JP2013191656A5 - - Google Patents

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JP2013191656A5
JP2013191656A5 JP2012055495A JP2012055495A JP2013191656A5 JP 2013191656 A5 JP2013191656 A5 JP 2013191656A5 JP 2012055495 A JP2012055495 A JP 2012055495A JP 2012055495 A JP2012055495 A JP 2012055495A JP 2013191656 A5 JP2013191656 A5 JP 2013191656A5
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amorphous film
contact
film
amorphous
conversion element
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JP2012055495A
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Japanese (ja)
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JP2013191656A (en
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Priority to JP2012055495A priority Critical patent/JP2013191656A/en
Priority claimed from JP2012055495A external-priority patent/JP2013191656A/en
Publication of JP2013191656A publication Critical patent/JP2013191656A/en
Publication of JP2013191656A5 publication Critical patent/JP2013191656A5/ja
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Claims (8)

第1の導電型を有する単結晶シリコンからなる半導体基板と、
前記半導体基板の一方の表面に接して設けられ、i型の導電型を有する第1の非晶質膜と、
前記第1の非晶質膜に接して設けられ、前記第1の導電型と反対の第2の導電型を有する第2の非晶質膜と、
前記半導体基板の面内方向において前記第2の非晶質膜に隣接し、かつ、前記第1の非晶質膜に接して設けられ、前記第1の導電型を有する第3の非晶質膜とを備え、
前記第1の非晶質膜において、前記第2および第3の非晶質膜の少なくとも一方と接する部分の膜厚が前記第2および第3の非晶質膜の少なくとも一方と接しない部分の膜厚よりも薄い、光電変換素子。
A semiconductor substrate made of single crystal silicon having a first conductivity type;
A first amorphous film provided in contact with one surface of the semiconductor substrate and having an i-type conductivity;
A second amorphous film provided in contact with the first amorphous film and having a second conductivity type opposite to the first conductivity type;
A third amorphous material that is provided adjacent to the second amorphous film in the in-plane direction of the semiconductor substrate and in contact with the first amorphous film and having the first conductivity type With a membrane,
In the first amorphous film, the thickness of the portion in contact with at least one of the second and third amorphous films is not in contact with at least one of the second and third amorphous films. A photoelectric conversion element that is thinner than the film thickness.
前記第1の非晶質膜は、前記第2の非晶質膜に接する部分において第1の膜厚を有し、前記第3の非晶質膜に接する部分において第2の膜厚を有し、前記第2および第3の非晶質膜に接しない部分において前記第1および第2の膜厚よりも厚い第3の膜厚を有する、請求項1に記載の光電変換素子。   The first amorphous film has a first film thickness at a portion in contact with the second amorphous film, and has a second film thickness at a portion in contact with the third amorphous film. The photoelectric conversion element according to claim 1, wherein the photoelectric conversion element has a third film thickness larger than the first and second film thicknesses in a portion not in contact with the second and third amorphous films. 前記第1の非晶質膜は、前記第2の非晶質膜に接する部分において第1の膜厚を有し、前記第2の非晶質膜に接しない部分および第3の非晶質膜に接する部分において前記第1の膜厚よりも厚い第2の膜厚を有する、請求項1に記載の光電変換素子。   The first amorphous film has a first film thickness at a portion in contact with the second amorphous film, and a portion not in contact with the second amorphous film and a third amorphous film. 2. The photoelectric conversion element according to claim 1, wherein the photoelectric conversion element has a second film thickness larger than the first film thickness at a portion in contact with the film. 前記第1の非晶質膜は、前記第3の非晶質膜に接する部分において第1の膜厚を有し、前記第3の非晶質膜に接しない部分および第2の非晶質膜に接する部分において前記第1の膜厚よりも厚い第2の膜厚を有する、請求項1に記載の光電変換素子。   The first amorphous film has a first film thickness at a portion in contact with the third amorphous film, a portion not in contact with the third amorphous film, and a second amorphous film. 2. The photoelectric conversion element according to claim 1, wherein the photoelectric conversion element has a second film thickness larger than the first film thickness at a portion in contact with the film. 第1の導電型を有する単結晶シリコンからなる半導体基板の一方の表面に接して、i型の導電型を有する第1の非晶質膜を形成する第1の工程と、
前記半導体基板の面内方向において前記第1の非晶質膜の一部分を除去する第2の工程と、
