CN117080765A - REBCO tape superconducting joint and preparation method thereof - Google Patents
REBCO tape superconducting joint and preparation method thereof Download PDFInfo
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- CN117080765A CN117080765A CN202211675034.1A CN202211675034A CN117080765A CN 117080765 A CN117080765 A CN 117080765A CN 202211675034 A CN202211675034 A CN 202211675034A CN 117080765 A CN117080765 A CN 117080765A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 138
- 229910052709 silver Inorganic materials 0.000 claims description 39
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 36
- 239000004332 silver Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000004381 surface treatment Methods 0.000 claims description 11
- 239000002356 single layer Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 7
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical group O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- -1 rare earth barium copper oxide Chemical class 0.000 claims description 4
- WSNMPAVSZJSIMT-UHFFFAOYSA-N COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 Chemical compound COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 WSNMPAVSZJSIMT-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000954177 Bangana ariza Species 0.000 description 1
- 229910002328 LaMnO3 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/68—Connections to or between superconductive connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
The application provides a REBCO tape superconducting joint and a preparation method thereof, comprising the following steps: the device comprises a connecting sheet and two REBCO strips, wherein the ends of the two REBCO strips are connected through the connecting sheet; the connecting sheet is an RE-BCO strip, and the RE-BCO strip comprises a silver-doped RE-BCO superconducting layer; the REBCO strip comprises REBCO superconducting layers, and the REBCO superconducting layers of the two REBCO strips are connected through the silver-doped RE-BCO superconducting layers; the melting point of the silver-doped RE BCO superconducting layer is lower than the melting point of the REBCO superconducting layer. The superconducting joint is manufactured by connecting the superconducting strips through the specially-made connecting sheets, has simple manufacturing process, simple heat treatment process and high manufacturing efficiency, and is suitable for industrial mass production.
Description
Technical Field
The application relates to the technical field of superconducting materials, in particular to a REBCO (rare earth-based composite oxide) tape superconducting joint and a preparation method thereof, and especially relates to a preparation method of a superconducting joint suitable for producing a second-generation high-temperature superconducting tape.
Background
The second-generation high-temperature superconducting tape is widely applied to the fields of power transmission, high-field magnets, microwave devices, magnetic suspension and the like by virtue of high critical transition temperature, excellent mechanical properties and large current carrying capacity. Continuous REBCO tapes varying from a few kilometers to tens of kilometers are required for these applications. Although the current technology can produce kilometer grade REBCO long tapes, the demand is far from being met. The REBCO tape must be joined using a splicing technique. The REBCO tape joint technology currently used can be divided into low resistance joint technology and superconducting joint technology. Low resistance joints are typically solder joints and silver diffusion joints, which cause current loss and the joint portion is very prone to quench due to resistive heat generation. Superconducting joints in which the tape is joined by superconducting material and typically has a resistivity of less than 10 -12 Ω·cm 2 The above problems do not exist, however, the existing joint technology has the following disadvantages: the manufacturing process is complex, the long-time post-treatment is carried out, and the electrical performance of the joint part is seriously reduced.
Disclosure of Invention
Aiming at the defects in the prior art, the application aims to provide a REBCO tape superconducting joint and a preparation method thereof.
According to the present application, there is provided a REBCO tape superconducting joint comprising: the device comprises a connecting sheet and two REBCO strips, wherein the ends of the two REBCO strips are connected through the connecting sheet;
the connecting sheet is an RE-BCO strip, and the RE-BCO strip comprises a silver-doped RE-BCO superconducting layer;
the REBCO strip comprises REBCO superconducting layers, and the REBCO superconducting layers of the two REBCO strips are connected through the silver-doped RE-BCO superconducting layers;
the melting point of the silver-doped RE BCO superconducting layer is lower than the melting point of the REBCO superconducting layer.
Preferably, the RE BCO tape has the structure: silver doped RE BCO superconductive layer deposited on a metal base band with a biaxially textured buffer layer;
the silver doped RE BCO superconducting layer is made by uniformly doping silver into the RE BCO layer during the fabrication process.
Preferably, the length of the silver-doped RE-BCO superconducting layer is 5-30mm, the thickness of the silver-doped RE-BCO superconducting layer is 0.1-0.5 μm, and the silver doping amount of the silver-doped RE-BCO superconducting layer is 10-60 wt%.
