JP2013205790A - Exposure marking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure marking device capable of easily positioning a substrate and forming an alignment mark on the substrate at satisfactory accuracy.SOLUTION: An exposure marking device comprises a marking part consisting of four marking heads 16A to 16D and a substrate positioning part. The marking heads 16A to 16D are provided with positioning pins X1 to X4 to position a substrate in relation to a substrate conveyance orthogonal direction (X direction). When the substrate is positioned, the marking heads 16A to 16D are moved to touch the positioning pins X1 to X4 to a substrate edge to position the substrate automatically, and the marking heads 16A to 16D are positioned at mark formation positions.

Description

  The present invention relates to an exposure marking apparatus that forms an alignment mark on a substrate by exposure, and more particularly to a stand-alone exposure marking apparatus that is independent of an exposure apparatus that forms a pattern such as an electronic circuit.

  In the substrate manufacturing process, an alignment mark is formed on the substrate before the exposure process of projecting pattern light onto the substrate. The drawing position is determined according to the position of the alignment mark. Further, the deformation amount of the substrate is detected from the difference between the predetermined reference position and the position of the alignment mark actually detected, and the drawing data is corrected according to the degree of deformation.

  As a method for forming the alignment mark, there is an exposure method for forming a resist latent image of the alignment mark by irradiating the substrate with light such as ultraviolet rays, in addition to a method for forming a hole in the substrate using a drill. In recent years, it is required for various applications to stack substrates and mount higher-density electronic circuit patterns, and exposure marking is used to mark an inner layer substrate and an outer layer substrate.

  For example, in the case of a maskless exposure apparatus that directly draws a pattern using a light modulation element such as a DMD (Digital Micro-mirror Device), a light source for forming a mark (such as an LED light source) is provided in the exposure apparatus. Perform exposure marking.

  As a configuration for performing exposure marking, an exposure apparatus that performs shot exposure for marking in a state in which a mark forming mechanism is installed around the drawing table and the substrate is set on the drawing table is known (for example, see Patent Document 1). ). On the other hand, a configuration is also known in which a marking place is provided separately from the drawing table and marking is performed before the drawing process (see Patent Document 2).

  Specifically, the substrate put into the exposure apparatus is carried into a place where the marking forming mechanism is located. Therefore, after aligning the substrate position, marking is performed on the four corners of the substrate. After the marking process, the drawing process is performed by conveying the substrate to the drawing table and projecting pattern light from an exposure head equipped with a DMD.

  When adjusting the substrate position so that the alignment of the substrate position, that is, the marking on the four corners of the substrate 4 can be performed, the positioning pins are brought into contact with the respective end faces of the substrate. When an alignment plate that can be moved up and down is installed in the lower part of a conveyance mechanism such as a roller, and the substrate is carried above the alignment plate, the alignment plate rises.

  An alignment pin is attached to the alignment plate, and the substrate is positioned as the plate rises. Thereafter, four mark forming mechanisms including a pair of light sources arranged at opposing positions move to the four corners of the substrate along guide rails or the like, and perform shot exposure of the marking light.

  Such an exposure apparatus capable of forming alignment marks is premised on installation in a substrate production line for mass production. In this case, the exposure apparatus operates so as to sequentially draw the substrates conveyed one after another (here, such an exposure apparatus is referred to as an automatic exposure apparatus). Therefore, once a target substrate is determined, substrates of the same size are sent one after another, and the same pattern light is projected onto the substrate.

  On the other hand, there is also known an exposure apparatus (herein referred to as a manual exposure apparatus) for the purpose of manufacturing a prototype substrate or a small quantity of various types of substrates. In this case, an operator puts substrates one by one into the exposure apparatus and performs a drawing process (see Patent Document 3).

  In the case of a manual exposure apparatus, an exposure marking mechanism is not incorporated. Therefore, a marking process is performed before exposure using a drilling machine or a dedicated exposure marking device (see, for example, Patent Document 4).

