each other or the peripheral portion (the edge 27a of the corner portion), or These wiring boards may be fixed to each other by supplying electromagnetic waves including microwaves or lasers, or electromagnetic waves including radio waves, infrared rays, visible rays, ultraviolet rays, X-rays, or γ rays.

  Further, as shown in FIGS. 7 to 9, the flexible hand 9 has one of the first and second main surfaces of the flexible substrate 27 (in this embodiment, the upper surface in FIG. 8). ) Transporting the wiring board in a three-dimensional direction while adsorbing at least its central portion (in this embodiment, adsorbing almost the entire surface excluding the four corners as shown in FIG. 7), for example, arranged vertically and horizontally. Further, it is a surface adsorption type handling device provided with a moving (conveying) mechanism such as a plurality of linear guides and linear motors. The flexible hand 9 includes a substrate contact member 33, which will be described in detail later, and a suspending portion 36 that suspends the substrate contact member 33 from above.

  Further, the substrate abutting member 33 is formed in a substantially rectangular shape, and a chamfered portion 9d in which the four corners are chamfered so that the edge 27a of the corner portion of the handled flexible substrate 27 is easily spot heat-sealed. Is provided. Since this flexible hand 9 is a surface-adsorption type device, even if it is a flexible substrate with low rigidity, the transport posture is inclined when transported in the triaxial direction and the θ1-θ2 direction. As a result, the positioning accuracy of the conductor bump portion of the flexible substrate can be improved. Here, the flexible hand 9 and the temporary fixing heating device 19 shown in FIG. 7 are configured as a single unit device. On the other hand, each of the flexible hand 9 and the temporary fixing heating device 19 includes It is possible to operate independently.

Further, the explanation of the rigid hand 11 will be described with reference to FIG.
As shown in FIG. 1, the rigid hand 11 reciprocates between the rigid substrate supply station and the substrate assembly station 3 while holding the rigid substrate assembly 25 and the wiring substrate unit 31, for example, as described above. Mainly works. Examples of the holding mechanism for the rigid board assembly 25 and the wiring board unit 31 include a suction mechanism and a clamp mechanism as in the case of a flexible hand. Also in the rigid hand 11, the rigid substrate assembly 25 needs to be positioned and placed with high accuracy at a predetermined position on the assembly table 14 of the substrate assembly station 3. Therefore, the three-axis direction (X1-X2 direction) , Y1-Y2 direction, Z1-Z2 direction) and along the substrate surface (with the horizontal plane as a reference plane), it is configured to be rotatable in the θ1-θ2 direction. Further, a mechanism that allows the rigid hand 11 to rotate in the tilt direction may be provided so that the tilt in the tilt direction of the wiring board held by the rigid hand 11 can be corrected.

Next, detailed configurations of the rigid position measurement camera 10 and the flexible position measurement camera 17 and movement control of the flexible hand 9 and the rigid hand 11 by these measurement cameras will be described.
That is, as shown in FIGS. 1 and 8, the flexible position measuring camera 17 is provided between or inside the flexible placement station 5 and the substrate assembly station 3, and is a conductor bump as a protrusion. It is possible to directly detect the position of the tip of the conductor bump of the flexible substrate 27 conveyed from the flexible placement station 5 side to the substrate assembly station 3 side by the flexible hand 9 with 51 facing downward. Yes.

  That is, the flexible position measurement camera 17 can capture an image of an area in the upward direction (Z1 direction) from the lower side of the wiring board unit manufacturing apparatus main body between the flexible placement station 5 and the substrate assembly station 3. It is possible. Further, the flexible position measurement camera 17 is installed on the upper side of the main body of the wiring board unit manufacturing apparatus, and is moved with the conductor bumps 51 of the flexible board 27 facing upward. The substrate may be assembled at the substrate assembly station 3 by reversing the front and back.

  On the other hand, as shown in FIGS. 1 and 8, the rigid position measurement camera 10 is disposed at a position facing the upper surface of the assembly table 14 of the substrate assembly station 3, that is, above the assembly table 14. Therefore, the rigid position measurement camera 10 can capture an image of the area from the upper side to the lower side of the assembly base 14. Accordingly, it is possible to directly detect the position of the land portion 53 formed on the stepped portion 47 of the rigid substrate 23 placed on the substrate assembly station 3 from the rigid substrate supply station side through the rigid hand 11. ing.

