JP2013219200A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device capable of easily removing liquid and end materials from a top face of a workpiece.SOLUTION: A cutting device 1 comprises: a stationary base 2; and a cutting unit 4 provided on a top face 2a of the stationary base 2. The cutting unit 4 comprises: a chuck table 10; processing means 20 for performing cutting processing while supplying processing liquid; X-axis movement means 30; Y-axis movement means 40; Z-axis movement means 50; imaging means 60; cornices 13a and 13b that cover the X-axis movement means 30; and drain channels 15 provided on both sides of the X-axis movement means 30. The cutting unit 4 inclines in a Y(YA)-axis direction with an X(XA)-axis direction as a fulcrum so that the chuck table 10 is lowered with the edge 2b of the stationary base 2 as a center.

Description

  The present invention relates to a cutting apparatus that divides a plate-like workpiece into individual device chips.

  In a semiconductor device manufacturing process and various electronic component manufacturing processes, a cutting apparatus called a dicing saw that rotates a very thin cutting blade at high speed to divide a workpiece into individual products and chips is indispensable. In this type of cutting device, a cutting blade having a cutting edge thickness of 20 to 300 μm composed of a bonding material and fine abrasive grains (diamond, SiC, etc.) contained in a large amount in the bonding material is rotated at high speed, The planned division line of the workpiece (semiconductor wafer, glass, ceramics, etc.) is pulverized and removed at the micron level and divided into individual products and chips.

  In this processing, cooling and cleaning are performed using a liquid such as a processing liquid, but when observing with a microscope in order to check the state of the upper surface during processing, or when processing is completed and the work piece is taken out, Since the liquid is obstructive or unnecessary, it must be removed with an air gun or the like. In addition, when the workpiece is directly sucked and held, the area other than the product chip (end material part) is pushed away from the chuck table by the momentum of the machining liquid, falls on the bellows, and continues to the machining liquid. It rides on the flow and falls from the bellows to be processed (see, for example, Patent Document 1).

JP 2002-239888 A

  However, in a normal cutting apparatus, the apparatus is configured so that the upper surface of the chuck table is horizontal, so water on the upper surface of the workpiece placed on the chuck table is removed by some force. . For this reason, in a so-called manual type cutting apparatus that does not have a cleaning and conveying function, the operator removes the liquid on the upper surface of the processed workpiece by blowing high-pressure air from an air gun.

  Further, the liquid on the bellows covering the processing feeding means and the cut off end material were also removed by the same means. In particular, in the case of mill ends, it was necessary to be careful because if the mill ends were sandwiched between bellows, the bellows could be damaged, liquid could leak into the shaft of the processing feed means, and the device could be broken.

  This invention is made | formed in view of the above, Comprising: It aims at providing the cutting device which can remove easily a liquid and an end material from the upper surface of a to-be-processed object.

  In order to solve the above-described problems and achieve the object, a cutting apparatus according to the present invention includes a chuck table for holding a workpiece, and cutting while supplying a machining fluid to the workpiece held by the chuck table. Processing means for processing, processing feeding means for moving the chuck table in the processing feeding direction, indexing feeding means for moving the processing means in an indexing feeding direction orthogonal to the processing feeding direction, and processing means for the processing feeding Cutting means for moving in a direction perpendicular to the direction and the indexing feed direction, imaging means for imaging a region to be cut of the workpiece held on the chuck table, and connected to the chuck table, A cutting unit comprising a bellows covering the processing feed means and drainage channels disposed on both sides of the processing feed means along the processing feed direction is stationary. A cutting device disposed on a flat upper surface of a table, wherein the cutting unit is configured such that the stationary base is inclined in the index feed direction with the machining feed direction as a fulcrum so that the chuck table is lowered. It is characterized by being.

