JP2013235699A - Joint method of high temperature superconducting thin film wire and high temperature superconducting thin film wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide long high temperature superconducting thin film wire in which such problems that the critical current value Ic is instable due to heating, the application range is limited because a permanent current mode cannot be used, etc., are eliminated by suppressing generation of a junction resistance on the joint surface.SOLUTION: In a joint method of high temperature superconducting thin film wire for forming a superconducting junction 5 by joining superconducting thin films 2a, 2b of a plurality of strands of high temperature superconducting thin film wire 1a, 1b, a film of a solution containing a metal composing a superconducting thin film is formed at a junction of the superconducting thin film, and a superconducting joint is formed at a junction by heat treating the film of a solution thus formed. Long high temperature superconducting thin film wire is produced by joining the superconducting thin films of a plurality of strands of high temperature superconducting thin film wire. A superconducting junction is formed at each junction by a superconducting layer containing a metal composing a superconducting thin film.

Description

  The present invention relates to a bonding method of a high-temperature superconducting thin film wire that can sufficiently suppress the bonding resistance at the bonding surface during bonding, and a long high-temperature superconducting thin film wire bonded using the bonding method of the high-temperature superconducting thin film wire. .

  Since the discovery of high-temperature superconductors that have superconductivity at the temperature of liquid nitrogen, high-temperature superconducting thin-film wires have been actively developed for application to power devices such as cables, current limiters, and magnets.

  When producing a superconducting cable or a superconducting coil for superconducting equipment using such a high-temperature superconducting thin film wire, since a long high-temperature superconducting thin-film wire is required, a plurality of high-temperature superconducting thin-film wires are sequentially connected. Accordingly, the length is increased (for example, Patent Documents 1 and 2).

  However, high-temperature superconducting materials, which are oxide ceramics, have a characteristic that they have a stable phase up to the vicinity of the melting point, but are easily decomposed when the melting point is exceeded. For this reason, even if it is going to join a some high temperature superconducting thin film wire between superconducting thin films, the method like a heat diffusion joining common with a metal cannot be applied.

  In addition, since the high-temperature superconducting material is a polyatomic molecule, it is difficult to join in a state where crystallinity is maintained. If the crystallinity cannot be maintained, the superconducting characteristics may be deteriorated.

  Thus, conventionally, since it was difficult to directly join the superconducting thin films of the high-temperature superconducting thin film wire, a method of joining the protective layer and the stabilization layer formed on the superconducting thin film is generally used. It was used.

Japanese Patent No. 4810268 JP 2011-228065 A

  However, when the protective layer and the stabilization layer are bonded to each other as described above, a bonding resistance is generated on the bonding surface, so that the instability of the critical current value Ic due to heat generation and the permanent current mode cannot be used. There were problems such as restrictions on application range.

  Therefore, in view of the above problems, the present invention sufficiently suppresses the occurrence of junction resistance at the joint surface, limits the application range due to the occurrence of instability of the critical current value Ic due to heat generation and the inability to use the permanent current mode. It is an object of the present invention to provide a long high-temperature superconducting thin film wire that does not have such problems and a bonding method thereof.

  In examining the solution of the above problems, the present inventor can join superconducting thin films directly if a high-temperature superconducting material can be used as a joining material when joining a plurality of high-temperature superconducting thin film wires. It was considered that the generation of resistance could be sufficiently suppressed.

  As a joining method using such a high-temperature superconducting material as a joining material, a coating pyrolysis method (MOD method) is applied, and a solution containing the metal constituting the superconducting thin film of the high-temperature superconducting thin film wire to be joined is applied to the joining surface. When applied and heated and fired, the superconducting thin film formed from this solution is considered to enable direct bonding between the superconducting thin film surfaces, which was difficult with the conventional method. The present invention has been completed.

  That is, by applying the above bonding method, direct bonding between the superconducting thin film surfaces, which was difficult with the conventional method, can be performed. Therefore, generation of bonding resistance is sufficiently suppressed, and the critical current value Ic due to heat generation is reduced. Problems such as the development of instability and the limitation of the application range due to the inability to use the permanent current mode can be solved.

