JP2013225705A - Manufacturing method of solid state imaging device, and solid state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a compact solid state imaging device, and the compact solid state imaging device.SOLUTION: The manufacturing method of the compact solid state imaging device includes the steps of: preparing a cover member; preparing an imaging device including a substrate having a pixel area, including a plurality of light receiving units, on a principal plane, a first convexoconcave portion having a lens shape to collect light to each of the plurality of light receiving units, and a second convexoconcave portion having a plurality of convex portions surrounding the first convexoconcave portion; and fixing the cover member to an area between the first convexoconcave portion and the second convexoconcave portion by a fixation member.

Description

  The present invention relates to a solid-state imaging device manufacturing method and a solid-state imaging device, and more particularly to a solid-state imaging device manufacturing method and a solid-state imaging device in which a cover member is fixed to a light-receiving side surface of a solid-state imaging element.

  In recent years, with the downsizing and thinning of digital cameras and mobile phones, there has been a demand for further downsizing and thinning of solid-state imaging devices.

  Therefore, a solid-state imaging device has been proposed in which a cover member made of a transparent material in which a frame portion is integrally formed on the lower surface edge portion is hermetically sealed to a solid-state imaging element chip (see, for example, Patent Document 1). Further, a solid-state imaging device in which a transparent substrate is mounted on a solid-state imaging element with a sealant has been proposed (see, for example, Patent Document 2).

Japanese Patent Laid-Open No. 07-202152 JP 2004-134672 A

  In the apparatus as described above, a microlens having a convex portion with a height of about several μm formed corresponding to each pixel is formed on the surface of the light receiving portion of the solid-state imaging device. In recent years, in order to further reduce the chip size and package size of the solid-state image sensor, it is required to make the area outside the pixel area of the solid-state image sensor as small as possible. However, when a transparent substrate is mounted on a solid-state imaging device having a microlens on the surface of the light receiving unit using a sealant, the sealant may come into contact with the microlens. When the sealing agent comes into contact with the microlens, there is a problem that the sealing agent penetrates through the gaps between the convex portions of the microlens by the capillary phenomenon and reaches the pixel region, thereby deteriorating the optical characteristics.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a solid-state imaging device and a small-sized solid-state imaging device that can be made smaller.

  In order to achieve the above object, a manufacturing method of a solid-state imaging device according to a first aspect of the present invention includes a step of preparing a cover member, a substrate having a pixel region having a plurality of light receiving portions on a main surface, and the plurality An imaging device having a first uneven portion having a lens shape for condensing light on each of the light receiving portions and a second uneven portion having a plurality of convex portions surrounding the first uneven portion is prepared. And a step of fixing the cover member with a fixing member in a region between the first uneven portion and the second uneven portion of the image sensor.

  The solid-state imaging device manufacturing method according to the second aspect of the present invention includes a step of preparing a cover member, a substrate having a pixel region having a plurality of light receiving portions on a main surface, and each of the plurality of light receiving portions. A first concavo-convex portion having a lens shape for condensing light and a force that is applied around the first concavo-convex portion and penetrated by a capillary phenomenon is greater than or equal to the first concavo-convex portion. A step of preparing an image sensor having a second uneven portion, and the cover member is disposed in an area between the first uneven portion and the second uneven portion of the image sensor via an adhesive. And a step of fixing the imaging element and the cover member, wherein the imaging element and the cover member are cured after being placed and infiltrating a part of the adhesive into the second uneven portion. To do.

  According to a third aspect of the present invention, there is provided a solid-state imaging device comprising: a pixel region having a plurality of light receiving portions; and a first uneven portion having a lens for condensing each of the plurality of light receiving portions. A solid-state imaging device that includes an imaging device having a cover member that covers the first concavo-convex portion and is fixed via the imaging device and a fixing member, wherein the imaging device includes the first concavo-convex portion. And a second concavo-convex part, wherein a part of the fixing member covers the surface outside the region facing the cover member.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a solid-state imaging device which can be reduced more, and a small-sized solid-state imaging device can be provided.