Preferably, both said REBCO tapes and said RE BCO tapes are superconducting tapes formed by depositing rare earth barium copper oxide on a metal base tape with a biaxially textured buffer layer.
Preferably, the metal base band with the biaxially-textured buffer layer has any one of the following structures:
structure one: coating a single-layer or multi-layer oxide film on the nickel base band as a buffer layer;
and (2) a structure II: the copper-based alloy base band is coated with a single-layer or multi-layer oxide film as a buffer layer.
Preferably, the structure of the oxide film is any one of the following: ceO (CeO) 2 /YSZ/Y 2 O 3 Formed multilayer structure, mgO formed single-layer structure, ceO 2 /LaMnO 3 /MgO/Y 2 O 3 And forming a multilayer structure.
Preferably, the REBCO tapes each further comprise a first base tape and a first buffer layer;
the first baseband, the first buffer layer and the REBCO superconducting layer are sequentially arranged from bottom to top;
the RE BCO tape further comprises a second base band and a second buffer layer;
the silver doped RE-BCO superconducting layer, the second baseband and the second buffer layer are sequentially arranged from bottom to top.
The application also provides a preparation method of the REBCO tape superconducting joint, which is used for preparing the REBCO tape superconducting joint and comprises the following steps of:
step 1: preparing two REBCO tapes as a first REBCO tape and a second REBCO tape respectively, and preparing one RE BCO tape as a connecting sheet; the REBCO tape includes a REBCO superconductive layer; the RE BCO tape comprises a silver doped RE BCO superconductive layer; the melting point of the silver doped RE x BCO superconducting layer is lower than that of the REBCO superconducting layer;
step 2: performing surface treatment on REBCO superconductive layers of the first REBCO tape and the second REBCO tape;
step 3: bridging the REBCO superconductive layers on the first REBCO tape and the second REBCO tape subjected to surface treatment and the silver-doped RE-BCO superconductive layers of the RE-BCO tape relatively;
step 4: the bridging portion is subjected to a heat treatment under pressure to form a superconducting joint.
Preferably, in the step 2, the surface treatment is: and bombarding the REBCO superconducting layer by using plasma, and removing non-superconducting phase and non-preferential orientation REBCO particles on the surface of the REBCO superconducting layer to enable the surface of a region to be connected of the REBCO superconducting layer to be flat.
Preferably, in the step 4, the bridging portion is placed in a pressurized mold, and heat treatment is performed at 30 to 100 kPa;
the temperature is set to 600-950 ℃ in the heat treatment process, the heat treatment atmosphere is pure oxygen atmosphere, and the heat treatment time is 5-30min.
Compared with the prior art, the application has the following beneficial effects:
1. in the preparation method, the superconductive joint is prepared by connecting the superconductive strip through the specially-made connecting sheet, and the preparation method has the advantages of simple preparation process, simple heat treatment process, high preparation efficiency and the like, and is suitable for industrial mass production;
2. according to the method for preparing the superconducting joint, the Ag doped REBCO connecting sheet is adopted, so that the joint preparation process is simplified, the heat treatment temperature and time in the joint preparation process are reduced, and the preparation efficiency of the superconducting joint is greatly improved;
3. the application uses the special RE-BCO connecting sheet to connect two REBCO strips, and efficiently manufacture the REBCO superconducting joint through a simple process, thereby being beneficial to further improving the large-scale application of the superconducting strips.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
fig. 1 is a schematic cross-sectional structure of the REBCO tape superconducting joint of the present application.
The figure shows:
first REBCO tape 1 re bco tape 6
First base band 2 second base band 7
First buffer layer 3 second buffer layer 8
Second REBCO tape 9 of REBCO superconductive layer 4
Silver doped RE BCO superconductive layer 5
Detailed Description
The present application will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present application, but are not intended to limit the application in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present application.
Example 1:
as shown in fig. 1, the present embodiment provides a REBCO tape superconducting joint, including: the end parts of the two REBCO strips are connected through a connecting sheet, the connecting sheet is RE-BCO strip 6, the RE-BCO strip 6 comprises a silver-doped RE-BCO superconducting layer 5, the REBCO strip comprises a REBCO superconducting layer 4, the REBCO superconducting layers 4 of the two REBCO strips are connected through the silver-doped RE-BCO superconducting layer 5, and the melting point of the silver-doped RE-BCO superconducting layer 5 is lower than that of the REBCO superconducting layer 4.