The present invention is based on the above knowledge, and the invention according to claim 1
A method of joining high-temperature superconducting thin film wires in which a superconducting thin film wire is joined to form a superconducting joint.
Forming a film of a solution containing the metal constituting the superconducting thin film at the junction of the superconducting thin film,
A method for joining high-temperature superconducting thin film wires, wherein a superconducting joint is formed at the joint by heat-treating the formed solution film.

And the invention of Claim 2 is
2. The method of joining high-temperature superconducting thin film wires according to claim 1, wherein the solution is a solution of an organometallic complex dissolved in an organic solvent.

  A method using a solution of an organometallic complex dissolved in an organic solvent is preferable because it is a technically established method in the MOD method, which is one of the methods for producing a high-temperature superconducting thin film wire.

The invention according to claim 3
3. The method of joining high-temperature superconducting thin film wires according to claim 2, wherein the organometallic complex is an organometallic complex containing no fluorine.

  When a solution in which an organometallic complex containing fluorine is dissolved in an organic solvent is used, this fluorine dissolves the superconducting layer on the bonding surface, and good crystallinity cannot be obtained from the film of the solution. Can not be suppressed. When a solution in which an organometallic complex containing no fluorine is dissolved in an organic solvent is used, these problems do not occur, which is preferable.

The invention according to claim 4
A film of the solution is formed on each superconducting thin film of a plurality of high-temperature superconducting thin film wires, and then heat-treated to decompose the organometallic complex contained in the solution,
4. The method of joining high-temperature superconducting thin film wires according to claim 2, wherein the superconducting thin films are bonded together and further subjected to crystallization heat treatment to form the superconducting joint.

  By bonding the films formed on the respective superconducting thin films and decomposing the organometallic complex together and heat-treating them, the both films can be integrated and the superconducting thin film surfaces can be joined together.

The invention described in claim 5
4. The method of bonding a high-temperature superconducting thin film wire according to claim 2, wherein the solution film is formed by pouring into a gap formed by a superconducting thin film of two high-temperature superconducting thin-film wires. .

  In addition to forming the solution film on each of the superconducting thin films of the two high-temperature superconducting thin film wires, the solution film can also be formed by pouring the solution into a gap formed between the superconducting thin films. In this case, the superconducting thin film surfaces can be bonded to each other without bonding as described above.

The invention described in claim 6
The superconducting thin film surface of two high temperature superconducting thin film wires is bonded to each other and joined to each other, and the method of joining high temperature superconducting thin film wires according to any one of claims 1 to 5.

  By superposing the superconducting thin film surfaces of the respective high-temperature superconducting thin film wires and applying each of the above bonding methods, a superconducting junction in which the generation of the junction resistance is suppressed can be easily formed.

The invention described in claim 7
Each superconducting thin film surface of the two high-temperature superconducting thin film wires is arranged in the same direction, the cross sections of the respective superconducting thin films are brought into contact with each other, and straddling each superconducting thin film surface, the superconducting thin film of the third high temperature superconducting thin film wire The method of joining high-temperature superconducting thin film wires according to any one of claims 1 to 5, wherein the surfaces are bonded and bonded.

  A superconducting junction in which the generation of junction resistance is suppressed by applying each of the above joining methods by bonding the superconducting thin film surface of the third superconducting thin film wire across the superconducting thin film surface of each high temperature superconducting thin film wire. While being able to form easily, the mechanical strength of the joined high-temperature superconducting thin film wire can be sufficiently secured.

The invention according to claim 8 provides:
8. The high-temperature superconducting thin film wire joining method according to claim 7, wherein after the superconducting junction is formed, the solution is poured into a portion corresponding to the cross-section that is abutted, and heat treatment is performed.

  In the case of bonding between superconducting thin film layers, the current flowing in the c-axis direction of the superconducting thin film layer, which is a bonding layer, is reduced to about 1/10 of the current flowing in the ab plane. It is preferable to form a superconducting thin film layer at a portion corresponding to the combined cross section, thereby forming a superconducting junction in the ab plane.

  Further, the formed superconducting junction can be reinforced more firmly.

The invention according to claim 9 is:
A high-temperature superconducting thin film wire obtained by joining a plurality of high-temperature superconducting thin film wires to each other, and a superconducting junction formed by a superconducting layer containing a metal constituting the superconducting thin film is formed at each joint. This is a high-temperature superconducting thin film wire.

  Since the superconducting junction is formed by the superconducting layer containing the metal constituting the superconducting thin film, it is possible to provide a high-temperature superconducting thin film wire in which the generation of junction resistance is sufficiently suppressed.