US Pat. No. 6,701,197 JP 2008-292915 A JP 2005-316411 A JP 2010-34165 A

  In the case of a manual exposure apparatus for a substrate that is produced in a small quantity and a variety of products, the size of the substrate to be input varies and is not uniform. Therefore, when aligning the substrate position, it is necessary to adjust the position of the substrate and the position of the alignment mark forming mechanism in accordance with the substrate size.

  However, in the case of the alignment mark forming mechanism built in the automatic exposure apparatus, the positioning is performed by applying a positioning pin to the end face of the substrate, and the marking apparatus is moved to a desired mark forming location using the standing position of the pin as an index. There is a need.

  Each time a substrate of various sizes is put in, it is necessary for the operator to adjust the moving installation point of the positioning pins and the moving position of the marking device, that is, to set the substrate alignment mechanism for each different size substrate. It will be a big burden for us.

  Therefore, it is required to accurately align the substrate and automatically form the alignment mark at an appropriate position even if substrates of various sizes are loaded without any special work by the operator.

  The exposure marking apparatus of the present invention can be applied as an alignment mark forming apparatus for a substrate used in a manual exposure apparatus, and in particular, can be applied to a maskless exposure apparatus using a light modulation element such as DMD. It can also be used in place of a hole punch used in a mask exposure apparatus or the like.

  For example, it can be configured as an independent unit that is not incorporated in the exposure apparatus. Moreover, you may provide the clean roller which removes the dust of the board | substrate conveyed by a conveyance part during conveyance.

  The exposure marking apparatus is movable along at least one direction of a transport unit that transports a loaded substrate, a substrate transport direction and a substrate transport orthogonal direction, and irradiates the substrate with light to form alignment marks. A mark forming unit; and a driving unit configured to move the plurality of mark forming units. The exposure apparatus also includes a plurality of substrate positioning members that can position the transported substrate along a direction in which the plurality of mark forming portions can move. The plurality of positioning members are arranged to correspond to the plurality of mark forming portions, respectively.

  In the present invention, when aligning the substrates, the drive unit moves the plurality of mark forming units toward the center of the substrate. Along with this, the plurality of substrate positioning members move in the same direction in conjunction with the movement of the corresponding mark forming portions, and position the substrate along at least one of the substrate transport direction and the substrate transport orthogonal direction. In accordance with this, a plurality of mark forming portions are positioned at predetermined alignment mark forming positions.

  That is, the drive unit of the present invention moves the plurality of mark forming units and interlocks the substrate positioning member in the same direction according to the movement. A series of operations such as substrate alignment, movement of the mark forming portion, and alignment of the substrate (positioning of the mark forming portion with respect to the substrate) are performed simultaneously.

  As a configuration in which the positioning member moves in conjunction with the mark forming portion, an independent driving portion for the positioning member can be prepared and interlocked by electronic control or the like. On the other hand, it is also possible to realize the interlocking movement of the positioning member and the mark forming member while being based on the same power source by the mechanically connected configuration.

  Therefore, the substrate positioning member can be configured to move integrally in the same direction as the mark forming portion by mechanical interlocking when the mark forming portion is moved by the driving portion. “Mechanical interlocking” here refers to interlocking according to mechanical structure, mechanical force, and action, unlike controlled movement based on electronic and electrical signals.

  As a simple configuration for realizing the integral movement, it is possible to create a structural connection between the positioning member and the mark forming portion. For example, the plurality of substrate positioning members can be connected to and connected to the corresponding mark forming portions.

  When the substrate is finally positioned, it is desirable that the positioning of the mark forming portion is completed at the same time. Therefore, the substrate positioning member can be attached to the corresponding mark forming portion so that the plurality of mark forming portions can irradiate the mark target position with light when the substrate is positioned.

  Further, it is possible to determine the attachment position of the positioning member in consideration of the fact that the positioning member comes into contact with the substrate when moving the mark forming portion. For example, the substrate positioning members are connected to the corresponding mark forming portions at a predetermined distance from the center of the substrate along the substrate transport direction. And as a shape and structure of a board | substrate positioning member, it is possible to form in the rod-shaped member extended in a board | substrate perpendicular | vertical direction, for example.

