JP2013214589A - Suction tool and component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a suction tool not easily sucking extraneous material in a through hole of a component when the component having the through hole penetrating vertically, is mounted on a substrate, and a component mounting apparatus.SOLUTION: A suction tool 22 is mounted on a mounting head 14 of a component mounting apparatus 1, and vacuum sucks and mounts a perforated component 2 having a through hole 2a penetrating vertically, on a substrate 3. The suction tool 22 has a structure that suction ports 45 which are apertures of a plurality of internal pipelines 44 connected to a vacuum supply line 14a at the mounting head 14, are annularly arrayed in a line on a component contacting surface 41b which is a contacting surface with the perforated component 2, and at least one of the plurality of suction ports 45 is positioned so as to outwardly protrude from an outer edge of a top surface 2b of the perforated component 2 in a state that the component contacting surface 41b is in contact with the top surface 2b of the perforated component 2.

Description

  The present invention relates to a suction tool that is attached to a mounting head provided in a component mounting apparatus and vacuum-sucks a component having a through-hole penetrating in the vertical direction and mounts it on a substrate, and a component mounting apparatus including the suction tool. is there.

  The component mounting apparatus is an apparatus for mounting a component such as an electronic component on a substrate positioned at a predetermined position, and a mounting head that is movably provided on the substrate is used for mounting the component. The mounting head has a suction tool attached to the lower end of a shaft member extending downward, and vacuum-sucks parts through this suction tool. The suction tool has a suction port formed by opening an internal pipe line connected to the vacuum pressure supply path on the mounting head side to the component contact surface, which is a contact surface with the component, and the vacuum pressure on the mounting head side. By supplying a vacuum pressure from the supply path into the internal pipe of the suction tool, a vacuum suction force is generated at the suction port, and the component contact surface is brought into contact with the upper surface of the component to suck the component.

  Among the suction tools provided in such a component mounting apparatus, it is possible to vacuum-suck a component (a perforated component) having a through hole (for example, a screw hole) penetrating in the vertical direction. 2. Description of the Related Art A part (suction port) is known that is arranged side by side in a shape (annular) corresponding to the shape of the upper surface of a component on the component contact surface (for example, Patent Document 1). When mounting a holed part on a board using such a suction tool, first, solder (or adhesive) for fixing is applied in advance to the target mounting position of the part on the board, and a plurality of suction parts are applied. The component contact surface of the suction tool is brought into contact with the upper surface of the component so that the mouth does not protrude into the inner space of the through hole of the component, and the mounting head is moved while the component is sucked by the multiple suction ports. It is located above the target mounting position on the substrate. Then, the suction tool is lowered to bring the lower surface of the component into contact with the upper surface of the substrate, and the supply of vacuum pressure to the suction tool is stopped at the timing when the component contacts the upper surface of the substrate (and further positive pressure is applied to the suction tool). The suction tool is raised.

Japanese Patent Laid-Open No. 11-346092

  However, when the perforated part is sucked by the suction tool and mounted on the substrate as described above, the suction tool is attached because the part is sucked in a state where the center axis of the suction tool is shifted from the center axis of the through hole of the part. If a part of the suction ports protrudes into the inner space of the through hole of the component, the component is brought into contact with the substrate as it is, and the top surface of the substrate and the component contact surface of the suction tool A high level of suction force acts in the inner space of the through hole of the part sandwiched between the parts, and the foreign material such as solder applied on the board is sucked into the suction tool, and the internal pipe line and mounting head of the suction tool There is a problem in that the adsorbing power of parts may be reduced by adhering in the vacuum pressure supply path on the side.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a suction tool and a component mounting apparatus that make it difficult to suck in foreign matters in a through hole of a component when a component having a through hole penetrating in the vertical direction is mounted on a substrate.

  The suction tool according to claim 1 is attached to a mounting head provided in a component mounting apparatus, and is a suction tool for vacuum-sucking a component having a through hole penetrating in the vertical direction and mounting the component on a substrate. Suction ports that are openings of a plurality of internal pipes connected to the vacuum pressure supply path on the side are arranged in a ring on a component contact surface that is a contact surface with the component, and at least one of the plurality of suction ports Is positioned so as to protrude outward from the outer edge of the upper surface of the component in a state where the component contact surface is in contact with the upper surface of the component.

  The suction tool according to claim 2 is the suction tool according to claim 1, wherein the through hole of the component is a screw hole.

  According to a third aspect of the present invention, a component mounting apparatus mounts a component on a board using the mounting head including the suction tool according to the first or second aspect.

