JP2013184256A - Polishing surface plate, and lapping device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing surface plate and a lapping device, capable of improving a polishing efficiency by vibrating a polishing surface of the polishing surface plate without forming the device in a massive configuration and allowing abrasive grains to easily intrude between the polishing surface and a workpiece.SOLUTION: Polishing is performed by inserting vibration bodies 300 equipped with ultrasonic vibrators 333 in a plurality of through holes 220 formed in a polishing surface plate 20 and by rotating the polishing surface plate 20 while vibrating polishing action members 310 arranged on upper parts of the vibration bodies 300 by the vibration bodies 300. A polishing surface of the polishing surface plate 20 is in a vibrating state by vibrating the plurality of small polishing action members 310 without vibrating the entire polishing surface plate 20, so that burden required for vibration is reduced.

Description

  The present invention relates to a polishing surface plate used for polishing various workpieces such as a semiconductor wafer, a magnetic head, an electronic component, and an optical component, and a lapping apparatus including the same.

  In the manufacturing process of semiconductor devices, electronic components, optical components, etc., the surface of the workpiece is polished by a lapping device, and a device such as LSI is formed on the polished workpiece surface, or the surface is an optical surface. Or used as In a lapping apparatus, generally, polishing is performed by bringing a workpiece into contact with the polishing surface plate while supplying an abrasive liquid onto the rotating polishing surface plate.

  In such a polishing process, higher polishing efficiency is desirable for shortening the processing time and reducing the manufacturing cost. In order to increase the polishing efficiency, a method such as increasing the polishing pressure or the polishing rate can be considered, but if the polishing pressure or the polishing rate is increased, the abrasive grains in the abrasive liquid are sufficiently between the workpiece and the polishing platen. Accordingly, there is a problem in that polishing becomes non-uniform and polishing efficiency cannot be increased. In order to solve such a problem, a polishing apparatus that applies vibration to a polishing surface plate or a CMP pad has been proposed (see, for example, Patent Documents 1 and 2).

JP-A-10-156706 JP-A-11-129155

  In general, a polishing surface plate for polishing a workpiece tends to increase its outer diameter in order to increase polishing efficiency and increase the number of sheets that can be processed at once, and vibrates the entire polishing surface plate. It ’s difficult. Further, if the entire polishing platen is vibrated, an apparatus including a power source for applying vibration becomes large and expensive.

  The present invention has been made in view of the above circumstances, and the main technical problem thereof is to vibrate the polishing surface and the workpiece by vibrating the polishing surface of the polishing platen without making the apparatus large-scale configuration. It is an object of the present invention to provide a polishing surface plate and a lapping apparatus capable of improving the polishing efficiency by making it easy for abrasive grains to enter between the two.

  The polishing surface plate of the present invention is a polishing surface plate that has a polishing surface for polishing a workpiece and polishes the workpiece by bringing the workpiece into contact with the polishing surface. Is formed with a plurality of through holes penetrating the polishing surface plate, and a vibrating body including an ultrasonic vibrator is inserted into the plurality of through holes, and the vibrating body is disposed above the vibrating body. A power for supplying power to the ultrasonic transducer is provided, wherein a polishing member is installed to close the through hole without being stepped from the polishing surface of the polishing platen while being inserted into the through hole. Supply means is provided, and electric power is supplied from the power supply means to the ultrasonic transducer, and the polishing member vibrates as the ultrasonic transducer is driven (Claim 1).

  In the polishing platen of the present invention, the through hole has a first circular hole having a predetermined depth formed in the polishing surface, and the first circular hole at the bottom of the first circular hole. And a second circular hole having a diameter smaller than that of the first circular hole and penetrating through the polishing surface plate, and the vibrating body includes the first circular hole and the second circular hole. The polishing member formed in the shape of a disk having the same diameter, the polishing member mounted concentrically on the upper surface, and a polishing member mounting portion having the same diameter as the polishing member, and the polishing member mounting And a vibrating portion having a diameter smaller than that of the second circular hole on the lower surface of the portion and having the ultrasonic transducer attached thereto, and having a flange-like width from the vibrating portion. The outer peripheral edge of the lower surface of the polishing member mounting portion is not When the vibrating body is inserted into the through hole, the ring-shaped elastic member mounted on the outer peripheral edge of the lower surface of the polishing action member mounting portion is attached to the first circular shape. It is mounted on the bottom of the hole, and the vibration part is inserted into the second circular hole (claim 2).