  In order to simultaneously align the substrate and align the substrate (positioning with the mark forming portion) while the transport portion moves the substrate along the transport direction, it is preferable to move the mark forming portion in the substrate transport orthogonal direction. For example, the plurality of mark forming portions can move in the substrate conveyance orthogonal direction, and the plurality of substrate positioning members can position the substrate along the substrate conveyance orthogonal direction. In this case, a substrate position alignment unit that adjusts the position of the substrate in the substrate transport direction may be provided.

  The number of mark forming portions and substrate positioning members is arbitrary. For example, the mark forming unit includes first and second mark forming units moving along the same line, and third and fourth moving along different lines from the first and second mark forming units. It is comprised from the mark formation part. The first to fourth mark forming portions move so as to form alignment marks at least at the four corners of the substrate.

  Depending on the substrate size, it may not be possible to use all the positioning members by moving all the mark forming portions. In this case, the driving unit moves the first and second mark forming units toward the alignment mark forming position, and after the exposure marking by the first and second mark forming units is completed, the third and fourth The mark forming portion can be moved toward the alignment mark forming position.

  In addition, it is desired that substrate alignment is performed by moving similar mark forming portions and positioning members even for substrates of various sizes. In that case, it is also possible for the drive unit to move the plurality of mark forming units so as to center the substrate along the substrate conveyance orthogonal direction in the substrate position adjustment area.

  An exposure marking method according to another aspect of the present invention is capable of transporting a loaded substrate and moving along at least one of a substrate transport direction and a substrate transport orthogonal direction, and irradiating the substrate with light to mark an alignment mark. The plurality of mark forming portions to be formed are moved toward the center of the substrate, and are arranged so as to correspond to the plurality of mark forming portions, respectively, and the conveyed substrate is moved in a direction in which the plurality of mark forming portions can move. A plurality of substrate positioning members that can be positioned along the same direction are moved in the same direction in conjunction with the movement of the corresponding mark forming portions, and the substrate is positioned along at least one of the substrate transport direction and the substrate transport orthogonal direction. At the same time, a plurality of mark forming portions are positioned at predetermined alignment mark forming positions, and exposure is performed so as to form alignment marks on the substrate. And wherein the Rukoto.

  An exposure marking apparatus according to another aspect of the present invention is capable of moving along at least one of a substrate transport direction and a substrate transport orthogonal direction, and irradiates the substrate with light to form an alignment mark, and a mark The substrate positioning member that can be positioned and corresponded to each of the forming portions, and can position the substrate along the direction in which the mark forming portion can move, and the mark forming portion, and the substrate positioning member in the same direction The drive unit moves the mark forming unit and the substrate positioning member toward the center of the substrate, and positions the substrate along at least one of the substrate transport direction and the substrate transport orthogonal direction. In addition, the mark forming portion is positioned at a predetermined alignment mark forming position.

  According to the present invention, the substrate position can be reliably aligned, and the alignment mark can be accurately formed on the substrate.

It is the figure which showed typically the internal structure of the exposure marking apparatus which is this embodiment. It is the figure which showed the arrangement configuration of a marking part. It is a front view of the marking head which comprises a marking part. It is a side view of a marking head. It is the flow which showed a series of flow of marking processing. It is the figure which showed the structure of the conveyance part. It is the figure which showed the position of the backup plate and the alignment pin.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram schematically showing an internal configuration of an exposure marking apparatus according to the present embodiment.

  The exposure marking apparatus 10 is a stand-alone exposure marking apparatus used in combination with a manual exposure apparatus (not shown). The manual type exposure apparatus is configured as a maskless exposure apparatus that directly draws using, for example, a DMD, and mainly performs a drawing process on a prototype substrate and a substrate intended for small-quantity multi-product production. A pre-alignment mechanism for forming alignment marks on a substrate is not mounted on a manual exposure apparatus.