  Specifically, the positional information of the tip of the conductor bump 51 on the flexible substrate 27 detected by the rigid position measuring camera 10 and the flexible position measuring camera 17 and the land portion on the rigid substrate 23 (rigid substrate assembly 25). The position information 53 is input to the system controller 18. Based on the position information, the system controller 18 calculates the XY coordinate position in, for example, two axis directions (X1-X2 direction and Y1-Y2 direction) that can be grasped by the controller, and recognizes this position. Here, the flexible hand 9, the rigid hand 11, and the camera moving mechanism described above detect a position detection scale configured by combining a large number of uniaxial optical or magnetic linear scales, interference fringes, and the like. For example, under the control of the system controller 18, high-accuracy positioning, for example, on the order of μm or less with respect to the rigid board 23 (rigid board assembly 25) and the flexible board 27 being handled is realized.

  Further, in place of the above configuration, a position detecting means in which an optical or magnetic rotary encoder is attached to a ball screw, a laser interferometer, or the like may be used. Further, when positioning the substrates, the rigid substrate 23 (rigid substrate assembly 25) side may be moved. Alternatively, the flexible substrate 27 side may be moved. Furthermore, both the rigid substrate 23 and the flexible substrate 27 may be moved to perform mutual positioning.

  Furthermore, the layout shown in FIG. 8 to which the rigid position measuring camera 10 and the flexible position measuring camera 17 are applied is the position of the conductor bump 51 on the connection terminal portion 27b provided on the flexible substrate 27 to be actually connected (FIG. 3b). And the position of the land portion 53 on the rigid substrate 23 (rigid substrate assembly 25) are directly detected, so that the alignment between the flexible substrate 27 and the rigid substrate 23 can be performed with high accuracy. .

  That is, the flexible hand 9 and the rigid hand 11 configured as described above are rigidly moved on the assembly table 14 as shown in FIG. 9 under the control of the system controller 18 in which the board assembly program is executed. The pair of rigid board 23 and flexible board 27 are positioned at a position where the conductor bump 51 and the land 53 detected by the position measurement camera 10 and the flexible position measurement camera 17 are opposed to each other. Further, as shown in FIGS. 6c, 6d, and 9, the temporary fixing heating device 19 temporarily fixes the flexible substrate 27 and the rigid substrate 23 (rigid substrate assembly 25) that are positioned as described above. Temporarily fix through 19.

  Next, a characteristic configuration of the flexible hand 9 provided in the wiring board unit manufacturing apparatus 1 of the present embodiment will be described with reference to FIGS. 10 and 11a to 11c. Here, FIG. 10 is a cross-sectional view showing the internal structure of the flexible hand 9. FIG. 11 a is a cross-sectional view for explaining the operation immediately before the flexible hand 9 sucks the flexible substrate 27 placed on the flexible placement tray 77, and FIG. 11 b shows the flexible placement tray 77. 6 is a cross-sectional view showing a state at the moment when the flexible substrate 27 placed on the substrate is adsorbed by the substrate adsorbing member 32 of the flexible hand 9. FIG. Further, FIG. 11 c is a cross-sectional view showing a state in which one main surface 12 of the flexible substrate 27 adsorbed to the substrate adsorbing member 32 of the flexible hand 9 is adsorbed to the substrate abutting member 33 as a whole.

  That is, as shown in FIGS. 10 and 11 a to 11 c, the flexible hand 9 is mainly composed of the substrate contact member 33, the substrate suction member 32, and the intake mechanism 71 described above. The substrate contact member 33 has a substrate contact surface 64 that contacts one main surface 12 (the main surface on which the conductor bumps 51 are not formed) of the flexible substrate 27, and an opening in the substrate contact surface 64. A stepped intake hole 34 is formed. The stepped intake hole 34 has, for example, large and small diameter holes formed in a cylindrical shape, and the large diameter hole 35 has one end opened to the substrate contact surface 64 side and the other end. The portion is connected to one end of the small-diameter hole 72.

  The other end portion of the small-diameter hole portion 72 is connected to the intake mechanism 71 through a hole portion drilled in the suspension portion 36. Moreover, the board | substrate contact surface 64 is provided in the bottom face side of the whole flexible hand 9, and the whole surface is formed flat. Thereby, the surface shape of the flexible substrate 27 that abuts the one main surface 12 side is flattened following the flat substrate abutment surface 64.