Both REBCO tapes and RE BCO tape 6 are superconducting tapes formed by depositing rare earth barium copper oxide on a metal base tape with a biaxially textured buffer layer. The metal base band with the biaxially-textured buffer layer has any one of the following structures:
structure one: coating a single-layer or multi-layer oxide film on the nickel base band as a buffer layer;
and (2) a structure II: the copper-based alloy base band is coated with a single-layer or multi-layer oxide film as a buffer layer.
The structure of the oxide film is any one of the following: ceO (CeO) 2 /YSZ/Y 2 O 3 Formed multilayer structure, mgO formed single-layer structure, ceO 2 /LaMnO 3 /MgO/Y 2 O 3 And forming a multilayer structure.
The structure of BCO tape 6 is: silver doped RE BCO superconductive layer 5 deposited on a metal base tape with a biaxially textured buffer layer, the silver doped RE BCO superconductive layer 5 being made by uniformly doping silver into the RE BCO layer during the manufacturing process. The length of the silver-doped RE-BCO superconductive layer 5 is 5-30mm, the thickness of the silver-doped RE-BCO superconductive layer 5 is 0.1-0.5 mu m, and the silver doping amount of the silver-doped RE-BCO superconductive layer 5 is 10-60 wt%.
The REBCO strips also comprise a first base band 2 and a first buffer layer 3, wherein the first base band 2, the first buffer layer 3 and the REBCO superconducting layer 4 are sequentially arranged from bottom to top, the first buffer layer 3 is arranged on the first base band 2, and the REBCO superconducting layer 4 is arranged on the first buffer layer 3. The RE BCO tape 6 further comprises a second base band 7 and a second buffer layer 8, and the silver doped RE BCO superconductive layer 5, the second base band 7 and the second buffer layer 8 are arranged in sequence from bottom to top.
The embodiment also provides a preparation method of the REBCO tape superconducting joint, which is used for preparing the REBCO tape superconducting joint and comprises the following steps:
step 1: preparing two REBCO tapes as a first REBCO tape 1 and a second REBCO tape 9, respectively, and preparing one RE BCO tape 6 as a connecting sheet; the REBCO tape comprises a REBCO superconductive layer 4; RE BCO tape 6 comprises silver doped RE BCO superconducting layer 5; the melting point of the silver doped RE BCO superconducting layer 5 is lower than that of the REBCO superconducting layer 4;
step 2: subjecting the REBCO superconductive layers 4 of the first REBCO tape 1 and the second REBCO tape 9 to surface treatment; the surface treatment is as follows: bombarding the REBCO superconducting layer 4 by using plasma, and removing non-superconducting phase and non-preferential orientation REBCO particles on the surface of the REBCO superconducting layer 4 to enable the surface of a region to be connected of the REBCO superconducting layer 4 to be flat;
step 3: bridging the REBCO superconductive layers 4 and the silver doped RE-BCO superconductive layers 5 of the RE-BCO tapes 6 on the first REBCO tape 1 and the second REBCO tape 9 subjected to surface treatment;
step 4: performing pressure heat treatment on the bridging part to form a superconducting joint; and placing the bridging part in a pressurizing mold, performing heat treatment at 30-100 kPa, wherein the temperature is set at 600-950 ℃, the heat treatment atmosphere is pure oxygen atmosphere, and the heat treatment time is 5-30min.
In the step 1, the silver-doped RE BCO superconducting layer 5 is formed by uniformly doping silver in the RE BCO layer, the length of the silver-doped RE BCO superconducting layer 5 is 5-30mm, the thickness of the silver-doped RE BCO superconducting layer 5 is 0.1 μm-0.5 μm, and the silver doping amount of the silver-doped RE BCO superconducting layer 5 is 10wt% -60 wt%.
REBCO tape superconducting joint prepared by the preparation method of the embodiment has the resistance of 0.1-5 multiplied by 10 at 77K -12 Ohmic.