  The exposure marking apparatus 10 includes a loading unit 12 and a conveyance unit 14, and a substrate S on which a photoresist is formed is loaded into the loading unit 12 by an operator or a hand robot. The input unit 12 and the transfer unit 14 include a plurality of conveyor rollers (not shown here) arranged in one direction, and both transfer the substrate S to the alignment mark formation place.

  A clean roller 24 is installed between the input unit 12 and the transport unit 14. The clean roller 24 removes dust, dust, and the like attached to the surface of the substrate S by rolling.

  A substrate position alignment unit 20 is provided below the transport unit 14. The substrate position alignment unit 20 includes a backup plate 70 that can be moved up and down in the vertical direction perpendicular to the substrate movement direction. The substrate position alignment unit 20 includes a sensor (not shown) that detects the position of the substrate S to be transported, and detects whether the substrate S has reached the alignment location. The elevation drive unit 11 raises and lowers the backup plate 70.

  On the other hand, a marking unit 16 is provided above the conveyance unit 14. As will be described later, the marking unit 16 is composed of a plurality of marking heads (not shown here), and each head constituting the exposure device is configured to be movable.

  The drive unit 18 drives the marking unit 16 to move to the marking position. The control unit 22 outputs a control signal to the marking unit 16, the drive unit 18, the substrate position matching unit 20, and the like, and controls the operation of the entire marking process.

  When the substrate S is transported to the transport unit 14, the backup plate 70 rises with the substrate S placed thereon, and the substrate is aligned with the substrate S lifted. When the substrate S is positioned, a marking process for forming alignment marks at the four corners of the substrate by exposure is performed.

  After the marking process is completed, the substrate S is transported to the input unit 12 by the transport unit 14. An operator, an arm robot, or the like takes out the substrate S from the loading unit 12 and then installs the substrate S marked on the drawing table of the manual exposure apparatus.

  In the manual exposure apparatus, the position of the substrate S is set to the drawing position based on the alignment marks formed at the four corners of the substrate S. Further, the substrate deformation amount is calculated based on the difference between the predetermined reference alignment mark position and the actually measured alignment mark position, and the drawing data is corrected according to the substrate deformation amount.

  Next, the structure of a marking part is demonstrated using FIGS.

  FIG. 2 is a diagram showing an arrangement configuration of the marking portion. FIG. 3 is a front view of a marking head constituting the marking portion. FIG. 4 is a side view of the marking head.

  The marking unit 16 includes four marking heads 16A to 16D. Marking heads 16A to 16D as exposure devices are movable along a direction (hereinafter referred to as X direction) perpendicular to a substrate transport direction (hereinafter referred to as Y direction), marking heads 16A and 16B, and marking 16C and 16D move along guide rails 55 and 56 extending in the X direction, respectively.

  When marking, the marking heads 16A and 16B move so as to approach each other from both ends of the substrate toward the center. The marking heads 16C and 16D move in the same manner. The amount of movement varies according to the substrate size.

  Alignment pins X1 to X4 are attached to the marking heads 16A to 16D, respectively, and the alignment pins X1 to X4 contact the substrate end faces K1 and K2 along the substrate transport direction to position the substrate. The alignment pins X1 to X4 are positioned closer to the center of the substrates MB and NB than the alignment marks AM1 to AM8. When the alignment pins X1 to X4 come into contact with the substrate end faces K1 and K2, the substrate is positioned, and the alignment marks are left as they are. The formation position is uniquely determined.

  FIG. 2 illustrates the positions of the marking heads 16A to 16D when the maximum size substrate MB and the minimum substrate NB that can be marked are positioned. However, in the case of the largest substrate MB, alignment marks AM1 to AM4 are formed at the positions of the four corners of the substrate. In the case of the minimum substrate NB, alignment marks AM5 to AM8 are formed at the positions of the four corners of the substrate. In the case of the substrate NB having the minimum size, the alignment pins X1 and X2 and the alignment pins X3 and X4 come into contact with the substrate at different stages.