  In the present invention, at least one of the plurality of suction ports arranged annularly on the component contact surface is positioned so as to protrude outward from the outer edge of the upper surface of the component with the component contact surface in contact with the upper surface of the component. In the state where the component contact surface is in contact with the upper surface of the component and the component is sucked, the vacuum pressure leaks from the protruding suction port. Even if the part is sucked in the state where the part protrudes into the inner space of the through hole of the part and the part is brought into contact with the board, a high level of suction is taken out into the inner space of the through hole of the part. The force does not act, and the suction tool can make it difficult to suck in the foreign matter in the through hole of the part.

The block diagram of the component mounting apparatus in one embodiment of this invention (A) Upper perspective view (b) Lower perspective view of a suction tool provided in a component mounting apparatus according to an embodiment of the present invention The partial cross section side view which shows the adsorption | suction tool in one embodiment of this invention with a perforated part (A) (b) The figure which shows a mode that the piercing | open_hole component attracted | sucked by the suction tool in one embodiment of this invention is mounted in a board | substrate. (A) (b) The figure which shows a mode that the piercing | open_hole component attracted | sucked by the suction tool in one embodiment of this invention is mounted in a board | substrate.

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 shown in FIG. 1 is an apparatus for mounting a component 2 (hereinafter referred to as a perforated component) 2 having a through hole 2a (for example, a screw hole) penetrating vertically on a substrate 3, and is a base (not shown). Mounting head movement comprising a substrate conveyor 11 provided on a table for conveying and positioning the substrate 3, a tray 12 as a component supply unit for supplying the perforated component 2, and an orthogonal axis robot provided on the platform The mechanism 13 includes a mounting head 14 that is movable above the substrate conveyor 11, a substrate camera 15 that is attached to the side of the mounting head 14, and a component camera 16 that is provided on the base.

  The mounting head 14 is provided with a plurality of shaft members 21 that can be moved up and down and rotated about the vertical axis, and a lower end of a part of the plurality of shaft members 21 is used for adsorbing the perforated component 2. A suction tool 22 is attached.

  The substrate camera 15 has an imaging field of view directed downward, and moves with the mounting head 14 to image the substrate mark 3m (FIG. 1) provided on the substrate 3 from above. The component camera 16 has an imaging field of view facing upward, and images the holed component 2 sucked by the mounting head 14 via the suction tool 22 from below.

  The board conveying conveyor 11 is controlled and operated by the control device 17 provided in the component mounting apparatus 1 (FIG. 1), and carries the board 3 and positions it at a predetermined work position.

  The mounting head moving mechanism 13 operates under the control of the control device 17 (FIG. 1), and moves the mounting head 14 in a horizontal plane. The raising / lowering operation and the rotating operation of the shaft member 21 provided in the mounting head 14 are performed when the control device 17 controls the operation of the shaft member driving mechanism 31 including an actuator (not shown) or the like (FIG. 1). The suction operation of the opening component 2 is performed when the control device 17 controls the operation of the suction mechanism 32 including an actuator (not shown) (FIG. 1).

  In FIG. 1, the control of the imaging operation by the substrate camera 15 and the imaging operation by the component camera 16 are performed by the control device 17. The image data obtained by the imaging operation of the board camera 15 and the image data obtained by the imaging operation of the component camera 16 are respectively transmitted to the control device 17, and image recognition processing is performed in the image recognition unit 17 a of the control device 17.

  As shown in FIGS. 2A, 2B, and 3, the suction tool 22 includes a cylindrical main body 41, a shaft member insertion portion 42 that protrudes upward from the upper surface 41a of the main body 41, and the main body. 41 has a frustoconical protrusion 43 that protrudes downward from a component contact surface 41b, which is the lower surface of 41. The shaft member insertion portion 42 is inserted into the lower end of the shaft member 21 from below and attached to the shaft member 21.

  The component contact surface 41b of the main body 41 is a surface that is in contact with the upper surface 2b (FIGS. 1 and 3) of the perforated component 2, and includes a plurality of internal conduits 44 connected to the vacuum pressure supply channel 14a on the mounting head 14 side. The suction port 45, which is an opening, is arranged in a ring on the component contact surface 41b. The protrusion 43 enters the through hole 2a of the perforated part 2 from above when the perforated part 2 is adsorbed by the suction tool 22, so that the rough positioning of the perforated part 2 with respect to the suction tool 22 is performed. It has become. The plurality of suction ports 45 are arranged such that at least one of the suction ports 45 protrudes outward from the outer edge of the upper surface 2b of the perforated component 2 in a state where the component contact surface 41b is in contact with the upper surface 2b of the perforated component 2. It is formed on the component contact surface 41b.