  Therefore, in the cutting apparatus of the present invention, the cutting unit including all of the processing feed means, the index feed means, and the cutting feed means has the stationary base indexed and fed with the work feed direction as a fulcrum so that the chuck table is lowered. Since it is inclined in the direction, the removal of liquids such as machining liquid and milled materials from the surface of the workpiece is naturally accelerated by gravity. In addition, since the machining feed direction, the index feed direction, and the depth direction are orthogonal to each other, the accuracy of the control of the machining feed means, the index feed means, and the cutting feed means is maintained without any change from before tilting. The effect of being played. Furthermore, since the chuck table for loading and unloading the workpiece is lowered, the operator can easily access the workpiece when placing the workpiece on the chuck table.

  Therefore, in the cutting device of the present invention, the liquid and the end material can be easily removed from the upper surface of the workpiece.

Drawing 1 is a figure showing the example of composition of the whole cutting device concerning an embodiment. Drawing 2 is a figure showing an example of composition of a cutting device of a cutting device concerning an embodiment. Drawing 3 is a figure showing the side of the cutting device concerning an embodiment. FIG. 4 is a perspective view showing a wafer or the like as a workpiece according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment
Drawing 1 is a figure showing the example of composition of the whole cutting device concerning an embodiment. Drawing 2 is a figure showing an example of composition of a cutting device of a cutting device concerning an embodiment. Drawing 3 is a figure showing the side of the cutting device concerning an embodiment. FIG. 4 is a perspective view showing a wafer or the like as a workpiece according to the embodiment.

  A cutting apparatus 1 according to the embodiment shown in FIG. 1 cuts a wafer W (corresponding to a workpiece) held on a chuck table 10 and divides it into individual device chips.

  Here, the wafer W as a workpiece is a workpiece to be machined, and is a disk-shaped semiconductor wafer or optical device wafer having silicon, sapphire, gallium or the like as a base material. As shown in FIG. 4, the wafer W has a plurality of devices D formed on the surface partitioned by a plurality of streets S in a lattice pattern. The wafer W is fixed to the annular frame F by adhering the adhesive tape T on the back surface opposite to the front surface, and the annular frame F being adhered to the adhesive tape T, and the cutting device 1 leaves the adhesive tape T. Then, the street S is cut and divided into devices D.

  As shown in FIGS. 1, 2 and 3, the cutting apparatus 1 includes a stationary base 2 having a chuck table 10 and a processing means 20 for cutting the wafer W on the upper surface 2a. A carry-in / out area O and a processing area P are provided on the upper surface 2 a of the base 2. The stationary base 2 is provided on the gantry 3. The chuck table 10 provided on the upper surface 2a of the stationary base 2 is movable by the X-axis moving means 30 (corresponding to the machining feed means) over the carry-in / out area O and the machining area P of the stationary base 2. Is provided. The chuck table 10 has a disk shape in which a portion constituting the surface is made of porous ceramic or the like, is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown), and is placed on the surface in the carry-in / out area O. The wafer W is sucked and held.

  The X-axis moving means 30 moves the chuck table 10 in the X (XA) axis direction (corresponding to the machining feed direction) between the loading / unloading area O and the machining area P, and the chuck table 10 is moved. A table moving base 12 is supported which is rotatably supported around a central axis (parallel to the ZA axis).

  A clamp portion 11 is provided around the chuck table 10 to sandwich the annular frame F around the wafer W. The chuck table 10 is provided on both sides of the chuck table 10 in the X (XA) axial direction. Bellows 13 a and 13 b that are connected and cover the X-axis moving means 30 are provided. The bellows 13a and 13b are made of an appropriate foldable material such as cloth, and expand and contract with the movement of the chuck table 10 so as to cover the X-axis moving means 30 together with the chuck table 10, and the X-axis moving means. It prevents that the process liquid mentioned later adheres to 30. It should be noted that drainage channels 15 for draining the processing liquid through the tube 14 are disposed on both sides of the X-axis moving means 30 along the X (XA) axis direction.