  Next, a lapping apparatus according to the present invention holds a polishing surface plate having a polishing surface for polishing a workpiece, and is rotatably supported, rotation driving means for rotating the polishing surface plate, and the workpiece. A workpiece holding means for holding the workpiece in a state of contacting the polishing surface plate with a holding surface; and an abrasive liquid supply means for supplying an abrasive liquid to the surface of the polishing surface plate, 3. A lapping apparatus for polishing a workpiece held by the workpiece holding means by sliding the workpiece holding means and the polishing platen, wherein the polishing platen is defined in claim 1 or 2. When polishing a workpiece, power is supplied from the power supply means to the ultrasonic vibrator, and the polishing member is vibrated as the ultrasonic vibrator is driven. Polishing is performed by (Claim 3).

  According to the first to third aspects of the present invention, the polishing is not performed on the entire polishing surface plate, but is polished with the plurality of polishing members disposed on the polishing surface plate in a vibrating state by the vibrating body. The workpiece is polished on the polishing surface of the polishing platen and the upper surface of the polishing member. Since the plurality of polishing members are vibrated without vibrating the entire polishing platen, the polishing surface of the polishing platen can be vibrated without having a large-scale apparatus. Further, by vibrating the polishing member, it is easy for the abrasive grains to enter between the polishing surface and the workpiece, and the polishing efficiency can be improved.

  The polishing surface plate of the present invention has a polishing surface for polishing a workpiece, and polishes the workpiece by contacting the workpiece with the polishing surface. A plate-shaped abrasive part having a polishing surface for polishing a workpiece, and a support part for supporting the abrasive part, and a plurality of through holes penetrating the support part are formed in the support part; A ring-shaped elastic member surrounding the openings is disposed on the outer peripheral edge of the openings of the plurality of through holes, and the upper surface of the ring-shaped elastic member is located a predetermined amount above the upper surface of the support portion, The plate-like abrasive part is placed on the upper surface of the elastic member, and is supported by the support part via the elastic member, and the polishing of the plate-like abrasive part supported by the support part is performed. One end of a columnar vibrator having an ultrasonic transducer is bonded to a position corresponding to the plurality of through holes on the back side of the surface. The other end of the vibrator is inserted into the through-hole, and includes power supply means for supplying power to the ultrasonic vibrator, and power is supplied to the ultrasonic vibrator from the power supply means. Polishing is performed in a state where the abrasive portion vibrates with the driving of the ultrasonic vibrator (claim 4).

  Further, the lapping apparatus of the present invention comprises a polishing surface plate having a polishing surface for polishing a workpiece and rotatably supported, a rotation driving means for rotating the polishing surface plate, and a holding for holding the workpiece. A workpiece holding means for holding the workpiece in contact with the polishing surface plate, and an abrasive liquid supply means for supplying an abrasive liquid to the surface of the polishing surface plate, A lapping apparatus for sliding a workpiece held by the workpiece holding means by sliding the workpiece holding means and the polishing platen, wherein the polishing platen is a polishing plate according to claim 4. When polishing the workpiece, power is supplied from the power supply means to the ultrasonic vibrator, and polishing is performed in a state where the abrasive material part vibrates as the ultrasonic vibrator is driven. A wrapping device characterized in that it is performed (claim 5).

  According to the inventions according to claims 4 and 5 described above, the entire polishing surface plate is not vibrated, but the polishing material portion constituting a part of the polishing surface plate is vibrated via the plurality of vibrating bodies. Done. The workpiece is polished on the polishing surface of the abrasive part. Since the polishing material part is vibrated through a plurality of vibrators without vibrating the entire polishing platen, the polishing surface of the polishing platen can be vibrated without having a large-scale apparatus. Further, by vibrating the abrasive part, abrasive grains can easily enter between the polishing surface and the workpiece, and the polishing efficiency can be improved.