It is sectional drawing which shows one Embodiment of the manufacturing method of the solid-state imaging device concerning this invention. It is the expanded sectional view and top view which show one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing which shows one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing which shows one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing which shows one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing which shows one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing and top view which show one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing and top view which show one Embodiment of the solid-state imaging device concerning this invention. It is sectional drawing and top view which show one Embodiment of the solid-state imaging device concerning this invention.

  Embodiments of a method for manufacturing a solid-state imaging device and a solid-state imaging device according to the present invention will be described below with reference to the drawings, but the present invention is not limited thereto.

(First embodiment)
A method for manufacturing a solid-state imaging device according to the first embodiment of the present invention will be described with reference to FIG.

  Fig.1 (a) is process sectional drawing which shows the process of preparing the solid-state image sensor 2 among the manufacturing methods of the solid-state imaging device 1 which shows 1st Embodiment. The solid-state imaging device 2 in FIG. 1A includes a substrate 11, a pixel region 12 having a plurality of light receiving portions arranged on the main surface of the substrate 11, and a terminal portion 13. Further, the solid-state imaging device 2 includes a color filter 14 disposed on the pixel region, a planarizing film 15 disposed on the color filter, and a convex portion that becomes the microlens 16 disposed on the planarizing film. Have. As the substrate 11, a silicon substrate or the like is used, and on the main surface of the substrate 11, a pixel region 12 including a plurality of pixels having a plurality of light receiving portions such as a CCD and a CMOS, a switch, and the like is configured. Here, a pixel group used for image formation is referred to as a pixel region 12. On the main surface of the substrate 11 including the pixel region 12, a color filter 14 in which any one of red, green, and blue (RGB) is arranged at a position corresponding to each pixel by using a photolithography technique. Has been placed. A flattening film 15 is disposed on the color filter in order to form the microlenses 16 uniformly. On the planarizing film, a transparent film is formed using photolithography technology. After patterning corresponding to each pixel by etching, the film is heated and melted by a method such as reflow, and is made into a lens shape by the action of surface tension. A lens 16 is arranged. The microlens has a role of collecting incident light on the light receiving unit. The microlens 16 may be a substrate in which a microlens array formed by nanoimprint in which a lens shape is transferred to a film of a resin material with a mold is bonded to the substrate 11. According to the nanoimprint technique, since the shape of the convex portion can be formed relatively freely, a convex portion having a large aspect ratio can be formed.

  FIG. 1B is a process cross-sectional view illustrating a process of preparing the cover member 3 in the manufacturing method of the solid-state imaging device 1. The cover member 3 shown in FIG. 1B has a structure having a concave portion from a flat plate portion 21 and a frame portion 22 having an integral structure. The cover member 3 is made of resin or crystal in addition to glass. The cover member 3 is a separate member such as an integrated structure of the flat plate portion 21 and the frame portion 22 in which concave portions are formed by polishing, etching, molding with a mold, or the like, or a transparent flat plate such as glass or resin. Any assembly structure with a fixed frame may be used. In the case of an assembly structure, the frame part can also use a metal. If the antireflection coating or the IR coating is provided on the front surface or the back surface of the flat plate portion 21, the optical characteristics become better. Further, in order to obtain a good image, it is necessary to suppress the reflected light from the frame portion 22 from entering the pixel region 12. For this reason, the frame portion 22 is preferably made of a material closer to the refractive index (1) of air or a material having a high light absorption rate. It is also preferable to provide an antireflection coat or IR coat similar to that of the flat plate portion 21 on the inner wall or outer wall of the frame portion 22.

  FIG. 1C is a process cross-sectional view illustrating a process of bonding the cover member 3 to the solid-state imaging device 2 via the uncured fixing member 23 in the manufacturing method of the solid-state imaging device 1. First, an uncured adhesive that is the fixing member 23 is applied to the solid-state image sensor side of the frame portion of the cover member 3, and the cover member 3 is pressed against the solid-state image sensor 2.

  FIG. 1D is a process cross-sectional view illustrating a state in which the adhesive as the fixing member 23 spreads on the solid-state imaging device in the bonding process illustrated in FIG. A space 25 is formed between the solid-state imaging device 2 and the cover member 3. Thereafter, the adhesive is cured.