  FIG. 3 shows the marking head 16A viewed from the R direction in FIG. FIG. 4 shows the marking head 16A viewed from the Q direction in FIG. The marking head 16 </ b> A includes L-shaped light source units 44 </ b> A and 44 </ b> B for marking by irradiating light on both the front and back surfaces of the substrate S.

  The light source unit 44A for exposing the substrate surface and the light source unit 44B for exposing the back surface of the substrate include LEDs 46A and 46B (see FIG. 4), respectively, and irradiate light in a short wavelength region such as ultraviolet rays. Further, the light source portions 44A and 44B have openings that follow the alignment mark shape.

  The light source unit 44A is held by a slide guide 56A (see FIG. 4), and can be moved up and down along the substrate vertical direction (hereinafter referred to as Z direction) by an air cylinder 42A (see FIG. 3). The light source unit 44B is held by a slide guide 56B (see FIG. 4) and moved up and down by an air cylinder 42B (see FIG. 3). A guide rail 54 is interposed between the slide guides 56A and 56B.

  The marking head 16A is configured such that the attachment mechanism 57 holds the entire head, and includes a plate 57A that supports the light source portions 44A and 44B and a plate 57B that extends in a horizontal direction perpendicular to the plate 57A. . The plate 57B is attached with a drive unit 18 composed of a linear motion actuator or the like, and is movable along a guide rail 55 extending along the substrate transport orthogonal direction (X direction). The attachment mechanism 57 is driven by the drive unit 18.

  The alignment pin X1 (see FIG. 4, not shown in FIG. 3) is attached and fixed at a position opposite to the light source portions 44A and 44B with the guide rail 55 interposed therebetween so as to protrude downward from the plate 57B. . In addition, the alignment pin is disposed on the outer side of the substrate with respect to the light source portions 44A and 44B in the substrate conveyance orthogonal direction (X direction).

  The mounting position of the alignment pin X1 is adjusted in advance so that the positions of the light source portions 44A and 44B coincide with the desired alignment mark formation position when the substrate is aligned, that is, when the alignment pin X comes into contact with the substrate. The marking head 16A includes a sensor (not shown) that detects contact between the alignment pin X1 and the substrate. The marking heads 16B, 16C, and 16D other than the marking head 16A are similarly configured.

  FIG. 5 is a flow showing a series of flow of the marking process. FIG. 6 is a diagram illustrating the configuration of the transport unit. FIG. 7 is a view showing the positions of the backup plate and the alignment pin. The substrate alignment and marking process will be described with reference to FIGS.

  When the substrate is loaded after the preliminary data processing operation and the operation start button is operated, the substrate is transported to the transport unit 14 via the clean roller 24 (S101 to S106). As shown in FIG. 6, the transport unit 14 includes a conveyor roller 14 </ b> A, and the substrate S is moved to a predetermined position of the transport unit 14 by the conveyor roller 14 </ b> A. When the substrate S reaches a predetermined position, the conveyor roller 14A stops (S107).

  The backup plate 70 constituting the substrate position aligning unit 20 is held at a position J1 below the conveyor roller 14A during substrate transport. When the conveyor roller stops, the backup plate 70 rises to the marking position J2 (S108). Then, the substrate is aligned at the marking position by the substrate alignment operation (S109).

  As shown in FIG. 7, the backup plate 70 is a plate having a size larger than the maximum substrate MS, and the marking heads 16A to 16D having the alignment pins X1 to X4 move along the substrate conveyance orthogonal direction (X direction). A plurality of cut portions TX are formed so as to be possible.

  On the other hand, with respect to the substrate transport direction (Y direction), alignment pins Y1, Y2, Y3, and Y4 for positioning the substrate are provided in the substrate position alignment unit 20. The backup plate 70 is formed with cut portions TY that allow the alignment pins Y1 to Y4 to move.

