JP2013146165A5 - - Google Patents

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Publication number
JP2013146165A5
JP2013146165A5 JP2012006406A JP2012006406A JP2013146165A5 JP 2013146165 A5 JP2013146165 A5 JP 2013146165A5 JP 2012006406 A JP2012006406 A JP 2012006406A JP 2012006406 A JP2012006406 A JP 2012006406A JP 2013146165 A5 JP2013146165 A5 JP 2013146165A5
Authority
JP
Japan
Prior art keywords
bus bar
hole
spacer
head
hole portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012006406A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013146165A (ja
JP5831239B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012006406A priority Critical patent/JP5831239B2/ja
Priority claimed from JP2012006406A external-priority patent/JP5831239B2/ja
Priority to US13/680,198 priority patent/US9181971B2/en
Priority to EP12196955.4A priority patent/EP2615895B1/en
Priority to CN201210543996.1A priority patent/CN103208906B/zh
Publication of JP2013146165A publication Critical patent/JP2013146165A/ja
Publication of JP2013146165A5 publication Critical patent/JP2013146165A5/ja
Application granted granted Critical
Publication of JP5831239B2 publication Critical patent/JP5831239B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012006406A 2012-01-16 2012-01-16 バスバー及び電子機器 Active JP5831239B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012006406A JP5831239B2 (ja) 2012-01-16 2012-01-16 バスバー及び電子機器
US13/680,198 US9181971B2 (en) 2012-01-16 2012-11-19 Bus bar and electronic device
EP12196955.4A EP2615895B1 (en) 2012-01-16 2012-12-13 Bus bar and electronic device
CN201210543996.1A CN103208906B (zh) 2012-01-16 2012-12-14 母线以及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012006406A JP5831239B2 (ja) 2012-01-16 2012-01-16 バスバー及び電子機器

Publications (3)

Publication Number Publication Date
JP2013146165A JP2013146165A (ja) 2013-07-25
JP2013146165A5 true JP2013146165A5 (enExample) 2015-03-05
JP5831239B2 JP5831239B2 (ja) 2015-12-09

Family

ID=47458666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012006406A Active JP5831239B2 (ja) 2012-01-16 2012-01-16 バスバー及び電子機器

Country Status (4)

Country Link
US (1) US9181971B2 (enExample)
EP (1) EP2615895B1 (enExample)
JP (1) JP5831239B2 (enExample)
CN (1) CN103208906B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5469270B1 (ja) * 2013-04-22 2014-04-16 三菱電機株式会社 電子機器
JP6322935B2 (ja) * 2013-09-13 2018-05-16 株式会社豊田自動織機 回路装置
JP6076277B2 (ja) * 2014-02-21 2017-02-08 三菱電機株式会社 電力変換装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546408A (en) * 1983-05-16 1985-10-08 Illinois Tool Works Inc. Electrically insulated heat sink assemblies and insulators used therein
US5065283A (en) * 1990-06-12 1991-11-12 Mitsubishi Denki Kabushiki Kaisha Printed circuit board with busbar interconnections
JP2698278B2 (ja) 1992-01-31 1998-01-19 三洋電機株式会社 混成集積回路装置
US6327157B1 (en) * 1999-09-27 2001-12-04 Hewlett-Packard Company High-current power bus system
DE19954421A1 (de) 1999-11-12 2001-05-31 Lohmann Therapie Syst Lts Filmförmige Zubereitung zur biphasigen Freisetzung pharmakologisch wirksamer oder anderer Substanzen
EP1489657A4 (en) * 2002-02-06 2011-06-29 Ibiden Co Ltd SEMICONDUCTOR CHIP MOUNTING PLATE, METHOD FOR THE PRODUCTION THEREOF AND SEMICONDUCTOR MODULE
JP2003264919A (ja) 2002-03-08 2003-09-19 Tdk Corp 電源用配線装置及びその製造方法
JP3969403B2 (ja) 2004-06-08 2007-09-05 株式会社デンソー 電子部品実装構造
JP2006074921A (ja) 2004-09-02 2006-03-16 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
JP4551166B2 (ja) * 2004-09-13 2010-09-22 矢崎総業株式会社 機器直付けコネクタ
SE528460C2 (sv) * 2004-12-27 2006-11-14 Danaher Motion Stockholm Ab Kraftterminal för elektrisk anslutning av en elektrisk kabel till ett kretskort samt enhet innefattande ett hölje och ett kretskort
TWI339789B (en) * 2006-09-29 2011-04-01 Delta Electronics Inc Device and heat sink
JP4882933B2 (ja) 2007-09-13 2012-02-22 株式会社デンソー 電子部品バスバー接合構造
JP2009071071A (ja) 2007-09-13 2009-04-02 Denso Corp 電子回路部品実装構造及びその製造方法
JP2010103371A (ja) 2008-10-24 2010-05-06 Keihin Corp 電子制御装置
US7835153B2 (en) * 2008-12-30 2010-11-16 Oracle America, Inc. Heat sink mount for providing non-rigid support of overhanging portions of heat sink
JP4935883B2 (ja) 2009-11-27 2012-05-23 株式会社デンソー バスバーアッセンブリ

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