The preparation method of the embodiment uses a hot pressing method to bridge two REBCO strips by using RE-BCO strips as connecting pieces to form a joint structure for connecting the connecting pieces and the ends of the two REBCO strips, and is characterized in that the connecting piece superconducting layer is a silver-doped RE-BCO layer, and the melting point of the silver-doped RE-BCO layer is lower than that of the REBCO layer of the strip to be connected.
Example 2:
the present embodiment will be understood by those skilled in the art as a more specific description of embodiment 1.
The present embodiment provides a REBa 2 Cu 3 O 7-δ A preparation method of (REBCO) tape superconducting joint relates to superconducting material technology and joint field, comprising the following steps: the superconducting joint comprises a REBCO strip to be connected and an RE-BCO strip serving as a connecting sheet; carrying out surface treatment on two REBCO strips to be connected; then bridging the two strips to be connected and the connecting sheet superconducting layer oppositely; and finally, carrying out pressurized heat treatment on the bridging part to form the superconducting joint.
Wherein, the REBCO strip to be connected and the RE BCO strip used as a connecting sheet are superconducting strips formed by depositing rare earth barium copper oxide on a metal base band with a biaxial texture buffer layer; the RE-BCO strip serving as the connecting sheet is of a mixed structure of RE-BCO and Ag, and different rare earth elements RE-BCO are selected so that the melting point of RE-BCO is lower than that of REBCO.
The surface treatment is to bombard the REBCO superconducting layer by using plasma to remove non-superconducting phase and non-preferential orientation REBCO particles on the surface, so that the surface of the area to be connected is flat.
The metal base band with the biaxially textured buffer layer can be a nickel base or copper base alloy base band, a single-layer or multi-layer oxide film is coated on the metal base band as the buffer layer, and the structure of the oxide film can be, but is not limited to, ceO2/YSZ/Y2O3, mgO, ceO2/LaMnO3/MgO/Y2O3.
The connecting sheet structure is a metal baseband/silver doped RE-BCO superconducting layer with a biaxial texture buffer layer, the length of the connecting sheet is 5-30mm, the thickness of the silver doped RE-BCO superconducting layer is 0.1-0.5 mu m, and the silver doping amount is 10-60 wt%.
The silver doped RE-BCO superconductive layer is formed by uniformly doping silver into the RE-BCO layer in the preparation process so as to reduce the melting point of the RE-BCO layer.
Placing the bridging part in a pressurizing mould, performing heat treatment at 30-100 kPa,
the temperature is set at 600-950 ℃ in the heat treatment process, the heat treatment atmosphere is pure oxygen atmosphere, and the heat treatment time is 5-30min. The heat treatment temperature enables the connection sheet RE BCO layer to generate a partial liquid phase without affecting the strip REBCO superconductive layer to be connected.
The prepared joint has a resistance of 0.1-5 x 10 ≡ -1 2 ohms.
Example 3:
the present embodiment will be understood by those skilled in the art as a more specific description of embodiment 1.
The embodiment provides a manufacturing method of a superconducting joint, in which a structure shown in fig. 1 is adopted, two REBCO strips are connected by using a specially-made RE x BCO connecting sheet, and the REBCO superconducting joint is manufactured efficiently through a simple process, so that the large-scale application of the superconducting strip is further improved.
In this embodiment, the preparation process of the joint in which the Ag-doped YBCO connection piece is connected to the EuBCO strip is taken as an example.
Will deposit on CeO 2 /YSZ/Y 2 O 3 EuBCO strip surface on base bandThe area with the length of 5mm is bombarded by plasma, so that the surface large particles are removed smoothly; bridging two strips to be connected with a superconducting layer of a 10% Ag doped YBCO connecting sheet with the length of 10mm deposited on the MgO base band; placing the bridge part into a mold, heat treating at 50kPa, 800deg.C under oxygen atmosphere for 30min, and cooling to form joint with resistance of 0.1-5×10 at 77K ^-12 Ohmic.
Example 4:
the present embodiment will be understood by those skilled in the art as a more specific description of embodiment 1.
In this embodiment, the preparation process of the joint in which the Ag-doped YBCO connection piece is connected to the EuBCO strip is taken as an example.
The heating temperature was set at 500 ℃, and other steps and conditions were the same as in example 3, failing to effectively join the EuBCO tape. REBCO in the connecting sheet aiming at specific Ag doping amount has specific remelting temperature, and the connecting sheet cannot remelt and connect two superconducting tapes to form a superconducting joint below the temperature.
