JP2013167646A - Laminated mounting structure - Google Patents

Laminated mounting structure Download PDF

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JP2013167646A
JP2013167646A JP2013108314A JP2013108314A JP2013167646A JP 2013167646 A JP2013167646 A JP 2013167646A JP 2013108314 A JP2013108314 A JP 2013108314A JP 2013108314 A JP2013108314 A JP 2013108314A JP 2013167646 A JP2013167646 A JP 2013167646A
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substrate
electrode
mounting structure
inspection
electronic component
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Hiroyuki Motohara
寛幸 本原
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Olympus Corp
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Olympus Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

PROBLEM TO BE SOLVED: To provide a laminated mounting structure, each substrate of which can be inspected after forming (manufacturing) the laminated mounting structure.SOLUTION: There is provided a laminated mounting structure which comprises: a first inspection electrode which provided on a first substrate and electrically connected to a first electronic component; a first substrate side connection electrode which is an electrode provided on a surface opposed to an intermediate member of the first substrate and electrically connected to the first electronic component; a second substrate side connection electrode which is provided on a second substrate and electrically connected to a second electronic component; a second inspection electrode which is provided on the first substrate and electrically connected to the second electronic component through a conductive member and the second substrate side connection electrode; and further a bump electrode provided on at least one of the first substrate side connection electrode and the second substrate side connection electrode, wherein the bump electrode is formed in a recess and the second inspection electrode is electrically connected to the second electronic component through the bump electrode and a conductive member in the recess.

Description

本発明は、検査用電極を設けた積層実装構造体に関する。   The present invention relates to a stacked mounting structure provided with an inspection electrode.

検査用電極を設けた積層実装構造体の従来例として、特許文献1(特開2004−7469号公報)記載の携帯電話に用いられたものが挙げられる。特許文献1における積層実装構造体(電子部品410)は、内部に部品(集積回路415)が収容され、基板441〜445が積層された積層実装構造体であって、実装面420以外の一つの面430に検査用電極(検査用端子431)を設けることにより、積層実装構造体形成後の検査を容易に行うことができる(図18)。   As a conventional example of a stacked mounting structure provided with an inspection electrode, there is one used in a mobile phone described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2004-7469). The stacked mounting structure (electronic component 410) in Patent Document 1 is a stacked mounting structure in which components (integrated circuits 415) are accommodated and substrates 441 to 445 are stacked. By providing the inspection electrode (inspection terminal 431) on the surface 430, the inspection after forming the stacked mounting structure can be easily performed (FIG. 18).

特開2004−7469号公報JP 2004-7469 A

しかしながら上述の積層実装構造体410では、積層実装構造体410を形成した後に積層実装構造体410の各層441〜445の検査を個別に行うことができなかった。よって、従来技術では、積層実装構造体410を構成する各層ごとの独立した機能を検査することができないため、積層実装構造体410に不良が発生した場合に不良箇所の特定が難しい。さらに、積層実装構造体410を構成する各層の一部のみが不良品であっても、その他の良品である各層も含めた積層実装構造体全体が不良品とされてしまうことから、歩留まり低下を招くことになる。特に、積層実装構造体410を構成する各層が高価な部材である場合では、コストへの影響が大きくなる。さらに、積層実装構造体410の機能が複雑化した場合、積層実装構造体410の形成後に一括して複雑化された積層実装構造体410の各機能の検査を行うことになるため、検査が複雑化するとともに検査の信頼性低下を招くことになる。   However, in the above-described stacked mounting structure 410, the layers 441 to 445 of the stacked mounting structure 410 cannot be individually inspected after the stacked mounting structure 410 is formed. Therefore, in the prior art, it is difficult to inspect the independent function of each layer constituting the stacked mounting structure 410, and therefore it is difficult to identify a defective portion when a failure occurs in the stacked mounting structure 410. Furthermore, even if only a part of each layer constituting the multilayer mounting structure 410 is a defective product, the entire multilayer mounting structure including each other layer that is a non-defective product is regarded as a defective product. Will be invited. In particular, when each layer constituting the stacked mounting structure 410 is an expensive member, the influence on the cost becomes large. Further, when the function of the stacked mounting structure 410 is complicated, the inspection of each function of the stacked mounting structure 410 that is complicated at a time after the stacked mounting structure 410 is formed is complicated. As a result, the reliability of inspection is reduced.

本発明は、上記に鑑みてなされたものであって、積層実装構造体形成後(製造後)において各基板の検査が可能である積層実装構造体を提供することを目的とする。   The present invention has been made in view of the above, and an object of the present invention is to provide a stacked mounting structure in which each substrate can be inspected after the stacked mounting structure is formed (after manufacturing).

