JP2013197555A5 - - Google Patents

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JP2013197555A5
JP2013197555A5 JP2012066454A JP2012066454A JP2013197555A5 JP 2013197555 A5 JP2013197555 A5 JP 2013197555A5 JP 2012066454 A JP2012066454 A JP 2012066454A JP 2012066454 A JP2012066454 A JP 2012066454A JP 2013197555 A5 JP2013197555 A5 JP 2013197555A5
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semiconductor substrate
amorphous film
contact
photoelectric conversion
amorphous
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JP2012066454A
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JP2013197555A (en
JP6032911B2 (en
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Claims (9)

第1の導電型を有する単結晶シリコンからなる半導体基板と、
前記半導体基板の一方の表面に接して設けられ、前記第1の導電型と反対の第2の導電型を有する第1の不純物層を少なくとも含む第1の非晶質膜と、
前記半導体基板の面内方向において前記第1の非晶質膜に隣接して前記半導体基板の一方の表面に接して設けられ、前記第1の導電型を有する第2の不純物層を少なくとも含む第2の非晶質膜とを備え、
前記第1および第2の非晶質膜の一方と前記半導体基板との界面は、前記半導体基板の厚み方向において、前記第1および第2の非晶質膜の他方と前記半導体基板との界面と異なる位置に存在する、光電変換素子。
A semiconductor substrate made of single crystal silicon having a first conductivity type;
A first amorphous film provided in contact with one surface of the semiconductor substrate and including at least a first impurity layer having a second conductivity type opposite to the first conductivity type;
A first impurity layer provided at least in contact with one surface of the semiconductor substrate adjacent to the first amorphous film in an in-plane direction of the semiconductor substrate, the second impurity layer having at least a first conductivity type Two amorphous films,
The interface between one of the first and second amorphous films and the semiconductor substrate is the interface between the other of the first and second amorphous films and the semiconductor substrate in the thickness direction of the semiconductor substrate. A photoelectric conversion element that exists in a different position.
前記第1の非晶質膜の一部は、前記半導体基板の面内方向において前記第1の非晶質膜に隣接する前記第2の非晶質膜の一部に重なっている、請求項1に記載の光電変換素子。   A part of the first amorphous film overlaps a part of the second amorphous film adjacent to the first amorphous film in an in-plane direction of the semiconductor substrate. 1. The photoelectric conversion element according to 1. 前記第2の非晶質膜と前記半導体基板との界面は、前記半導体基板の厚み方向において、前記第1の非晶質膜と前記半導体基板との界面よりも前記半導体基板の光入射側に位置する、請求項1または請求項2に記載の光電変換素子。   The interface between the second amorphous film and the semiconductor substrate is closer to the light incident side of the semiconductor substrate than the interface between the first amorphous film and the semiconductor substrate in the thickness direction of the semiconductor substrate. The photoelectric conversion element of Claim 1 or Claim 2 located. 前記第1の非晶質膜と前記半導体基板との界面は、前記半導体基板の厚み方向において、前記第2の非晶質膜と前記半導体基板との界面よりも前記半導体基板の光入射側に位置する、請求項1または請求項2に記載の光電変換素子。   The interface between the first amorphous film and the semiconductor substrate is closer to the light incident side of the semiconductor substrate than the interface between the second amorphous film and the semiconductor substrate in the thickness direction of the semiconductor substrate. The photoelectric conversion element of Claim 1 or Claim 2 located. 前記第1の非晶質膜は、
前記半導体基板の一方の表面に接して設けられ、i型の導電型を有する第1のノンドープ層と、
前記第1のノンドープ層に接して設けられた前記第1の不純物層とを含み、
前記第2の非晶質膜は、
前記半導体基板の一方の表面に接して設けられ、i型の導電型を有する第2のノンドープ層と、
前記第2のノンドープ層に接して設けられた前記第2の不純物層とを含む、請求項1から請求項4のいずれか1項に記載の光電変換素子。
The first amorphous film includes:
A first non-doped layer provided in contact with one surface of the semiconductor substrate and having an i-type conductivity;
Including the first impurity layer provided in contact with the first non-doped layer,
The second amorphous film is
A second non-doped layer provided in contact with one surface of the semiconductor substrate and having an i-type conductivity;
The photoelectric conversion device according to claim 1, further comprising: the second impurity layer provided in contact with the second non-doped layer.
第1の導電型を有する単結晶シリコンからなる半導体基板の一方の表面に接して、前記第1の導電型と反対の第2の導電型を有する第1の不純物層を少なくとも含む第1の非晶質膜と、前記第1の導電型を有する第2の不純物層を少なくとも含む第2の非晶質膜とのうち、一方の非晶質膜を形成する第1の工程と、
前記半導体基板の面内方向における前記一方の非晶質膜の一部分と、該一部分に接する前記半導体基板の一部分とを除去する第2の工程と、
前記一方の非晶質膜の残部上に被覆層を形成する第3の工程と、
前記半導体基板の一方の表面および前記被覆層上に前記第1および第2の非晶質膜の他方の非晶質膜を形成する第4の工程と、
前記被覆層を除去する第5の工程とを備える光電変換素子の製造方法。
A first non-layer including at least a first impurity layer having a second conductivity type opposite to the first conductivity type in contact with one surface of the semiconductor substrate made of single crystal silicon having the first conductivity type. A first step of forming one of the crystalline film and the second amorphous film including at least the second impurity layer having the first conductivity type;
A second step of removing a part of the one amorphous film in an in-plane direction of the semiconductor substrate and a part of the semiconductor substrate in contact with the part;
A third step of forming a coating layer on the remaining portion of the one amorphous film;
A fourth step of forming the other amorphous film of the first and second amorphous films on one surface of the semiconductor substrate and the covering layer;
A manufacturing method of a photoelectric conversion element provided with the 5th process of removing the above-mentioned covering layer.
前記第3の工程において、前記被覆層は、前記半導体基板の面内方向における寸法が前記一方の非晶質膜の残部の前記半導体基板の面内方向における寸法よりも小さくなるように形成される、請求項6に記載の光電変換素子の製造方法。   In the third step, the covering layer is formed such that the dimension in the in-plane direction of the semiconductor substrate is smaller than the dimension in the in-plane direction of the semiconductor substrate of the remaining portion of the one amorphous film. The manufacturing method of the photoelectric conversion element of Claim 6. 前記第1の工程において、前記半導体基板の一方の表面に接して前記第1の非晶質膜を形成し、
前記第2の工程において、前記第1の非晶質膜の一部分と、該一部分に接する前記半導体基板の一部分とを除去し、
前記第4の工程において、前記半導体基板の一方の表面および前記被覆層上に前記第2の非晶質膜を形成する、請求項6または請求項7に記載の光電変換素子の製造方法。
Forming the first amorphous film in contact with one surface of the semiconductor substrate in the first step;
Removing a part of the first amorphous film and a part of the semiconductor substrate in contact with the part in the second step;
8. The method of manufacturing a photoelectric conversion element according to claim 6, wherein, in the fourth step, the second amorphous film is formed on one surface of the semiconductor substrate and the covering layer.
前記第1の工程において、前記半導体基板の一方の表面に接して前記第2の非晶質膜を形成し、
前記第2の工程において、前記第2の非晶質膜の一部分と、該一部分に接する前記半導体基板の一部分とを除去し、
前記第4の工程において、前記半導体基板の一方の表面および前記被覆層上に前記第1の非晶質膜を形成する、請求項6または請求項7に記載の光電変換素子の製造方法。
Forming the second amorphous film in contact with one surface of the semiconductor substrate in the first step;
Removing a part of the second amorphous film and a part of the semiconductor substrate in contact with the part in the second step;
8. The method of manufacturing a photoelectric conversion element according to claim 6, wherein, in the fourth step, the first amorphous film is formed on one surface of the semiconductor substrate and the covering layer.
JP2012066454A 2012-03-23 2012-03-23 Photoelectric conversion element and manufacturing method thereof Active JP6032911B2 (en)