Example 5:
the present embodiment will be understood by those skilled in the art as a more specific description of embodiment 1.
In this embodiment, the process of preparing the Ag doped YBCO tab to GdBCO strip joint is taken as an example.
Will deposit on CeO 2 /LaMnO 3 /MgO/Y 2 O 3 The area with the surface length of 30mm of the EuBCO strip on the base band is bombarded by plasma, so that the surface large particles are removed smoothly; then two strips to be connected and 60mm in length are deposited on CeO 2 /YSZ/Y 2 O 3 Bridging the superconductive layers of the 60% Ag doped YBCO connecting sheet on the base band relatively; placing the bridge part into a mold, heat treating at 30kPa and 600deg.C under oxygen atmosphere for 60min, and cooling to form joint with resistance of 0.5X10 at 77K ^-12 Ohmic.
Example 6:
the present embodiment will be understood by those skilled in the art as a more specific description of embodiment 1.
In this embodiment, the process of preparing the Ag-doped GdBCO connection tab-connection EuBCO strip is taken as an example. Carrying out plasma bombardment on a region with the surface length of 30mm of the EuBCO strip deposited on the MgO base band to enable the region to be smooth and remove large surface particles; then two strips to be connected and 60mm in length are deposited on CeO 2 /LaMnO 3 /MgO/Y 2 O 3 Bridging the superconductive layers of the 60% Ag doped YBCO connecting sheet on the base band relatively; placing the bridge part into a mold, heat treating at 100kPa and 950 deg.C under oxygen atmosphere for 5min, and cooling to form joint with resistance of 5×10 at 77K ^-12 Ohmic.
In the preparation method, the superconductive joint is prepared by connecting the superconductive strip through the specially-made connecting sheet, and the preparation method has the advantages of simple preparation process, simple heat treatment process, high preparation efficiency and the like, and is suitable for industrial mass production.
In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The foregoing describes specific embodiments of the present application. It is to be understood that the application is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the application. The embodiments of the application and the features of the embodiments may be combined with each other arbitrarily without conflict.
Claims (10)
1. A REBCO tape superconducting joint, comprising: the device comprises a connecting sheet and two REBCO strips, wherein the ends of the two REBCO strips are connected through the connecting sheet;
the connecting piece is an RE-BCO strip (6), and the RE-BCO strip (6) comprises a silver-doped RE-BCO superconducting layer (5);
the REBCO tape comprises a REBCO superconducting layer (4), wherein the two REBCO superconducting layers (4) of the REBCO tape are connected through the silver-doped RE x BCO superconducting layer (5);
the melting point of the silver doped RE BCO superconducting layer (5) is lower than the melting point of the REBCO superconducting layer (4).
2. REBCO tape superconducting joint according to claim 1, characterized in that the RE BCO tape (6) has the structure: a silver doped RE BCO superconducting layer (5) deposited on a metal base tape with a biaxially textured buffer layer;
the silver doped RE-BCO superconductive layer (5) is prepared by uniformly doping silver into the RE-BCO layer in the preparation process.
3. The REBCO tape superconducting joint according to claim 2, wherein the length of the silver doped RE x BCO superconducting layer (5) is 5-30mm, the thickness of the silver doped RE x BCO superconducting layer (5) is 0.1-0.5 μm, and the silver doping amount of the silver doped RE x BCO superconducting layer (5) is 10-60 wt%.
4. REBCO tape superconducting joint according to claim 1, characterized in that both the REBCO tapes and the RE BCO tape (6) are superconducting tapes formed by depositing rare earth barium copper oxide on a metal base tape with a biaxially textured buffer layer.
5. The REBCO tape superconducting joint of claim 4, wherein the metal base tape with biaxially textured buffer layer is any one of the following structures:
structure one: coating a single-layer or multi-layer oxide film on the nickel base band as a buffer layer;
and (2) a structure II: the copper-based alloy base band is coated with a single-layer or multi-layer oxide film as a buffer layer.
6. The REBCO tape superconducting joint of claim 5, wherein the oxide film has a structure of any one of: ceO (CeO) 2 /YSZ/Y 2 O 3 Formed multilayer structure, mgO formed single-layer structure, ceO 2 /LaMnO 3 /MgO/Y 2 O 3 And forming a multilayer structure.