  According to the present invention, the polishing surface of the polishing platen is vibrated without making the apparatus large-scale, and the abrasive grains easily enter between the polishing surface and the workpiece to improve the polishing efficiency. Thus, there is an effect that a polishing surface plate and a lapping device that can be provided are provided.

It is a perspective view of the lapping apparatus concerning one embodiment of the present invention. It is a top view of the lapping apparatus of one embodiment. It is a perspective view which shows the part which supports the workpiece holding means of the lapping apparatus of one Embodiment. It is a side view which shows the state which hold | maintained the workpiece by the workpiece holding means. It is a perspective view which shows the polishing surface plate of the lapping apparatus of one Embodiment. It is sectional drawing of the part corresponding to the through-hole of the polishing surface plate of one Embodiment. It is a disassembled perspective view of the same vibrating body. It is a perspective view of the polishing platen concerning other embodiments of the present invention. It is sectional drawing of the part corresponding to the through-hole of the polishing surface plate of other embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 and 2 are a perspective view and a plan view, respectively, of a lapping apparatus 1 provided with a polishing surface plate according to one embodiment. The lapping apparatus 1 polishes the workpiece W held by the workpiece holding means 40 with the polishing platen 20. In this case, the workpiece W is disk-shaped and is, for example, a semiconductor wafer, but a hard disk-shaped member made of silicon carbide, sapphire, or the like is also applicable.

  In FIG. 1 and FIG. 2, reference numeral 10 denotes an apparatus base including a processing table 11. The processing table 11 has a horizontal upper surface, and a disk-shaped polishing surface plate 20 is supported on the upper surface via a rotating shaft 21 so as to be horizontal and rotatable. The rotating shaft 21 of the polishing surface plate 20 is rotationally driven in the direction of arrow A by a rotational driving means 22 such as a motor disposed in the apparatus base 10. The polishing platen 20 has a diameter of about 13 to 20 inches, for example.

  On the upper surface of the processing table 11, an abrasive liquid supply means 30 for supplying an abrasive liquid to the polishing surface on the surface of the polishing surface plate 20 is disposed. The abrasive liquid supply means 30 includes a cylindrical tank 31 that stores the abrasive liquid, a nozzle 32 connected to the tank 31, and a pump 33 that pumps the abrasive liquid in the tank 31 to the nozzle 32. By driving 33, the abrasive liquid in the tank 31 is discharged from the nozzle 32 onto the polishing surface 210 of the polishing surface plate 20. As the abrasive liquid, one containing or not containing abrasive grains is used depending on the workpiece W or depending on the situation of the polishing process.

  A drive unit 50 that supports the workpiece holding means 40 and reciprocates in the direction of the arrow X is provided on the back side (upper side in FIG. 2) of the processing base 11 in FIG. . The drive unit 50 is provided with an arm 51 that extends perpendicularly to the arrow X direction and extends horizontally on the processing table 11. The arm 51 reciprocates in the direction of the arrow X by driving means (not shown) accommodated in the driving unit 50.

  As shown in FIGS. 2 and 3, the tip of the arm 51 is bifurcated in the lateral direction, and the rollers 52 and 53 are rotatable at the tips of the branch portions 511 and 512, respectively, with the vertical direction as the rotation axis. It is supported. As shown in FIG. 3, a drive pulley 54 is rotatably supported on the lower surface of the arm 51, and the drive pulley 54 is rotationally driven by a motor 55 fixed to the upper surface of the arm 51. A belt 56 is wound around the drive pulley 54 and one roller (drive roller) 53, and the rotation of the drive pulley 54 is transmitted to the drive roller 53 via the belt 56 by operating the motor 55. ing. In this case, the drive roller 53 is rotationally driven in the direction of arrow C as shown in FIGS. 1 and 2, and the roller 52 around which the belt 56 is not wound is a driven roller.

  The workpiece holding means 40 is a cylindrical member having a diameter slightly larger than that of the workpiece W, and has a predetermined weight. As shown in FIG. Is placed on the polishing surface plate 20. As shown in FIG. 4, the workpiece W is stuck and held on a holding surface 41 which is the lower surface of the workpiece holding means 40 via a holding material such as wax.