  On the other hand, the substrate adsorbing member 32 is formed of sponge rubber made of natural rubber, chloroprene rubber, ethylene propylene rubber, nitrile rubber, silicon rubber or the like. Further, the substrate suction member 32 is formed, for example, in a cylindrical shape, and the substrate suction surface 63 protrudes from the opening end of the large-diameter hole portion 35 of the suction hole 34 (when no load is applied to itself). In the state, it is disposed in the hole portion 35 of the intake hole 34. The substrate adsorbing member 32 made of sponge rubber substantially functions as an internal intake passage in which a plurality of internal holes are connected to the inside of the intake holes 34 and open to the substrate adsorbing surface 63. The one main surface 12 side of the flexible substrate 27 is adsorbed. Further, the end surface of the substrate adsorbing member 32 that is different from the substrate adsorbing surface 63 is joined to the step surface (seat surface) 95 of the intake hole 34 via an adhesive or the like.

  Further, the peripheral surface (side surface) of the substrate suction member 32 and the inner wall surface of the hole portion 35 of the suction hole 34 so that the substrate suction member 32 can be easily elastically deformed and contracted in the direction of the arrow Z1 by the suction action of the suction mechanism 71. A predetermined clearance 38 is formed between the two. Further, the air suction mechanism 71 sucks the substrate suction member 32 and sucks a part of one main surface 12 of the flexible substrate 27 so that the substrate suction surface 63 is flush with the substrate contact surface 64. A compressor that sucks air in the intake hole 34 in the direction of the arrow Z1. Here, the sponge rubber substrate adsorbing member 32 is elastic in a state in which the substrate adsorbing surface 63 is substantially flush with the substrate abutting surface 64 when contraction occurs due to intake by the intake mechanism 71. It is formed to be the limit. Thereby, the flexible substrate 27 can be sucked and held in a more flat state.

  That is, in the flexible hand 9 configured as described above, the substrate suction surface 63 of the substrate suction member 32 is first placed on the flexible placement tray 77 as shown in FIG. When the flexible substrate 27 is brought close to one main surface 12, negative pressure is generated in a region 39 between the substrate suction surface 63 and the flexible substrate 27, and the flexible substrate 27 is placed on the substrate suction surface 63 as shown in FIG. Is adsorbed. In the state shown in FIG. 11 b, negative pressure is applied to the regions 61 and 62 between the substrate contact surface 64 of the substrate contact member 33 and the flexible substrate 27 due to the intake action from the peripheral surface (side surface) of the substrate adsorption member 32. In addition, since the substrate adsorbing member 32 itself is sucked and elastically deforms and contracts, one main surface 12 of the flexible substrate 27 is attached to the substrate abutting surface 64 of the substrate abutting member 33 as shown in FIG. It will be adsorbed and held on top.

  As described above, in the flexible hand 9 of the present embodiment, the substrate suction surface 63 is brought into contact with the substrate contact surface while the flexible substrate 27 is attracted to the substrate suction surface 63 through the substrate suction member 32 by suction through the suction hole 34. The main body 12 of the flexible substrate 27 can be brought into contact with and adsorbed to the entire substrate abutting surface 64 by contracting the substrate adsorbing member 32 so as to be flush with the substrate 64. Thereby, according to the flexible hand 9, the flexible substrate 27 can be reliably sucked and held in a state where the surface shape of the flexible substrate 27 is flattened along the substrate contact surface 64.

  Therefore, according to the wiring board unit manufacturing apparatus 1 including such a flexible hand 9, the conductor bump 51 is formed by the flexible position measuring camera 17 in a state in which the flexible substrate 27 is flattened as much as possible and the flexible substrate 27 is securely held. Therefore, the positioning with respect to the rigid board 23 can be performed with high accuracy.