  2A is an enlarged cross-sectional view taken along line A of FIG. 1D of the solid-state imaging device 1 according to the manufacturing method of the solid-state imaging device 1 shown in FIG. 1, and FIG. It is a top view of 1 (d).

  In the solid-state imaging device 1 of FIGS. 2A and 2B, the area of the solid-state imaging device 2 that faces the frame portion 22 of the cover member 3 is a fixed area B. Inside the fixed region B, the pixel region 12 of the solid-state image sensor 2 is disposed, and the microlens 16 is disposed on the surface of the solid-state image sensor 2. A plurality of convex portions formed by the microlenses 16 facing at least the pixel region 12 inside the fixed region B are referred to as first concavo-convex portions 16. Similarly, a member similar to the microlens 16 is arranged on the surface of the solid-state imaging device 2 in the region C outside the fixed region B. A plurality of convex portions formed by the microlens-shaped member in the region C is referred to as a second uneven portion 17. That is, the fixed region B is a region between the first uneven portion and the second uneven portion. And the fixed area | region B is an area | region which mounts a cover member via an adhesive agent on a solid-state image sensor. In the present embodiment, in the fixed region B, the microlens-shaped members are arranged in an integrated configuration with continuity between the inside and the outside of the fixed region B. The plurality of convex portions formed by the microlenses in the fixed region are referred to as third uneven portions 18. Here, for example, when the microlens is disposed only inside the fixed region, the fixing member 23 may come into contact with the first uneven portion 16 and penetrate into the pixel region 12. In order to prevent the fixing member 23 from coming into contact with the first uneven portion 16, it is necessary to increase the distance between the first uneven portion 16 and the frame portion 22. That is, the frame portion 22 is arranged away from the first uneven portion 16 so that the fixing member 23 does not possibly come into contact with the first uneven portion 16. However, such a configuration cannot reduce the size of the solid-state imaging device.

  However, in the configuration of the present embodiment, the fixing member 23 on the pixel region 12 is infiltrated with the adhesive as the fixing member 23 in both the inner region (pixel region side) and the outer region C of the fixing region. Therefore, the solid-state imaging device can be reduced in size. That is, it is possible to reduce the penetration of the fixing member into the first uneven portion due to the capillary phenomenon in the second uneven portion and the third uneven portion. In addition, the force which the applied adhesive permeates by capillary action may be a second uneven portion that is not less than the first uneven portion. In the present embodiment, the second concavo-convex part and the third concavo-convex part used the same microlens-shaped member as the first concavo-convex part. However, any shape can be used as long as the capillary phenomenon occurs. It may be uneven.

  In addition, when the microlens is formed by heating and melting, since the microlens is arranged from the pixel region to the region outside the region where the frame is fixed, the microlens in the pixel region can be formed in a uniform state. Therefore, it becomes a good shape.

  In addition, since the microlens is arranged in an integrated configuration from the pixel area to the area outside the area where the frame is fixed, the pixel area has a distance even if peeling occurs at the periphery of the microlens. A decrease in optical characteristics within the region is suppressed.

  3A is a cross-sectional view of the solid-state imaging device 1 in which the solid-state imaging device 1 shown in FIG. 1D is packaged, and FIG. 3B is a plan view thereof. The solid-state imaging device of the solid-state imaging device 1 shown in the figure is fixed to the wiring substrate 4 via a fixing member 33 on the side opposite to the integrated cover member side. The terminal portion 13 of the solid-state imaging device 2 and the terminal portion 32 of the wiring board 4 are connected by a conductive portion such as a metal wire. Further, in the solid-state imaging device 1, the periphery of the wiring substrate 4, the solid-state imaging device 2, and the cover member 3 is sealed with a sealing member 35. As the wiring board 4, a lead frame, a printed wiring board, a flexible wiring board, a metal base wiring board, or the like is used. When the wiring board 4 is a lead frame, the solid-state imaging device is fixed on the lead frame via a fixing member. The wiring board 4 shown in the figure is a printed wiring board, and includes a substrate 31 made of a material such as ceramic or glass epoxy, and a terminal portion 32 disposed on the surface of the substrate 31. Furthermore, the printed wiring board as the wiring board 4 has wiring arranged on the surface or inside of the board 31. In addition, the metal wire 34 that is a conductive portion is used for signal transfer between the solid-state imaging device 2 and the wiring board 4. With such a configuration, the solid-state imaging device can further reduce moisture intrusion into the space.