前記第1の導電型と反対の第2の導電型を有する第2の非晶質膜を前記第1の非晶質膜に接して形成する第3の工程と、
前記半導体基板の面内方向において前記第2の非晶質膜に隣接し、かつ、前記第1の非晶質膜に接して、前記第1の導電型を有する第3の非晶質膜を形成する第4の工程とを備え、
前記第3および第4の工程の少なくとも一方において、前記第2および第3の非晶質膜の少なくとも一方は、前記一部分が除去された第1の非晶質膜に接して形成される、光電変換素子の製造方法。
A first step of forming a first amorphous film having an i-type conductivity type in contact with one surface of a semiconductor substrate made of single crystal silicon having a first conductivity type;
A second step of removing a portion of the first amorphous film in an in-plane direction of the semiconductor substrate;
A third step of forming a second amorphous film having a second conductivity type opposite to the first conductivity type in contact with the first amorphous film;
A third amorphous film having the first conductivity type is adjacent to the second amorphous film in the in-plane direction of the semiconductor substrate and in contact with the first amorphous film. A fourth step of forming,
In at least one of the third and fourth steps, at least one of the second and third amorphous films is formed in contact with the first amorphous film from which the part has been removed. A method for manufacturing a conversion element.
前記第3の工程において、前記一部分が除去された第1の非晶質膜に接して前記第2の非晶質膜を形成し、
前記第4の工程において、前記一部分が除去された第1の非晶質膜に接して前記第3の非晶質膜を形成する、請求項5に記載の光電変換素子の製造方法。
Forming the second amorphous film in contact with the first amorphous film from which the part has been removed in the third step;
6. The method of manufacturing a photoelectric conversion element according to claim 5, wherein, in the fourth step, the third amorphous film is formed in contact with the first amorphous film from which the part has been removed.
前記第3の工程において、前記一部分が除去された第1の非晶質膜に接して前記第2の非晶質膜を形成し、
前記第4の工程において、前記一部分が除去されていない第1の非晶質膜に接して前記第3の非晶質膜を形成する、請求項5に記載の光電変換素子の製造方法。
Forming the second amorphous film in contact with the first amorphous film from which the part has been removed in the third step;
6. The method of manufacturing a photoelectric conversion element according to claim 5, wherein, in the fourth step, the third amorphous film is formed in contact with the first amorphous film from which the part has not been removed.
前記第3の工程において、前記一部分が除去されていない第1の非晶質膜に接して前記第2の非晶質膜を形成し、
前記第4の工程において、前記一部分が除去された第1の非晶質膜に接して前記第3の非晶質膜を形成する、請求項5に記載の光電変換素子の製造方法。
Forming the second amorphous film in contact with the first amorphous film from which the part has not been removed in the third step;
6. The method of manufacturing a photoelectric conversion element according to claim 5, wherein, in the fourth step, the third amorphous film is formed in contact with the first amorphous film from which the part has been removed.
JP2012055495A 2012-03-13 2012-03-13 Photoelectric conversion element and manufacturing method thereof Pending JP2013191656A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
JP2012055495A JP2013191656A (en) 2012-03-13 2012-03-13 Photoelectric conversion element and manufacturing method thereof

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JP2013191656A JP2013191656A (en) 2013-09-26
JP2013191656A5 true JP2013191656A5 (en) 2015-03-12

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Publication number Priority date Publication date Assignee Title
WO2016076300A1 (en) * 2014-11-14 2016-05-19 シャープ株式会社 Photoelectric conversion element
WO2016076299A1 (en) * 2014-11-14 2016-05-19 シャープ株式会社 Photoelectric converter
JP6476015B2 (en) * 2015-03-06 2019-02-27 シャープ株式会社 Photoelectric conversion element and manufacturing method thereof
JP2018170482A (en) * 2017-03-30 2018-11-01 パナソニック株式会社 Solar battery cell, and method for manufacturing solar battery cell
JP7221276B2 (en) * 2018-03-23 2023-02-13 株式会社カネカ SOLAR CELL MANUFACTURING METHOD AND SOLAR CELL
WO2020217999A1 (en) * 2019-04-23 2020-10-29 株式会社カネカ Method for manufacturing solar cell and solar cell

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JPH11112011A (en) * 1997-09-30 1999-04-23 Sanyo Electric Co Ltd Manufacture of photovolatic element
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