The invention according to claim 10 is:
The high-temperature superconducting thin film wire according to claim 9, wherein the joint is formed at a location where the superconducting thin films of the plurality of high-temperature superconducting thin film wires are opposed to each other.

  Since each superconducting thin film is made to oppose and the junction is formed, a high-temperature superconducting thin film wire in which the area of the junction is sufficiently secured can be provided.

The invention according to claim 11
Between the respective superconducting thin film surfaces of the high-temperature superconducting thin film wires arranged in the same direction and faced with each other, and between the superconducting thin film surfaces of the third high-temperature superconducting thin film wires arranged across the respective superconducting thin film surfaces. The high temperature superconducting thin film wire according to claim 9, wherein the high temperature superconducting thin film wire is formed.

  Since the junction is formed between each superconducting thin film surface of the high-temperature superconducting thin film wire and the superconducting thin film surface of the third high-temperature superconducting thin film wire disposed across each superconducting thin film surface, the junction resistance of the junction is reduced. It is possible to provide a high-temperature superconducting thin film wire in which the generation is sufficiently suppressed and the mechanical strength of the high-temperature superconducting thin film wire is sufficiently secured.

The invention according to claim 12
The high-temperature superconducting thin film wire according to claim 11, wherein a superconducting layer containing a metal constituting the superconducting thin film is also formed at a location corresponding to the cross-section that is abutted.

  Since the superconducting layer is also formed in the cross section of the butt portion, as described above, a superconducting junction in the ab plane is preferably formed.

The invention according to claim 13
The high-temperature superconducting thin film wire according to claim 12, wherein a reinforcing material is disposed on the substrate surface side of the high-temperature superconducting thin film wire.

  Since the reinforcing material is disposed on the substrate surface side opposite to the joint formation surface of the butted portion, it is possible to provide a high-temperature superconducting thin film wire in which the mechanical strength of the high-temperature superconducting thin film wire is further reinforced.

The invention according to claim 14
The high-temperature superconducting thin film wire according to any one of claims 9 to 13, wherein a protective layer and a stabilizing layer are provided around the bonded high-temperature superconducting thin film wire.

  Since the protective layer and the stabilization layer are provided in the surroundings, a high-temperature superconducting thin film wire that can exhibit more stable superconducting characteristics can be provided.

  According to the present invention, it is possible to sufficiently suppress the occurrence of junction resistance at the joint surface, and there are no problems such as the occurrence of instability of the critical current value Ic due to heat generation and the limitation of the application range due to the inability to use the permanent current mode. A long high-temperature superconducting thin film wire and a joining method thereof can be provided.

It is sectional drawing which shows the joining structure of the high-temperature superconducting thin film wire of one embodiment of this invention. It is sectional drawing which shows the joining structure of the high temperature superconducting thin film wire of other embodiment of this invention. It is sectional drawing which shows the joining structure of the high-temperature superconducting thin film wire of other embodiment of this invention.

  Hereinafter, the present invention will be described based on embodiments with reference to the drawings.

1. Structure of High-Temperature Superconducting Thin Film Wire First, the structure of a high-temperature superconducting thin-film wire (hereinafter simply referred to as a superconducting wire) according to the present invention will be described with reference to three embodiments.

(First embodiment)
In the first embodiment, the superconducting layers of two superconducting wires are bonded together to form a bonding layer.

  FIG. 1 is a cross-sectional view showing the superconducting wire joining structure of the present embodiment. As shown in FIG. 1, in the present embodiment, superconducting bonding layer 5 is formed at a location where superconducting thin film 2a of superconducting wire 1a and superconducting thin film 2b of superconducting wire 1b are opposed to each other. 3a and 3b are intermediate layers, and 4a and 4b are metal substrates.

  In this way, since the two superconducting wires 1a and 1b are joined via the superconducting joining layer 5, unlike the conventional superconducting wires joined via the protective layer and the stabilizing layer, joining at the joining portion is performed. The generation of resistance is sufficiently suppressed.

  The superconducting thin films 2a and 2b may be formed by any method such as a liquid phase method such as the MOD method or a gas phase method such as the PLD method. Further, the structures of the two superconducting thin films may be different such that the superconducting thin film 2a is GdBCO and the superconducting thin film 2b is YBCO.