(Second Embodiment)
Next, a second embodiment will be described. FIG. 4 is a cross-sectional view of the solid-state imaging device according to the second embodiment.

  The solid-state imaging device 1 in FIG. 4 is different from the solid-state imaging device of the first embodiment in that the third uneven portion on the surface of the solid-state imaging device 2 facing the frame portion is flattened. That is, the microlenses are arranged inside (on the pixel area side) and outside the fixed area B except for the fixed area of the solid-state imaging device 2 facing the frame portion 22. In the method of manufacturing the solid-state imaging device 1, in the step of preparing the solid-state imaging device 2, the solid-state imaging device 2 in which the configuration of the first uneven portion 16, the second uneven portion 17, and the flat portion 19 is the above-described configuration is prepared. To do. Such a configuration suppresses penetration of the fixing member 23 onto the pixel region 12 by allowing the adhesive, which is the fixing member, to penetrate both the inner region (pixel region side) and the outer region of the fixing region B. Therefore, the solid-state imaging device 1 can be downsized.

  Further, the distance from the concave portion of the third uneven portion 18 of the solid-state imaging device 1 of FIG. 1D to the frame portion 22 and the distance from the flat portion 19 of the solid-state imaging device 1 of FIG. 4 to the lower portion of the frame portion 22. Are the same, since the protrusion of the fixing member 23 can be suppressed. This is because the fixing member 23 corresponding to the volume of the convex portion of the third uneven portion 18 can be stored in the fixing region B.

  In addition, when the lower region of the frame portion is a flat portion, the displacement of the frame portion can be reduced by increasing the frictional force compared to the case where the lower portion of the frame portion is a spherical surface. There is also an effect that the position is easily stabilized.

  Further, the first uneven portion 16 corresponding to the pixel region 12, the flat portion 19 corresponding to the region to which the frame portion is fixed, and the second uneven portion 17 corresponding to the region outside the frame portion are the same. It can be formed by the process. Therefore, the configuration of the solid-state imaging device of this embodiment is preferable because the manufacturing process does not increase and the cost does not change.

(Third embodiment)
Next, a third embodiment will be described. FIG. 5 is a cross-sectional view of the solid-state imaging device according to the third embodiment.

  The solid-state imaging device 1 of FIG. 5 is different from the solid-state imaging device 1 of the first embodiment in that the planarizing film and the color filter on the surface of the solid-state imaging element facing the frame portion are removed. In other words, except for the region of the solid-state imaging device 2 that faces the frame portion 22 and the fixed region B ′ that includes a portion adjacent to the region, the first that becomes the microlens inside the fixed region B ′ (on the pixel region side). The second uneven portion 17 is disposed outside the uneven portion 16. More specifically, in the solid-state imaging device 1 of FIG. 5A, the flattening film 15 and the color filter 14 in the fixed region B ′ portion on the surface of the solid-state imaging device are removed, and the first unevenness that is a microlens. A flat portion formed of the same material as the portion 16 is provided in the B ′ portion. 5B has a configuration in which a flat portion formed of the same material as the microlens in the fixed region B ′ portion on the surface of the solid-state imaging device is further removed from FIG. 5A. In the method for manufacturing the solid-state imaging device 1, in the step of preparing the solid-state imaging device 2, the configuration of the first concavo-convex portion 16, the second concavo-convex portion 17, and the fixed region B ′ is the solid-state imaging device 2 having the above configuration. prepare. Specifically, in FIG. 5A, after the color filter 14 and the planarizing film 15 are formed on the substrate, the fixed region B ′ is removed by etching or cutting such as a circular rotary blade to form grooves. Forming microlenses. Further, when the microlens is formed, the fixed region B ′ is flattened. In FIG. 5B, after the microlens is formed, the microlens, the color filter 14 and the planarizing film 15 in the vicinity of the region where the frame portion 22 of the solid-state imaging device 2 is fixed are etched or a circular rotary blade. It is removed by cutting to form a groove. Such a configuration can suppress penetration of the fixing member into the pixel region 12 by allowing the fixing member to penetrate both the inner region (pixel region side) and the outer region of the fixed region B. Therefore, the solid-state imaging device Downsizing can be realized. 5A shows that the microlens material extends from the pixel region 12 to the outside of the cover member 3 through a groove having an anchor effect, and is arranged in an integrated configuration. The peeling of the lens 16 can be reduced.

