JP2013207243A - Sheet sticking device and sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sheet sticking method capable of sticking an adhesive sheet without causing a gap, even for a stuck body having a recess.SOLUTION: A sheet sticking device 1 includes sheet support means 3 for supporting a plastically deformable adhesive sheet MS, plastic processing means 4 for plastically deforming the adhesive sheet MS supported by the sheet support means 3 so as to match the shape of a recess WF1 in a stuck body WF provided with the recess WF1 in one surface, and press means 5 for sticking the adhesive sheet MS, subjected to plastic processing by the plastic processing means 4, to one surface of the stuck body WF by pressing.

Description

  The present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.

Conventionally, in a semiconductor manufacturing process, an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape is attached to the surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) as an adherend. A sticking device is known (see, for example, Patent Document 1).
The sheet sticking device described in Patent Document 1 includes a table that holds and holds a wafer having a recess formed on one surface, and a pressing member that presses the adhesive sheet to the one surface of the held wafer. By pressing the adhesive sheet into the recess while elastically deforming the adhesive sheet with a member, the adhesive sheet can be stuck in the recess.

JP 2010-118584 A

  However, since the conventional sheet sticking apparatus as described in Patent Document 1 elastically deforms the adhesive sheet with the pressing member and sticks the adhesive sheet to the recess, tension is still applied to the stuck adhesive sheet. . For this reason, there is an inconvenience that an elastic restoring force acts on the adhesive sheet and the adhesive sheet is peeled from the concave portion, and a gap is generated between the wafer and the adhesive sheet.

  The objective of this invention is providing the sheet sticking apparatus and the sheet sticking method which can stick an adhesive sheet without producing a space | gap also to the to-be-adhered body which has a recessed part.

  The sheet sticking device of the present invention is a sheet sticking device for sticking a plastically deformable adhesive sheet to an adherend provided with a recess on one surface, the sheet supporting means for supporting the adhesive sheet, and the sheet Plastic working means for processing the adhesive sheet supported by the supporting means so as to be plastically deformed according to the shape of the concave portion of the adherend, and plastic working on one surface of the adherend by the plastic working means And pressing means for pressing and sticking the adhesive sheet.

In the sheet sticking device of the present invention, the plastic working means includes a mold formed in accordance with the shape of the recess, and an extension means for pressing the adhesive sheet against the mold and extending the adhesive sheet into the shape of the recess. Are preferably provided.
In the sheet sticking device of the present invention, the extension means is provided so as to be able to hold the adhesive sheet, and is provided to surround the first extension member, a first extension member that extends the adhesive sheet, and the adhesive It is preferable that the apparatus includes a second extending member that extends the sheet, and a moving unit that relatively moves the first extending member and the second extending member.
In the sheet sticking device of the present invention, it is preferable that the plastic working means constitutes the pressing means.

  On the other hand, the sheet sticking method of the present invention is a sheet sticking method for sticking a plastically deformable adhesive sheet to an adherend provided with a recess on one surface, the step of supporting the adhesive sheet and being supported. A step of plastically deforming the adhesive sheet in conformity with the shape of the concave portion of the adherend, and a step of pressing and sticking the plastically processed adhesive sheet to one surface of the adherend. It is characterized by that.

  According to the present invention as described above, since the adhesive sheet processed so as to be plastically deformed in accordance with the shape of the concave portion of the adherend is attached to the adherend, it is possible to prevent an elastic restoring force from acting on the adhesive sheet. The adhesive sheet can be adhered to the adherend without causing a gap between the concave portion of the adherend and the adhesive sheet.