  In a state where the suction tool 22 is attached to the lower end of the shaft member 21 of the mounting head 14, the vacuum pressure supply path 14a on the mounting head 14 side and each internal pipe 44 of the suction tool 22 are in communication (FIG. 3). . For this reason, by supplying vacuum pressure from the suction mechanism 32 to the vacuum pressure supply path 14a in the mounting head 14 (air flow is indicated by broken lines in FIG. 3), vacuum suction is performed on the suction ports 45 of the suction tool 22. Can generate power.

  Next, a mounting operation of the holed component 2 on the substrate 3 by the component mounting apparatus 1 in the present embodiment will be described.

  In the mounting operation of the perforated component 2 to the substrate 3 by the component mounting apparatus 1, the control device 17 first operates the substrate transport conveyor 11 to transfer the substrate 3 sent from the apparatus on the upstream process side of the component mounting apparatus 1. The substrate 3 is received and conveyed, and the substrate 3 is positioned at a predetermined work position. After positioning the substrate 3 at the work position, the control device 17 controls the operation of the mounting head moving mechanism 13 to move the mounting head 14 and causes the substrate camera 15 to image the pair of substrate marks 3m on the substrate 3. . When the image data of the pair of substrate marks 3m is obtained, the control device 17 performs image recognition of the substrate marks 3m and obtains a positional deviation of the substrate 3 from the reference position.

  When the control device 17 obtains the positional deviation of the substrate 3 from the reference position, the control device 17 controls the operation of the mounting head moving mechanism 13 to position the mounting head 14 above the tray 12, and the shaft member driving mechanism 31 and the suction mechanism. Thus, the perforated component 2 is sucked by the suction tool 22 provided in the mounting head 14.

  In the suction of the perforated component 2 by the suction tool 22, the protrusion 43 provided in the suction tool 22 is inserted into the through hole 2 a of the perforated component 2 on the tray 12 from above, and the component contact surface 41 b of the suction tool 22. Is brought into contact with the upper surface 2b of the perforated component 2, and the suction mechanism 32 is operated to supply the vacuum pressure from the vacuum pressure supply path 14a on the mounting head 14 side into the internal pipe 44 of the suction tool 22. As a result, the perforated component 2 is sucked (vacuum sucked) by the suction tool 22.

  In a state where the component contact surface 41b is brought into contact with the upper surface 2b of the perforated component 2 and the perforated component 2 is adsorbed, at least one of the plurality of suction ports 45 arranged annularly on the component contact surface 41b of the suction tool 22 is used. One is located so as to protrude outward from the outer edge of the upper surface 2b of the perforated part 2, and since the vacuum pressure leaks from there, the suction force of the perforated part 2 by the suction tool 22 is weakened by the amount of the leak. It is in the state that was.

  The control device 17 moves the mounting head 14 so that the perforated component 2 passes above the component camera 16 when the perforated component 2 is attracted to the suction tool 22. Then, the component camera 16 performs imaging of the perforated component 2 and performs image recognition based on the obtained image data to calculate the positional deviation of the perforated component 2 with respect to the suction tool 22.

  When the control device 17 performs imaging and image recognition of the perforated component 2 and calculates the positional deviation of the perforated component 2 with respect to the suction tool 22, the control device 17 controls the operation of the mounting head moving mechanism 13 to place the mounting head 14 on the substrate 3. The perforated component 2 is positioned above the target mounting position on the substrate 3 (FIG. 4A or FIG. 5A). Solder Hd (or adhesive) for fixing the perforated component 2 on the substrate 3 is applied to the target mounting position on the substrate 3.

  When the control device 17 positions the perforated component 2 above the target mounting position on the substrate 3, the control device 17 moves the shaft member 21 downward relative to the mounting head 14 to lower the perforated component 2 (FIG. 4 ( a) or the arrow A) shown in FIG. 5A, the perforated component 2 is brought into contact with the target mounting position of the substrate 3 (FIG. 4B or FIG. 5B).

  When the perforated component 2 is brought into contact with the substrate 3, none of the plurality of suction ports 45 of the suction tool 22 protrudes into the inner space of the through hole 2a of the perforated component 2 (FIG. 4 ( a) → FIG. 4B), a high level of suction force does not act in the inner space of the through hole 2a of the perforated component 2 sandwiched between the upper surface of the substrate 3 and the component contact surface 41b of the suction tool 22. Of course, since the perforated component 2 is adsorbed in a state where the central axis of the suction tool 22 and the central axis of the through hole 2a of the perforated component 2 are shifted, one of the plurality of suction ports 45 of the suction tool 22 is absorbed. Even when the portion protrudes into the inner space of the through hole 2a of the perforated component 2 (FIG. 5 (a) → FIG. 5 (b)), the upper surface of the substrate 3 and the component contact surface of the suction tool 22 In the inner space of the through hole 2a of the perforated component 2 sandwiched by 41b Suction force of the level does not act.