上述した課題を解決し、目的を達成するために、本発明に係る積層実装構造体は、第1の電子部品が実装された第1の基板と、第1の基板に対向して配置され、第2の電子部品が実装された第2の基板と、第1の基板と第2の基板との間に設置され、第1の基板と第2の基板とを所定の間隙をもって接続し、内側に第2の電子部品を収納する空間を有する中間部材と、中間部材に形成された凹部内に設けられた導電部材と、第1の電子部品の動作を検査するための電極として、第1の基板に設けられた電極であって、第1の電子部品に電気的に接続された第1の検査用電極と、導電部材に電気的に接続するための電極として、第1の基板の中間部材に対向する面に設けられた電極であって、第1の電子部品に電気的に接続された第1の基板側接続電極と、導電部材に電気的に接続するための電極として、第2の基板に設けられた電極であって、第2の電子部品に電気的に接続された第2の基板側接続電極と、第2の電子部品の動作を検査するための電極として、第1の基板に設けられた電極であって、導電部材及び第2の基板側接続電極を介して第2の電子部品に電気的に接続された第2の検査用電極と、さらに第1の基板側接続電極と第2の基板側接続電極との少なくともいずれか一方に設けられている突起電極とを有し、突起電極は、凹部内に形成され、第2の検査用電極は突起電極と凹部内の導電部材とを介して第2の電子部品に電気的に接続されていることを特徴としている。   In order to solve the above-described problems and achieve the object, the stacked mounting structure according to the present invention is disposed so as to face the first substrate, the first substrate on which the first electronic component is mounted, Installed between the second board on which the second electronic component is mounted, the first board, and the second board, connecting the first board and the second board with a predetermined gap, As an electrode for inspecting the operation of the first electronic component, an intermediate member having a space for housing the second electronic component, a conductive member provided in a recess formed in the intermediate member, An electrode provided on the substrate, the first inspection electrode electrically connected to the first electronic component, and an intermediate member of the first substrate as an electrode for electrically connecting to the conductive member A first substrate side electrically connected to the first electronic component, the electrode provided on a surface facing the first electronic component And a second substrate-side connection electrode electrically connected to the second electronic component, the electrode being provided on the second substrate as an electrode for electrically connecting to the conductive member. The electrode for inspecting the operation of the second electronic component is an electrode provided on the first substrate, and is electrically connected to the second electronic component via the conductive member and the second substrate-side connection electrode. And a projection electrode provided on at least one of the first substrate-side connection electrode and the second substrate-side connection electrode, the projection electrode, The second inspection electrode is formed in the recess and is electrically connected to the second electronic component via the protruding electrode and the conductive member in the recess.

本発明に係る積層実装構造体において、第1の基板側接続電極には第1の突起電極が形成され、第2の基板側接続電極には第2の突起電極が形成されていることが好ましい。   In the stacked mounting structure according to the present invention, it is preferable that a first protruding electrode is formed on the first substrate-side connection electrode, and a second protruding electrode is formed on the second substrate-side connection electrode. .

本発明に係る積層実装構造体において、第2の基板側接続電極は、第2の基板が中間部材に接続されていない状態においては、第2の電子部品の動作を検査するための電極として機能することが好ましい。   In the stacked mounting structure according to the present invention, the second substrate-side connection electrode functions as an electrode for inspecting the operation of the second electronic component when the second substrate is not connected to the intermediate member. It is preferable to do.

本発明にかかる積層実装構造体は、第1の電子部品を備えた第1の基板と、第1の基板に対向して配置され、第2の電子部品を備えた第2の基板と、第1の基板と第2の基板との間に設置され、第1の基板と第2の基板を所定の間隔をもって接続し、第2の電子部品を収納する空間を備えた中間部材と、中間部材に設けられた導電部材と、第1の電子部品の動作を検査するための電極として、第1の基板に設けられた電極であって、第1の電子部品に電気的に接続された第1の検査用電極と、導電部材に電気的に接続するための電極として、第2の基板に設けられた電極であって、第2の電子部品に電気的に接続された第2の基板側接続電極と、第2の電子部品の動作を検査するための電極として、第1の基板に設けられた電極であって、導電部材及び第2の基板側接続電極を介して第2の電子部品に電気的に接続された第2の検査用電極と、を備える。これにより、積層実装構造体形成後(製造後)において各基板の検査が可能となる。したがって、(1)積層実装構造体形成後において各基板の不良箇所を特定でき、品質向上が期待できる、(2)積層実装構造体形成後、第2の基板を検査するための電極を外部に露出しておく必要がないため、設計の自由度が拡がるとともに、積層実装構造体の小型化が可能となる、と言う効果がある。   A stacked mounting structure according to the present invention includes a first substrate provided with a first electronic component, a second substrate provided opposite to the first substrate, and provided with a second electronic component, An intermediate member installed between the first substrate and the second substrate, connecting the first substrate and the second substrate at a predetermined interval, and having a space for storing the second electronic component; The electrode provided on the first substrate as an electrode for inspecting the operation of the conductive member provided on the first electronic component and the first electronic component electrically connected to the first electronic component And a second substrate-side connection that is provided on the second substrate as an electrode for electrically connecting to the conductive member and electrically connected to the second electronic component An electrode provided on the first substrate as an electrode for inspecting the operation of the electrode and the second electronic component, Comprising a second testing electrode electrically connected to the second electronic component via the members and the second board-side connecting electrode. Thereby, each board | substrate can be test | inspected after laminated mounting structure formation (after manufacture). Therefore, (1) after forming the stacked mounting structure, it is possible to identify a defective portion of each substrate and expect improvement in quality. (2) After forming the stacked mounting structure, an electrode for inspecting the second substrate is provided outside. Since it is not necessary to expose, there is an effect that the degree of freedom in design is expanded and the stacked mounting structure can be miniaturized.