  Further, the processing region P on the upper surface 2a of the stationary base 2 is provided with processing means 20 that is positioned above the wafer W held by the chuck table 10 and performs cutting while supplying a processing liquid to the wafer W. Yes. The processing means 20 is applied to the wafer W held on the chuck table 10 in the YA axis direction (corresponding to the indexing direction) perpendicular to the X (XA) axis direction by the Y axis moving means 40 (corresponding to the indexing feeding means). It is moved and moved in the ZA axis direction (corresponding to the depth direction) perpendicular to the X (XA) axis direction and the YA axis direction by the Z axis moving means 50 (corresponding to the cutting feed means).

  The processing means 20 includes a cutting blade 21 that is rotationally driven by a blade drive source (not shown). The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape, and is cut into the wafer W by rotating. Apply. Further, the processing means 20 includes a nozzle 22 that supplies a processing fluid to the cutting blade 21, and the nozzle 22 injects the processing fluid toward the cutting blade 21 and a cutting portion of the wafer W cut by the cutting blade 21. . The machining means 20 is moved in the YA axis direction and the ZA axis direction by the Y axis moving means 40 and the Z axis moving means 50 in the machining area P, and jets the machining liquid from the nozzle 22 while rotating the cutting blade 21. Then, the wafer W held on the chuck table 10 is cut. At this time, the machining fluid ejected from the nozzle 22 collides with the cutting blade 21 and the cutting portion of the wafer W to be cut by the cutting blade 21, and then travels along the chuck table 10, the wafer W, and the bellows 13a, 13b to the drainage channel. 15 and is discharged out of the cutting apparatus 1 through the tube 14.

  Further, in the vicinity of the processing means 20, an imaging means 60 that is movable in the YA axis direction and the ZA axis direction by the Y axis moving means 40 and the Z axis moving means 50 is provided integrally with the processing means 20. The imaging means 60 includes a CCD camera that captures an area to be cut of the wafer W before cutting that is held on the chuck table 10 in the carry-in / out area O. The CCD camera captures the wafer W held on the chuck table 10. An image is obtained by imaging to obtain alignment for aligning the wafer W and the cutting blade 21, and information on the obtained image is displayed on the control means 70 and the display means 80 provided further above the processing means 20. Output.

  The control means 70 is mainly composed of an arithmetic processing unit constituted by a CPU or the like, and a microprocessor (not shown) provided with a ROM, a RAM, etc., and the image obtained by the imaging means 60 on the display means 80 and the state of the processing operation And an operation means (not shown) used when an operator registers machining content information and the like. When the chuck table 10 in the carry-in / out area O sucks and holds the wafer W before cutting, the control means 70 causes the X-axis moving means 30 to move the chuck table 10 toward the processing area P. Then, when the image of the wafer W before cutting obtained by the CCD camera is input from the imaging unit 60, the control unit 70 performs pattern matching for aligning the wafer W and the cutting blade 21 based on this image. The image processing such as the above is executed to align the processing means 20. Then, based on the alignment information, the control unit 70 causes the processing unit 20 to perform the cutting process on the streets S of the wafer W while ejecting the processing liquid from the nozzles 22, and the cutting process is performed on all the streets S. Then, the processing means 20 is stopped, and the chuck table 10 is moved to the carry-in / out area O. In this way, the control means 70 controls the above-described components constituting the cutting device 1 to cause the cutting device 1 to perform a machining operation on the wafer W.

  In the cutting apparatus 1 described above, the cutting unit 4 includes the chuck table 10, the processing means 20, the X-axis moving means 30, the Y-axis moving means 40, the Z-axis moving means 50, the imaging means 60, the bellows 13 a and 13 b, and the drainage channel 15. The cutting unit 4 is disposed on the flat upper surface 2 a of the stationary base 2. In the cutting apparatus 1 described above, an angle θ is formed between the ZA axis perpendicular to the upper surface 2 a of the stationary base 2 and the Z axis parallel to the vertical direction, and XA parallel to the upper surface 2 a of the stationary base 2. The axis coincides with the X axis parallel to the horizontal direction, and an angle θ is formed between the YA axis parallel to the upper surface 2a of the stationary base 2 and the Y axis parallel to the horizontal direction.