  After the backup plate 70 is lifted, the alignment pins Y1 and Y2 move along the cut portion TY to a position where the alignment pins Y1 and Y2 come into contact with the conveyed substrate. In addition, the alignment pins Y3 and Y4 on the substrate carry-in side rise from the lower side after the substrate is lifted, and move along the cut portions TY formed in the back plate 70.

  Simultaneously with the substrate positioning operation along the substrate transport direction (Y direction), the substrate positioning operation along the substrate transport orthogonal direction (X direction) is executed by the movement of the marking heads 16A to 16D. Specifically, the marking heads 16A and 16B and the marking heads 16C and 16D move by substantially the same distance so as to set the substrate to the center in the substrate transport orthogonal direction (X direction). When the alignment pins X1 to X4 come into contact with the substrate end surface, the substrate is automatically positioned at the marking position.

  In the present embodiment, the procedure of substrate alignment and marking processing differs depending on the substrate size. The substrate size is detected based on a substrate position detection sensor provided in the substrate position aligning unit 20, or is detected by an input operation by an operator.

  The marking process for the maximum substrate MS will be described. The alignment pins Y1, Y2, Y3, and Y4 move toward the center of the substrate and come into contact with the substrate end surfaces K3 and K4. At the same time, the marking heads 16A to 16D move from the outside of the substrate toward the center line and come into contact with the end faces K1 and K2 of the substrate MS.

  When the marking heads 16A to 16D are positioned, the alignment marks are formed at the four corners of the substrate by irradiating ultraviolet rays toward both surfaces of the substrate (S110). In FIG. 7, an alignment mark MP formed on the front side of the largest substrate MS is shown.

  On the other hand, if the substrate size is small and only one marking head can be positioned with respect to the end faces K1 and K2 along the substrate transport direction (Y direction), the marking head is positioned in stages and the marking process is also performed in stages. Is called.

  The marking process for the minimum substrate NS will be described. When the substrate NS is transported to near the alignment pins Y1 and Y2 in the transport direction (Y direction), the substrate NS is lifted by the backup plate 70. Then, simultaneously with the alignment pins Y1 and Y2 moving toward the smallest substrate NS, the two marking heads 16A and 16B move toward the substrate center line.

  When the alignment pins Y1 and Y2 are in contact with the substrate end surface L3 and the alignment pins X1 and X2 are in contact with the substrate end surfaces L1 and L2 and the marking heads 16A and 16B are positioned, marking processing is performed at two corners of the minimum substrate NS. Done. Thereafter, the marking heads 16A and 16B move and retract once.

  After the marking process, this time, the alignment pins Y1 and Y2 move toward the front side in the substrate transport direction (Y direction). As a result, the minimum substrate NS moves to the front side in the transport direction (see broken line arrow). Further, the alignment pins Y3 and Y4 move up and move to the same position as that of the maximum substrate MS in the substrate transport direction (Y direction). This position is determined according to the position of the guide rail 56 and the notch TX regardless of the substrate size.

  The marking heads 16C and 16D also move toward the substrate center line at the same time. Thereby, the alignment pins Y3 and Y4 are in contact with the end surface L4 of the minimum substrate NS, and the alignment pins X3 and X4 are in contact with the end surfaces L1 and L2 of the minimum substrate NS. Thus, when the marking heads 16C and 16D are positioned, marking processing is performed on the two corners of the remaining substrate. By the above-described stepwise marking process, alignment marks MP ′ are formed at the four corners of the substrate.

  When the marking process is completed, the marking heads 16A to 16D and the alignment pins Y1 to Y4 move so as to retract. Then, the backup plate 70 is lowered and the substrate is mounted again on the transport unit 14 (S111). The marked substrate is conveyed in a direction opposite to that at the time of loading, cleaned by the clean roller 24, and then discharged to the loading unit 12 (S112 to S114).

  In addition, although the marking process of the minimum board | substrate and the largest board | substrate was demonstrated, the marking process is possible also with respect to a board | substrate with the size between them by either system. Further, with respect to the alignment of the substrate position in the substrate transport direction, the alignment pins Y1 to Y4 may be used as necessary within the range intended to support alignment by the alignment pins X1 to X4. It does not have to be limited.