  According to this apparatus, as shown in FIGS. 1 and 2, the workpiece W is placed on the holding surface 41 in a state where the polishing surface plate 20 rotates in the direction of arrow A and the driving roller 53 rotates in the direction of arrow C. The held workpiece holding means 40 is placed on the polishing surface plate 20 and the peripheral wall 42 is set in contact with the rollers 52 and 53. In this state, the workpiece W is brought into contact with the polishing surface plate 20. The polishing surface plate 20 rotates at, for example, about 10 to 100 rpm.

  The workpiece holding means 40 set in this way is pressed against the rollers 52 and 53 by the rotating polishing surface plate 20 and held at the processing position, and is rotated in the direction of arrow B by the driving roller 53 to be polished. 20 and slide. The workpiece W held on the holding surface 41 of the workpiece holding means 40 rotates and its lower surface is polished by the rotating polishing platen 20. At the time of polishing, an abrasive liquid is appropriately supplied from the abrasive liquid supply means 30 to the surface of the polishing surface plate 20, and the supplied abrasive liquid is supplied between the workpiece W and the polishing surface plate 20. During polishing, the workpiece holding means 40 is moved in the direction of the arrow X via the arm 51 to change the contact portion of the workpiece with respect to the polishing platen 20 to prevent uneven wear of the polishing platen 20. The operation is performed appropriately.

  As shown in FIGS. 5 and 6, the polishing surface plate 20 of the present embodiment has a plurality of circular through holes 220 penetrating the polishing surface plate 20 on the upper polishing surface 210. The polishing surface plate 20 is configured by adhering a plate-shaped abrasive material portion 202 thinner than the support portion 201 to the upper surface of the main support portion 201 as shown in FIG. The upper surface of 202 is a polishing surface 210. A circular hole 203 is formed at the center of the abrasive part 202, and thus the center of the upper surface of the polishing surface plate 20 is a recess.

  The support part 201 is made of, for example, aluminum or stainless steel, and the abrasive part 202 is made of a material (for example, copper or copper alloy, tin or tin alloy, or cast iron) according to the workpiece W. The through hole 220 penetrates from the surface of the abrasive part 202 to the lower surface of the support part 201.

  As shown in FIG. 6, a vibrating body 300 including an ultrasonic transducer 333 is inserted into the through hole 220. The through hole 220 includes a first circular hole 221 having a predetermined depth formed on the polishing surface 210 of the polishing surface plate 20, and a first circular hole 221 at the bottom 225 of the first circular hole 221. And a second circular hole 222 having a smaller diameter than the first circular hole 221 and penetrating the polishing surface plate 20.

  The vibrating body 300 has a polishing member 310 formed in a disk shape having the same diameter as the first circular hole 221 and a polishing member 310 concentrically mounted on the upper surface and has the same diameter as the polishing member 310. A disc-shaped polishing member mounting portion 320 and a vibration formed on the lower surface of the polishing member mounting portion 320 in a cylindrical shape having a diameter smaller than that of the second circular hole 222 and mounted with the ultrasonic transducer 333. The unit 330 is configured. The polishing member mounting portion 320 is mounted by bonding its upper surface to the lower surface of the polishing member 310.

  The vibration unit 330 has a three-layer structure, and is configured such that an ultrasonic transducer 333 is sandwiched between an upper first vibration member 331 and a lower second vibration member 332. As shown in FIG. 7, a screw portion 335 extending downward along the axial direction is provided at the center of the lower surface of the first vibration member 331. Insertion holes 333a and 332a are formed in the shaft centers of the ultrasonic vibrator 333 and the second vibration member 332, respectively, and a screw part 335 is inserted through the insertion holes 333a and 332a, and a protruding screw part 335 is projected downward. By screwing and fastening the nut 336 to the tip of the vibration member 330, the vibration unit 330 is configured in which the ultrasonic vibrator 333 is sandwiched between the first vibration member 331 and the second vibration member 332.