In the present invention, if an extension means is provided, the adhesive sheet can be plastically deformed simply by pressing and stretching the adhesive sheet against the mold, so that the adhesive sheet can be plastically processed with a simple structure. The structure can be simplified.
Further, if the moving means is provided, the first extension member holding the adhesive sheet is extended while the region corresponding to the inner edge of the concave portion of the adhesive sheet is extended by the second extension member provided surrounding the first extension member. 2. The extension member can be moved in the direction opposite to the extension direction. As a result, the region of the adhesive sheet can be greatly expanded, so that the adhesive sheet can be reliably plastically deformed.
Further, if the pressing means is constituted by the plastic working means, it is not necessary to separately provide a structure for pressing the adhesive sheet against the adherend, so that the structure of the apparatus can be further simplified.

The partial cross section side view of the sheet sticking apparatus which concerns on one Embodiment of this invention. (A) And (B) is a sheet plastic processing operation explanatory drawing of a sheet sticking apparatus. Explanatory drawing of a sticking operation | movement of a sheet sticking apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, without giving a reference figure, for example, when showing directions such as up, down, left, right, near side, and back, all of FIG. 1 is viewed from a normal direction. , And the top, bottom, left, and right directions are directions parallel to the paper surface, and the front and back directions are directions orthogonal to the paper surface.

  As shown in FIG. 1, the sheet sticking apparatus 1 of the present embodiment has a mounting sheet MS as an adhesive sheet attached in advance so as to close the opening portion RF1 of the ring frame RF on a wafer WF as an adherend. The wafer WF and the ring frame RF are integrated with the mounting sheet MS. Here, the wafer WF is ground so that the outer edge is thicker than the other parts, so that the recess WF1 is formed on the inner side surrounded by the outer edge. In addition, the mounting sheet MS is configured such that an adhesive layer is laminated on one surface of a base material and can be plastically deformed.

  The sheet sticking apparatus 1 includes a sheet supporting unit 3 that supports the mounting sheet MS via the ring frame RF, and a plastic processing unit that processes the mounting sheet MS so as to be plastically deformed in accordance with the shape of the recess WF1 of the wafer WF. 4 and pressing means 5 for pressing and attaching the mounting sheet MS plastically processed by the plastic processing means 4 to one surface of the wafer WF.

  The sheet support means 3 is supported by a frame FR provided so as to be movable up and down by a linear motor LM1, and a support member having a support surface 32 provided with an opening 31 having substantially the same size as the opening RF1 of the ring frame RF. 33 and a clamping member 36 supported by the output shaft 34 of a linear motion motor 35 as a driving device supported on the surface opposite to the support surface 32, and is disposed above a table TB that supports the wafer WF. ing.

  The plastic working means 4 moves the die 41 in the vertical direction via a die 41 having an opening 41A provided in a shape slightly larger than the inner periphery of the recess WF1 of the wafer WF, and a plate PL1 supported by the output shaft 42A. A linear motor LM2 as a drive device including a linear motion motor 42 as a drive device for driving the plate, a plate PL2 for supporting the linear motion motor 42 from the lower surface, and a slider SL for supporting the plate PL2 from the lower surface, A plate-shaped upper surface portion 46A, a cylindrical side surface portion 46B, and an annular bottom surface portion 46C, and a first extension member 46 forming a chamber 46D communicating with a suction means 45 such as a vacuum pump or a vacuum ejector, are not shown. A drive device including an output shaft 47A supported by the frame FR via a bracket and supporting the first extension member 46 from the upper surface portion 46A. The linear motion motor 47, a plurality of linear motion motors 48 which are driving devices supported by the side surface portion 46B and also moving means, and an output shaft 48A of each linear motion motor 48, are supported by the first extension member. And an annular second extending member 49 disposed around 46.

A suction part 46E made of a disk-like porous body is formed on the bottom face part 46C of the first extension member 46, and the mounting sheet MS can be sucked through the suction part 46E.
An inclined surface that is inclined upward toward the inside of the second extending member 49 is formed at the lower end of the second extending member 49, and the inclined surface is provided with a pressurizing means 43 such as a pressurizing pump or a turbine. A pressure unit 49A that communicates is provided. The shape of the outer edge of the second extending member 49 is provided to be slightly smaller than the inner edge of the recess WF1 of the wafer WF.
The first extension member 46, the second extension member 49, and the linear motor LM1 constitute the pressing unit 5.