  Furthermore, when marking is performed at positions other than the four corners of the substrate, the marking heads 16C and 16D used in the latter half may be used to perform exposure marking a plurality of times.

  As described above, according to the present embodiment, the exposure marking apparatus 10 includes the marking unit 16 and the substrate position alignment unit 20 including the four marking heads 16A to 16D, and the marking heads 16A to 16D include a substrate conveyance orthogonal direction ( Alignment pins X1 to X4 for positioning the substrate with respect to the X direction) are provided, and the alignment pins Y1 to Y4 for positioning the substrate with respect to the substrate plate bidirectional (Y direction) are provided in the substrate position alignment unit 20. .

  When the substrate is aligned, when the marking heads 16A to 16D are moved and the alignment pins X1 to X4 are applied to the end surfaces of the substrate, the substrate is automatically positioned and the marking heads 16A to 16D are also positioned at the mark forming positions. The

  By equipping the marking head, not the substrate alignment portion, with the substrate alignment mechanism, the alignment mark can be reliably formed at a desired marking position. In addition, it is not necessary to adjust the position of alignment pins, which is necessary for substrate alignment as in the prior art, and the alignment mechanism can be mounted with a simple configuration. Furthermore, since the substrate position adjustment is performed simultaneously with the movement of the marking head, it is possible to perform a quick substrate position adjustment and a subsequent marking process.

  And since it is the structure which centers a board | substrate with respect to a board | substrate conveyance orthogonal direction (X direction), it becomes possible to align a board | substrate center line to the center position of a board | substrate alignment place, and even if a board | substrate is what size, a marking head The substrate alignment and positioning can be easily performed without being limited to the movement range. This is easily realized by providing the marking head with alignment pins for positioning the substrate.

  Further, the marking head that controls the formation of the mark and the alignment pin that controls the positioning of the substrate move together in an integrated manner, so that the alignment mark can be accurately exposed from the end surface of the substrate to a predetermined position. In particular, since the alignment mark and the alignment pin are moved by the same drive unit, the device can be simplified by using a common drive device. Furthermore, since the preparation for exposing the alignment mark is completed at the same time as the positioning of the substrate is completed, the time required for marking can be shortened.

  Various configurations of the marking head can be applied at any time, and various designs can be applied to the shape of the alignment pin and the mounting structure with the marking head. Further, the structure is not limited to the structure in which the alignment pins are directly connected, and any structure may be used as long as the alignment pins move in conjunction with the movement of the mark forming portion. Furthermore, the substrate can be positioned by a shape and structure other than the alignment pins.

  In the present embodiment, the substrate is arranged so as to be centered in the direction perpendicular to the substrate transport direction, but the substrate may be placed close to one side. In that case, one or several of the matching pins Y1 to Y4 may be replaced with reference pins that are not linked to the mark forming portion. Moreover, you may make it the structure which moves a marking head along a board | substrate conveyance direction.

  The exposure marking apparatus can also be applied to marking for a manual mask exposure apparatus. Furthermore, it is not limited to being configured as a stand-alone type, but may be configured to be incorporated into an automatic mask exposure apparatus or maskless exposure apparatus.

DESCRIPTION OF SYMBOLS 10 Exposure marking apparatus 12 Input part 14 Conveyance part 16 Marking part 16A-16D Marking head (mark formation part)
18 drive unit 20 substrate position alignment unit X1 to X4 alignment pin (substrate positioning member)
Y1-Y4 alignment pins

Claims (14)

