JP2013224923A5 - - Google Patents

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JP2013224923A5
JP2013224923A5 JP2013007385A JP2013007385A JP2013224923A5 JP 2013224923 A5 JP2013224923 A5 JP 2013224923A5 JP 2013007385 A JP2013007385 A JP 2013007385A JP 2013007385 A JP2013007385 A JP 2013007385A JP 2013224923 A5 JP2013224923 A5 JP 2013224923A5
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JP6036321B2 (ja
JP2013224923A (ja
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JP2013007385A 2012-03-23 2013-01-18 Ｘ線複合装置 Active JP6036321B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013007385A JP6036321B2 (ja) 2012-03-23 2013-01-18 Ｘ線複合装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012068002 2012-03-23
JP2012068002 2012-03-23
JP2013007385A JP6036321B2 (ja) 2012-03-23 2013-01-18 Ｘ線複合装置

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JP2013224923A JP2013224923A (ja) 2013-10-31
JP2013224923A5 true JP2013224923A5 (https=) 2015-02-26
JP6036321B2 JP6036321B2 (ja) 2016-11-30

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US (1) US8971483B2 (https=)
JP (1) JP6036321B2 (https=)

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CN110376223B (zh) * 2013-04-04 2023-03-31 伊利诺斯工具制品有限公司 X射线成像系统及方法及数据存储媒介
WO2015031675A1 (en) * 2013-08-28 2015-03-05 The Regents Of The University Of California Nanoparticle assisted scanning focusing x-ray fluorescence imaging and enhanced treatment
JP2016099308A (ja) * 2014-11-26 2016-05-30 株式会社日立ハイテクサイエンス 蛍光ｘ線分析装置及び蛍光ｘ線分析方法
CN104634797A (zh) * 2015-02-12 2015-05-20 重庆大学 扇形平面/锥形束ct多转台同步扫描装置与方法
US10180404B2 (en) * 2015-04-30 2019-01-15 Shimadzu Corporation X-ray analysis device
US9939393B2 (en) * 2015-09-28 2018-04-10 United Technologies Corporation Detection of crystallographic properties in aerospace components
CN106896122B (zh) * 2015-12-18 2019-07-30 清华大学 液体检测方法和系统
JP6861470B2 (ja) * 2016-03-04 2021-04-21 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Ｘ線検査装置
US11051772B2 (en) * 2016-04-08 2021-07-06 Rensselaer Polytechnic Institute Filtration methods for dual-energy X-ray CT
WO2017213996A1 (en) * 2016-06-05 2017-12-14 Sigray, Inc. Method and apparatus for x-ray microscopy
US10352881B2 (en) * 2016-12-27 2019-07-16 Malvern Panalytical B.V. Computed tomography
CN118058764A (zh) * 2017-07-25 2024-05-24 清华大学 射线透射和荧光ct成像系统和成像方法
US10845491B2 (en) 2018-06-04 2020-11-24 Sigray, Inc. Energy-resolving x-ray detection system
GB2591630B (en) 2018-07-26 2023-05-24 Sigray Inc High brightness x-ray reflection source
WO2020051221A2 (en) 2018-09-07 2020-03-12 Sigray, Inc. System and method for depth-selectable x-ray analysis
CN110376226B (zh) * 2019-07-03 2021-01-08 浙江大学 一种涡轮发动机转子裂纹扩展特征确定方法
DE112020004169T5 (de) 2019-09-03 2022-05-25 Sigray, Inc. System und verfahren zur computergestützten laminografieröntgenfluoreszenz-bildgebung
US11175243B1 (en) 2020-02-06 2021-11-16 Sigray, Inc. X-ray dark-field in-line inspection for semiconductor samples
JP7395775B2 (ja) 2020-05-18 2023-12-11 シグレイ、インコーポレイテッド 結晶解析装置及び複数の検出器素子を使用するｘ線吸収分光法のためのシステム及び方法
WO2022061347A1 (en) 2020-09-17 2022-03-24 Sigray, Inc. System and method using x-rays for depth-resolving metrology and analysis
KR20260030946A (ko) 2020-12-07 2026-03-06 시그레이, 아이엔씨. 투과 x-선 소스를 이용한 고처리량 3D x-선 이미징 시스템
US12480892B2 (en) 2020-12-07 2025-11-25 Sigray, Inc. High throughput 3D x-ray imaging system using a transmission x-ray source
CN113390910A (zh) * 2021-06-23 2021-09-14 北京理工大学 一种基于劳厄衍射原理对全尺寸异型单晶无损检测的设备
US11817231B2 (en) * 2021-08-16 2023-11-14 Carl Zeiss Smt Gmbh Detection system for X-ray inspection of an object
US12040103B2 (en) 2021-08-16 2024-07-16 Carl Zeiss Smt Gmbh Imaging optical arrangement to image an object illuminated by X-rays
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JP7687689B2 (ja) * 2022-02-14 2025-06-03 株式会社リガク Ｘ線回折装置及び計測方法
WO2023168204A1 (en) 2022-03-02 2023-09-07 Sigray, Inc. X-ray fluorescence system and x-ray source with electrically insulative target material
WO2023177981A1 (en) 2022-03-15 2023-09-21 Sigray, Inc. System and method for compact laminography utilizing microfocus transmission x-ray source and variable magnification x-ray detector
CN114878614B (zh) * 2022-04-28 2025-10-21 度微检测技术(杭州)有限公司 X射线光片共聚焦三维荧光显微成像系统和方法
CN119173759A (zh) 2022-05-02 2024-12-20 斯格瑞公司 X射线顺序阵列波长色散光谱仪
CN121013975A (zh) 2023-02-16 2025-11-25 斯格瑞公司 具有至少两个堆叠的平面布拉格衍射器的x射线探测器系统
US12181423B1 (en) 2023-09-07 2024-12-31 Sigray, Inc. Secondary image removal using high resolution x-ray transmission sources
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