本発明に係る積層実装構造体は、第1の検査用電極及び第2の検査用電極が第1の基板の1つの面上に設けられている、または、第3の検査用電極が第1の基板の1つの面(第1の検査用電極及び第2の検査用電極が設けられた面)と同一面上に設けられているため、検査用プローブを一方向からアクセスすることが可能となる。よって、検査が容易となり検査時間の短縮が期待できる。   In the stacked mounting structure according to the present invention, the first inspection electrode and the second inspection electrode are provided on one surface of the first substrate, or the third inspection electrode is the first. Since it is provided on the same surface as one surface of the substrate (the surface on which the first inspection electrode and the second inspection electrode are provided), the inspection probe can be accessed from one direction. Become. Therefore, inspection can be facilitated and the inspection time can be shortened.

本発明に係る積層実装構造体は、第1の基板の1つの面を第2の基板に対向する面とは反対側に位置する面とすることにより、第1の基板に対して垂直な方向に検査用プローブをアクセスすることが可能となり、検査用プローブのアクセスによる積層実装構造体の損傷の可能性を低減できる。   In the stacked mounting structure according to the present invention, one surface of the first substrate is a surface located on the opposite side of the surface facing the second substrate, so that the direction is perpendicular to the first substrate. Thus, the inspection probe can be accessed, and the possibility of damage to the stacked mounting structure due to the access of the inspection probe can be reduced.

本発明に係る積層実装構造体は、各検査用電極がそれぞれ複数の電極からなり、所定の検査用電極の少なくとも1つの電極が、ほかの検査用電極の少なくとも1つの電極と機能を兼ねることにより、複数の検査用電極をひとつの検査用電極として使用することができる。よって、検査に必要なプローブの本数を削減できる。   In the stacked mounting structure according to the present invention, each inspection electrode includes a plurality of electrodes, and at least one electrode of a predetermined inspection electrode also functions as at least one electrode of another inspection electrode. A plurality of inspection electrodes can be used as one inspection electrode. Therefore, the number of probes necessary for inspection can be reduced.

本発明に係る積層実装構造体は、機能を兼ねている検査用電極が、グランド端子、電源端子、又は信号ライン端子として用いられることから、分離していたグランド、電源ライン、又は信号ラインがひとつのグランド、電源ライン、又は信号ラインで形成でき、これにより、グランド、電源ライン、又は信号ラインが電気的に安定することが期待できる。   In the stacked mounting structure according to the present invention, since the test electrode having a function is used as a ground terminal, a power supply terminal, or a signal line terminal, one separated ground, power supply line, or signal line is provided. Therefore, it can be expected that the ground, the power supply line, or the signal line is electrically stabilized.

本発明に係る積層実装構造体は、すべての検査用電極が同じ面積であるため、複数の検査用電極をひとつの検査用電極の面積で形成できる。よって、積層実装構造体の小型化が期待できる。   In the stacked mounting structure according to the present invention, since all the inspection electrodes have the same area, a plurality of inspection electrodes can be formed with the area of one inspection electrode. Therefore, size reduction of the stacked mounting structure can be expected.

第1の実施形態に係る積層実装構造体の構成を示す斜視図である。It is a perspective view which shows the structure of the laminated mounting structure which concerns on 1st Embodiment. 第1の実施形態に係る積層実装構造体の構成を示す分解斜視図である。It is a disassembled perspective view which shows the structure of the laminated mounting structure which concerns on 1st Embodiment. 第1の実施形態に係る第1の基板の構成を示す斜視図である。It is a perspective view which shows the structure of the 1st board | substrate which concerns on 1st Embodiment. 第1の実施形態に係る第2の基板の構成を示す斜視図である。It is a perspective view which shows the structure of the 2nd board | substrate which concerns on 1st Embodiment. 第1の実施形態に係る第1の基板と検査用プローブとの関係を示す斜視図である。It is a perspective view which shows the relationship between the 1st board | substrate and inspection probe which concern on 1st Embodiment. 第1の実施形態に係る第2の基板と検査用プローブとの関係を示す斜視図である。It is a perspective view which shows the relationship between the 2nd board | substrate and inspection probe which concern on 1st Embodiment. 第1の実施形態に係る積層実装構造体の製造工程を示す斜視図である。It is a perspective view which shows the manufacturing process of the laminated mounting structure which concerns on 1st Embodiment. 製造後の積層実装構造体において第1の基板を検査するときの積層実装構造体と検査用プローブとの関係を示す斜視図である。It is a perspective view which shows the relationship between the multilayer mounting structure and inspection probe when test | inspecting a 1st board | substrate in the multilayer mounting structure after manufacture. 製造後の積層実装構造体において第2の基板を検査するときの積層実装構造体と検査用プローブとの関係を示す斜視図である。It is a perspective view which shows the relationship between the multilayer mounting structure and inspection probe when inspecting the 2nd board | substrate in the multilayer mounting structure after manufacture. 製造後の積層実装構造体全体を検査するときの積層実装構造体と検査用プローブとの関係を示す斜視図である。It is a perspective view which shows the relationship between the lamination | stacking mounting structure and inspection probe when test | inspecting the whole lamination | stacking mounting structure after manufacture. 3層以上の積層実装構造体の例を示す斜視図である。It is a perspective view which shows the example of the laminated mounting structure of 3 layers or more. 中間部材に形成した貫通孔及び導電部材の構成を示す斜視図である。It is a perspective view which shows the structure of the through-hole and conductive member which were formed in the intermediate member. 図12のXIII−XIII線における断面図である。It is sectional drawing in the XIII-XIII line | wire of FIG. 中間部材に形成した溝部及び導電部材の構成を示す斜視図である。It is a perspective view which shows the structure of the groove part and conductive member which were formed in the intermediate member. 図14のXV−XV線における断面図である。It is sectional drawing in the XV-XV line | wire of FIG. 第2の実施形態に係る積層実装構造体の構成を示す分解斜視図である。It is a disassembled perspective view which shows the structure of the laminated mounting structure which concerns on 2nd Embodiment. 第3の実施形態に係る第1の基板の構成を示す斜視図である。It is a perspective view which shows the structure of the 1st board | substrate which concerns on 3rd Embodiment. 従来の積層実装構造体の構成を示す斜視図である。It is a perspective view which shows the structure of the conventional laminated mounting structure.