7. The REBCO tape superconducting joint according to claim 1, wherein the REBCO tapes each further comprise a first base tape (2) and a first buffer layer (3);
the first baseband (2), the first buffer layer (3) and the REBCO superconducting layer (4) are sequentially arranged from bottom to top;
the RE BCO tape (6) further comprises a second base tape (7) and a second buffer layer (8);
the silver doped RE-BCO superconducting layer (5), the second baseband (7) and the second buffer layer (8) are sequentially arranged from bottom to top.
8. A process for preparing a REBCO tape superconducting joint, characterized by being used for preparing a REBCO tape superconducting joint according to any one of claims 1 to 7, comprising the steps of:
step 1: preparing two REBCO tapes as a first REBCO tape (1) and a second REBCO tape (9), respectively, and preparing one RE BCO tape (6) as a connecting sheet; the REBCO tape comprises a REBCO superconductive layer (4); the RE BCO tape (6) comprises a silver doped RE BCO superconducting layer (5); the melting point of the silver doped RE-BCO superconducting layer (5) is lower than that of the REBCO superconducting layer (4);
step 2: subjecting the REBCO superconductive layers (4) of the first REBCO tape (1) and the second REBCO tape (9) to a surface treatment;
step 3: bridging the REBCO superconductive layers (4) on the first REBCO strip (1) and the second REBCO strip (9) subjected to surface treatment and the silver doped RE BCO superconductive layer (5) of the RE BCO strip (6) oppositely;
step 4: the bridging portion is subjected to a heat treatment under pressure to form a superconducting joint.
9. The method of claim 8, wherein in step 2, the surface treatment is: and bombarding the REBCO superconducting layer (4) by using plasma, and removing non-superconducting phase and non-preferential orientation REBCO particles on the surface of the REBCO superconducting layer (4) to enable the surface of a region to be connected of the REBCO superconducting layer (4) to be flat.
10. The method of manufacturing a REBCO tape superconducting joint according to claim 8, wherein in step 4, the bridging portion is placed in a pressurized mold and heat-treated at 30 to 100 kPa;
the temperature is set to 600-950 ℃ in the heat treatment process, the heat treatment atmosphere is pure oxygen atmosphere, and the heat treatment time is 5-30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN102351571A (en) * | 2011-08-17 | 2012-02-15 | 西北有色金属研究院 | Preparation method of nanosilver-doped yttrium barium copper oxide film |
| JP2013235699A (en) * | 2012-05-08 | 2013-11-21 | Sumitomo Electric Ind Ltd | Joint method of high temperature superconducting thin film wire and high temperature superconducting thin film wire |
| US20170011823A1 (en) * | 2014-02-04 | 2017-01-12 | Riken | Low-Resistance Connection Body for High-Temperature Superconducting Wire Material and Connection Method |
| CN107799917A (en) * | 2017-10-20 | 2018-03-13 | 东北大学 | The low resistance connection device and its manufacture method of a kind of REBCO high-temperature superconductors band |
| CN111485213A (en) * | 2020-04-28 | 2020-08-04 | 上海超导科技股份有限公司 | Process method suitable for producing second-generation high-temperature superconducting tape |
| CN114221191A (en) * | 2022-01-06 | 2022-03-22 | 中国科学院电工研究所 | Connecting method of second-generation high-temperature superconducting tapes and connecting superconducting wire |
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| CN102351571A (en) * | 2011-08-17 | 2012-02-15 | 西北有色金属研究院 | Preparation method of nanosilver-doped yttrium barium copper oxide film |
| JP2013235699A (en) * | 2012-05-08 | 2013-11-21 | Sumitomo Electric Ind Ltd | Joint method of high temperature superconducting thin film wire and high temperature superconducting thin film wire |
| US20170011823A1 (en) * | 2014-02-04 | 2017-01-12 | Riken | Low-Resistance Connection Body for High-Temperature Superconducting Wire Material and Connection Method |
| CN107799917A (en) * | 2017-10-20 | 2018-03-13 | 东北大学 | The low resistance connection device and its manufacture method of a kind of REBCO high-temperature superconductors band |
| CN111485213A (en) * | 2020-04-28 | 2020-08-04 | 上海超导科技股份有限公司 | Process method suitable for producing second-generation high-temperature superconducting tape |
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