  Further, instead of such a flexible hand 9, a flexible hand 65 shown in FIG. 12 may be configured. The flexible hand 65 includes a cylindrical substrate suction member 73 having a through hole 67 formed in the central portion of the substrate suction member 32 in place of the substrate suction member 32 of the flexible hand 9. According to such a flexible hand 65, the suction force to the substrate suction surface 63 can be improved through the opening end 68 of the through hole 67, and thereby the flexible substrate 27 can be suctioned and held more reliably. It becomes.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS. 13 and 14a to 14c.
Here, FIG. 13 is a cross-sectional view showing the internal structure of the flexible hand 81. FIG. 14 a is a cross-sectional view for explaining the operation immediately before the flexible hand 81 sucks the flexible substrate 27 placed on the flexible placement tray 77, and FIG. 14 b shows the flexible placement tray 77. 6 is a cross-sectional view showing a state at the moment when the flexible substrate 27 placed on the substrate is adsorbed by the substrate adsorbing member 90 of the flexible hand 81. FIG. 14C is a cross-sectional view showing a state in which one main surface 12 of the flexible substrate 27 adsorbed to the substrate adsorbing member 90 of the flexible hand 81 is adsorbed to the substrate abutting member 33 as a whole. In FIG. 13 and FIGS. 14a to 14c, the same components as those provided in the flexible hand 9 of the first embodiment are given the same reference numerals and the description thereof is omitted.

  That is, as shown in FIGS. 13 and 14a to 14c, the flexible hand 81 according to this embodiment replaces the substrate adsorbing member 32 of the flexible hand 9 according to the first embodiment and urges the cylindrical member 82. A substrate adsorbing member 90 composed of unit parts with a coil spring 85 as a member is provided. The base end portion of the coil spring 85 is fixed to a spring locking portion 36 a provided on the inner wall of the hole portion of the suspension portion 36. The tip of the coil spring 85 is fixed to a spring locking portion 82 a provided at the base of the cylindrical member 82.

  On the other hand, the cylindrical member 82 is disposed in the intake hole 34 so as to be able to advance and retract, and has a substrate suction surface 86 on one end surface (tip surface) different from the spring locking portion 82a. Further, the cylindrical member 82 includes an internal intake passage 83 that is connected to the intake hole 34 and opens through an open end 84 on the substrate suction surface 86. Further, in order to allow the cylindrical member 82 to easily retract in the direction of the arrow Z1 while contracting the coil spring 85 by the intake air by the intake mechanism 71, the peripheral surface (side surface) of the cylindrical member 82 and the hole of the intake hole 34 are provided. A predetermined clearance 38 is formed between the inner wall surface of the portion 35. Here, the clearance 38 applies a negative pressure around the substrate contact surface 64 of the substrate contact member 33 when the flexible substrate 27 is attracted to the substrate suction surface 86 and the opening end 84 of the intake hole 34 is closed. It functions as an intake passage for generating.

  The coil spring 85 described above urges the cylindrical member 82 in the direction of the arrow Z2 so that the substrate suction surface 86 protrudes from the opening end of the intake hole 34. Here, the step surface (seat surface) 95 inside the substrate contact member 33 is a position where the substrate suction surface 86 is flush with the substrate contact surface 64 of the substrate contact member 33. It functions as a stopper portion that prevents movement in a direction in which the cylindrical member 82 moves backward in contact with the base portion.

  That is, in the flexible hand 81 configured as described above, the substrate suction surface 86 of the substrate suction member 90 is placed on the flexible placement tray 77 as shown in FIG. When approaching one main surface 12 of the placed flexible substrate 27, a negative pressure is applied to the region 39 between the substrate suction surface 86 and the flexible substrate 27 due to the intake action from the opening end 84 toward the internal intake passage 83. As a result, as shown in FIG. 14 b, the flexible substrate 27 is adsorbed to the substrate adsorption surface 86. In the state shown in FIG. 14 b, the cylindrical member 82 itself is sucked and retracted against the urging force of the coil spring 85, and the circumferential surface of the cylindrical member 82 and the hole portion 35 of the intake hole 34. Due to the intake action through the clearance between them, negative pressure is generated in the regions 61 and 62 between the substrate contact surface 64 of the substrate contact member 33 and the flexible substrate 27. Therefore, as shown in FIG. One main surface 12 of the substrate is attracted and held on the substrate contact surface 64 of the substrate contact member 33.