以下に、本発明にかかる積層実装構造体の実施形態を図面に基づいて詳細に説明する。なお、この実施形態によりこの発明が限定されるものではない。   Embodiments of a stacked mounting structure according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment.

(第1の実施形態)
図1〜15を参照しつつ、第1の実施形態に係る積層実装構造体100について説明する。図1及び図2は、3枚の基板10、20、30を、2つの中間部材40、50を介して積層する構成を示している。以下、説明を簡単にするため、第1の基板10、中間部材40、及び第2の基板20の関係を例に説明する。
(First embodiment)
The stacked mounting structure 100 according to the first embodiment will be described with reference to FIGS. FIGS. 1 and 2 show a configuration in which three substrates 10, 20, 30 are stacked via two intermediate members 40, 50. Hereinafter, in order to simplify the description, the relationship between the first substrate 10, the intermediate member 40, and the second substrate 20 will be described as an example.

第1の基板10には、第1の検査用電極11a、11b、第2の検査用電極12a、12b、積層実装構造体検査用電極13a、13b、13cが設けられており電子部品19a、19b、19cが実装される(図3)。第2の基板20には、第2の基板側接続電極22a、22bが設けられており、電子部品29a、29b、29cが実装される(図4)。ここで、図3は第1の基板10の構成を示す斜視図、図4は第2の基板20の構成を示す斜視図である。   The first substrate 10 is provided with first inspection electrodes 11a, 11b, second inspection electrodes 12a, 12b, and stacked mounting structure inspection electrodes 13a, 13b, 13c, and electronic components 19a, 19b. 19c are implemented (FIG. 3). The second substrate 20 is provided with second substrate-side connection electrodes 22a, 22b, and electronic components 29a, 29b, 29c are mounted (FIG. 4). Here, FIG. 3 is a perspective view showing the configuration of the first substrate 10, and FIG. 4 is a perspective view showing the configuration of the second substrate 20.

第1の検査用電極11a、11bは電子部品19a、19b、19cと電気的に接続されており、検査用プローブ61a、61bをそれぞれ接触させることで、電子部品19a、19b、19cが実装された第1の基板10の動作確認を行う(図5、図8)。また、第2の基板側接続電極22a、22bは電子部品29a、29b、29cと電気的に接続されており、検査用プローブ62a、62bをそれぞれ接触させることで、電子部品29a、29b、29cが実装された第2の基板20の動作確認を行う(図6、図9)。ここで、図5は、積層実装構造体100製造前の第1の基板10の動作確認時における第1の基板10と検査用プローブ61a、61bとの関係を示す図である。   The first inspection electrodes 11a and 11b are electrically connected to the electronic components 19a, 19b and 19c, and the electronic components 19a, 19b and 19c are mounted by bringing the inspection probes 61a and 61b into contact with each other. The operation of the first substrate 10 is confirmed (FIGS. 5 and 8). The second substrate side connection electrodes 22a, 22b are electrically connected to the electronic components 29a, 29b, 29c, and the electronic components 29a, 29b, 29c are brought into contact with the inspection probes 62a, 62b, respectively. The operation of the mounted second substrate 20 is checked (FIGS. 6 and 9). Here, FIG. 5 is a diagram illustrating the relationship between the first substrate 10 and the inspection probes 61a and 61b when the operation of the first substrate 10 is confirmed before the stacked mounting structure 100 is manufactured.