A transport unit for transporting the loaded substrate;
A plurality of mark forming portions that are movable along at least one direction of the substrate transport direction and the substrate transport orthogonal direction, and irradiate the substrate with light to form alignment marks;
A plurality of substrate positioning members capable of positioning the substrates disposed and conveyed so as to respectively correspond to the plurality of mark forming portions along a direction in which the plurality of mark forming portions can move;
A drive unit that moves the plurality of mark forming units,
The drive unit moves the plurality of mark forming units toward the center of the substrate,
Each of the plurality of substrate positioning members moves in the same direction in conjunction with the movement of the corresponding mark forming unit, and positions the substrate along at least one of the substrate transport direction and the substrate transport orthogonal direction, An exposure marking apparatus, wherein the plurality of mark forming portions are positioned at predetermined alignment mark forming positions.   2. The exposure according to claim 1, wherein when the mark forming unit is moved by the driving unit, the substrate positioning member moves integrally in the same direction as the mark forming unit by mechanical interlocking. Marking device.   The exposure marking apparatus according to claim 1, wherein the plurality of substrate positioning members are respectively connected to corresponding mark forming portions.   The plurality of substrate positioning members are attached to the corresponding mark forming portions so that the plurality of mark forming portions can emit light to the mark target position when the substrate is positioned. The exposure marking apparatus according to claim 3.   The exposure marking apparatus according to claim 4, wherein the plurality of substrate positioning members are spaced apart from each corresponding mark forming portion by a predetermined distance along the substrate transport direction toward the center of the substrate.   6. The exposure marking apparatus according to claim 1, wherein each of the plurality of substrate positioning members has a bar-shaped member extending in a direction perpendicular to the substrate. The plurality of mark forming portions are movable in the substrate conveyance orthogonal direction,
The exposure marking apparatus according to claim 1, wherein the plurality of substrate positioning members position the substrate along a direction perpendicular to the substrate conveyance.   The exposure marking apparatus according to claim 7, further comprising a substrate position alignment unit that adjusts a position of the substrate with respect to the substrate transport direction. The mark forming portion moves along the same line as the first and second mark forming portions, and the third and fourth move along different lines from the first and second mark forming portions. A mark forming portion, and
The exposure marking apparatus according to claim 1, wherein the first to fourth mark forming portions move so as to form alignment marks at least at four corners of the substrate.   The driving unit moves the first and second mark forming units toward the alignment mark forming position, and after the exposure marking by the first and second mark forming units is completed, the third and fourth The exposure marking apparatus according to claim 9, wherein the mark forming portion is moved toward the alignment mark forming position.   11. The exposure apparatus according to claim 1, wherein the driving unit moves the plurality of mark forming units so that the substrate is centered in the substrate transport orthogonal direction in the substrate position adjustment area. .   12. The exposure marking apparatus according to claim 1, wherein the exposure marking apparatus is a stand-alone type that is not built in an exposure apparatus that performs drawing processing. Transport the loaded substrate,
It is movable along at least one direction of the substrate conveyance direction and the substrate conveyance orthogonal direction, and a plurality of mark forming portions that form alignment marks by irradiating the substrate with light are moved toward the substrate center side,
A plurality of substrate positioning members that can be positioned along the direction in which the plurality of mark forming portions can move are arranged corresponding to the plurality of mark forming portions, respectively. Move in the same direction in conjunction with the movement of the formation part,
Positioning the substrate along at least one of the substrate transport direction and the substrate transport orthogonal direction, and positioning the plurality of mark forming portions at a predetermined alignment mark forming position,
An exposure marking method comprising exposing to form an alignment mark on the substrate. A mark forming portion that is movable along at least one direction of the substrate transport direction and the substrate transport orthogonal direction, and irradiates the substrate with light to form an alignment mark;
A substrate positioning member capable of positioning the substrate disposed and conveyed corresponding to each of the mark forming portions along a direction in which the mark forming portion can move; and
A drive unit that moves the mark forming unit and interlocks the substrate positioning member in the same direction;
The drive unit moves the mark forming unit and the substrate positioning member toward the center of the substrate, positions the substrate along at least one of the substrate transport direction and the substrate transport orthogonal direction, and forms the mark. An exposure marking apparatus characterized by positioning a portion at a predetermined alignment mark formation position.

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