  Therefore, in the flexible hand 81 of the present embodiment, the substrate suction surface 86 is the same as the substrate contact surface 64 while the flexible substrate 27 is attracted to the substrate suction surface 86 of the cylindrical member 82 by suction through the suction hole 34. The coil spring 85 of the substrate adsorbing member 90 is contracted so as to be flat (same surface), so that one main surface 12 of the flexible substrate 27 can be brought into contact with and adsorbed to the substrate contact surface 64 as a whole. Here, the flexible hand 81 is provided with a stopper (step surface 95) in a direction in which the cylindrical member 82 moves backward, so that the flexible substrate 27 to be held can be sucked and held in a flatter state. Thereby, also in the flexible hand 81 of this embodiment, this can be reliably adsorbed and held in a state where the surface shape of the flexible substrate 27 is made flat following the substrate contact surface 64.

  Although the present invention has been specifically described above with reference to the first and second embodiments, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the present invention. is there. That is, in the above-described embodiment, an example in which the substrate suction holding device of the present invention is applied to a flexible hand has been described, but instead, this may be applied to a rigid hand that sucks and holds a rigid substrate. In the above-described embodiment, the conductor bump is formed on the flexible substrate side. Instead, the conductor bump is formed on the rigid substrate side, and the terminal portion on the flexible substrate side is configured with a flat land portion. However, they may be joined together.

  Further, in the above embodiment, the configuration of the vacuum multi-stage press machine is not particularly described. However, by operating the vacuum multi-stage press machine under the control of the system controller 18 or the like, for example, this vacuum multi-stage press machine is used. The above-described wiring board unit manufacturing apparatus 1 (wiring board unit manufacturing system) may be configured so as to include a pressing machine as one component device, and the vacuum multistage pressing machine is independent of the wiring board unit manufacturing apparatus 1. It may be a separate device that operates in the same manner.

The figure which shows schematically the wiring board unit manufacturing apparatus which concerns on the 1st Embodiment of this invention. The block diagram which shows the structure of the wiring board unit manufacturing apparatus of FIG. 1 functionally. Sectional drawing which shows the structure of the rigid board | substrate assembled | attached to a flexible substrate later by the wiring board unit manufacturing apparatus of FIG. Sectional drawing which shows the state just before the rigid board | substrate of FIG. 3a is assembled | attached to a flexible substrate. FIG. 3B is a cross-sectional view illustrating a state where the flexible substrate and the rigid substrate of FIG. 3B are assembled. The top view which shows the wiring board unit manufactured by the wiring board unit manufacturing apparatus of FIG. Sectional drawing which shows the structure of the tray for flexible mounting with which the wiring board unit manufacturing apparatus of FIG. 1 is provided. The perspective view which shows the state which has positioned the rigid board | substrate and flexible substrate which are the components of the wiring board unit shown in FIG. The perspective view which shows the state just before a flexible substrate is temporarily fixed to the rigid board | substrate of FIG. 6a. FIG. 6B is a perspective view showing a state in which the flexible substrate is temporarily fixed to the rigid substrate of FIG. 6B. The perspective view which shows the state by which the flexible substrate was temporarily fixed to the rigid board | substrate of FIG. 6c. The figure for demonstrating simply the structure of the flexible hand with which the wiring board unit manufacturing apparatus of FIG. 1 is equipped, and the heating apparatus for temporary fixing. The figure for demonstrating the position detection of the land part of a rigid board | substrate by the wiring board unit manufacturing apparatus of FIG. 1, and the conductor bump of a flexible substrate. The figure for demonstrating positioning and temporary fixing of the rigid board | substrate and flexible substrate of FIG. 8 (by the wiring board unit manufacturing apparatus of FIG. 1). Sectional drawing which shows the structure of the flexible hand of 1st Embodiment with which the manufacturing apparatus of the wiring board unit of FIG. 1 is provided in detail. Sectional drawing for demonstrating an effect | action immediately before the flexible hand of FIG. 10 adsorb | sucks a flexible substrate. FIG. 11 is a cross-sectional view showing a state at the moment when the substrate adsorbing member of the flexible hand of FIG. 10 adsorbs the flexible substrate. FIG. 11 is a cross-sectional view showing a state in which one main surface of the flexible substrate adsorbed to the substrate adsorbing member of the flexible hand of FIG. 10 is adsorbed to the substrate abutting member as a whole. Sectional drawing which shows the structure of the other flexible hand of 1st Embodiment from which the flexible hand of FIG. 10 differs in structure. Sectional drawing which shows the structure of the flexible hand which concerns on the 2nd Embodiment of this invention. Sectional drawing for demonstrating an effect | action immediately before the flexible hand of FIG. 13 adsorb | sucks a flexible substrate. FIG. 14 is a cross-sectional view showing a state at the moment when the substrate adsorbing member of the flexible hand of FIG. 13 adsorbs the flexible substrate. FIG. 14 is a cross-sectional view showing a state in which one main surface of the flexible substrate adsorbed to the substrate adsorbing member of the flexible hand of FIG. 13 is adsorbed to the substrate abutting member as a whole.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board unit manufacturing apparatus, 9, 65, 81 ... Flexible board handling apparatus (flexible hand), 10 ... Rigid position measuring camera, 11 ... Rigid board handling apparatus (rigid hand), 14 ... Assembly stand, 17 ... Flexible Position measuring camera, 18 ... System controller, 19 ... Temporary fixing heating device, 23 ... Rigid board, 25 ... Rigid board assembly, 27 ... Flexible printed wiring board (flexible board), 31 ... Wiring board unit, 32, 73, 90 DESCRIPTION OF SYMBOLS ... Substrate adsorption member, 33 ... Substrate contact member, 34 ... Intake hole, 38 ... Clearance, 51 ... Conductor bump, 53 ... Land part, 63, 86 ... Substrate adsorption surface, 64 ... Substrate contact surface, 71 ... Intake mechanism , 82 ... cylindrical member, 83 ... internal intake passage, 85 ... coil spring, 95 ... step surface.