  The polishing member mounting portion 320 that is attached to the lower surface of the polishing member 310 is widened in a flange shape from the vibration portion 330, and the outer peripheral edge of the lower surface has an elastic made of a ring-shaped rubber or the like. A member 340 is attached. The vibrating body 300 having the vibration member 330 mounted on the lower surface of the polishing member 310 and the polishing member mounting portion 320 is inserted into the through hole 220 from the vibration portion 330 side. The elastic member 340 attached to the outer peripheral edge portion of the lower surface is placed on the bottom portion 225 of the first circular hole 221, and the vibrating portion 330 is inserted into the second circular hole 222. The polishing member 310 of the vibrating body 300 is set to have a diameter of about 20 to 80 mm, for example.

  The elastic member 340 is a ring-shaped member having a rectangular cross section whose outer diameter is approximately the same as the inner diameter of the first through-hole 220 and whose inner diameter is approximately the same as the inner diameter of the second circular hole 222. It is attached to the lower surface of 320 by adhesion. Further, the elastic member 340 may be placed on the bottom portion 225 of the first circular hole 221 or may be adhered to the bottom portion 225. In the vibrating body 300 inserted into the through hole 220 in this way, the polishing member 310 is fitted in a state where no step is generated between the first through hole 220 and the polishing surface 210 of the polishing surface plate 20, The through hole 220 is blocked.

  The ultrasonic vibrator 333 of the vibration unit 330 includes an electric wire that is connected to a power supply source (not shown) housed in the apparatus base 10 and supplies power to the ultrasonic vibrator 333 from the power supply source. A power supply means 350 is connected. A voltage of, for example, about 20 to 200 V is applied to the ultrasonic vibrator 333, whereby the vibrating body 300 vibrates at a frequency of, for example, about 10 to 100 kHz. The power supply means 350 is wired to each vibrator 300 inserted in each through-hole 220. However, since the polishing surface plate 20 rotates in one direction, the power supply source and each power supply means 350 are different from each other. A slip ring or the like is appropriately used as a contact for enabling the polishing platen 20 to rotate.

  The polishing surface plate 20 of the present embodiment has the above-described configuration, and the workpiece W is polished while rotating the polishing surface plate 20 and rotating the workpiece holding means 40 as described above. At this time, power is supplied from the power supply means 350 to the ultrasonic transducer 333 to drive the ultrasonic transducer 333. As the ultrasonic vibrator 333 is driven, the vibration section 330 vibrates, and the vibration of the vibration section 330 is transmitted to the entire vibration body 300 and the polishing member 310 also vibrates. In other words, during polishing of the workpiece, the plurality of polishing action members 310 scattered on the surface of the polishing surface plate 20 vibrate, and the workpiece W is polished with the polishing surface 210 of the polishing surface plate 20 and vibrating. It is ground by the upper surface of the member 310.

  According to the present embodiment, the polishing platen 20 is not vibrated, but the polishing is performed with the plurality of polishing members 310 arranged on the polishing platen 20 in a vibrating state. The workpiece W is polished by the polishing surface 210 of the polishing surface plate 20 and the upper surface of the polishing member 310. Since the plurality of polishing action members 310 that are considerably smaller than the polishing surface plate 20 are vibrated without vibrating the entire polishing surface plate 20, the polishing surface of the polishing surface plate 20 can be formed without using a large-scale apparatus. It can be in a vibrating state. Further, by vibrating the polishing member 310, the abrasive grains can easily enter between the polishing surface and the workpiece W, and the polishing efficiency can be improved.

  The present invention includes a lapping apparatus including the polishing surface plate 20 shown in FIG. 8 instead of the polishing surface plate 20 of the above-described embodiment. That is, as shown in FIG. 9, the polishing surface plate 20 as another embodiment includes a plate-like abrasive portion 202 whose upper surface is a polishing surface 202 a for polishing the workpiece W, and the abrasive portion 202. And a support portion 201 disposed on the lower side. The abrasive material part 202 is formed thinner than the support part 201, and the two parts are arranged concentrically with a gap therebetween to constitute the polishing surface plate 20.