  Further, the position control of the frame portion placed on the solid-state imaging device is facilitated by the groove portion of the solid-state imaging device.

  Moreover, since the protrusion of a fixing member can be suppressed compared with the solid-state imaging device 1 of FIG.1 (d) and FIG.4, it is more suitable. This is because the fixing members corresponding to the volume of the microlens, the planarizing film, and the color filter can be stored in the fixing region B ′.

(Fourth embodiment)
Next, a fourth embodiment will be described. FIG. 6 is a cross-sectional view of the solid-state imaging device according to the fourth embodiment.

  The solid-state imaging device 1 of FIG. 6 is different from the solid-state imaging device 1 of the first embodiment in that a water-repellent portion is provided on the surface of the first concavo-convex portion on the inner side (pixel region side) than the frame portion. Therefore, a water repellent material is applied to the surface of the first concavo-convex portion 16 serving as a microlens facing the pixel region 12, and the surface of the second and third concavo-convex portions outside the fixed region B is repellent. Water material is not applied. In this case, penetration of the fixing member 23 onto the pixel region 12 can be suppressed. In the method of manufacturing the solid-state imaging device 1, in the step of preparing the solid-state imaging device 2, the configuration of the first uneven portion 16 prepares the solid-state imaging device 2 having the above configuration. Such a configuration can suppress the penetration of the fixing member into the pixel region by infiltrating the fixing member into the region outside the fixing region B, so that the solid-state imaging device can be downsized.

(Fifth embodiment)
Next, a fifth embodiment will be described. FIG. 7A is a cross-sectional view of the solid-state imaging device according to the fifth embodiment, and FIG. 7B is a plan view thereof.

  The solid-state imaging device 1 in FIGS. 7A and 7B is different from the solid-state imaging device 1 of the first embodiment in that the solid-state imaging device 1 includes continuous convex portions that surround the pixel region on the inner side (pixel region side) than the frame portion. It has a bank. Therefore, since the fixing member 23 does not contact the first uneven portion 16 that becomes the microlens of the pixel region 12 in which the capillary phenomenon occurs, the penetration of the fixing member 23 onto the pixel region 12 can be suppressed. In the manufacturing method of the solid-state imaging device 1, in the step of preparing the solid-state imaging device, the configuration of the bank portion 20 prepares the solid-state imaging device having the above-described configuration. Such a configuration can suppress the penetration of the fixing member 23 into the pixel region 12 by infiltrating the fixing member 23 into the region outside the fixing region B, so that the solid-state imaging device can be downsized. .

  Further, the first uneven portion 16 corresponding to the pixel region 12, the bank portion 20 surrounding the pixel region 12, the third uneven portion 18 corresponding to the fixed region B to which the frame portion 22 is fixed, and the frame portion 22. The second concavo-convex portion 17 corresponding to the outer region can be formed in the same process. Therefore, the configuration of the solid-state imaging device of this embodiment is preferable because the manufacturing process does not increase and the cost does not change.

(Sixth embodiment)
Next, a sixth embodiment will be described. FIG. 8A is a cross-sectional view of the solid-state imaging device according to the sixth embodiment, FIG. 8B is a plan view of an enlarged cross-sectional view of part of FIG. It is FIG.8 (b) which shows this.