Claims (10)

A board abutting member in which a board abutting surface for abutting the surface of the wiring board and an intake hole opening in the board abutting surface are formed;
It has a substrate suction surface that opens an internal intake passage leading to the intake hole, is disposed in the intake hole with the substrate suction surface protruding from the opening end of the intake hole, and can be contracted by an intake action A substrate adsorbing member comprising a site;
An air intake mechanism that sucks in the air intake hole so that the substrate adsorbing surface that sucks the substrate adsorbing member and adsorbs the wiring board is flush with the substrate abutting surface;
A substrate suction holding device comprising:   The substrate suction holding apparatus according to claim 1, wherein the suction mechanism sucks the surface of the wiring board on the side sucked through the substrate suction surface to the substrate contact surface.   3. The substrate suction holding apparatus according to claim 1, wherein the substrate suction member is made of sponge rubber.   When the sponge rubber elastically deforms and contracts due to suction by the suction mechanism, the sponge rubber reaches an elastic limit in a state where the protruding end as the substrate suction surface is substantially flush with the substrate contact surface. 4. The substrate suction holding apparatus according to claim 3, wherein the substrate suction holding apparatus is formed as described above.   The substrate adsorbing member includes a cylindrical member having the substrate adsorbing surface on one end surface disposed so as to freely advance and retreat in the intake hole, and the cylindrical shape so that the substrate adsorbing surface protrudes from an opening end of the intake hole. 3. The substrate suction holding apparatus according to claim 1, wherein the substrate suction holding apparatus is a unit component including an elastically deformable biasing member that biases the member.   A stopper portion that contacts the cylindrical member at a position where the substrate suction surface is flush with the substrate abutting surface of the substrate abutting member and prevents movement in a direction in which the cylindrical member retracts; The substrate suction holding apparatus according to claim 5.   The substrate suction holding apparatus according to claim 1, wherein the wiring substrate is a flexible substrate.   8. The apparatus according to claim 1, further comprising a moving mechanism that moves the substrate contact member in a three-dimensional direction together with the substrate suction member disposed in the intake hole of the substrate contact member. A substrate suction holding apparatus according to claim 1. A substrate suction holding device according to any one of claims 1 to 8,
Terminal position detecting means for detecting the positions of the respective terminal portions of the first wiring board sucked and held by the board suction holding device and the second wiring board different from the first wiring board;
Fixing means for fixing the wiring boards to each other at a position where the terminal portions of the first and second wiring boards detected by the terminal position detection means face each other; and
An apparatus for manufacturing a wiring board unit, comprising:   10. The apparatus for manufacturing a wiring board unit according to claim 9, wherein a projection for connecting between terminals is formed on one terminal part of the first and second wiring boards.

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