  In the cutting apparatus 1, the chuck table 10 is formed such that the ZA axis forms an angle θ with the Z axis, the XA axis coincides with the X axis, and the YA axis forms an angle θ with the Y axis. The stationary base 2 is inclined in the Y (YA) axis direction with the X (XA) axis as a fulcrum so as to be lowered (inclined around the X (XA) axis). In the present embodiment, the cutting apparatus 1 tilts the stationary base 2 around the X (XA) axis around the edge 2b of the stationary base 2 on the chuck table 10 side so that the chuck table 10 is lowered. . The angle θ is preferably between 3 degrees and 7 degrees, and more preferably about 5 degrees. Furthermore, in the cutting apparatus 1, even if the stationary base 2 is inclined as described above, the orientation of the display means 80 can be changed to an orientation that is easy for the operator to use.

  As described above, according to the cutting apparatus 1 according to the embodiment, the cutting unit 4 including all of the X-axis moving unit 30, the Y-axis moving unit 40, and the Z-axis moving unit 50 is configured so that the chuck table 10 is lowered. , Since it is inclined in the Y (YA) axis direction with the X (XA) axis direction as a fulcrum, the removal from the surface of the wafer W such as the machining fluid and the workpiece end material is naturally accelerated by gravity. . Further, the removal of the machining fluid is naturally promoted, and the XA axis, the YA axis, and the ZA axis are orthogonal to each other, so that the X axis moving means 30, the Y axis moving means 40, and the Z axis moving means 50 are controlled. There is also an effect that accuracy is maintained without changing anything before tilting. Furthermore, since the stationary base 2 is inclined as described above, the chuck table 10 for loading and unloading the wafer W is lowered, so that the operator can easily access the wafer W when placing it on the chuck table 10. There is also an effect. Therefore, the cutting apparatus 1 can easily remove the liquid such as the machining fluid and the end material of the workpiece from the surface of the wafer W.

  In the embodiment described above, the stationary base 2 is tilted around the edge 2b of the stationary base 2 near the chuck table 10 so that the chuck table 10 is lowered. However, in the present invention, the X (XA) axis is inclined. If the stationary base 2 is tilted about the center, the stationary base 2 may be tilted about an arbitrary position of the stationary base 2.

  In the present invention, the workpiece is not limited to the wafer W, and may be a plate member or a package substrate made of glass, resin, or the like. In the present invention, the package substrate as a workpiece may be directly held on the chuck table 10 without using the adhesive tape T or the annular frame F. When cutting a package substrate as a workpiece, it is desirable to use a rectangular chuck table having a clearance groove or the like that avoids contact with the cutting blade 21 on the surface.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Cutting device 2 Stationary base 2a Upper surface 4 Cutting unit 10 Chuck table 13a, 13b Bellows 15 Drainage channel 20 Processing means 30 X-axis moving means (processing feed means)
40 Y-axis moving means (index feed means)
50 Z-axis moving means (cutting feed means)
60 Imaging means O Loading / unloading area P Machining area X, XA Machining feed direction YA Index feed direction ZA Depth direction W Wafer (workpiece)

Claims (1)

A chuck table for holding the workpiece;
Processing means for cutting while supplying a processing fluid to the workpiece held by the chuck table;
Machining feed means for moving the chuck table in the machining feed direction;
Indexing feeding means for moving the machining means in an indexing feeding direction orthogonal to the machining feeding direction;
Incision feed means for moving the machining means in a depth direction perpendicular to the machining feed direction and the index feed direction;
Imaging means for imaging an area to be cut of the workpiece held on the chuck table;
A bellows connected to the chuck table and covering the processing feed means;
A cutting unit comprising a drainage channel disposed on both sides of the processing feed means along the processing feed direction is a cutting device disposed on a flat upper surface of a stationary base,
The cutting apparatus is characterized in that the stationary base is inclined in the index feed direction with the machining feed direction as a fulcrum so that the chuck table is lowered.

Images