  The support portion 201 is formed with a plurality of through holes 220 penetrating the support portion 201, and these through holes 220 are covered with the abrasive material portion 202. As shown in FIG. 9, the vibrating body 400 is inserted into each through hole 220.

  In this embodiment, an annular recess 229 is formed on the outer peripheral edge of the opening of the through hole 220, and a ring-shaped elastic member 340 surrounding the opening is disposed in the recess 229. The thickness of the elastic member 340 is thicker than the depth of the recess 229. Therefore, the upper surface of the elastic member 340 is positioned a predetermined amount above the upper surface of the support portion 201, and the abrasive portion 202 is placed on the upper surface of the elastic member 340. Has been. That is, the abrasive material part 202 is supported by the support part 201 via the elastic member 340, and the upper surface of the elastic member 340 is positioned above the upper surface of the support part 201 by a predetermined amount. There is a gap between the upper surface of the support portion 201 and the upper surface of the support portion 201. In this case, the elastic member 340 is bonded to the back surface of the abrasive material portion 202 and the bottom surface of the concave portion 229 of the support portion 201.

  One end of the vibrating body 400 is bonded to a position corresponding to the through hole 220 on the back surface side of the abrasive material portion 202. The vibrating body 400 here has the same configuration as that of the vibrating section 330 in the above-described embodiment, that is, the ultrasonic vibrator 333 is sandwiched between the first vibrating member 331 and the second vibrating member 332, and the ultrasonic vibrator The power supply means 350 is connected to 333. The end portion of the first vibration member 331 passes through the elastic member 340, and the upper end surface of the first vibration member 331 is bonded to the back surface of the abrasive material portion 202. The first vibration member 331 and the elastic member 340 are not particularly bonded, and may be dimensioned so as to be separated from each other.

  In this embodiment, when the workpiece W is polished, power is supplied from the power supply means 350 to the ultrasonic vibrator 333 of the vibrating body 400, and the vibration of the vibrating body 400 is driven as the ultrasonic vibrator 333 is driven. Is transmitted to the abrasive part 202 and polishing is performed in a state where the abrasive part 202 vibrates.

  In this embodiment, the polishing surface plate 20 is not vibrated as a whole, but the polishing member 202 constituting the upper surface portion which is a part of the polishing surface plate 20 is vibrated via the plurality of vibrating bodies 400 to perform polishing. As a result, the workpiece W is polished by the polishing surface 202a of the abrasive part 202. According to this embodiment, in order to vibrate the abrasive member 202 that constitutes the upper surface of the polishing surface plate 20 via the plurality of vibrating bodies 400 without vibrating the entire polishing surface plate 20, the apparatus is configured in a large scale. The polishing surface of the polishing surface plate 20 can be vibrated without doing so. Further, by vibrating the abrasive portion 202, it becomes easy for the abrasive grains to enter between the polishing surface 202a and the workpiece W, and the polishing efficiency can be improved.

  The lapping apparatus 1 and each polishing platen 20 provided in the apparatus 1 are embodiments of the present invention, but the present invention only invents a polishing platen that can vibrate like the polishing platen 20. It is also a product. That is, such a polishing surface plate of the present invention is versatile and can be used even if incorporated in another lapping apparatus.

DESCRIPTION OF SYMBOLS 1 ... Lapping apparatus 20 ... Polishing surface plate 22 ... Rotation drive means 30 ... Abrasive liquid supply means 40 ... Workpiece holding means 41 ... Holding surface 201 ... Support part 202 ... Abrasive material part 210, 202a ... Polishing surface 220 ... Through-hole 221 ... 1st circular hole 222 ... 2nd circular hole 225 ... Bottom 300, 400 of 1st circular hole ... Vibration body 310 ... Polishing action member 320 ... Polishing action member mounting part 330 ... Vibration part 333 ... Ultrasonic vibration Child 340 ... Elastic member 350 ... Electric power supply means W ... Workpiece

Claims (5)