(Second Embodiment)
In the second embodiment, the third superconducting wire rods are arranged so that the superconducting layers of the two superconducting wires that are not physically connected to each other are arranged in the same direction and are faced to each other. A bonding layer is formed at the place where the superconducting layers are superposed.

  FIG. 2 is a cross-sectional view showing the superconducting wire joining structure of the present embodiment. As shown in FIG. 2, in the present embodiment, the two superconducting wires 1a and 1c are arranged with the superconducting thin films 2a and 2c in the same direction with a gap 6 therebetween, The superconducting wire 1b is disposed so as to straddle these two superconducting wires 1a and 1c. The superconducting bonding layer 5a is superposed on the superconducting thin film 2a of the superconducting wire 1a and the superconducting thin film 2b of the superconducting wire 1b, and the superconducting thin film 2c of the superconducting wire 1c is superposed on the superconducting thin film 2b of the superconducting wire 1b. A superconducting bonding layer 5b is formed at the combined location, and the two superconducting wires 1a and 1c are bonded.

  In this way, since the two superconducting wires 1a and 1c are joined via the superconducting joining layers 5a and 5b, the joining portion is different from the conventional superconducting wires joined via the protective layer and the stabilizing layer. Generation | occurrence | production of junction resistance in is fully suppressed. Moreover, the mechanical strength of the superconducting wire can be sufficiently ensured by disposing the third superconducting wire 1b at the butt portion.

(Third embodiment)
In the third embodiment, in addition to the second embodiment described above, a superconducting layer is also formed in the gap formed by the butting.

  FIG. 3 is a cross-sectional view showing the superconducting wire joining structure of the present embodiment. As shown in FIG. 3, in the present embodiment, as in the second embodiment, the superconducting bonding layer 5a is formed at the place where the superconducting thin film 2a of the superconducting wire 1a and the superconducting thin film 2b of the superconducting wire 1b are overlapped. In addition, a superconducting bonding layer 5b is formed at a position where the superconducting thin film 2c of the superconducting wire 1c and the superconducting thin film 2b of the superconducting wire 1b are overlapped, and the two superconducting wires 1a and 1c are joined. The superconducting bonding layer 7 is also formed in the gap formed by the butting.

  In this way, by forming the superconducting layer 7 that connects the two superconducting wires 1a and 1c, between the two superconducting wires 1a and 1c, that is, the ab plane (in FIG. A superconducting junction is formed within the plane formed in a direction perpendicular to the paper surface, and a decrease in the current flow in the c-axis direction can be compensated.

2. Next, a method for manufacturing a superconducting wire according to the present invention will be described. This manufacturing method is basically the same in the first to third embodiments described above, and will be described below based on the first embodiment.

(1) Production of solution First, a solution containing the metal constituting the superconducting thin films 2a and 2b of the two superconducting wires 1a and 1b to be joined is produced.

  As such a solution, a raw material solution in the MOD method described above, that is, a solution in which an organic complex of these metals is dissolved in an organic solvent is preferable, and an organic metal complex solution containing no fluorine is more preferable.

(2) Application of solution Prepare two superconducting wires 1a and 1b with the outermost surface as the surface of the superconducting thin film. A film is formed. The coating is preferably performed over the entire width of the superconducting thin film, but the length and thickness are not particularly limited and can be set as appropriate. Moreover, as a coating method of a solution, any method such as a die coating method or an ink jet method may be adopted, and it is not particularly limited.

(3) Calcination heat treatment Next, the temperature is raised to about 500 ° C., the coating film is heat-treated, the metal complex of the coating film is decomposed, and a calcination film is formed. The rate of temperature increase is preferably changed depending on the film thickness, such as being set low when the film thickness is thick, but is usually set to about 10 to 20 ° C./min.

  The treatment atmosphere at this time is preferably an atmosphere having a dew point of 15 to 20 ° C. and an oxygen concentration of 20% or more.

(4) Main firing heat treatment Next, the calcined films formed on the superconducting thin films 2a and 2b of the superconducting wires 1a and 1b are overlapped with each other and pressed with a pressure of 1 MPa or more. Thereafter, the pressed state is placed in a low oxygen concentration atmosphere, for example, in an Ar atmosphere having an oxygen concentration of 100 ppm, and the temperature is raised to about 800 ° C. at a rate of temperature increase of 1000 ° C./min or less and held for about 10 minutes. The holding time is appropriately set depending on the film thickness, and is set longer when the film thickness is thick.