In the sheet sticking apparatus 1 described above, a procedure for sticking the mounting sheet MS to the wafer WF will be described.
First, when the conveying means (not shown) places the ring frame RF whose opening portion RF1 is closed by the mounting sheet MS on the support surface 32 of the support member 33, the sheet support means 3 moves linearly as shown in FIG. The motor 35 is driven and the ring frame RF is clamped by the clamping member 36. Then, the plastic working means 4 drives the linear motor LM2 to move the die 41 between the table TB and the sheet support means 3 as indicated by a two-dot chain line in FIG.

  Next, the plastic working means 4 drives the linear motion motor 42 to move the die 41 into the opening RF1 of the ring frame RF as indicated by the solid line in FIG. Abut.

  Next, the plastic working means 4 drives the linear motion motor 47 to lower the first and second extension members 46 and 49 as shown in FIG. The MS is pressed against the mold 41 with a pressing force exceeding the yield point of the mounting sheet MS and is expanded. Thereby, the inner periphery shape of the recessed part WF1 of the wafer WF can be formed in the mounting sheet MS.

  Here, if the mounting sheet MS is simply pressed against the mold 41 and stretched, the shape of the corners may not be reliably formed on the mounting sheet MS. For example, in the case where the corner is a right angle, even if the mounting sheet MS is stuck to the corner in this state, the mounting sheet MS is peeled off from the corner by the elastic restoring force, and the corner and the mount are mounted. An air gap may be generated between the sheet MS for use. Therefore, the plastic working means 4 drives the suction means 45 and sucks and holds the mounting sheet MS by the suction portion 46E. In this state, as shown in FIG. 2B, the plastic working means 4 drives the linear motion motor 48 while driving the linear motion motor 48 while lowering the second expansion member 49, thereby driving the first expansion member. By raising 46, the mounting sheet MS is pulled up by the first extending member 46 while the mounting sheet MS is pressed by the second extending member 49. At this time, the first extending member 46 is adjusted to pull up the mounting sheet MS with a tension that does not exceed the yield point of the mounting sheet MS. Thereby, the mounting sheet MS can be brought close to the shape (right angle) of the corner of the recessed portion WF1 of the wafer WF, and the mounting sheet MS matching the shape of the corner can be attached to the corner. It becomes.

  Next, the plastic working means 4 drives the linear motion motors 47 and 48 to move the first and second extension members 46 and 49 to the positions indicated by the solid lines in FIG. The plastic working means 4 drives the linear motion motor 42 to lower the die 41 and drives the linear motor LM2 to retract the die 41 to the position indicated by the solid line in FIG. When the mold 41 is retracted, the pressing means 5 drives the linear motor LM1, and as shown in FIG. 3, the frame FR is lowered toward the table TB on which the wafer WF is placed, and the first and second extending members 46 are moved. 49, the mounting sheet MS is pressed and stuck to the wafer WF. At this time, the pressurizing means 43 is driven and gas is sprayed onto the mount sheet MS from the pressurizing portion 49A of the second extension member 49, thereby securely attaching the mount sheet MS to the corner of the recess WF1. be able to.

  When the mounting of the mounting sheet MS is completed, the plastic working means 4 stops the suction means 45, releases the holding of the mounting sheet MS by the first extension member 46, and releases the support of the wafer WF on the table TB. Then, the pressing means 5 drives the linear motor LM1 to raise the frame FR to the position shown by the solid line in FIG. 1, and the plastic working means 4 drives the linear motion motor 47, and the first and second extending members 46, 49 is retracted to a position indicated by a solid line in FIG. Thereafter, when the sheet support means 3 drives the linear motor 35 to release the holding of the ring frame RF by the holding member 36, the wafer WF is transferred to the next process by a transfer means (not shown). Thereafter, the same operation as described above is repeated.