図6は、積層実装構造体100製造前の第2の基板20の動作確認時における第2の基板20と検査用プローブ62a、62bとの関係を示す図である。図7は、積層実装構造体100の製造工程を示す斜視図であって、左図(a)は組み立て前の状態を、中央図(b)は組み立て後の状態を、右図(c)は導電部材配置後の状態を、それぞれ示す。図8は、積層実装構造体100製造後の第1の基板10の動作確認時における第1の基板10と検査用プローブ61a、61bとの関係を示す図である。図9は、積層実装構造体100製造後の第2の基板20の動作確認時における第2の基板20と検査用プローブ62a、62bとの関係を示す図である。   FIG. 6 is a diagram illustrating a relationship between the second substrate 20 and the inspection probes 62a and 62b when the operation of the second substrate 20 is confirmed before the stacked mounting structure 100 is manufactured. FIG. 7 is a perspective view showing a manufacturing process of the stacked mounting structure 100. The left figure (a) shows the state before assembly, the middle figure (b) shows the state after assembly, and the right figure (c) shows. The state after arrangement of the conductive members is shown. FIG. 8 is a diagram illustrating a relationship between the first substrate 10 and the inspection probes 61a and 61b when checking the operation of the first substrate 10 after the stacked mounting structure 100 is manufactured. FIG. 9 is a diagram showing the relationship between the second substrate 20 and the inspection probes 62a and 62b when checking the operation of the second substrate 20 after the stacked mounting structure 100 is manufactured.

電子部品19a、19b、19cが実装された第1の基板10と、電子部品29a、29b、29cが実装された第2の基板20とは、電子部品29a、29b、29cが収納可能な中間部材40を介して接着剤などにより接続される。中間部材40の壁面には、例えば導電性粒子を含有する液体をディスペンス法により塗布および焼結することで導電部材45が形成される。これにより第1の基板10と、第2の基板20との電位的接続がとられた積層実装構造体100が形成される。   The first substrate 10 on which the electronic components 19a, 19b, and 19c are mounted and the second substrate 20 on which the electronic components 29a, 29b, and 29c are mounted are intermediate members that can store the electronic components 29a, 29b, and 29c. 40 is connected by an adhesive or the like. The conductive member 45 is formed on the wall surface of the intermediate member 40 by, for example, applying and sintering a liquid containing conductive particles by a dispensing method. Thereby, the stacked mounting structure 100 in which the potential connection between the first substrate 10 and the second substrate 20 is taken is formed.

このとき、第2の基板20に設けられた第2の基板側接続電極22a、22bは、中間部材40側の壁面に形成された導電部材45を介して第1の基板10に設けられた第2の検査用電極12a、12bに電気的に接続される(図2、図7)。なお、中間部材50を介して第2の基板20と第3の基板30を電位的接続する場合には、中間部材50にも導電部材45と同様に導電部材55を設けるとよい(図1、図11)。ここで、図11は、3層以上の基板を積層した積層実装構造体の例を示す斜視図である。   At this time, the second substrate-side connection electrodes 22a and 22b provided on the second substrate 20 are provided on the first substrate 10 via the conductive member 45 formed on the wall surface on the intermediate member 40 side. The two test electrodes 12a and 12b are electrically connected (FIGS. 2 and 7). In the case where the second substrate 20 and the third substrate 30 are connected in potential via the intermediate member 50, the intermediate member 50 may be provided with a conductive member 55 as in the case of the conductive member 45 (FIG. 1, FIG. FIG. 11). Here, FIG. 11 is a perspective view showing an example of a stacked mounting structure in which three or more layers of substrates are stacked.

第1の基板10と第2の基板20とを電気的に接続する手段としては、例えば、中間部材40に貫通孔46を形成する。そして、貫通孔46内部に導電部材47を形成する(図12、13)、あるいは、中間部材40に溝部48を形成し、この溝部48に導電部材49を形成する(図14、15)。これらの場合は、導電部材47(導電部材49)と第1の基板10、及び、導電部材47(導電部材49)と第2の基板20との接合を強化するために、第1の基板10および第2の基板20に、それぞれ突起電極16、26を形成するとよい(図13、15)。   As a means for electrically connecting the first substrate 10 and the second substrate 20, for example, a through hole 46 is formed in the intermediate member 40. Then, the conductive member 47 is formed in the through hole 46 (FIGS. 12 and 13), or the groove portion 48 is formed in the intermediate member 40, and the conductive member 49 is formed in the groove portion 48 (FIGS. 14 and 15). In these cases, in order to strengthen the bonding between the conductive member 47 (conductive member 49) and the first substrate 10 and between the conductive member 47 (conductive member 49) and the second substrate 20, the first substrate 10 is strengthened. The protruding electrodes 16 and 26 may be formed on the second substrate 20 (FIGS. 13 and 15), respectively.

ここで、図12は、中間部材40に貫通孔46を、この貫通孔46に導電部材47を、それぞれ形成した構成を示す斜視図であり、図13は、図12のXIII−XIII線における断面図である。また、図14は、中間部材40に溝部48を、この溝部48に導電部材49を、それぞれ形成した構成を示す斜視図であり、図15は、図14のXV−XV線における断面図である。   Here, FIG. 12 is a perspective view showing a configuration in which a through hole 46 is formed in the intermediate member 40 and a conductive member 47 is formed in the through hole 46, and FIG. 13 is a cross section taken along line XIII-XIII in FIG. FIG. 14 is a perspective view showing a configuration in which the groove 48 is formed in the intermediate member 40 and the conductive member 49 is formed in the groove 48, and FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. .