  In addition, as a heating method in the calcining heat treatment and the main heat treatment described above, a heater is provided in a pressure application portion of a jig for applying pressure, or an external heater is provided in each of a wire joint portion and a pressure application portion. The method of performing etc. can be used.

  Next, the ambient oxygen concentration is switched to 100%, and the temperature is lowered to introduce oxygen into the film that has been heat-treated by annealing. This introduction of oxygen gives the film superconducting properties.

  Thus, the superconducting thin film 5 is formed, and the superconducting thin films 2a and 2b are superconductingly joined.

(5) Formation of protective layer and stabilization layer Thereafter, a protective layer such as an Ag layer and a stabilization layer such as a Cu layer are further formed around the joined superconducting wires 1a and 1b as necessary. The production of a long superconducting wire is completed.

1. Examples In the following examples, the bonding shown in FIGS. 1 to 3 is performed based on the first to third embodiments described above, and the examples 1, 2, and 3 are performed. A superconducting wire was prepared.

(1) Preparation of superconducting wire to be joined First, as a superconducting wire to be joined, on a metal substrate in which an intermediate layer having a thickness of 600 nm is formed on a clad type oriented metal substrate made of Ni / Cu / SUS having a thickness of 150 μm, Six superconducting wires having a width of 4 mm and a length of 0.1 m on which a 3 μm-thick superconducting thin film was formed and two superconducting wires having a width of 4 mm and a length of 20 mm were prepared.

(2) Preparation of solution In parallel, the Y: Ba: Cu molar ratio is 1: 2: 3, and the total ion concentration of Y + Ba + Cu is 1 mol / L. An alcohol solution containing a narate complex was prepared.

(3) Application of solution
The above-mentioned solution was applied to the surface of the superconducting film at the end of each superconducting wire with a thickness of about 25 μm on the prepared superconducting wire using a fluorine three MOD method (in the case of a 0.1 m long superconducting wire, the width is 4 mm × The superconducting wire having a length of 10 mm and a length of 20 mm was applied to the entire surface of 4 mm wide × 20 mm long). Then, it dried in air | atmosphere over about 10 minutes at the temperature of about 150 degreeC, and formed the coating film.

(4) Calcining heat treatment The superconducting wire on which the coating film is formed is placed in an atmosphere having a dew point of 15 ° C. to 20 ° C. and an oxygen concentration of 20%, and the temperature is increased to 500 ° C. at a temperature rising rate of 2.5 ° C./min By heating, the metal complex of the solution was decomposed to form a calcined film.

(5) Main firing heat treatment Based on the first to third embodiments, the calcined film thus formed is coated with two superconducting wires having a length of 0.1 m in Example 1. In Example 2 and Example 3, the 20 mm-long superconducting wire application surfaces are overlapped so as to straddle the two 0.1 m-long superconducting wire application surfaces (see FIGS. 1 to 3). ) After pressing with a pressure of 1 MPa, it was placed in an Ar atmosphere with a low oxygen concentration atmosphere and an oxygen concentration of 100 ppm, heated up to 800 ° C. at a heating rate of 1000 ° C./min, and held for 10 minutes.

  Thereafter, the atmospheric oxygen concentration was switched to 100%, the average temperature decreasing rate up to 200 ° C. was adjusted to 30 ° C./min, and the temperature was decreased to room temperature.

  And in Example 3, after that, said solution is poured into the crevice part of two superconducting wires with a length of 0.1 m, and calcining heat treatment, main heat treatment, and temperature decrease in oxygen are performed again. The superconducting bonding layer 7 shown was formed. At this time, the main heat treatment was not performed because pressing of the wires was unnecessary.

(6) Formation of protective layer and stabilizing layer Finally, an Ag protective layer having a thickness of 2 μm and a Cu stabilizing layer having a thickness of 20 μm are formed around the periphery to obtain a length of 0.19 m (Example 1) and a length of 0. A superconducting wire having a length of 2 m (Examples 2 and 3) was produced, and the superconducting wire of the example was obtained.

2. Comparative Example A superconducting wire similar to that of Example 1 was prepared as a superconducting wire to be joined. However, an Ag protective layer having a thickness of 2 μm and a Cu stabilizing layer having a thickness of 20 μm are formed in advance on the superconducting wire.