  The solid-state imaging device 1 of FIGS. 8A, 8 </ b> B, and 8 </ b> C is different from the solid-state imaging device 1 of the first embodiment in that a fixed region is obtained from the first uneven portion 16 corresponding to the pixel region 12. The second and third concavo-convex portions corresponding to the outer side from B are smaller in pitch. That is, the area between the convex portions is smaller in the second and third concave portions than in the first concave portion because the diameter of the convex portion and the distance between the adjacent convex portions are smaller. In other words, in the cross section perpendicular to the main surface of the substrate, the average of the minimum cross sectional areas of the concave portions of the second and third concave and convex portions is smaller than the average of the minimum cross sectional areas of the concave portions of the first concave and convex portions. ,That's what it means. The minimum cross-sectional area refers to an area surrounded by a vertical cross-section concave portion and a two-dot chain line as viewed from the side of the substrate by a line connecting the apexes of adjacent convex portions in FIG. The vertical cross section at a position shifted from the top of the convex portion has a larger cross-sectional area than the vertical cross section at the top of the convex portion. If the average of the minimum cross-sectional areas of the concave portions of the second concave and convex portions is smaller than the average of the minimum cross-sectional areas of the concave portions of the first concave and convex portions, the third concave and convex portions are fixed even if they are equal to the first concave and convex portions. The member is configured to easily penetrate into the second uneven portion. The same applies to the relationship between the diameters of the above-described protrusions and the distance between adjacent protrusions. Therefore, since the fixing member 23 easily penetrates outside the pixel region 12, the penetration of the fixing member 23 onto the pixel region 12 can be suppressed. In the method for manufacturing the solid-state imaging device 1, in the step of preparing the solid-state imaging device, the solid-state imaging device having the above-described configuration is prepared for the microlens. In such a configuration, since the fixing member 23 can easily penetrate into a region other than the pixel region, the penetration of the fixing member 23 onto the pixel region 12 can be suppressed. Therefore, the solid-state imaging device can be downsized. it can.

  Further, the microlens 16 corresponding to the pixel region 12 and the microlens corresponding to the region other than the pixel region can be formed in the same process. Therefore, the configuration of the solid-state imaging device of this embodiment is preferable because the manufacturing process does not increase and the cost does not change.

  In addition, when the microlens is formed by heating and melting, the microlens from the pixel area to the area facing the frame portion has the same structure, so that the microlens in the pixel area can be formed in a uniform situation, and has a good shape It becomes.

(Seventh embodiment)
Next, a seventh embodiment will be described. FIG. 9A is a cross-sectional view of the solid-state imaging device according to the seventh embodiment, and FIG. 9B is a plan view thereof.

  The solid-state imaging device 1 of FIG. 9 is different from the solid-state imaging device 1 of the first embodiment in that stripe-shaped convex portions are arranged in regions other than the pixel region. Also in the case of the stripe-shaped convex portion, it is preferable that the average of the minimum cross-sectional area is smaller in the second uneven portion than in the first uneven portion as described above. The minimum cross-sectional area of the second concavo-convex portion in the case of the stripe-shaped convex portion is an area surrounded by the concave portion in the vertical cross section at the position of the line orthogonal to the concave portion (groove). As described above, in order to suppress the penetration of the fixing member 23 onto the pixel region 12, in order to generate the capillary phenomenon in the region other than the pixel region, not only the microlens shape but also any other shape is used. May be. In the method for manufacturing the solid-state imaging device 1, in the step of preparing the solid-state imaging device, the solid-state imaging device having the above-described configuration is prepared for the second and third uneven portions. In such a configuration, since the fixing member 23 can easily penetrate into a region other than the pixel region, the penetration of the fixing member 23 onto the pixel region 12 can be suppressed. Therefore, the solid-state imaging device can be downsized. it can.

  In addition, the first uneven portion 16 serving as a microlens corresponding to the pixel region 12 and the stripe uneven portion corresponding to the region other than the pixel region can be formed in the same process. Therefore, the configuration of the solid-state imaging device of this embodiment is preferable because the manufacturing process does not increase and the cost does not change.

  In addition, when the microlens is formed by heating and melting, the microlens from the pixel area to the area facing the frame portion has the same structure, so that the microlens in the pixel area can be formed in a uniform situation, and has a good shape It becomes.