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JP2013197555A5 true JP2013197555A5 (en) 2015-03-12
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DE112015000559T5 (en) 2014-01-29 2016-12-15 Panasonic Intellectual Property Management Co., Ltd. solar cell
JP6153885B2 (en) * 2014-05-09 2017-06-28 信越化学工業株式会社 Back junction solar cell
DE102015112046A1 (en) * 2015-07-23 2017-01-26 Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh Method for producing unilaterally arranged structured contacts in a layer arrangement for a photovoltaic component
JP7183245B2 (en) * 2018-02-23 2022-12-05 株式会社カネカ Solar cell manufacturing method
JP2021129085A (en) * 2020-02-17 2021-09-02 パナソニック株式会社 Solar cell

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JP4155899B2 (en) * 2003-09-24 2008-09-24 三洋電機株式会社 Photovoltaic element manufacturing method
FR2906406B1 (en) * 2006-09-26 2008-12-19 Commissariat Energie Atomique PROCESS FOR PRODUCING A PHOTOVOLTAIC CELL WITH REAR-SIDE HETEROJUNCTION
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JP5347409B2 (en) * 2008-09-29 2013-11-20 三洋電機株式会社 Solar cell and manufacturing method thereof
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CN102349166A (en) * 2009-03-10 2012-02-08 三洋电机株式会社 Process for producing solar battery, and solar battery
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