以上のような構成の各基板の検査は次のように行う。まず、積層実装構造体100の形成後において、第1の基板10に形成された第1の検査用電極11a、11bに検査用プローブ61a、61bを接触させることで、電子部品19a、19b、19cが実装された第1の基板10の動作確認を行う(図8)。また、積層実装構造体100の形成後において、第1の基板10に形成された第2の検査用電極12a、12bに検査プローブ62a、62bを接触させることで、電子部品29a、29b、29cが実装された第2の基板20の動作確認を行う(図9)。さらに、積層実装構造体100形成後において、第1の基板10に形成された積層実装構造体検査用電極13a、13b、13cに検査用プローブ63a、63b、63cをそれぞれ接触させることで、積層実装構造体の動作確認を行う(図10)。   The inspection of each substrate having the above configuration is performed as follows. First, after the stacked mounting structure 100 is formed, the inspection probes 61a and 61b are brought into contact with the first inspection electrodes 11a and 11b formed on the first substrate 10 to thereby form the electronic components 19a, 19b, and 19c. The operation of the first substrate 10 on which is mounted is confirmed (FIG. 8). Further, after the stacked mounting structure 100 is formed, the inspection probes 62a and 62b are brought into contact with the second inspection electrodes 12a and 12b formed on the first substrate 10, so that the electronic components 29a, 29b and 29c are brought into contact with each other. The operation of the mounted second substrate 20 is confirmed (FIG. 9). Furthermore, after the stacked mounting structure 100 is formed, the stacked mounting structure inspection electrodes 13a, 13b, and 13c formed on the first substrate 10 are brought into contact with the inspection probes 63a, 63b, and 63c, respectively. The operation of the structure is confirmed (FIG. 10).

なお、本実施形態では、2層の基板の例を示したが、3層以上の基板が積層された積層実装構造体であってもよく(図11)、同様に検査電極を配置することによって各基板の検査を行うことができる。   In the present embodiment, an example of a two-layer substrate is shown, but a stacked mounting structure in which three or more layers are stacked may be used (FIG. 11). Each substrate can be inspected.

第1の実施形態によれば、積層実装構造体100の形成後(製造後)においても各基板の検査が可能となり、これにより以下の効果を奏する。
(1)積層実装構造体100の形成後において各基板の不良箇所を特定でき、品質向上が期待できる。
(2)積層実装構造体100の形成後、第2の基板20を検査するための電極を外部に露出しておく必要がないため、設計の自由度が拡がるとともに、積層実装構造体100の小型化が可能となる。
According to the first embodiment, it is possible to inspect each substrate even after the stacked mounting structure 100 is formed (after manufacture), and the following effects are obtained.
(1) After the stacked mounting structure 100 is formed, a defective portion of each substrate can be specified, and improvement in quality can be expected.
(2) Since the electrode for inspecting the second substrate 20 does not need to be exposed to the outside after the stacked mounting structure 100 is formed, the degree of freedom in design is increased and the size of the stacked mounting structure 100 is reduced. Can be realized.

(第2の実施形態)
図16を参照しつつ、第2の実施形態に係る積層実装構造体200について説明する。ここで、図16は、積層実装構造体200の構成を示す斜視図であって、第1の実施形態に係る積層実装構造体100における部材と共通の部材については同一の符号を用いる。また、第2の実施形態に係る積層実装構造体200においても、第1の実施形態に係る積層実装構造体100と同様に、第1の基板10と第2の基板20との間に中間部材を配置するが、図16においては中間部材の図示を省略している。
(Second Embodiment)
A stacked mounting structure 200 according to the second embodiment will be described with reference to FIG. Here, FIG. 16 is a perspective view showing a configuration of the stacked mounting structure 200, and the same reference numerals are used for members common to the members in the stacked mounting structure 100 according to the first embodiment. Also in the multilayer mounting structure 200 according to the second embodiment, an intermediate member is provided between the first substrate 10 and the second substrate 20 as in the multilayer mounting structure 100 according to the first embodiment. However, the intermediate member is not shown in FIG.

第2の実施形態に係る積層実装構造体200は、第1の実施形態に係る積層実装構造体100と比較して、以下の点が異なる。
(1)第1の基板10に第1の検査用電極11a、11bが設けられている。
(2)第2の基板20に第2の基板側接続電極22a、22bが設けられている。
(3)第1の基板10に第2の検査用電極12a、12bが設けられている。
(4)第1の基板10に設けられた積層実装構造体検査用電極13a、13b、13cは、一つの面(積層実装構造体200において実装面20aと反対の面10a)に向くように設けられている。ここで、積層実装構造体200の実装方向Mは、図16における下向き方向である。
The stacked mounting structure 200 according to the second embodiment differs from the stacked mounting structure 100 according to the first embodiment in the following points.
(1) First inspection electrodes 11 a and 11 b are provided on the first substrate 10.
(2) The second substrate 20 is provided with second substrate-side connection electrodes 22a and 22b.
(3) Second inspection electrodes 12 a and 12 b are provided on the first substrate 10.
(4) The stacked mounting structure inspection electrodes 13a, 13b, 13c provided on the first substrate 10 are provided so as to face one surface (the surface 10a opposite to the mounting surface 20a in the stacked mounting structure 200). It has been. Here, the mounting direction M of the stacked mounting structure 200 is the downward direction in FIG.