According to the present embodiment as described above, the following effects are obtained.
That is, since the mounting sheet MS processed so as to be plastically deformed in accordance with the shape of the concave portion WF1 of the wafer WF is attached to the wafer WF, it is possible to prevent the elastic restoring force from acting on the mounting sheet MS. The mounting sheet MS can be affixed to the wafer WF without creating a gap between the recess WF1 of the WF and the mounting sheet MS.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, the plastic working means 4 may push up the mounting sheet MS by providing another extending member on the opposite side of the first extending member 46 across the mounting sheet MS. Further, the mounting sheet MS is heated or cooled in a state in which the mounting sheet MS is pressed against the mold 41 by the first and second extending members 46 and 49, and the mounting sheet MS is processed to be plastically deformed. May be.

  The pressing means 5 may be provided as a single unit separately from the plastic working means 4, and a pressing member made of a roller, a blade material, rubber, resin, sponge, or the like can be employed. Furthermore, it is also possible to employ a configuration in which gas is supplied to the chamber 46D, gas is sprayed from the bottom surface portion 46C onto the mounting sheet MS, and pressed against the recess WF1.

  Further, the sheet support means 3 may suck and hold the ring frame RF by the support surface 32 of the support member 33. Further, only the mounting sheet MS may be sandwiched or adsorbed and held.

  Further, the suction part 46E is not limited to a porous body, and may be, for example, a single or a plurality of suction holes or grooves communicating with the chamber 46D.

  Further, the adherend may be a glass plate, a steel plate, a resin plate, or the like other than the wafer WF. The wafer WF can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet attached to such a semiconductor wafer is not limited to the mounting sheet MS, but a protective sheet, a dicing tape, a die attach film, and the like. Arbitrary uses, shapes, etc., such as arbitrary sheets, films, and tapes can be applied.

In addition, the type and material of the adhesive sheet are not particularly limited. For example, the adhesive sheet may have an intermediate layer provided between the base sheet and the adhesive layer, or may have three or more layers such as other layers. Alternatively, a single adhesive layer without a base sheet may be used.
Further, the adherend may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. As described above, as an adherend, any form of member or article can be targeted.

  The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Sheet sticking apparatus 3 Sheet support means 4 Plastic processing means 5 Press means 41 Type | mold 46 1st extending | stretching member (extension means)
47 Linear motor (moving means, extending means)
49 Second extension member (extension means)
MS mount sheet (adhesive sheet)
WF Wafer (Substrate)
WF1 recess

Claims (5)

A sheet sticking device for sticking a plastically deformable adhesive sheet to an adherend provided with a recess on one surface,
Sheet support means for supporting the adhesive sheet;
Plastic working means for processing the adhesive sheet supported by the sheet supporting means to plastically deform in accordance with the shape of the concave portion of the adherend;
A sheet pasting apparatus comprising: a pressing unit that presses and bonds the adhesive sheet plastic-processed by the plastic processing unit to one surface of the adherend.   The plastic working means includes a mold formed in accordance with the shape of the recess, and an extension means for pressing the adhesive sheet against the mold and extending the adhesive sheet into the shape of the recess. The sheet sticking device according to claim 1. The extension means includes
A first extension member provided to hold the adhesive sheet and extending the adhesive sheet;
A second extension member provided around the first extension member and extending the adhesive sheet;
The sheet sticking apparatus according to claim 2, further comprising a moving unit that relatively moves the first extending member and the second extending member.   The sheet sticking device according to any one of claims 1 to 3, wherein the plastic working means constitutes the pressing means. A sheet sticking method for sticking a plastically deformable adhesive sheet to an adherend provided with a recess on one surface,
Supporting the adhesive sheet;
A process of plastically deforming the supported adhesive sheet according to the shape of the concave portion of the adherend, and
And a step of pressing and sticking a plastically bonded adhesive sheet on one surface of the adherend.

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