  As described above, this is because the at least one of the plurality of suction ports 45 arranged annularly on the component contact surface 41b has the component contact surface 41b in contact with the upper surface 2b of the holed component 2 in the perforated component 2. This is because the vacuum pressure leaks from the outer edge of the upper surface 2b. As a result, the solder Hd in the inner space of the through hole 2a of the perforated component 2 remains on the substrate 3 without being sucked out from the suction port 45 to the mounting head 14 side.

  When the control device 17 brings the perforated component 2 into contact with the substrate 3 as described above, the control device 17 controls the operation of the suction mechanism 32 to release the vacuum suction of the perforated component 2 by the suction tool 22, and attaches it to the mounting head 14. In contrast, the shaft member 21 is moved upward. As a result, one holed component 2 is mounted at the target mounting position on the substrate 3.

  When the control device 17 mounts one perforated component 2 on the substrate 3 as described above, the control device 17 mounts the perforated component 2 on the target mounting position on the substrate 3 on which the perforated component 2 is not yet mounted. Do. When all the perforated components 2 to be mounted on the substrate 3 are mounted on the substrate 3 in this way, the control device 17 operates the substrate transfer conveyor 11 to mount the substrate 3 on the downstream process side of the component mounting device 1. To be taken out. The perforated component 2 mounted on the substrate 3 is used for screwing a cover member (not shown) separately prepared on the downstream process side.

  As described above, the suction tool 22 that is attached to the mounting head 14 provided in the component mounting apparatus 1 and that vacuum-sucks the perforated component 2 having the through hole 2a penetrating in the vertical direction and mounts it on the substrate 3 is mounted. Adsorption ports 45 that are openings of a plurality of internal pipe lines 44 connected to the vacuum pressure supply path 14a on the head 14 side are arranged in a ring on the component contact surface 41b that is a contact surface with the perforated component 2, and the plurality At least one of the suction holes 45 is configured to protrude outward from the outer edge of the upper surface 2b of the perforated component 2 in a state where the component contact surface 41b is in contact with the upper surface 2b of the perforated component 2. In a state where the component contact surface 41b is in contact with the upper surface 2b of the perforated component 2 and the perforated component 2 is adsorbed, the vacuum pressure leaks from the adsorbing port 45 that protrudes. For this reason, a part is adsorbed in a state where a part of the plurality of suction ports 45 of the suction tool 22 protrudes into the inner space of the through hole 2 a of the perforated part 2, and the perforated part 2 is brought into contact with the substrate 3. Even if it is made, high level suction force does not act in the inner space of the through-hole 2a of the perforated part 2, and the suction tool 22 is not suitable for solder Hd or the like in the through-hole 2a of the perforated part 2. It is possible to make it difficult to suck in foreign matter.

  In addition, the component mounting apparatus 1 that mounts the holed component 2 on the substrate 3 using the mounting head 14 having the suction tool 22 as described above mounts the holed component 2 on the substrate 3 with little foreign matter sucked in. Therefore, it is possible to increase the production efficiency with a low occurrence frequency of defective substrates.

  Provided are a suction tool and a component mounting apparatus that make it difficult to suck in foreign matter in a through hole of a component when a component having a through hole penetrating in the vertical direction is mounted on a substrate.

1 Component mounting equipment 2 Hole-drilled parts (parts)
2a Through hole 2b Upper surface of holed part
14 Mounting Head 14a Vacuum Pressure Supply Path 22 Suction Tool 41b Component Contact Surface 44 Internal Pipeline 45 Suction Port

Claims (3)

A suction tool that is attached to a mounting head provided in a component mounting apparatus and that vacuum-sucks a component having a through-hole penetrating in the vertical direction and attaches it to a substrate,
Adsorption ports that are openings of a plurality of internal conduits connected to the vacuum pressure supply path on the mounting head side are arranged in a ring on a component contact surface that is a contact surface with the component, and the plurality of adsorption ports At least one of the suction tools is positioned so as to protrude outward from the outer edge of the upper surface of the component in a state where the component contact surface is in contact with the upper surface of the component.   The suction tool according to claim 1, wherein the through hole is a screw hole.   A component mounting apparatus, wherein a component is mounted on a substrate using the mounting head including the suction tool according to claim 1.

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