A polishing surface plate having a polishing surface for polishing a workpiece and polishing the workpiece by contacting the workpiece with the polishing surface,
A plurality of through holes penetrating the polishing surface plate are formed on the polishing surface of the polishing surface plate,
A vibrating body including an ultrasonic vibrator is inserted into the plurality of through holes,
A polishing member that closes the through hole in a state where the vibration body is inserted into the through hole and does not cause a step with the polishing surface of the polishing surface plate is disposed on the upper part of the vibration body. ,
Power supply means for supplying power to the ultrasonic transducer,
A polishing surface plate, wherein power is supplied from the power supply means to the ultrasonic vibrator, and the polishing member vibrates as the ultrasonic vibrator is driven. The through-hole is formed in the first circular hole having a predetermined depth formed in the polishing surface, and is formed concentrically with the first circular hole at the bottom of the first circular hole. A second circular hole having a diameter smaller than that of the circular hole and penetrating the polishing surface plate,
The vibrating body has the same diameter as the polishing member, the polishing member formed in a disc shape having the same diameter as the first circular hole, and the polishing member mounted concentrically on the upper surface. And at least a polishing member mounting portion, and a vibrating portion formed on a lower surface of the polishing member mounting portion in a cylindrical shape having a diameter smaller than that of the second circular hole and mounted with the ultrasonic transducer. Configured,
A ring-shaped elastic member is mounted on the outer peripheral edge of the lower surface of the polishing member mounting portion widened in a flange shape from the vibrating portion, and the polishing member is mounted when the vibrator is inserted into the through hole. The ring-shaped elastic member mounted on the outer peripheral edge of the lower surface of the part is placed on the bottom of the first circular hole, and the vibration part is inserted into the second circular hole. The polishing surface plate according to claim 1. A polishing surface plate having a polishing surface for polishing a workpiece and rotatably supported; a rotation driving means for rotating the polishing surface plate; and a holding surface for holding a workpiece. A workpiece holding means for holding the workpiece in contact with the polishing platen; and an abrasive liquid supply means for supplying an abrasive liquid to the surface of the polishing platen. The workpiece holding means and the polishing plate. A lapping apparatus for polishing a workpiece held by a workpiece holding means by sliding a board,
The polishing platen is the polishing platen according to claim 1 or 2,
When polishing the workpiece, power is supplied from the power supply means to the ultrasonic vibrator, and polishing is performed in a state where the polishing member vibrates as the ultrasonic vibrator is driven. Characteristic wrapping device. A polishing surface plate having a polishing surface for polishing a workpiece and polishing the workpiece by contacting the workpiece with the polishing surface,
The polishing platen has a plate-like abrasive part having a polishing surface for polishing a workpiece, and a support part for supporting the abrasive part,
The support part is formed with a plurality of through holes penetrating the support part.
A ring-shaped elastic member surrounding the openings is disposed on the outer peripheral edge of the openings of the plurality of through holes,
The upper surface of the ring-shaped elastic member is located a predetermined amount above the upper surface of the support part,
The plate-like abrasive part is supported on the support part via the elastic member by being placed on the upper surface of the elastic member,
One end of a columnar vibrator having an ultrasonic transducer is bonded to a position corresponding to the plurality of through holes on the back surface side of the polishing surface of the plate-like abrasive material portion supported by the support portion. The other end of the vibrator is inserted into the through-hole, and includes power supply means for supplying power to the ultrasonic transducer,
A polishing surface plate, wherein power is supplied from the power supply means to the ultrasonic vibrator, and polishing is performed in a state where the abrasive portion vibrates as the ultrasonic vibrator is driven. A polishing surface plate having a polishing surface for polishing a workpiece and rotatably supported; a rotation driving means for rotating the polishing surface plate; and a holding surface for holding a workpiece. A workpiece holding means for holding the workpiece in contact with the polishing platen; and an abrasive liquid supply means for supplying an abrasive liquid to the surface of the polishing platen. The workpiece holding means and the polishing plate. A lapping apparatus for polishing a workpiece held by a workpiece holding means by sliding a board,
The polishing surface plate is a polishing surface plate according to claim 4,
When polishing the workpiece, power is supplied from the power supply means to the ultrasonic vibrator, and polishing is performed in a state where the abrasive portion vibrates as the ultrasonic vibrator is driven. Characteristic wrapping device.

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