第2の実施形態に係る積層実装構造体200によれば、検査用プローブを一方向からアクセスすることが可能となる。また、検査用電極が、実装面20aと反対の面10aに設けられているため、第1の基板10に対して垂直な方向(実装方向M)に検査用プローブをアクセスすることが可能となる。よって、第2の実施形態に係る積層実装構造体200によれば、検査が容易となり検査時間の短縮が期待できる。また、実装方向に検査用プローブをアクセスすることが可能となるため、積層実装構造体を破壊する危険性を低減できる。   According to the stacked mounting structure 200 according to the second embodiment, the inspection probe can be accessed from one direction. In addition, since the inspection electrode is provided on the surface 10a opposite to the mounting surface 20a, the inspection probe can be accessed in a direction perpendicular to the first substrate 10 (mounting direction M). . Therefore, according to the stacked mounting structure 200 according to the second embodiment, the inspection can be facilitated and the inspection time can be shortened. In addition, since the inspection probe can be accessed in the mounting direction, the risk of destroying the stacked mounting structure can be reduced.

(第3の実施形態)
図17を参照しつつ、第3の実施形態に係る積層実装構造体について説明する。ここで、図17は、第3の実施形態に係る積層実装構造体の第1の基板310の構成を示す斜視図であって、第1の実施形態に係る第1の基板10における部材と共通の部材については同一の符号を用いる。また、第3の実施形態に係る積層実装構造体においても、第1の実施形態に係る積層実装構造体100と同様に、第2の基板20、及び、中間部材を用いる。
(Third embodiment)
A stacked mounting structure according to the third embodiment will be described with reference to FIG. Here, FIG. 17 is a perspective view showing the configuration of the first substrate 310 of the stacked mounting structure according to the third embodiment, and is common to the members in the first substrate 10 according to the first embodiment. The same reference numerals are used for these members. Also in the stacked mounting structure according to the third embodiment, the second substrate 20 and the intermediate member are used as in the stacked mounting structure 100 according to the first embodiment.

第3の実施形態に係る積層実装構造体は、第1及び第2の実施形態に係る積層実装構造体と比較して、第1の基板310を検査する第1の検査用電極311bが積層実装構造体を検査する第1の検査用電極の1つを兼ねている点が異なる。この第1の検査用電極311b以外の検査用電極は、第1の実施形態に係る第1の基板10における検査用電極と同様である。すなわち、第1の検査用電極311a、第2の検査用電極312a、312b、第3の検査用電極313b、313cは、第1の検査用電極11a、第2の検査用電極12a、12b、第3の検査用電極13b、13cに、それぞれ対応する。   In the multilayer mounting structure according to the third embodiment, the first inspection electrode 311b for inspecting the first substrate 310 is stacked by mounting, as compared with the multilayer mounting structure according to the first and second embodiments. The difference is that it also serves as one of the first inspection electrodes for inspecting the structure. The inspection electrodes other than the first inspection electrode 311b are the same as the inspection electrodes in the first substrate 10 according to the first embodiment. That is, the first inspection electrode 311a, the second inspection electrodes 312a and 312b, the third inspection electrode 313b and 313c are the first inspection electrode 11a, the second inspection electrodes 12a and 12b, 3 corresponding to the three inspection electrodes 13b and 13c.

第3の実施形態に係る積層実装構造体によれば、複数の検査用電極をひとつの検査用電極として使用することができるため、検査用プローブの本数を削減でき、検査が容易となるとともに、積層実装構造体の小型化が可能となる。   According to the stacked mounting structure according to the third embodiment, since a plurality of inspection electrodes can be used as one inspection electrode, the number of inspection probes can be reduced, and inspection can be facilitated. The stacked mounting structure can be downsized.

さらに、第1の基板310を検査する検査用電極と積層実装構造体100を検査する検査用電極とを兼ねている第1の検査用電極311bをグランド端子、電源端子、又は信号ラインとすると、分離していたグランド、電源ライン、又は信号ラインがひとつのグランドパターンで形成することができる。よって、グランド、電源ライン、又は信号ラインが電気的に安定することが期待できる。   Furthermore, when the first inspection electrode 311b that doubles as the inspection electrode for inspecting the first substrate 310 and the inspection electrode for inspecting the stacked mounting structure 100 is a ground terminal, a power supply terminal, or a signal line, The separated ground, power supply line, or signal line can be formed with one ground pattern. Therefore, it can be expected that the ground, the power supply line, or the signal line is electrically stable.

以上のように、本発明にかかる積層実装構造体は、電子部品を実装した基板を複数積層した構造を備えた構造体の検査に有用であり、特に、内視鏡、携帯電話その他の小型の電子機器に適している。   As described above, the stacked mounting structure according to the present invention is useful for inspecting a structure having a structure in which a plurality of substrates on which electronic components are mounted is stacked, and in particular, an endoscope, a mobile phone, and other small-sized structures. Suitable for electronic equipment.