DESCRIPTION OF SYMBOLS 1 Solid-state imaging device 2 Solid-state image sensor 3 Cover member 4 Wiring board 11 Substrate 12 Pixel area 13 Terminal part 14 Color filter 15 Flattening film 16 Micro lens (1st uneven part)
17 2nd uneven | corrugated | grooved part 21 Flat plate part 22 Frame part 23 Fixing member 25 Space part

Claims (14)

Preparing a cover member;
A substrate having a pixel region having a plurality of light receiving portions on a main surface; a first uneven portion having a lens shape for condensing light on each of the plurality of light receiving portions; and a plurality of portions surrounding the first uneven portion. A step of preparing an image sensor having a second uneven portion having a convex portion;
Fixing the cover member with a fixing member in a region between the first uneven portion and the second uneven portion of the imaging element;
A method for manufacturing a solid-state imaging device.   The step of preparing the image pickup device is a cross section in a direction perpendicular to the main surface, and the average of the minimum cross-sectional areas of the concave portions of the second concavo-convex portions is the average of the minimum cross-sectional areas of the concave portions of the first concavo-convex portions. The method for manufacturing a solid-state image pickup device according to claim 1, wherein the step is a step of preparing an image pickup device having a small size.   The step of preparing the image pickup device is a step of preparing an image pickup device in which a plurality of convex portions of the second concavo-convex portion has a lens shape, and manufacturing the solid-state image pickup device according to claim 1 or 2 Method.   The step of preparing the image pickup device is a step of preparing an image pickup device in which a plurality of convex portions of the second concavo-convex portion has a stripe shape, and manufacturing a solid-state image pickup device according to claim 1 or 2 Method.   The step of preparing the image pickup device is a step of preparing an image pickup device in which the first uneven portion and the second uneven portion of the image pickup device are integrated. A method for producing a solid-state imaging device according to any one of the above.   The step of preparing the imaging device is a step of preparing an imaging device in which a flat portion is formed in the region between the first uneven portion and the second uneven portion of the image sensor. A method for manufacturing a solid-state imaging device according to claim 1.   The step of preparing the image sensor includes imaging in which a third uneven portion having a plurality of protrusions is formed in the region between the first uneven portion and the second uneven portion of the image sensor. The method for manufacturing a solid-state imaging device according to claim 1, wherein the device is a step of preparing an element.   The method of manufacturing a solid-state imaging device according to claim 7, wherein the step of preparing the imaging device is a step of preparing an imaging device in which a plurality of convex portions of the third concavo-convex portion has a stripe shape.   The step of preparing the image sensor includes preparing an image sensor having a color filter between the first uneven portion and the substrate and not having a color filter in the region where the cover member is fixed. The method for manufacturing a solid-state imaging device according to claim 1, wherein the manufacturing method is a step of:   10. The solid according to claim 1, wherein the step of preparing the image pickup device is a step of preparing an image pickup device in which a bank portion surrounding the periphery of the first uneven portion is formed. Manufacturing method of imaging apparatus.   11. The solid according to claim 1, wherein the step of preparing the image pickup device is a step of preparing an image pickup device in which a water repellent portion is formed on a surface of the first uneven portion. Manufacturing method of imaging apparatus. Preparing a cover member;
A substrate having a pixel region having a plurality of light receiving portions on a main surface, a first uneven portion having a lens shape for condensing light on each of the plurality of light receiving portions, and arranged around the first uneven portion A step of preparing an imaging device having a second concavo-convex portion having a force that allows the applied adhesive to permeate due to capillary action is not less than the first concavo-convex portion;
The cover member is placed via an adhesive in a region between the first uneven portion and the second uneven portion of the imaging element, and a part of the adhesive is transferred to the second uneven portion. A step of fixing the imaging element and the cover member, the adhesive being cured after infiltrating
A method for manufacturing a solid-state imaging device. An imaging device having a pixel region having a plurality of light receiving portions, and a first concavo-convex portion having a lens for focusing on each of the plurality of light receiving portions;
A solid-state imaging device having a cover member that covers the first concavo-convex portion and is fixed via the imaging element and a fixing member,
The imaging device is a solid-state imaging device that is arranged around the first concavo-convex portion, and has a second concavo-convex portion where a part of the fixing member covers a surface outside a region facing the cover member.   A wiring board fixed on the side opposite to the cover member side of the imaging element; a conductive part for transferring a signal between the imaging element and the wiring board; a periphery of the cover member; and the conductive part The solid-state imaging device according to claim 13, further comprising: a sealing member that seals.

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