  After selecting two of the prepared superconducting wires and arranging the ends of each superconducting film to face each other in a size of width 4 mm × length 10 mm, the Cu stabilizing layers are joined together using solder, An elongated superconducting wire having a length of 0.19 m was manufactured to obtain a superconducting wire of a comparative example.

3. Evaluation Using the superconducting wires obtained in Examples and Comparative Examples, the junction resistance was measured by a four-terminal method.

  The measurement results are shown in Table 1.

  From the results of Table 1, it can be seen that in the examples, the superconducting junction has been realized, so that the junction resistance has been reduced to an unmeasurable level.

  While the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments. Various modifications can be made to the above-described embodiments within the same and equivalent scope as the present invention.

1a, 1b, 1c Superconducting wire 2a, 2b, 2c Superconducting thin film 3a, 3b, 3c Intermediate layer 4a, 4b, 4c Metal substrate 5, 7 Superconducting junction layer 6 Gap

Claims (14)

A method of joining high-temperature superconducting thin film wires in which a superconducting thin film wire is joined to form a superconducting joint.
Forming a film of a solution containing the metal constituting the superconducting thin film at the junction of the superconducting thin film,
A method for joining high-temperature superconducting thin film wires, wherein a superconducting joint is formed at the joint by heat-treating the formed solution film.   2. The method for bonding high-temperature superconducting thin film wires according to claim 1, wherein the solution is a solution of an organometallic complex dissolved in an organic solvent.   The method for bonding high-temperature superconducting thin film wires according to claim 2, wherein the organometallic complex is an organometallic complex containing no fluorine. A film of the solution is formed on each superconducting thin film of a plurality of high-temperature superconducting thin film wires, and then heat-treated to decompose the organometallic complex contained in the solution,
4. The method for bonding high-temperature superconducting thin film wires according to claim 2, wherein the superconducting thin films are bonded to each other and further subjected to crystallization heat treatment to form the superconducting junction.   4. The method for joining high-temperature superconducting thin film wires according to claim 2, wherein the solution film is formed by pouring into a gap formed by a superconducting thin film of two high-temperature superconducting thin-film wires.   6. The method of joining high-temperature superconducting thin film wires according to claim 1, wherein the superconducting thin film surfaces of the two high-temperature superconducting thin film wires are bonded together and joined together.   Each superconducting thin film surface of the two high-temperature superconducting thin film wires is arranged in the same direction, the cross sections of each superconducting thin film are butted together, and the superconducting thin film of the third high temperature superconducting thin film wire is straddled across each superconducting thin film surface. 6. The method of joining high-temperature superconducting thin film wires according to any one of claims 1 to 5, wherein the surfaces are bonded and bonded.   8. The method for joining high-temperature superconducting thin film wires according to claim 7, wherein after the superconducting junction is formed, the solution is poured into a portion corresponding to the cross-section that is abutted, and heat treatment is performed.   A high-temperature superconducting thin film wire obtained by joining a plurality of high-temperature superconducting thin film wires to each other, and a superconducting junction formed by a superconducting layer containing a metal constituting the superconducting thin film is formed at each joint. A high-temperature superconducting thin film wire characterized by that.   The high-temperature superconducting thin film wire according to claim 9, wherein the joint is formed at a location where the superconducting thin films of the plurality of high-temperature superconducting thin film wires are opposed to each other.   Between the respective superconducting thin film surfaces of the high-temperature superconducting thin film wires arranged in the same direction and faced with each other, and between the superconducting thin film surfaces of the third high-temperature superconducting thin film wires arranged across the respective superconducting thin film surfaces. The high temperature superconducting thin film wire according to claim 9, wherein the high temperature superconducting thin film wire is formed.   The high-temperature superconducting thin film wire according to claim 11, wherein a superconducting layer containing a metal constituting the superconducting thin film is also formed at a location corresponding to the cross-section that is abutted.   The high temperature superconducting thin film wire according to claim 12, wherein a reinforcing material is disposed on the substrate surface side of the high temperature superconducting thin film wire.   The high-temperature superconducting thin film wire according to any one of claims 9 to 13, wherein a protective layer and a stabilizing layer are provided around the bonded high-temperature superconducting thin film wire.

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