10 第1の基板
10a 反対の面
11a 11b 第1の検査用電極
12a 12b 第2の検査用電極
13a 13b 13c 積層実装構造体検査用電極
16 突起電極
19a 19b 電子部品
20 第2の基板
20a 実装面
22a 22b 第2の基板側接続電極
26 突起電極
29a 29b 29c 電子部品
30 第3の基板
40 中間部材
45 導電部材
46 貫通孔
47 導電部材
48 溝部
49 導電部材
50 中間部材
55 導電部材
61a 61b 検査用プローブ
62a 62b 検査用プローブ
63a 63b 63c 検査用プローブ
100 200 積層実装構造体
310 第1の基板
311a 311b 第1の検査用電極
312a 312b 第2の検査用電極
313b 313c 第3の検査用電極
DESCRIPTION OF SYMBOLS 10 1st board | substrate 10a Opposite surface 11a 11b 1st test electrode 12a 12b 2nd test electrode 13a 13b 13c Stacked mounting structure test electrode 16 Projection electrode 19a 19b Electronic component 20 2nd board | substrate 20a Mounting surface 22a 22b Second substrate side connection electrode 26 Projection electrode 29a 29b 29c Electronic component 30 Third substrate 40 Intermediate member 45 Conductive member 46 Through hole 47 Conductive member 48 Groove portion 49 Conductive member 50 Intermediate member 55 Conductive member 61a 61b Inspection probe 62a 62b Inspection probe 63a 63b 63c Inspection probe 100 200 Stacked mounting structure 310 First substrate 311a 311b First inspection electrode 312a 312b Second inspection electrode 313b 313c Third inspection electrode

Claims (3)

第1の電子部品が実装された第1の基板と、
前記第1の基板に対向して配置され、第2の電子部品が実装された第2の基板と、
前記第1の基板と前記第2の基板との間に設置され、前記第1の基板と前記第2の基板とを所定の間隙をもって接続し、内側に前記第2の電子部品を収納する空間を有する中間部材と、
前記中間部材に形成された凹部内に設けられた導電部材と、
前記第1の電子部品の動作を検査するための電極として、前記第1の基板に設けられた電極であって、前記第1の電子部品に電気的に接続された第1の検査用電極と、
前記導電部材に電気的に接続するための電極として、前記第1の基板の前記中間部材に対向する面に設けられた電極であって、前記第1の電子部品に電気的に接続された第1の基板側接続電極と、
前記導電部材に電気的に接続するための電極として、前記第2の基板に設けられた電極であって、前記第2の電子部品に電気的に接続された第2の基板側接続電極と、
前記第2の電子部品の動作を検査するための電極として、前記第1の基板に設けられた電極であって、前記導電部材及び前記第2の基板側接続電極を介して前記第2の電子部品に電気的に接続された第2の検査用電極と、
さらに前記第1の基板側接続電極と前記第2の基板側接続電極との少なくともいずれか一方に設けられている突起電極とを有し、
前記突起電極は、前記凹部内に形成され、前記第2の検査用電極は前記突起電極と前記凹部内の前記導電部材とを介して前記第2の電子部品に電気的に接続されていることを特徴とする積層実装構造体。
A first substrate on which a first electronic component is mounted;
A second substrate disposed opposite to the first substrate and mounted with a second electronic component;
A space that is installed between the first substrate and the second substrate, connects the first substrate and the second substrate with a predetermined gap, and houses the second electronic component inside. An intermediate member having
A conductive member provided in a recess formed in the intermediate member;
As an electrode for inspecting the operation of the first electronic component, an electrode provided on the first substrate, the first inspection electrode being electrically connected to the first electronic component; ,
An electrode provided on a surface of the first substrate facing the intermediate member as an electrode for electrically connecting to the conductive member, wherein the first substrate is electrically connected to the first electronic component. 1 substrate side connection electrode;
As an electrode for electrically connecting to the conductive member, an electrode provided on the second substrate, the second substrate-side connection electrode electrically connected to the second electronic component;
As an electrode for inspecting the operation of the second electronic component, an electrode provided on the first substrate, the second electron via the conductive member and the second substrate side connection electrode A second inspection electrode electrically connected to the component;
Furthermore, it has a protruding electrode provided on at least one of the first substrate side connection electrode and the second substrate side connection electrode,
The protruding electrode is formed in the recess, and the second inspection electrode is electrically connected to the second electronic component via the protruding electrode and the conductive member in the recess. A laminated mounting structure characterized by the above.
前記第1の基板側接続電極には第1の突起電極が形成され、
前記第2の基板側接続電極には第2の突起電極が形成されていることを特徴とする請求項1に記載の積層実装構造体。
A first protruding electrode is formed on the first substrate-side connection electrode,
The stacked mounting structure according to claim 1, wherein a second protruding electrode is formed on the second substrate-side connection electrode.
前記第2の基板側接続電極は、前記第2の基板が前記中間部材に接続されていない状態においては、前記第2の電子部品の動作を検査するための電極として機能することを特徴とする請求項2に記載の積層実装構造体。
The second substrate-side connection electrode functions as an electrode for inspecting the operation of the second electronic component when the second substrate is not connected to the intermediate member. The stacked mounting structure according to claim 2.
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