JP2013187486A5 - - Google Patents

Download PDF

Info

Publication number
JP2013187486A5
JP2013187486A5 JP2012053398A JP2012053398A JP2013187486A5 JP 2013187486 A5 JP2013187486 A5 JP 2013187486A5 JP 2012053398 A JP2012053398 A JP 2012053398A JP 2012053398 A JP2012053398 A JP 2012053398A JP 2013187486 A5 JP2013187486 A5 JP 2013187486A5
Authority
JP
Japan
Prior art keywords
forming
etching
manufacturing
wiring board
inner layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012053398A
Other languages
English (en)
Japanese (ja)
Other versions
JP5933996B2 (ja
JP2013187486A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012053398A priority Critical patent/JP5933996B2/ja
Priority claimed from JP2012053398A external-priority patent/JP5933996B2/ja
Priority to CN201310073854.8A priority patent/CN103313533B/zh
Priority to TW102108249A priority patent/TWI581687B/zh
Publication of JP2013187486A publication Critical patent/JP2013187486A/ja
Publication of JP2013187486A5 publication Critical patent/JP2013187486A5/ja
Application granted granted Critical
Publication of JP5933996B2 publication Critical patent/JP5933996B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012053398A 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法 Active JP5933996B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012053398A JP5933996B2 (ja) 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法
CN201310073854.8A CN103313533B (zh) 2012-03-09 2013-03-08 多层柔性配线板的制造方法
TW102108249A TWI581687B (zh) 2012-03-09 2013-03-08 Method for manufacturing multi - layer flexible patch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012053398A JP5933996B2 (ja) 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法

Publications (3)

Publication Number Publication Date
JP2013187486A JP2013187486A (ja) 2013-09-19
JP2013187486A5 true JP2013187486A5 (https=) 2015-04-23
JP5933996B2 JP5933996B2 (ja) 2016-06-15

Family

ID=49138178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012053398A Active JP5933996B2 (ja) 2012-03-09 2012-03-09 多層フレキシブル配線板の製造方法

Country Status (3)

Country Link
JP (1) JP5933996B2 (https=)
CN (1) CN103313533B (https=)
TW (1) TWI581687B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110545636B (zh) * 2018-05-29 2022-02-22 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4431170B2 (ja) * 2006-12-04 2010-03-10 日本特殊陶業株式会社 積層基板及びその製造方法
JP2009272444A (ja) * 2008-05-08 2009-11-19 Sony Chemical & Information Device Corp フレックスリジッド配線基板とその製造方法
JP5267487B2 (ja) * 2010-03-10 2013-08-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板用基板の製造方法
US20120170242A1 (en) * 2009-06-03 2012-07-05 Sharp Kabushiki Kaisha Circuit board, connecting structure of circuit boards, and display panel assembly

Similar Documents

Publication Publication Date Title
JP2015502021A5 (https=)
JP2012146793A5 (https=)
JP2016029697A5 (https=)
JP2015076597A5 (https=)
JP2015109449A5 (https=)
EP3657916A4 (en) STRUCTURE INCLUDING ELECTRO-CONDUCTIVE REGIONS, ITS PRODUCTION PROCESS, LAMINATE, ITS PRODUCTION PROCESS AND COPPER WIRING
JP2013525918A5 (https=)
WO2013029028A3 (en) Patterned transparent conductors and related manufacturing methods
PH12016502502A1 (en) Printed circuit board, electronic component, and method for producing printed circuit board
JP2016004833A5 (https=)
JP2011211705A5 (https=)
JP2013232452A5 (https=)
TWI563888B (zh) 表面處理銅箔、附載體銅箔、積層板、印刷配線板、電子機器、以及印刷配線板之製造方法
JP2013042180A5 (https=)
JP2014501449A5 (https=)
JP2014013810A5 (https=)
JP2013187313A5 (https=)
TWI561373B (zh) 附載體銅箔、使用其之覆銅積層板、印刷配線板、印刷電路板及印刷配線板之製造方法
TWI562885B (zh) 附載體銅箔、使用其之覆銅積層板、印刷配線板、電子機器及印刷配線板之製造方法
JP2013236046A5 (https=)
JP2012134329A5 (https=)
JP2013247367A5 (https=)
JP2013219191A5 (https=)
JP2011134957A5 (https=)
SG169948A1 (en) Reliable interconnect for semiconductor device