JP2013224923A5 - - Google Patents

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JP2013224923A5
JP2013224923A5 JP2013007385A JP2013007385A JP2013224923A5 JP 2013224923 A5 JP2013224923 A5 JP 2013224923A5 JP 2013007385 A JP2013007385 A JP 2013007385A JP 2013007385 A JP2013007385 A JP 2013007385A JP 2013224923 A5 JP2013224923 A5 JP 2013224923A5
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JP2013224923A (ja
JP6036321B2 (ja
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Ｘ線複合装置１００では、３Ｄ画像として表示された玉６００の表面上で、たとえば低密度の構造部分６１０が指定されると、その指定した低密度の構造部分６１０のみを内部構造も含め取り出し、その状態で表示できる。図１０は、試料における低密度の構造部分のみを取出した３Ｄ画像を示す図である。なお、図８〜１０に示す例は別の装置を用いて分析、表示したものであるが（「材料科学から見る美術工芸と文化財の美」、北田正弘著、内田老鶴圃発行、Ｐ４−７から引用）、Ｘ線複合装置１００を用いることで容易に同等の分析を行うことができる。
JP2013007385A 2012-03-23 2013-01-18 Ｘ線複合装置 Active JP6036321B2 (ja)

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JP2013007385A JP6036321B2 (ja) 2012-03-23 2013-01-18 Ｘ線複合装置

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JP2012068002 2012-03-23
JP2012068002 2012-03-23
JP2013007385A JP6036321B2 (ja) 2012-03-23 2013-01-18 Ｘ線複合装置

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JP2013224923A JP2013224923A (ja) 2013-10-31
JP2013224923A5 true JP2013224923A5 (ja) 2015-02-26
JP6036321B2 JP6036321B2 (ja) 2016-11-30

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JP (1) JP6036321B2 (ja)

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CN110376226B (zh) * 2019-07-03 2021-01-08 浙江大学 一种涡轮发动机转子裂纹扩展特征确定方法
DE112020004169T5 (de) 2019-09-03 2022-05-25 Sigray, Inc. System und verfahren zur computergestützten laminografieröntgenfluoreszenz-bildgebung
US11175243B1 (en) 2020-02-06 2021-11-16 Sigray, Inc. X-ray dark-field in-line inspection for semiconductor samples
JP7395775B2 (ja) 2020-05-18 2023-12-11 シグレイ、インコーポレイテッド 結晶解析装置及び複数の検出器素子を使用するｘ線吸収分光法のためのシステム及び方法
DE112021004828T5 (de) 2020-09-17 2023-08-03 Sigray, Inc. System und verfahren unter verwendung von röntgenstrahlen für tiefenauflösende messtechnik und analyse
DE112021006348T5 (de) 2020-12-07 2023-09-21 Sigray, Inc. 3d-röntgenbildgebungssystem mit hohem durchsatz, das eine transmissionsröntgenquelle verwendet
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